13 results about "Thermal diode" patented technology

The invention belongs to the technical field of intersection of mobile air conditioners and heat energy and water quality purification, and discloses a gravity assisted heat pipe waste heat recovery and condensate water direct drinking purification mobile air conditioning system and a control method. The system comprises an air conditioner refrigeration cycle unit, a condensate water collecting and pre-cooling unit, an efficient refined filtration and purification module, a cold and hot dual-temperature storage and supply unit and an intelligent control unit. An attached gravity heat pipe waste heat recoverer is adopted, an evaporation section of the recoverer is attached to a pipeline plane of an exhaust section of a compressor, waste heat is passively recovered through working medium phase change circulation, and reverse heat transfer is automatically prevented by means of the characteristics of a thermal diode; the efficient fine filtration purification module realizes deep purification and direct drinking of condensate water; a control strategy adopts an intelligent cooperation mode of waste heat priority and electric heating supplement. The three functions of refrigeration, normal-temperature direct drinking and boiled water supply are integrated in a compact space, the structure is reliable, energy is saved, efficiency is high, drinking water is safe, the problems that in the prior art, waste heat recovery is low in efficiency, reverse heat transfer is prone to occurring, and integration is poor are solved, and the system is suitable for various mobile scenes.

An electronic system for evaluating temperature differences between different pairs of thermal diodes to evaluate the quality of a thermal interface material layer used for cooling the electronic system. Formation of a thermal diode array on a semiconductor die allows the measurement of temperature and temperature differences between a plurality of the thermal diode pairs arranged in an orthogonal configuration. The temperature differences between the thermal diode pairs can indicate the presence of irregular distribution of the thermal interface material. Such components with thermal interface material flaws can be rejected during manufacture to improve manufacturing quality.

This invention discloses a thermal diode fabric for personal cooling and its preparation method. The preparation method includes: preparing a spinning solution containing thermally conductive particles, a hydrophobic polymer, and a crosslinking agent; electrospinning under low humidity to obtain a dense heat-transferring fiber film; using the obtained dense heat-transferring fiber film as a receiving substrate, electrospinning under high humidity to obtain a fluffy heat-insulating fiber wadding layer; and finally performing a crosslinking heat treatment to obtain the thermal diode fabric. This invention utilizes a simple electrospinning process to prepare a fiber material with a double-layer asymmetric density structure in a single step by controlling humidity without changing the spinning solution. It exhibits unidirectional thermal conductivity similar to a thermal diode, effectively dissipating heat when the human body is in a hot environment and effectively insulating when the human body is in a cold environment, ensuring that the skin temperature is maintained even in situations with significant temperature changes, such as entering and exiting air-conditioned spaces in summer.

An electronic system for evaluating temperature differences between different pairs of thermal diodes to evaluate the quality of a thermal interface material layer used for cooling the electronic system. Formation of a thermal diode array on a semiconductor die allows the measurement of temperature and temperature differences between a plurality of the thermal diode pairs arranged in an orthogonal configuration. The temperature differences between the thermal diode pairs can indicate the presence of irregular distribution of the thermal interface material. Such components with thermal interface material flaws can be rejected during manufacture to improve manufacturing quality.

This invention provides a phase-change thermal diode based on directional transport and its implementation method. The phase-change thermal diode includes a tube wall, a directional transport capillary structure, a boiling-enhancing capillary structure, and a liquid working fluid. The inner side of the tube wall comprises the directional transport capillary structure and the boiling-enhancing capillary structure. The directional transport capillary structure functions to directionally transport the liquid working fluid; the boiling-enhancing capillary structure enhances boiling. The tube wall is in a vacuum or negative pressure environment and is filled with a compatible liquid working fluid. The directional transport capillary structure and the boiling-enhancing capillary structure are integrally formed by spin forming. This invention overcomes the shortcomings of existing phase-change thermal diodes, such as cumbersome fabrication processes, unsuitability for large-scale fabrication, and limited application range.

This invention discloses a high-vacuum low-temperature chamber, including a cavity, a sample stage located within the cavity, and further including a cold source module, a heat flow distribution module, a temperature equalization module, and a vacuum and cold shield module. The cold source module includes an external liquid nitrogen tank, a gas-liquid separation buffer tank, and a multi-channel solenoid valve array. The heat flow distribution module includes a multi-channel thermal diode, multiple thermal switches, and N temperature sensors for recording temperature response curves. Each channel of the multi-channel thermal diode is composed of a high thermal conductivity graphene film, with one end connected to the cold source and the other end connected to different areas of the sample stage. Each channel has a thermal switch based on a thermally induced phase change material. The temperature equalization module uses a high thermal conductivity graphite plate to ensure that heat can rapidly diffuse laterally once it enters the sample stage. The vacuum and cold shield module is a heatable regenerable cold shield with independent temperature control. Through online identification and rolling optimization, accurate tracking of the temperature trajectory is achieved without repeated manual parameter tuning, and it has adaptive capabilities.

The present application belongs to the technical field of semiconductor devices, and relates to a near-field thermal radiation device with thermal rectification and thermal stability, which is arranged in a vacuum cavity shell and comprises a negative thermal expansion substrate, an emitter, a thermal expansion substrate and a receiver. The negative thermal expansion substrate is arranged on a top wall in the vacuum cavity shell, the emitter is arranged on a side of the negative thermal expansion substrate away from the top wall of the vacuum cavity shell, the thermal expansion substrate is arranged on a bottom wall in the vacuum cavity shell, and the receiver is arranged on a side of the thermal expansion substrate away from the bottom wall of the vacuum cavity shell. The emitter and the receiver are used for near-field radiation heat transfer. By adjusting the temperature of the emitter and the receiver, the negative thermal expansion substrate and the thermal expansion substrate are expanded or contracted, the vacuum gap between the emitter and the receiver is changed, the heat flux of the near-field thermal radiation device is changed, and the near-field thermal radiation device realizes the functions of a thermal diode with thermal rectification and a thermal stabilizer with thermal stability.

The invention discloses a heat flow time sequence programmable chip heat dissipation system, belongs to the technical field of chip heat management, and aims at solving the technical problem of how to overcome the defects that in an existing chip heat dissipation technology, a heat flow path is fixed, and the time-space power consumption characteristic of a chip cannot be cooperatively utilized. According to the technical scheme, the system comprises a chip, thermal diode units distributed in an array mode are integrated on the back face of the chip, a multi-stage phase change heat storage layer is arranged above the thermal diode units, and the thermal diode units are connected with the phase change heat storage layer. A micro-channel cold plate is arranged on the multi-stage phase change heat storage layer; and each thermal diode unit is an independent controllable thermal switch, has high on-off ratio and quick response capability, and is used for reconstructing a heat flow network and realizing one-way conduction and controllable turn-off of heat flow.

This invention relates to the technical field of thermal diode walls, and more particularly to a thermal diode wall based on spectrally selective aerogel. The wall comprises, from the outside in, an outer glass layer, an aerogel layer, an absorption layer, and a phase change heat storage layer, arranged sequentially from the outside in. The aerogel layer is a spectrally selective aerogel composed of CsWO3 nanoparticle-modified silica aerogel. The layers are tightly bonded together to form an integrated wall structure. The thermal diode wall is integrally attached to the outer surface of the building wall, with the inner side of the phase change heat storage layer bonded to the outer surface of the building wall. The thermal diode wall provided by this invention allows the functional layers to work synergistically, enabling the wall to adaptively regulate the direction of heat flow according to seasonal changes, thereby reducing building heating and cooling energy consumption without relying on active energy input.

The application discloses a convection type flexible heat diode based on an asymmetric wetting structure, which comprises, from top to bottom, a water collection function film at an evaporation end, a super-hydrophobic function film at a condensation end and a flexible packaging film which are sequentially arranged and sealedly packaged, and a plurality of liquid-vapor transport channels are arranged in the super-hydrophobic function film at the condensation end. The evaporation end is hydrophilized and treated with hygroscopic salt, so that the evaporation end has high efficient hygroscopic and evaporation capacity. Meanwhile, the condensation end is constructed with hydrophobic columnar array pores, so that the condensation liquid drops are quickly separated and directionally returned. The binary design of 'hydrophilic evaporation / hydrophobic condensation' creates low-thermal-resistance and high-thermal-resistance heat transfer paths in the positive and reverse directions, so that high efficient heat rectification is realized.

The application belongs to the technical field of thermal radiation, and particularly relates to a radiation heat flow regulating device and application thereof. The radiation heat flow regulating device comprises at least two oppositely arranged radiation bodies, each of which comprises a radiation layer; at least one of the radiation bodies comprises a substrate and one or more organic polymer layers, wherein the organic polymer layer is arranged between the substrate and the radiation layer to reduce the radiation absorption of materials other than the radiation layer. The radiation spectrum mismatch between the organic polymer layer and the radiation layer can effectively reduce the heat energy absorbed by the substrate or other materials to establish an efficient heat radiation channel, which is beneficial to improving the thermal rectification ratio of the thermal rectifier and improving the output power and energy conversion efficiency of the thermal photovoltaic device. The radiation heat flow regulating device is prepared into a heat flow regulating device, such as a thermal diode, a thermal triode, a thermal photovoltaic device, a thermal switch, a thermal imager, a thermal lithography instrument and the like, which can effectively regulate the heat flow.

The application discloses a heat conduction path logic regulation system and method based on a thermal diode, and the system comprises a forward thermal diode, a reverse thermal diode and a structured external field. The forward and reverse thermal diodes have the same structure and are composed of a mold, a logic flow channel and a functional fluid; the logic flow channel is composed of a center branch fluid storage chamber, a center branch flow channel, a working chamber, an edge branch flow channel and an edge branch fluid storage chamber. When there is no structured external field, the thermal diode can be used as a one-way heat transfer device to realize switching of two heat conduction paths, form two temperature distributions on a heat flow output surface, and the temperature of the forward thermal diode on the heat flow output surface is always greater than that of the reverse thermal diode; when the structured external field is applied, the forward and reverse thermal diodes can respectively realize different logic AND gates and cooperatively realize a logic NOT gate, and form wide and controllable temperature distributions on the heat flow output surface, thereby providing a new idea for meeting different thermal control requirements of multiple devices in a complex temperature field.

This disclosure provides a thermal diode including a first plate having a first surface defining a wick structure. The thermal diode can include a second plate having a smooth surface facing the wick structure, the smooth surface and the wick structure defining a chamber for accommodating a phase-change liquid. The thermal diode also can include a separator positioned between the first plate and the second plate to separate the wick structure from the smooth surface by a gap that is less than a capillary length of the phase-change liquid.