38 results about "Thermal diode" patented technology

The invention provides a thermal diode structure for realizing contact type one-way heat conduction based on a multi-material framework, and belongs to the field of thermal function structure design. The thermal diode structure is composed of thermal diode periodic cell elements which are periodically arranged in a construction plane; the construction plane is a plane perpendicular to the heat transfer direction; the thermal diode periodic cell element is a minimum geometrically repeatable structure in periodic arrangement; the thermal diode periodic cells include multi-branch thermal diode periodic cells that are symmetric about multiple rotations perpendicular to the construction plane and passing through the thermal diode periodic cell centroid. The thermal diode structure designed by the invention has excellent asymmetric heat conduction characteristic. During forward heating, the heat-conducting property of the structure is enhanced by adopting a high-heat-conductivity material; and during reverse heating, the heat insulation capacity of the structure is improved through structural gaps, and the two contradictory performance requirements of forward heat conduction and reverse heat insulation of the structure are met. The method is not limited by physical fields such as gravity, and the applicable engineering scenes are wider.

The present invention relates to a Tesla valve-type ultra-thin planar thermal diode based on phase change heat transfer technology. The diode comprises a tube body, within which are disposed an evaporation end, a liquid working fluid cavity, a Tesla valve flow channel, a liquid wick filled with liquid working fluid, and a condensation end. The wick is disposed within the liquid working fluid cavity. The condensation end, the wick, and the evaporation end are sequentially connected to form a liquid working fluid path, while the evaporation end, the Tesla valve flow channel, and the condensation end are sequentially connected to form a gaseous working fluid path. The Tesla valve utilizes the fluid acceleration characteristics and unidirectional conductivity of the fluid to improve the unidirectional thermal conductivity of the ultra-thin planar thermal diode. During forward heating, the gaseous working fluid flows from the evaporation end to the condensation end, flowing downstream within the Tesla valve with low air resistance and high thermal conductivity. During reverse heating, the gaseous working fluid flows from the condensation end to the evaporation end, flowing countercurrently within the Tesla valve with high air resistance and low thermal conductivity, thereby achieving the effect of a thermal diode. The diode can be widely used in the microelectronics industry.

The invention discloses a double-phase-change temperature self-response thermal diode and a preparation method thereof, and belongs to the technical field of phase change thermal diode manufacturing. The thermal diode solves the problems that an existing thermal diode is complex in structure, high in direction dependence, weak in thermal rectification effect and the like. The phase change material comprises a supporting framework, a first heat conduction layer and a second heat conduction layer are arranged at the two opposite ends of the supporting framework respectively, a PNIPAM hydrogel phase change layer and a heat insulation functional layer are sequentially arranged in the supporting framework from the first heat conduction layer to the second heat conduction layer, and the heat insulation functional layer is provided with a steam channel; phase change of a water medium is induced through phase change of the PNIPAM hydrogel phase change layer, and heat flow generated by phase change of the water medium flows through the steam channel to achieve one-way heat transfer. Compared with the technical defects of complex preparation process, obvious structural direction dependence and response delay in the prior art, the preparation method has the advantages of simple and time-saving preparation process, weak direction dependence, high self-response speed and strong thermal rectification effect.

The invention belongs to the technical field of intersection of mobile air conditioners and heat energy and water quality purification, and discloses a gravity assisted heat pipe waste heat recovery and condensate water direct drinking purification mobile air conditioning system and a control method. The system comprises an air conditioner refrigeration cycle unit, a condensate water collecting and pre-cooling unit, an efficient refined filtration and purification module, a cold and hot dual-temperature storage and supply unit and an intelligent control unit. An attached gravity heat pipe waste heat recoverer is adopted, an evaporation section of the recoverer is attached to a pipeline plane of an exhaust section of a compressor, waste heat is passively recovered through working medium phase change circulation, and reverse heat transfer is automatically prevented by means of the characteristics of a thermal diode; the efficient fine filtration purification module realizes deep purification and direct drinking of condensate water; a control strategy adopts an intelligent cooperation mode of waste heat priority and electric heating supplement. The three functions of refrigeration, normal-temperature direct drinking and boiled water supply are integrated in a compact space, the structure is reliable, energy is saved, efficiency is high, drinking water is safe, the problems that in the prior art, waste heat recovery is low in efficiency, reverse heat transfer is prone to occurring, and integration is poor are solved, and the system is suitable for various mobile scenes.

An electronic system for evaluating temperature differences between different pairs of thermal diodes to evaluate the quality of a thermal interface material layer used for cooling the electronic system. Formation of a thermal diode array on a semiconductor die allows the measurement of temperature and temperature differences between a plurality of the thermal diode pairs arranged in an orthogonal configuration. The temperature differences between the thermal diode pairs can indicate the presence of irregular distribution of the thermal interface material. Such components with thermal interface material flaws can be rejected during manufacture to improve manufacturing quality.

A thermal diode includes: a dielectric enclosure having a top surface, a bottom surface, a first side, and a second side; a first Weyl semimetal nanoparticle disposed on the first side; a second Weyl semimetal nanoparticle disposed on the second side; a nanograting disposed on the bottom surface; and a voltage source configured to provide a voltage bias to the nanograting to suppress surface waves from the first Weyl semimetal nanoparticle to the second Weyl semimetal nanoparticle and to modify surface waves from the second Weyl semimetal nanoparticle to the first Weyl semimetal nanoparticle.

This invention discloses a thermal diode fabric for personal cooling and its preparation method. The preparation method includes: preparing a spinning solution containing thermally conductive particles, a hydrophobic polymer, and a crosslinking agent; electrospinning under low humidity to obtain a dense heat-transferring fiber film; using the obtained dense heat-transferring fiber film as a receiving substrate, electrospinning under high humidity to obtain a fluffy heat-insulating fiber wadding layer; and finally performing a crosslinking heat treatment to obtain the thermal diode fabric. This invention utilizes a simple electrospinning process to prepare a fiber material with a double-layer asymmetric density structure in a single step by controlling humidity without changing the spinning solution. It exhibits unidirectional thermal conductivity similar to a thermal diode, effectively dissipating heat when the human body is in a hot environment and effectively insulating when the human body is in a cold environment, ensuring that the skin temperature is maintained even in situations with significant temperature changes, such as entering and exiting air-conditioned spaces in summer.

Systems or methods of the present disclosure may provide for any suitable number of thermal diodes selectively coupled to a single pair of package balls via a plurality of switches. That is, multiple thermal diodes may all be coupled to the single pair of package balls, which reduces a number of package balls coupled to the thermal diodes and increases a number of package balls available to other components. Additionally or alternatively, reducing the number of package balls coupled to the thermal diodes may reduce a size of the systems of the present disclosure.

The invention provides a flexible thermal diode and a processing method thereof, and the flexible thermal diode comprises a flexible supporting structure which is provided with a plurality of parallel air channels of hollow structures in the length direction of the flexible supporting structure; the two or more directional flow liquid absorption cores are made of flexible materials and are stacked at the upper end and the lower end of the flexible supporting mechanism respectively, a gradually-dense rectangular hydrophobic structure is formed in the length direction of each directional flow liquid absorption core, and a liquid working medium is injected into each directional flow liquid absorption core; the flexible shell is made of flexible materials and wraps the flexible supporting structure and the directional flowing liquid absorption core in a hot pressing mode. According to the implementation mode, directional flowing of the liquid working medium can be controlled through the directional flowing wick, and therefore directional heat transfer is achieved. The directional flow liquid absorption core, the flexible supporting structure and the flexible shell can be greatly bent, and the flexibility of the flexible thermal diode can be guaranteed.

The invention discloses a power-adjustable phase change energy storage ventilating duct for air conditioner operation decoupling. The power-adjustable phase change energy storage ventilating duct comprises a ventilating duct body, a phase change material plate, a phase change material heat preservation plate and an electromagnetic thermal diode heat exchange mechanism. The active control of heat transfer between the phase-change material and air can be realized by adjusting the electromagnetic thermal diode heat exchange mechanism, so that the effects of independently adjusting the charging and discharging power and decoupling from the operation of the air conditioner are achieved. The problems that in the prior art, energy consumption is wasted, and the air pressure drop is too large are solved, the controllability and operation efficiency of the energy storage device are improved, and the energy storage device is suitable for various building air conditioning systems and meets the energy storage requirement.

An electronic system for evaluating temperature differences between different pairs of thermal diodes to evaluate the quality of a thermal interface material layer used for cooling the electronic system. Formation of a thermal diode array on a semiconductor die allows the measurement of temperature and temperature differences between a plurality of the thermal diode pairs arranged in an orthogonal configuration. The temperature differences between the thermal diode pairs can indicate the presence of irregular distribution of the thermal interface material. Such components with thermal interface material flaws can be rejected during manufacture to improve manufacturing quality.

This invention provides a phase-change thermal diode based on directional transport and its implementation method. The phase-change thermal diode includes a tube wall, a directional transport capillary structure, a boiling-enhancing capillary structure, and a liquid working fluid. The inner side of the tube wall comprises the directional transport capillary structure and the boiling-enhancing capillary structure. The directional transport capillary structure functions to directionally transport the liquid working fluid; the boiling-enhancing capillary structure enhances boiling. The tube wall is in a vacuum or negative pressure environment and is filled with a compatible liquid working fluid. The directional transport capillary structure and the boiling-enhancing capillary structure are integrally formed by spin forming. This invention overcomes the shortcomings of existing phase-change thermal diodes, such as cumbersome fabrication processes, unsuitability for large-scale fabrication, and limited application range.

The invention discloses a thermal diode-phase change radiation refrigeration roof which comprises an optical projection film layer, an air thermal resistance layer, a radiation refrigeration layer, a thermal diode layer and a phase change material layer which are sequentially arranged from top to bottom. The air thermal resistance layer is a hollow layer between the optical transmission film layer and the radiation refrigeration layer, the thermal diode layer is constructed into a transverse U-shaped thermal diode, two opposite horizontal sections of the thermal diode layer are embedded into heat conduction metal plates located on the upper side and the lower side of the thermal diode layer respectively, and the thermal diode is embedded into the horizontal section of the heat conduction metal plate on the upper side to form a condensation section. The thermal diode is embedded into the horizontal section of the lower heat-conducting metal plate to form an evaporation section, a heat insulation layer is arranged on the outer side of the middle section of the thermal diode, and the sides, deviating from each other, of the upper and lower heat-conducting metal plates are bonded with the radiation refrigeration layer and the phase-change material layer respectively. According to the invention, day-cycle roof thermal disturbance self-balancing can be realized, energy consumption is reduced, and energy shortage is relieved.

The present invention discloses a self-powered device and an Internet of Things distributed sensor node based on a thermal diode. The self-powered device includes a forward / reverse thermal diode, electrodes and N-type / P-type thermoelectric bars, a boosting device and an energy storage device. The forward / reverse thermal diodes have the same structure, and are both composed of a low-thermal-conductivity mold prefabricated with a groove structure and a boss and a high-thermal-conductivity filler; the array form and number of the thermal diodes, the different grooves prefabricated in the low-thermal-conductivity mold, and the different high-thermal-conductivity fillers filled therein all directly affect the service performance of the self-powered device. In the present invention, even the long-term non-high-temperature waste heat generated in a restricted scenario or the short-term high-temperature waste heat generated in a remote scenario can enable the self-powered device with a millimeter-level external dimension to continuously output a voltage of volts or more for dozens of minutes. The integration of the structural unit is higher, the scalability in a restricted scenario is stronger, and the durability and reliability in a remote scenario are higher, providing a new idea for the self-power supply of Internet of Things sensor nodes in complex environments.

This invention discloses a high-vacuum low-temperature chamber, including a cavity, a sample stage located within the cavity, and further including a cold source module, a heat flow distribution module, a temperature equalization module, and a vacuum and cold shield module. The cold source module includes an external liquid nitrogen tank, a gas-liquid separation buffer tank, and a multi-channel solenoid valve array. The heat flow distribution module includes a multi-channel thermal diode, multiple thermal switches, and N temperature sensors for recording temperature response curves. Each channel of the multi-channel thermal diode is composed of a high thermal conductivity graphene film, with one end connected to the cold source and the other end connected to different areas of the sample stage. Each channel has a thermal switch based on a thermally induced phase change material. The temperature equalization module uses a high thermal conductivity graphite plate to ensure that heat can rapidly diffuse laterally once it enters the sample stage. The vacuum and cold shield module is a heatable regenerable cold shield with independent temperature control. Through online identification and rolling optimization, accurate tracking of the temperature trajectory is achieved without repeated manual parameter tuning, and it has adaptive capabilities.

The invention relates to a thermal diode device comprising an electronic unit (1) to be cooled, a heat spreading medium (2), a temperature sensor (4) for measuring the temperature of the heat spreading medium (2) and an actuator configured to thermally disconnect the electronic unit from the heat spreading medium if the temperature of the heat spreading medium is higher than a reference temperature, thereby inhibiting any heat transfer between the heat spreading medium and the electronic unit, and to thermally connect the electronic unit to the heat spreading medium if the temperature of the heat spreading medium is lower than the reference temperature, so as to allow conductive heat transfer between the electronic unit and the heat spreading medium.

The invention relates to the technical field of heat management of new energy automobiles, in particular to a quasi-crystal-based composite heat conduction material, a solid-state composite thermal diode and a preparation method. The composite heat conduction material is of a structure with at least two layers and comprises a quasi-crystal material base body layer and a thermoelectric material layer. Wherein the material of the quasi-crystal material matrix layer is an Al-Cu-Fe-based quasi-crystal material, and the material of the thermoelectric material layer is a Cu-Ag-Se-based thermoelectric material; the quasi-crystal material has a regular 20-surface symmetry; under the condition of heat conduction, an asymmetric thermal resistance network structure is arranged between the quasi-crystal material matrix layer and the thermoelectric material layer. The composite heat conduction material can form an asymmetric thermal resistance network structure through the characteristics that the thermal conductivity of the quasicrystal material matrix layer is positively correlated with the temperature and the thermal conductivity of the thermoelectric material layer is negatively correlated with the temperature, and the asymmetric thermal resistance network structure can improve the thermal rectification ratio of the thermal composite heat conduction material.

An augmented reality chemistry system is presented that combines visual and thermal feedback to create immersive laboratory simulations. A video see-through AR headset or device captures the user's real environment and overlays virtual chemical reactions inside a physical analog vessel. The physical vessel analog is instrumented with a thermal diode embedded in its structure, capable of safely heating or cooling its surface to simulate exothermic or endothermic reactions. A unique marker on the vessel is tracked by the AR device, enabling a processor to anchor virtual liquid visuals to the vessel and retrieve predetermined reaction parameters from a database. As virtual reactions occur (e.g. mixing chemicals), the system dynamically adjusts the vessel's temperature via the thermal diode in sync with the visual augmentation, so the user can feel temperature changes corresponding to the reaction. This AR apparatus enriches remote chemistry training by providing realistic heat feedback and interactive visualizations without real hazardous materials.

The present application belongs to the technical field of semiconductor devices, and relates to a near-field thermal radiation device with thermal rectification and thermal stability, which is arranged in a vacuum cavity shell and comprises a negative thermal expansion substrate, an emitter, a thermal expansion substrate and a receiver. The negative thermal expansion substrate is arranged on a top wall in the vacuum cavity shell, the emitter is arranged on a side of the negative thermal expansion substrate away from the top wall of the vacuum cavity shell, the thermal expansion substrate is arranged on a bottom wall in the vacuum cavity shell, and the receiver is arranged on a side of the thermal expansion substrate away from the bottom wall of the vacuum cavity shell. The emitter and the receiver are used for near-field radiation heat transfer. By adjusting the temperature of the emitter and the receiver, the negative thermal expansion substrate and the thermal expansion substrate are expanded or contracted, the vacuum gap between the emitter and the receiver is changed, the heat flux of the near-field thermal radiation device is changed, and the near-field thermal radiation device realizes the functions of a thermal diode with thermal rectification and a thermal stabilizer with thermal stability.

The present disclosure relates to a directional heat transfer using thermal control devices, including a dual phase change thermal diode and an active contact-based thermal switch. The thermal diode includes a positive temperature coefficient switching material and a negative temperature coefficient switching material arranged in series. The thermal switch includes two thermally conducting surfaces which may be moved to contact (i.e., having a distance between them of substantially zero) creating minimal thermal contact resistance. Both thermal control devices may be used to control heat flow into and / or out of a building.

The invention discloses a heat flow time sequence programmable chip heat dissipation system, belongs to the technical field of chip heat management, and aims at solving the technical problem of how to overcome the defects that in an existing chip heat dissipation technology, a heat flow path is fixed, and the time-space power consumption characteristic of a chip cannot be cooperatively utilized. According to the technical scheme, the system comprises a chip, thermal diode units distributed in an array mode are integrated on the back face of the chip, a multi-stage phase change heat storage layer is arranged above the thermal diode units, and the thermal diode units are connected with the phase change heat storage layer. A micro-channel cold plate is arranged on the multi-stage phase change heat storage layer; and each thermal diode unit is an independent controllable thermal switch, has high on-off ratio and quick response capability, and is used for reconstructing a heat flow network and realizing one-way conduction and controllable turn-off of heat flow.

The present invention discloses a heat flux regulation device based on near-field thermal radiation. The heat flux regulation device includes a first radiator and a second radiator arranged oppositely, the distance between the first radiator and the second radiator is d. The first radiator is a composite metamaterial, and the second radiator is a polar material. The first radiator includes a substrate and nanoparticles mixed and distributed in the substrate. By utilizing the inherent nonlocal effect of materials in a small volume, the present invention can achieve an efficient thermal diode under a small temperature difference. At the same time, by utilizing the characteristics of the multi-parameter tunability of the composite metamaterial, a high-degree-of-freedom thermal diode with the working temperature and the working temperature range being controllable to a certain extent by humans is realized.

Temperature of a processor is monitored and managed by a control circuit. A thermal diode is positioned to indicate the temperature of the processor. A controller measures a voltage across the thermal diode and calculates a temperature of the thermal diode as a function of the voltage and a correction factor. The correction factor is a constant value that is determined based on 1) a negative correlation between the voltage and a reference temperature of the thermal diode, and 2) a positive correlation between a resistance of the thermal diode and the reference temperature. The controller causes the processor to alter an operation in response to the temperature being above a threshold.

The invention provides a thermal diode effect calculation method and device for frozen soil block stone roadbed filler. The method comprises the following steps: placing a temperature sensor in a closed box containing water, and freezing the temperature sensor into ice; a block stone roadbed filler is used as an experimental material, a closed box is placed at one end of the experimental material, the other end of the experimental material is connected with a constant-temperature heating plate, and the whole system is sealed by thermal insulation cotton; starting a constant-temperature heating plate to heat the experimental material, measuring the duration time of the ice blocks in the closed box in the melting stage, and calculating the temperature difference between the two ends of the experimental material according to the duration time of the ice blocks in the melting stage, the total energy change of the system in the ice block melting stage and the temperature difference between the two ends of the experimental material. And the equivalent heat conductivity coefficient of the experimental material is calculated according to the attributes of the experimental material and the ice blocks, so that the thermal diode effect of the material is represented. The method and the device can realize accurate measurement of the thermal diode effect of the material, and are simple and efficient.

Systems and methods using the systems of testing radio frequency receivers include a radio frequency receiver testing device that has a PIN switch adapted to receive a radio transmission, a thermal diode coupled to the PIN switch and controlling the amount of noise within the PIN switch, and a noise diode providing a stable noise source to the radio frequency receiver testing device.

This invention relates to the technical field of thermal diode walls, and more particularly to a thermal diode wall based on spectrally selective aerogel. The wall comprises, from the outside in, an outer glass layer, an aerogel layer, an absorption layer, and a phase change heat storage layer, arranged sequentially from the outside in. The aerogel layer is a spectrally selective aerogel composed of CsWO3 nanoparticle-modified silica aerogel. The layers are tightly bonded together to form an integrated wall structure. The thermal diode wall is integrally attached to the outer surface of the building wall, with the inner side of the phase change heat storage layer bonded to the outer surface of the building wall. The thermal diode wall provided by this invention allows the functional layers to work synergistically, enabling the wall to adaptively regulate the direction of heat flow according to seasonal changes, thereby reducing building heating and cooling energy consumption without relying on active energy input.

The application discloses a convection type flexible heat diode based on an asymmetric wetting structure, which comprises, from top to bottom, a water collection function film at an evaporation end, a super-hydrophobic function film at a condensation end and a flexible packaging film which are sequentially arranged and sealedly packaged, and a plurality of liquid-vapor transport channels are arranged in the super-hydrophobic function film at the condensation end. The evaporation end is hydrophilized and treated with hygroscopic salt, so that the evaporation end has high efficient hygroscopic and evaporation capacity. Meanwhile, the condensation end is constructed with hydrophobic columnar array pores, so that the condensation liquid drops are quickly separated and directionally returned. The binary design of 'hydrophilic evaporation / hydrophobic condensation' creates low-thermal-resistance and high-thermal-resistance heat transfer paths in the positive and reverse directions, so that high efficient heat rectification is realized.

A system for controlling heat transfer between components. The system includes a first component and a second component spaced apart from the first component. The system also includes a thermal diode positioned between the first and second components. The thermal diode includes a negative coefficient of thermal expansion layer and a positive coefficient of thermal expansion layer. The thermal diode is configured to transition between a connected state and a disconnected state. The thermal diode is configured to transition back-and-forth between the connected and disconnected states with variations in at least one of a first temperature of the first component or a second temperature of the second component.

The present invention provides a novel solar-coupled air-water dual-source heat pump system based on a thermal diode. In this system, circulating water in the heating network exchanges heat with a heat pump working fluid in the air-water dual-source heat pump condenser. A portion of the cooled heat pump working fluid enters the thermal diode for heat exchange with hot water from the solar PVT panel. The heated heat pump working fluid enters the compressor, while the remaining portion enters the air-water dual-source heat pump evaporator, where it is heated and heated using an air or water source. The heated heat pump working fluid is then mixed with the heat pump working fluid output from the thermal diode in the compressor for pressure-boosting. The heated and pressurized heat pump working fluid then enters the air-water dual-source heat pump condenser for continued heat exchange with the circulating water in the heating network. The heating system of the present invention is particularly suitable for operation under complex and changeable climatic conditions and can be widely used in heating in cold regions, industrial and agricultural hot water supply, and other fields.

The present invention relates to an advanced augmented reality, AR, apparatus featuring a video see-through AR, VST-AR, device that captures images of a real-world environment and displays augmented versions on a screen. The system includes a corporal entity, such as an empty laboratory vessel, equipped with a unique identification marker. This marker provides real-time spatial data for generating visual augmentations representing virtual matter within the vessel. The apparatus integrates various sensors, including an inertial measurement unit, IMU, capacitive tactile sensors, and a thermal diode, to dynamically adjust visual augmentations based on user interactions. Additional sensory enhancements include an olfactory output fan, an eccentric rotating mass, ERM, motor, and auditory outputs. Wireless connectivity via IEEE 802.11 (Wi-Fi) and IEEE 802.15.1 (Bluetooth) ensures seamless communication between components. This AR system is particularly valuable for educational and laboratory settings, offering realistic, interactive simulations.