3983 results about "Heat transfer efficiency" patented technology

A vapor chamber structure includes a casing, a working fluid, and an improved wick layer. The casing has an airtight vacuum chamber. The working fluid is filled into the airtight vacuum chamber. The wick layer is formed on a surface of the airtight vacuum chamber. Therefore, the present invention can increase the backflow velocity of the working fluid and improve the boiling of the working fluid due to the match of the improved wick structure. Because the backflow velocity and boiling of the working fluid is increased, the heat-transmitting efficiency is increased.

A support structure for a compact planar cooling device is presented. The support structure allows the cooling device to be made with a simpler structure than most conventional cooling devices. The cooling device includes a planar casing, a wick layer, and the support structure. The support structure includes a flat plate with a portion cut out to form an opening and a spacer on the flat plate. The spacer is made by bending or folding the cut-out portion of the plate. The spacer enhances coolant circulation inside the cooling device by pushing the wick layer against the inner surface of the casing and maintaining a set distance between the support structure and the casing to allow unimpeded coolant movement. The cooling device can be made cost-effectively without compromising heat transfer efficiency.

A plate heat exchanger includes a plurality of plates sandwiched between a pair of end plates. Each of the plurality of plates has two passageways defined therein that are not in fluid communication with each other. Alternatively, some of the plurality of plates have a passageway, while some of the remaining plates have another passageway. Two fluids flow through the two passageways in a countercurrent fashion. Because the countercurrent flows are superior in heat transfer efficiency, it is possible to enhance the performance and reduce the size of the plate heat exchangers.

The invention provides a novel electric cooker temperature control assembly which is high in PTC heater heat transfer efficiency and stable in performance.The temperature control assembly comprises a kick type temperature controller, a PTC heater, a support and a heat conduction cover, wherein the upper heat dissipation surface of the PTC heater is tightly attached to the inner top surface of the heat conduction cover, and the kick type temperature controller and the PTC heater are pressed and fixed into the heat conduction cover through the support.The invention further provides an electric cooker using the temperature control assembly.The electric cooker further comprises a heating disc and a liner.A skirt extends outwards from the open portion of the heat conduction cover, an elastic component is arranged on the lower portion of the heat conduction cover, the heating disc is provided with a heat conduction cover installation hole, the heat conduction cover upwards penetrates through the heat conduction cover installation hole, the skirt of the heat conduction cover is sustained by the elastic component so as to be in close contact with the heating disc, and the PTC heater and the kick type temperature controller are connected in parallel and then connected with the heating disc in a power circuit of the electric cooker in series.The electric cooker adopting the temperature control assembly can achieve automatic temperature limitation, heat insulation and dry heating prevention.

The invention belongs to the technical field of preparation of phase change materials and microcapsules, and specifically relates to a method for preparing a hollow polymer microsphere coated with a phase change material. The method comprises the following steps of: performing surface modification on hydrophilic inorganic nanoparticles by an ionic surfactant, and adding the phase change material and monomers to the modified inorganic nanoparticles, which are taken as a stabilizer, to prepare the hollow polymer microsphere coated with the phase change material through a Pickering suspension polymerization method. The preparation process is simple, the raw materials are cheap and easily available, the inner wall of the prepared hollow polymer microsphere is made from polymers, the outer layer of the prepared hollow polymer microsphere is made from the inorganic nanoparticles, and the organic phase change material is coated inside the prepared hollow polymer microsphere. The prepared microsphere has a small size, the coating rate of the phase change material is high, and the outer inorganic nanoparticle layer enhances thermal stability, heat transfer efficiency, sealing performance and mechanical properties of the microsphere.

The invention discloses an electric cooking appliance. The electric cooking appliance comprises a pot body, a heating device and a temperature controller, wherein the pot body is provided with an inner pot cavity, and the inner pot cavity is internally provided with an inner pot; the heating device is arranged in the pot body and used for heating the inner pot; the temperature controller is arranged in the pot body and magnetically attracted on the outer wall face of the inner pot. According to the technical scheme, the temperature controller is magnetically attracted on the outer wall face ofthe inner pot, and more tightly fits the outer wall face of the inner pot under the action of magnetic field force, the fit gap between the temperature controller and the inner pot is smaller, and the heat transfer efficiency between the inner pot and the temperature controller is improved, so that the temperature at a temperature sensor is closer to the actual temperature of the inner pot, thereby reducing the error of the detection temperature of the temperature sensor, and being beneficial to the precise control over the temperature of the inner pot.

The present invention relates to environmental protection engineering technology, and is especially sludge drying and incinerating treatment process. The present invention has effective utilization of heat energy, no exhaust of harmful gas and bad smell, no exhaust of dangerous clinker, simple structure and high burning efficiency of the sludge incinerating system, no need of auxiliary fuel and other advantages.

The invention provides an environment-friendly method for prolonging the service life of a face milling cutter based on heat pipe phase changes, so durability of the face milling cutter can be remarkably improved under a milling especial for high-speed milling machining condition. The method comprises a novel face milling cutter. The novel face milling cutter comprises a heat pipe, a face milling cutter shank, a face milling cutter body and a face milling head. The face milling head is arranged at one end of the face milling cutter body, the face milling cutter shank is arranged at the other end of the face milling cutter body, the heat pipe is implanted into the face milling cutter body from the face milling cutter shank in the direction parallel with the axis of the face milling cutter body and is close to the main cutting edge part on the face milling head, and the heat pipe is filled with a liquid absorption core. Heat pipe phase change heat transferring is adopted in the method, so the heat pipe is higher than cutting fluid in heat transfer efficiency. A heat pipe technology is adopted, the cutting temperature of the face milling cutter is lowered, the heat pipe is more environment-friendly than the cutting fluid, and personal injuries to operation staff do not exist. In addition, the heat pipe adopted in the method is cheaper than the cutting fluid in market price, and therefore manufacturing cost of products of enterprises can be reduced.

An ethylene cracking furnace comprises a radiation segment, a convection segment, a bottom burner, sidewall burners and a quench boiler; the radiation segment is provided with a radiation room; radiation furnace tubes used for the pyrolysis of hydrocarbons and petroleum distillate are arranged inside the radiation room; each radiation furnace tube is composed of an inlet tube and an outlet tube; each inlet tube and each outlet tube are respectively provided with one channel; at least a radiation room 3 is arranged in the radiation segment of the cracking furnace; the radiation furnace tubes are arranged in two rows in the radiation room; each row of radiation furnace tubes forms a tube row plane; an inlet tube 6 and an outlet tube 7 of a radiation furnace tube are in two different tube row planes in an alternating interval way; the bottom parts of the inlet tube 6 and the outlet tube 7 are connected together through a symmetrical U-connector 8. The invention achieves a large-scale cracking furnace; the furnace tube arrangement way of the invention improves the radiation heat transfer efficiency of the radiation furnace tubes so as to prolong the operating cycle of the cracking furnace and reduce energy consumption of products.

A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles and one or more vapor vents are defined in the capillary structer. In this way, a network of capillary passageways are formed between the particles and vapor-vents through the capillary structure so as to aid in the transfer of working fluid by capillary action, while the plurality of fillets provide enhanced thermal transfer properties between the plurality of particles so as to greatly improve over all heat transfer efficiency of the device. A method of making the capillary structure according to the invention is also presented.

Disclosed is a heat exchanger configured by laminating layers having micro-channels by adapting a micromachining, wherein the micro-channels having uniform length and cross section are constructed within a heat exchanger body in a curved outer shape, thereby minimizing deviation for each channel and improving heat transfer efficiency.

Provided is a water cooling type cooling jacket for an electronic device including a pouch body formed of a soft, loose elastic material that is deformable to closely contact heat-generating elements having various shapes due to a contact pressure and accommodating and a coolant, and a coolant inlet tube and a coolant outlet tube formed at one side of the pouch body to allow the coolant to circulate inside the pouch body and connected to coolant circulation lines for circulating the coolant. Therefore, the water cooling type jacket for an electronic device can be adapted to various shapes of heat-generating elements having uneven surfaces and various shapes of installation spaces beyond electrical and mechanical limitation to increase a heat transfer area and maximize a heat transfer efficiency and can be installed at various electronic devices such as hard disk drives, video cards or memory cards and a PCB without spatial limitation. Also, the water cooling type, soft cooling jacket for an electronic device can reduce a fabrication cost by simplifying the structure while maintaining close adhesion and can safely protect various elements by distributing pressure applied to the elements.

The far infrared vegetable dewatering apparatus includes drying cabinet, transmission mechanical,, conveying mechanism and heater. The drying cabinet has material feeding port and induced draft port in the top and discharge port and air intake in the bottom. The present invention features that the drying cabinet is separated with partition boards into several layers with separated conveying mechanism, transmission mechanism, heating unit and guide board. The present invention has small size, convenient operation, fast drying speed, high heat efficiency and low power consumption, and the dried vegetable product has bright color and high quality.

The present invention provides a heat exchanger, which is improved in terms of heat transfer efficiency and space saving, which can be manufactured with simplified steps and at a reduced cost, and which ensures improved reliability when used, a method for manufacturing the heat exchanger, and an air conditioner including the heat exchanger. The heat exchanger includes: a plurality of plate fins, made of an aluminum alloy, subjected to a hydrophilic film forming treatment, and stacked at predetermined intervals to allow air to flow therebetween; and a flat heat transmission tube, made of an aluminum alloy and provided with a plurality of refrigerant flow paths arranged in a major axis direction of the tube so as to extend in a longitudinal direction of the tube; wherein the heat transmission tube is fitted into grooves provided in the plate fins, and a solder layer provided on an outer surface of the heat transmission tube at a front edge thereof is melted such that the heat transmission tube is fixedly secured to the plate fins by the solder.

A heat exchanger for exchanging heat between a first fluid and a second fluid is disclosed; wherein the heat exchanger has improved thermal efficiency and low fluid back pressure. The heat exchanger comprises conduits for conveying the first fluid, wherein the conduits include a plurality of flow passages. The flow passages are defined by a plurality of fins that are continuous along the direction of flow of the first fluid. Each fin includes a wave-shaped region, and adjacent fins sub-divide each flow passage into first and second sections that are interposed by a third section. The wave-shape of the fins creates a continuously varying cross-sectional area for each third section. The variation of the cross-sectional area of the third section, coupled with the wave-shape of the fins, induces a swirl flow between the third section and each of the first and second sections. This swirl flow improves the efficiency of the overall convection heat transfer in each conduit. Further, the overall cross-sectional area of each conduit remains constant even as the cross-sectional areas of individual flow passages changes, which mitigates the development of back pressure in the flow of the first fluid.

The invention discloses a thermal interface material and a semiconductor packaging structure. The semiconductor packaging structure comprises a substrate, a chip and a heat dissipation plate. The chip is arranged on the substrate, and the heat dissipation plate is arranged on the chip. The thermal interface material is contained between the chip and the heat dissipation plate; the thermal interface material comprises a grapheme layer and two low-melting-point metal layers; the two low-melting-point metal layers are covered on the grapheme layer from top to bottom. According to the thermal interface material and the semiconductor packaging structure, the flat heat-transfer efficiency between the chip and the heat dissipation plate can be improved through the grapheme material with high thermal conductivity; and the cost is lower than that of the thermal interface material using pure indium.

A reaction vessel which includes internally placed temperature controlling mixing baffles in which liquid is boiled, resulting in an isothermal heat sink. The energy of vaporization is supplied by the reaction vessel contents. The vapor produced by the boiling is directed to channel coils which surround the outside of the reaction vessel wall. The channel coils contact the outside wall of the reaction vessel perpendicularly, and provide mechanical support for the reaction vessel. The mechanical support from the channel coils allows for a decrease in the thickness of the reaction vessel wall and corresponding increased heat transfer efficiency between the channel coil contents and the reaction vessel contents. The entire above described apparatus is enclosed within an evacuated shell to provide additional insulation. The apparatus includes a gravitationally powered device that ensures that saturated or sub-cooled liquid enters the isothermal mixing baffles, thus guaranteeing that isothermal phase change will occur therein.

The invention discloses semiconductor material growing equipment, and in particular relates to a Czochralski crystal growing furnace for semiconductor single crystal growth. In the invention, the downward motion of a heat shield is used to replace the upward motion of a crucible, so that the crucible can only rotate and not ascend any more, thus, one degree of freedom is reduced and the system complexity is decreased; by adopting dual heaters respectively located at the bottom and the side face of the crucible respectively to control the growth of a crystal by aiming at different stages respectively, the temperature gradient control of the crystal and melt is more convenient; the relative positions between the crucible and the heaters are kept parallel and unchanged, and the heat radiation of the heaters is directly used for baking the crucible, so that the heat transfer efficiency is greatly improved in comparison with that in a traditional method in which the crucible in the traditional single crystal furnace is constantly away from a heating zone; and a flow guiding cylinder is used for guiding argon gas to carry out enhanced heat exchange on the crystal, so that an convection vortex of the argon gas above the melt is inhibited, thus, impurities and micro-defects in the crystal are favorably reduced and the consumption level of the argon gas is decreased.