Support structure for a planar cooling device

a support structure and cooling device technology, applied in indirect heat exchangers, lighting and heating apparatus, instruments, etc., can solve the problems of increasing the difficulty of keeping various electronic devices cool enough for optimal performance, reducing the overall thickness of the device, and not providing an adequate solution to heat generation in these devices
US20070240860A1Inactive Publication Date: 2007-10-18CELSIA TECH KOREA
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
CELSIA TECH KOREA
Publication Date
2007-10-18
Estimated Expiration
Not applicable · inactive patent

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Abstract

A support structure for a compact planar cooling device is presented. The support structure allows the cooling device to be made with a simpler structure than most conventional cooling devices. The cooling device includes a planar casing, a wick layer, and the support structure. The support structure includes a flat plate with a portion cut out to form an opening and a spacer on the flat plate. The spacer is made by bending or folding the cut-out portion of the plate. The spacer enhances coolant circulation inside the cooling device by pushing the wick layer against the inner surface of the casing and maintaining a set distance between the support structure and the casing to allow unimpeded coolant movement. The cooling device can be made cost-effectively without compromising heat transfer efficiency.
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Description

CROSS REFERENCE TO RELATED APPLICATION(S)

[0001] This application claims priority from Korean Patent Application No. 10-2006-0034917 filed on Apr. 18, 2006, the content of which is incorporated by reference herein in its entirety. BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The invention relates generally to heat transfer devices and more specifically to cooling devices capable of being placed in small spaces.

[0004] 2. Background Information

[0005] Today, memory chips, central processing units, and embedded chips are used in numerous types of electronic devices. To ensure reliable operation of these devices, the devices have to be prevented from overheating. Keeping various electronic devices cool enough for optimal performance has become more challenging as the circuit density increases and many of these devices are made smaller and lighter. Furthermore, many consumer electronic devices today include additional heat sources such as optical display component...

Claims

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