2650 results about "Heat transfer coefficient" patented technology

There is provided a means for uniformly controlling the in-plane temperature of a semiconductor wafer at high speed in a high heat input etching process. A refrigerant channel structure in a circular shape is formed in a sample stage. Due to a fact that a heat transfer coefficient of a refrigerant is largely changed from a refrigerant supply port to a refrigerant outlet port, the cross sections of the channel structure is structured so as to be increased from a first channel areas towards a second channel areas in order to make the heat transfer coefficient of the refrigerant constant in the refrigerant channel structure. Thereby, the heat transfer coefficient of the refrigerant is prevented from increasing by reducing the flow rate of the refrigerant at a dry degree area where the heat transfer coefficient of the refrigerant is increased. Further, the cross section of the channel structure is structured so as to be reduced from the second channel areas towards a third channel areas, and thereby the heat transfer coefficient of the refrigerant is prevented from decreasing. Accordingly, the heat transfer coefficient of the refrigerant can be uniformed in the channel structure.

A heating element includes a plurality of folded surfaces which can be resistively heating using electrical current. The heating element can advantageously function both as a heating source and a heat transfer device, as the need for separate fins or other heat dissipation members is eliminated. In some embodiments, the heating element can be included in a fluid heating system. The fluid heating system can include a fluid transfer device configured to deliver a volume or ambient air or other fluid through the heating element. As air moves past the heated folded surface of the heating element, it is heated. Heated air can then be discharged to one or more desired locations.

Systems and methods for operating a hydraulically actuated device/system are described herein. For example, systems and methods for the compression and/or expansion of gas can include at least one pressure vessel defining an interior region for retaining at least one of a volume of liquid or a volume of gas and an actuator coupled to and in fluid communication with the pressure vessel. The actuator can have a first mode of operation in which a volume of liquid disposed within the pressure vessel is moved to compress and move gas out of the pressure vessel. The actuator can have a second mode of operation in which a volume of liquid disposed within the pressure vessel is moved by an expanding gas entering the pressure vessel. The system can further include a heat transfer device configured to transfer heat to or from the at least one of a volume of liquid or a volume of gas retained by the pressure vessel.

Real-time monitoring of an energy characteristic of a building such as an energy performance of the building or a carbon offset of the building is performed by first computing a heat transfer coefficient of the building from nighttime steady-state thermal load data of the building and from nighttime steady-state indoor and outdoor temperature data of the building. A thermal inertia of the building is then computed from nighttime transient indoor temperature data of the building and nighttime transient thermal load data of the building. During daytime, a solar radiation gain coefficient is computed from daytime thermal load data, daytime indoor and outdoor temperature data, incident solar radiation data, and the heat transfer coefficient. The energy characteristic of the building is then estimated in real time from the heat transfer coefficient, the thermal inertia, and the solar radiation gain coefficient.

An airfoil insert comprises an insert wall, a contact element and a flow director. The insert wall defines an interior extending inside the insert wall from a first end to second end, and an exterior extending outside the insert wall from the first end to the second end. The contact element is formed on the exterior of the insert wall. The flow director is formed on the insert wall at a boundary between the interior and the exterior. The flow director increases a heat transfer coefficient of convective flow along the insert wall by directing the convective flow to the exterior of the insert wall.

A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigetant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level. Accordingly, the conventional dry evaporator is forced to absorb heat at a lower heat transfer coefficient, as compared with the present dry evaporator.

A surface cooler comprises a plate-like layer and a plurality of spaced-apart fins extending substantially perpendicular from an uppermost layer of the plate-like layer. The plurality of fins defining a plurality of air flow paths. The plurality of spaced-apart fins are configured to augment heat transfer of the surface cooler by increasing the turbulence levels of a fluid flowing through the airflow paths by promoting increased mixing with a resulting increase in the heat transfer coefficient of the surface cooler. A method of forming the surface cooler and an engine including the surface cooler.

A method for in situ heating of a selected portion of a targeted organic-rich rock formation such as an oil shale formation is provided. The method includes the steps of providing casing in a wellbore extending to a depth within or below the selected portion of the organic-rich rock formation, and also providing a tubing within the casing. An annular region is formed between the tubing and the surrounding casing. Air or other oxidant and a combustible fuel are injected into the wellbore. Either the air or the combustible fuel is in stoichiometric combustion excess. The method also includes providing hardware in the wellbore so as to cause the air and the combustible fuel to mix and to combust at substantially the depth of the organic-rich rock formation. The hardware may include more than one burner. Insulation may be placed along the tubing adjacent the first burner in order to reduce the heat transfer coefficient within the tubing and to provide a more uniform temperature within the annulus.

A mirror is provided with throughholes, or channels, formed through its main body and a coolant pipe of a heat-conductive material is inserted in each of the channels for passing a cooling fluid inside. The outer wall of the coolant pipe does not contact the inner wall of the channel, and there is left a gap in between. The gap contains a heat-conducting gas such as helium. The gap is of a width of less than 100 μm such that the gas has a high heat transfer coefficient even if its pressure is not too high. In some applications the gap may be filled with a heat-conductive fluid. It may be preferable, depending upon the circumstances, to form these channels proximally to the surface on which radiation is made incident. Additionally, the surface of the side of the mirror opposite the reflective side may be heated by auxiliary heat sources.

The invention provides a refrigerating device for cylinder clustered printed circuit board type micro-channels, comprising a medium feeding unit, a high-pressure micro-channel unit used for guiding a high-pressure gas refrigerating medium to flow, a throttling unit used for throttling the high-pressure gas refrigerating medium flowing through the high-pressure micro-channel unit, an evaporating unit used for enabling a low-temperature low-pressure gas refrigerating medium to absorb heat of external environment, and a low-pressure micro-channel unit arranged above the high-pressure micro-channel unit and used for guiding the low-temperature low-pressure gas refrigerating medium after heat exchanger to flow, and a medium discharge unit. Runners of the high-pressure micro-channel unit and the low-pressure micro-channel unit are all in cylinder clustered form, so that a medium can generate certain disturbance in flowing, thus enhancing heat transfer coefficients between a sheet bar and the medium and weakening the axial heat conduction of a refrigerator.

DCMD and VMD systems and methods for use in desalination applications are provided. The DCMD and VMD systems employ coated porous hydrophobic hollow fiber membranes. The coatings advantageously function to essentially eliminate pore wetting of the membrane, while permitting substantially unimpeded water vapor permeance through the fiber walls. The DCMD and VMD membranes are characterized by larger fiber bore diameters and wall thicknesses. The membranes substantially reduce the loss of brine sensible heat, e.g., heat loss via conductive heat flux through the membrane wall and the vapor space and, in exemplary embodiments, the brine-side heat transfer coefficient is dramatically enhanced by horizontal/vertical cross flow of brine over the outside surface of the coated fibers. Superior water vapor fluxes are achieved with the systems and methods.

The present invention is directed to a semiconductor processing apparatus and a method for clamping a semiconductor substrate and controlling a heat transfer associated therewith. According to one aspect of the present invention, a multi-polar electrostatic chuck and associated method is disclosed which provides a controlled and uniform heat transfer coefficient across a surface thereof. The multi-polar electrostatic chuck comprises a semiconductor platform having a plurality of protrusions that define gaps therebetween, wherein a distance or depth of the gaps is uniform and associated with a mean free path of the cooling gas therein. The electrostatic chuck is permits a control of a backside pressure of a cooling gas within the plurality of gaps to thus control a heat transfer coefficient of the cooling gas. The plurality of protrusions further provide a uniform contact surface, wherein a contact conductivity between the plurality of protrusions and the substrate is controllable and significantly uniform across the substrate.

The invention provides a preparation method of an epoxy-modified insulated thermal-conductive high-temperature resistant organosilicon coating, comprising the following steps: preparing raw materials; synthesizing an organosilicon pre-polymer; synthesizing an epoxy-modified organosilicon resin; and preparing the epoxy-modified insulated thermal-conductive high-temperature resistant organosilicon coating. The invention also provided the epoxy-modified insulated thermal-conductive high-temperature resistant organosilicon coating prepared by the method. The coating is composed by the epoxy modified organosilicon resin, fillers, a coupling agent and solvents. The coating prepared by the method in the invention takes account of insulation, thermal-conductivity, and high-temperature resistance at the same time, has coating adhesion of first level, hardness of 5H, a breakdown voltage of 1800V/0.5mA, 2 seconds, a heat transfer coefficient of larger than 100W/(m<2>.K), and no obviously changed coating at a temperature of 250 DEG C for 24 hours, therefore the coating can be widely used in various industrial equipment and household appliances.

A polymerization reactor for exothermic liquid phase reactions comprises a reaction zone which is divided into a plurality of channels by thermally conductive heat transfer fins which are conductively mounted on one or more heat pipes for the removal of heat of reaction from reactants and reaction products flowing between the heat transfer fins. The reactor of the invention is capable of maintaining essentially isothermal conditions without the use of complicated and maintenance intensive agitators. The reactor is particularly useful when viscosity of the reactants and/or reaction products is high, when the reaction conducted has a fast reaction rate and when consistent polymer properties are desired.

A Heat Exchanger comprising a three-dimensional ordered microstructure material within a shell. The three-dimensional ordered microstructure material has dimensions that allow for large surface area to volume ratios, between 300 and 15000 m²/m³. Alternatively the three-dimensional ordered microstructure may have an open volume fraction between 0.4 and 0.6. The three-dimensional ordered microstructure may be comprised of hollow truss elements and partially filled with a thermally conductive material or a fluid. The Heat Exchanger has a heat transfer coefficient multiplied by the surface area to volume ratio between 3.7*10⁷ and 7*10⁹ Watts per M³K.

A heat dissipation device with a fluid cavity that utilizes a hybrid of star pins with concave surfaces and sharp edges, and truncated dimples, which creates turbulence and a vortex phenomenon perpendicular to fluid flow transmission, and increases the heat transfer coefficient without increasing restriction of fluid flow through the device. This process increases the heat transfer along local pins which are located around each truncated dimple. This effect allows the use of taller pins than previous devices thus increasing the surface of heat transfer and thus these pins have a more efficient heat transfer coefficient along the total length of the pin, not possible previously. Star pins with sharp edges prevent the distortion of the highly efficient vortex flow which increases fluid flow and simultaneously intensifies the desired phenomena of extraordinary turbulence.

A cooling hole having an inlet passage forming an inward spiral flow path and an outlet passage forming an outward spiral flow path in which the two paths are counter flowing in order to improve the heat transfer coefficient. The spiral cooling hole is used in a blade outer air seal (BOAS) for a turbine in which the edges of the shroud segments include a counter flowing micro serpentine flow cooling circuit with thin diffusion discharge cooling slots for the BOAS edges. The total BOAS cooling air is impingement from the BOAS cooling air manifold and metered through the impingement cooling holes to produce impingement cooling onto the backside of the BOAS. The spent cooling air is then channels into the multiple micro serpentine cooling flow circuits located around the four edges of the shroud segments. This cooling air then flows in a serpentine path through the horizontal serpentine flow channels and then discharged through the thin diffusion cooling slots as peripheral purge air for the mate faces as well as the spacing around the BOAS or shroud segments. Trip strips are used in the serpentine flow channels for the augmentation of internal heat transfer cooling capability. The micro serpentine flow cooling air circuits spaced around the four edges of the shroud segments are formed into the shroud segments during the casting process of the shroud segments.

There is described a method for cooling and sealing of a heat shield element, comprising a main wall with an inner side, which is restricted by side walls or rims, and an outer side, which can be exposed to a hot fluid, and wherein a coolant is introduced into an impingement region of that heat shield element and an impingement flow of said coolant is directed on a surface area of that inner side through a plurality of impingement holes, effecting an impingement pressure drop. In the method discharge flow is metered through a number of discharge holes through said side wall or rims from the inner side to the outer side of the main wall, generating a discharge pressure drop in series with the impingement pressure drop. The impingement pressure drop and the discharge pressure drop are matched to one another so that a required coolant flow is generated which yields a required predetermined heat-transfer coefficient of the main wall. Discharging coolant into the gaps between side opposing walls of neighbouring heat shield elements only allows for an effective sealing against hot gas pingestion. Furthermore, the invention relates to a heat shield element, preferably to a single chamber or double chamber metallic heat shield element, which can be exposed to hot gases. In particular the heat shield element is suitable for being used in a combustion chamber of a gas turbine installation.

An apparatus and method for evaporating a coating solvent from a coating on a substrate and for minimizing the formation of mottle. The coating is heated with a first drying gas at no higher than a first heat transfer rate. The first heat transfer rate is created by a first heat transfer coefficient and a first temperature difference between the first coating temperature and the first drying gas temperature. The first heat transfer rate causes maximum evaporation of the coating solvent yet insignificant formation of mottle when the coating is at the first coating thickness and the first coating viscosity.

A heat sink includes a fluid channel and a cooling wall in contact with coolant flowing in the fluid channel. The channel is configured to vary the velocity of coolant along the length of the fluid channel to vary the coolant's heat transfer coefficient and thereby compensate for the coolant's temperature rise along the length of the fluid channel. The result is a heat sink that is isothermal along its length.

Temperature-controlled therapy wrap for treatment of at least a portion of an animate body including a fluid bladder including an inlet, an outlet, and at least one fluidic channel connecting the inlet to the outlet; and a thermal insulating member on the fluid bladder only directly adjacent the inlet and extending along the at least one fluidic channel. The therapy wrap may be adapted to compensate for a temperature delta in the wrap. The therapy wrap may include an insulating layer of one or more insulating members. The insulating layer is dimensioned and configured to have different coefficients of heat transfer. The insulating layer may have varying thicknesses and materials to achieve varying heat transfer rates. Also disclosed is a method of administering a temperature-controlled treatment to an anatomical body part.

A device has four fundamental components: an enclosure, a soft seal, a vacuum system and a thermal energy system having a thermal energy contacting element. The device provides thermal energy therapy and negative pressure therapy device simultaneously and/or in conjunction to a patient. The device has a thermal energy system that is more efficient in thermal energy transfer and the soft seal decreases tissue interface pressure to obtain the desired soft seal effect.

A method of electrostatically chucking a wafer while removing heat from the wafer in a plasma reactor includes providing a polished generally continuous surface on a puck, placing the wafer on the polished surface of the puck and cooling the puck. A chucking voltage is applied to an electrode within the puck to electrostatically pull the wafer onto the surface of the puck with sufficient force to attain a selected heat transfer coefficient between contacting surfaces of the puck and wafer.

The invention discloses an efficient machine for desalting sea water. The efficient machine for desalting sea water mainly comprises a sea water desalting device and a water supply tank, wherein the sea water desalting device comprises a high-pressure water chamber, a heat exchange chamber, a pipe sheet, a transversely fluted tube, an sprayer, a heat exchange surface, a film forming device, a baffle and a plurality of heat pipes; and a sewage draining cooling pipe and a desalted water cooling pipe are arranged inside the water supply tank. According to the efficient machine for desalting sea water, the technology of using smoke to release heat on high-speed spraying by an orifice spraying method is adopted, so that the heat transfer coefficient of the device is improved; the technology of using the excess heat of the smoke is preheated on the sea water, so that the smoke is secondarily used in the device, and the energy use ratio of the device is improved; the two-stage preheating technology of the fed material sea water is adopted, so that the temperature of the preheated sea water is raised; and the technology of using the film forming device to form rotary water film at the heat exchange surface of a round table body is adopted, so that the heat transfer effect and the evaporation effect of a water side are effectively improved. Therefore, the efficient machine for desalting sea water has the advantages of high energy use ratio and good heat transfer effect, and is suitable for the demands of places, such as ships, islands and enterprises on middle or small sea water desalting devices.