3332results about "Thermometer testing/calibration" patented technology

A temperature measuring device and a temperature measuring method are provided which are capable of obtaining precise measured temperature values with respect even to old persons, sucklings or infants, which device may be formed into a disposable type according to need, which method may be carried out using such a disposable type device according to need, and which enable precise temperature measurement in real time. An on-subject temperature measuring device 1, which is attached to a subject when a temperature of the subject is measured, receives a radio wave from a reader 2 as an external device and is thereby electrically powered. Using the electric power, temperature measurement is performed in the on-subject temperature measuring device 1. The results of the measurement are transmitted through radio waves to the reader 2 in the form of a temperature of the subject and ID data. The reader 2 is so constructed as to be connectable to a personal computer (not shown), and data processing by the personal computer is performed according to need.

Systems are provided for measuring temperature in a semiconductor processing chamber. Embodiments provide a multi-junction thermocouple comprising a first junction and a second junction positioned to measure temperature at substantially the same portion of a substrate. A controller may detect failures in the first junction, the second junction, a first wire pair extending from the first junction, or a second wire pair extending from the second junction. The controller desirably responds to a detected failure of the first junction or first wire pair by selecting the second junction and second wire pair. Conversely, the controller desirably responds to a detected failure of the second junction or second wire pair by selecting the first junction and first wire pair. Systems taught herein may permit accurate and substantially uninterrupted temperature measurement despite failure of a junction or wire pair in a thermocouple.

A remotely programmable integrated sensor transmitter device for measuring and reporting a physical quantity of a given medium comprises a sensor for measuring a physical quantity of a medium and providing an electrical output as a function of the property measured, a scaler module for receiving the electrical output and for producing a scaled analog signal as a function of the physical quantity and a scale selection input, and a data interface for receiving programming data from an external computer and for providing the scale selection output to the scaler module.

An object of the invention is to calibrate an upper pyrometer for indirectly measuring a substrate temperature at the time of epitaxial growth in a comparatively short time and with accuracy to thereby improve the quality of an epitaxial substrate. After calibrating an upper pyrometer by a thermocouple mounted to a temperature calibrating susceptor, a measured value of a lower pyrometer is adjusted to a calibrated value of the upper pyrometer. Then, a correlation line between substrate temperature indirectly measured by the upper pyrometer at the time of epitaxial growth onto a sample substrate and haze of a sample substrate measured immediately after epitaxial growth is set to indirectly measure a substrate temperature by the upper pyrometer at the time of epitaxial growth onto a mass-production substrate. Moreover, substrate temperature at the time of epitaxial growth onto the mass-production substrate is estimated by applying the haze of the mass-production substrate measured immediately after epitaxial growth to the correlation line and then a measured temperature of the upper pyrometer is adjusted to the estimated temperature.

Methods for thermally calibrating reaction chambers are provided. In some embodiments, methods may include calculating a first correction factor of a first contact type temperature sensor within a first reaction chamber utilizing a first temperature sensor and applying the first correction factor to a first temperature controller to provide a first calibrated contact type temperature sensor. Embodiments may also include calculating a first calibration factor of a first non-contact type temperature sensor within the first reaction chamber utilizing the first calibrated contact type temperature sensor and applying the first calibration factor to the first non-contact type temperature sensor to provide a first calibrated non-contact type temperature sensor.

An object of the invention is to calibrate an upper pyrometer for indirectly measuring a substrate temperature at the time of epitaxial growth in a comparatively short time and with accuracy to thereby improve the quality of an epitaxial substrate.After calibrating an upper pyrometer by a thermocouple mounted to a temperature calibrating susceptor, a measured value of a lower pyrometer is adjusted to a calibrated value of the upper pyrometer. Then, a correlation line between substrate temperature indirectly measured by the upper pyrometer at the time of epitaxial growth onto a sample substrate and haze of a sample substrate measured immediately after epitaxial growth is set to indirectly measure a substrate temperature by the upper pyrometer at the time of epitaxial growth onto a mass-production substrate. Moreover, substrate temperature at the time of epitaxial growth onto the mass-production substrate is estimated by applying the haze of the mass-production substrate measured immediately after epitaxial growth to the correlation line and then a measured temperature of the upper pyrometer is adjusted to the estimated temperature.

Methods and systems for calibrating a temperature control system in a vapor deposition chamber. A temperature sensor senses temperature within a semiconductor processing chamber and generates an output signal. A temperature control system controls a chamber temperature by controlling a heating apparatus based on the output signal. A method includes instructing the control system to target a setpoint temperature, and depositing a layer of material onto a surface in the chamber by a vapor deposition process. A variation of a property of the layer is measured while depositing the layer, the property known to vary cyclically as a thickness of the layer increases. The measured property is allowed to vary cyclically for one or more cycles. If there is a difference between a time period of one or more of the cycles and an expected time period associated with the setpoint temperature, the temperature control system is adjusted based on the difference.

A battery management system is disclosed for control of individual cells in a battery string. The battery management system includes a charger, a voltmeter, a selection circuit and a microprocessor. Under control of the microprocessor, the selection circuit connects each cell of the battery string to the charger and voltmeter. Information relating to battery performance is recorded and analyzed. The analysis depends upon the conditions under which the battery is operating. By monitoring the battery performance under different conditions, problems with individual cells can be determined and corrected.

A body of a thermometer (1001), a first location to be measured (1002), a second location to be measured (1003) and a third installation location (1004) is established by the thermometer management system. Further, communication lines (1005) are connected to network units at each location to be measured. Network units relay the sensor output from a sensor part to the communication lines. A sensor part is fixed to an object to be measured and sends a sensor output in response to the temperature of the object to be measured. A network unit has a radio frequency identifier (RFID) reader and transmits to the thermometer body commands and the like stored in the memory of an RFID card in response to approach of the RFID card arranged corresponding to a location to be measured. The thermometer body receives the commands and the like and performs predetermined operations.

A system and method to calibrate a temperature probe through immersion in a substance of known change of state temperature. The saturated Surface Acoustic Wave (SAW) probe temperature signal is calculated, overcoming oven reference temperature variability.

A method and an article of manufacture are provided to monitor a temperature sensing circuit and detect a fault therein. The method comprises monitoring sensor readings output from a plurality of temperature sensing circuits. An average sensor reading is determined, calculated from the sensor readings output from a subset of the temperature sensing circuits. Each of the sensor readings is compared to the average sensor reading. A fault is identified when one of the sensor readings deviates from the average sensor reading by an amount greater than a threshold, more particularly when one of the sensor readings deviates from the average sensor reading by an amount greater than the threshold at least a quantity of X times out of Y sensor readings.

The invention relates to a temperature measurement and calibration platform in space vacuum environment. The temperature measurement and calibration platform is favorable for realizing the simultaneous calibration of contact type temperature measurement and non-contact type temperature measurement, so the temperature measurement and calibration platform is served for heat vacuum and heat balance experiments of spacecrafts such as satellites, spaceship and the like. The temperature measurement and calibration platform comprises a constant temperature bath, wherein a double-sub-cavity vacuum cavity, the double-sub-cavity vacuum cavity comprises a first vacuum cavity body and a second vacuum cavity body, the first vacuum cavity body and the second vacuum cavity body are connected with a vacuum pumping device through a three-way valve, standard temperature indicator sensors are respectively arranged on the outer wall of the first vacuum cavity body and on the outer wall of the second vacuum cavity body, the standard temperature indicator sensors are connected with a temperature secondary meter, a laser light path reflecting device is arranged in the vacuum cavity of the first vacuum cavity body for calibrating a non-contact type temperature measuring system based on the tunable diode laser absorption spectrum technology, and the vacuum cavity of the second vacuum cavity body is used for accommodating a temperature sensor for calibrating a contact type temperature measuring system adopting the temperature sensor.

Methods and systems are disclosed for detecting overheating in an optical device before harmful consequences, such as severe local heating, can result. In one embodiment of the invention, a blackbody emitter is disposed in close proximity to a therapeutic optical fiber to absorb therapeutic radiation at a fault and re-emit blackbody (infrared) radiation. The emitter can be coupled to the fiber but, during normal operation, lies outside the optical path between the output of the laser radiation and the site of treatment. Systems and catheters incorporating such emitters are also described for effective monitoring of the laser power transmitted along the optical fiber within the phototherapy device.

An integrated circuit system has a reference data table for holding information that is used to control at least one circuit block in the system and also has a power supply circuit, a body bias control circuit, a clock delivery circuit, a temperature monitor circuit, and / or a configuration control circuit. The performance of the system is improved by obtaining system performance data by testing the system at different supply voltages, different body-bias voltages, different clock speeds, and / or different temperatures. Values based on the data are entered into the reference data table. The power supply circuit, the body bias control circuit, the clock delivery circuit, and / or the temperature monitor circuit data is adjusted using the entered values.

Methods and systems for detecting a temperature TO of a remote object are provided. The method includes storing in memory, a lookup table relating an output voltage of an infrared sensor to a temperature sensed by the infrared sensor V(TO, TA), determining a temperature sensor voltage output corresponding to a temperature TA proximate the infrared sensor, determining a first voltage as a function of the temperature TA proximate the infrared sensor and a reference temperature TREF, V(TA,TREF), determining a second voltage as a function of the temperature of the object TO and the reference temperature TREF, V(TO,TREF) by combining the determined temperature sensor voltage output and the first voltage, and determining a temperature of the object TO from the lookup table using the second voltage.

A system, apparatus and method for controlling environmental zones in a residence or other building using radio frequency enabled environmental controllers. At least one damper is associated with each of the various zones. From each environmental controller, a command is wirelessly transmitted, where the command includes an environmental control command and a respective unique identifier associated with the environmental controller. The command is received at a zone controller, and each environmental controller is bound with a respective one of the zones using the respective unique identifier associated with the environmental controller. The damper(s) associated with the zone that is bound with the environmental controller associated with the unique identifier from the command are operated in response to the zone controller. Environmental adjustment equipment is operated, which is responsive to the zone controller to execute the environmental control command.

Methods and apparatus are provided for eliminating hot spots on processor chips in a symmetric multiprocessor (SMP) computer system. Some operations, in particular, floating point multiply / add, repetitively utilize portions of a processor chip to the point that the average power of the affected portions exceeds cooling capabilities. The localized temperature of the affected portions can then exceed design limits. The current invention determines when a hot spot occurs and task swaps the task to another processor prior to the localized temperature becoming too hot. Moving of tasks to processors that have data affinity with the processor reporting a hot spot is considered. Further considerations include prioritizing unused processors and those processors that have not recently reported a hot spot.

Systems and methods for calibrating a temperature sensing system are disclosed. In one respect, a dual light source configuration may be provided. A first light source may illuminate a sensing fiber and an anti-Stokes band may be detected. A second light source may illuminate a sensing fiber and a Stokes band may be detected, where the Stokes band is substantially similar to the anti-Stokes band of the first light source. A ratio between the anti-Stokes and Stokes band may be used to calibrate a temperature sensing system.

A heat conduction-type sensor corrects (calibrate) effects of a temperature of a measurement target fluid and a type of the fluid on a measurement value in measurement of a flow velocity, a mass flow, or an atmospheric pressure. Also provided is a thermal flow sensor and a thermal barometric sensor with this correcting function, high sensitivity, simple configuration, and low cost. At least two thin films that are thermally separated from a substrate through the same cavity are provided, one thin film comprises a heater and a temperature sensor, and the other thin film comprises at least one temperature sensor, the temperature sensors being thin-film thermocouples. The thin film is arranged in proximity so that it is heated only through the measurement target fluid by heating of the heater. A calibration circuit calculates and compares quantities concerning heat transfer coefficients of a standard fluid and the unknown measurement target fluid.

The present invention relates to a calibration circuit, computer program product, and method of calibrating a junction temperature measurement of a semiconductor element, wherein respective forward voltages at junctions of the semiconductor element and a reference temperature sensor are measured, and an absolute ambient temperature is determined by using the reference temperature sensor, and the junction temperature of the semiconductor element is predicted based on the absolute ambient temperature and the measured forward voltages.

An infra-red imaging camera comprises focusing optics for gathering infra-red energy from an external scene, and an uncooled and unshielded detector arranged to detect infra red energy. Internal temperature sensing together with approximation of the temperature response of the camera provides a time varying calibration that allows the infra-red energy received at the detector to be used as a temperature measurement for objects in the camera's field of view.

Inexpensive position sensing devices that allow widespread use and availability of position information are disclosed. One embodiment of the position-sensing device acquires, down converts and extracts raw position data from position signals. Then, the position-sensing device wirelessly transmits the raw position data to a position-computing device, which converts the raw position data into the position of the device. The position-computing device can also receive auxiliary information from auxiliary sensors, and perform analyzes based on the position and the auxiliary information. The position-computing device can re-transmit the position and auxiliary information to a remote site for further analysis and / or central storage. The remote site can also download information to the position-computing device. The position-computing device can also control an actuator to perform an operation.

A battery pack includes a battery module, a plurality of temperature sensors, a temperature data generating unit, and a control unit. The battery module has a plurality of battery cells. The temperature data generating unit detects battery temperatures from the temperature sensors and generates battery temperature data including temperature values corresponding to the battery temperatures. The control unit determines whether or not the temperature sensors are defective based on the battery temperature data, and controls the battery module based on temperature values corresponding to temperature sensors determined not to be defective.

Sensor measurements are used to detect when a device incorporating the sensor is stationary. While the device is stationary, sensor measurements at a current device temperature are used to estimate model parameters. The model parameters can be used in a state estimator to provide an estimated attitude that can be provided to other applications. In some implementations, the estimated attitude can be used to mitigate interference in other sensor measurements.

A method for managing the power consumption of an information handling system including a processor and an associated cooling system. The method may include providing power to the cooling system based on a performance / power balance setting, accepting a user input to adjust the performance / power balance setting, and adjusting the power provided to the cooling system based on the adjusted performance / power balance setting. The performance / power balance setting may define a balance between performance of the processor and power consumption of the associated cooling system.

A method of diagnosing a temperature sensing system having a temperature sensor, a field processing module coupled to the temperature sensor, a bitbus, a fieldbus, and an auxiliary processing module communicating with the bitbus and the fieldbus. The method includes generating a temperature characteristic at the temperature sensor, processing the temperature characteristic at the field processing module, and generating field operating data including a temperature diagnostic parameter as a function of the temperature characteristic. The method also includes communicating the field operating data including the temperature diagnostic parameter over the bitbus from the field processing module to the auxiliary processing module, generating at the auxiliary processing module auxiliary field data as a function of the received field operating data, and communicating the auxiliary field data over the fieldbus.

A method and apparatus for temperature sensor calibration is disclosed. In one embodiment, an integrated circuit (IC) is tested at a first known temperature corresponding to a first temperature threshold. During the test, a first temperature reading is obtained from a temperature sensor. A first offset is calculated by determining the difference between the first known temperature and the first temperature reading. The first offset is recorded in a storage unit for later use during operation of the IC. During operation, the first offset may be added to temperature readings obtained from a temperature sensing unit to produce an adjusted temperature value. The adjusted temperature value may be compared to one or more temperature thresholds. Based on the comparisons, a power management unit may perform power control actions.

Systems, methods and apparatus are provided through which in some implementations a non-contact thermometer is diagnosed and calibrated under instruction of a mobile phone.

A distributed operations system having integrated diagnostics, a bitbus and a fieldbus and includes a field device for generating a field operating characteristic and a field processing module for receiving the field operating characteristic from the field device. The field processing module includes a field diagnostic component and a field communication component configured for communication over the bitbus. The field processing module is configured for generating field operating data including a field diagnostic parameter as a function of the field operating characteristic. An auxiliary processing module is configured for communicating with the bitbus and receiving the field operating data. The auxiliary processing module includes an auxiliary diagnostic component and an auxiliary communication component having a fieldbus interface and a gateway component. The auxiliary processing module is also configured for generating auxiliary field data as a function of the field operating data and for communicating the auxiliary field data over the fieldbus.