The application discloses a novel
phase change material packaging structure for electronic device
temperature control, which comprises a base and a
metal heat dissipation structure, a
closed space is formed in the base, the
closed space comprises a filling space and an expansion space, the expansion space is located at the top of the
closed space, the filling space is used for filling
phase change material, and the expansion space is used after the
phase change material expands; an connecting groove is arranged on the outer side of the base, the connecting groove is located at the top end or the bottom end of the base, the depth of the connecting groove is smaller than the thickness of the base, and the connecting groove is used for connecting a heat source; the
metal heat dissipation structure is connected in the base, the
metal heat dissipation structure is in the shape of a tree
branch, the root of the metal heat dissipation structure is connected with the base at the connecting groove, and the
branch of the metal heat dissipation structure is connected with the
phase change material; the metal heat dissipation structure is in the shape of a tree
branch, the forming material of the metal heat dissipation structure is metal material, and finally, the metal heat dissipation structure can reduce the use amount of metal material and improve the heat storage capacity of the packaging structure per
unit volume under the same heat exchange efficiency.