The embodiment of the invention provides a
chip heat dissipation
assembly and a vehicle, relates to the technical field of heat dissipation, and is used for reducing the stress borne by a
chip while improving the heat dissipation capability of the
chip heat dissipation
assembly. The chip heat dissipation
assembly comprises a circuit board, a chip, a heat dissipation structure and a heat-conducting medium. The chip is located on the circuit board. The heat dissipation structure covers the side, away from the circuit board, of the chip and is connected with the circuit board. The heat dissipation structure comprises a heat dissipation plate, a surrounding part and a boss part. The surrounding part and the boss part are located on the side, close to the chip, of the heat dissipation plate. The
enclosure part and the boss part are both connected with the heat dissipation plate, and the
enclosure part is arranged around the boss part; a
closed space is defined by the heat dissipation plate, the
enclosure part, the boss part and the chip, and a gap is formed between the boss part and the chip. The
closed space is filled with the heat-conducting medium, the heat-conducting medium is in a
solid state at a first temperature and is in a
liquid state at a second temperature, and the second temperature is higher than the first temperature. The chip heat dissipation assembly is applied to a vehicle so as to improve the heat dissipation capacity of a chip in the vehicle.