Electronic temperature control heat dissipation assembly
By designing an electronic temperature-controlled heat dissipation component that includes temperature control components and heat dissipation components, the problem of poor heat dissipation of electronic products is solved, effective cooling treatment is achieved, and the service life of the product is extended.
Patent Information
- Application Number
- CN202421064896.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-16
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2034-05-16
AI Technical Summary
The heat dissipation of electronic products is poor, which causes heat to occur after long working hours, which may damage the components.
An electronic temperature-controlled heat dissipation assembly is designed, including a base, support plate, lifting groove, lifting block, placing plate, lifting assembly, storage groove, temperature-controlling assembly and heat dissipation assembly. The temperature control component detects the heat on the surface of the electronic product through a temperature sensor, and starts the heat dissipation component through the signal transceiver and controller for cooling. The heat dissipation assembly includes a U-shaped cooling tube and a heat conductor, combining a liquid pump and a cooling box to realize the recycling of the coolant.
It effectively solves the problems of poor heat dissipation and low heat dissipation efficiency of electronic products. Through continuous cooling treatment, the service life of electronic products is extended.
Smart Images
Figure CN222655606U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of temperature control, in particular to an electronic temperature control heat dissipation component. Background Art
[0002] With the popularization of digital electronic products, electronic products are becoming more and more popular in our lives, and the proportion of their use is getting higher and higher. The heat dissipation of electronic products is the main problem they face. Most electronic products have poor heat dissipation. After working for a long time, the components are damaged due to heat. The heat dissipation of electronic products themselves is poor and the heat dissipation efficiency is low. Therefore, a solution is needed to solve the above problems. Utility Model Content
[0003] In view of the above situation, in order to overcome the defects of the prior art, the purpose of the present invention is to provide an electronic temperature control and heat dissipation component, which has the advantages of solving the problems raised in the above background technology.
[0004] The above technical objectives of the utility model are achieved through the following technical solutions:
[0005] An electronic temperature control and heat dissipation component comprises a base, symmetrical support plates are vertically fixedly connected on both sides of the top of the base, symmetrical lifting grooves are provided on adjacent sides of the support plates, lifting blocks are slidably fitted in the lifting grooves, a placement plate is fixedly connected between the lifting blocks, a lifting component for driving the placement plate to move up and down is provided on the top surface of the base between the support plates, a storage groove is provided on the top surface of the placement plate, a temperature control component is also provided in the storage groove, the temperature control component comprises a temperature sensor located in the installation groove, a signal transceiver located on the outer wall of the placement plate, a controller located on one side of the signal transceiver, and a heat dissipation component electrically connected to the controller is also provided on the top surface of the placement plate.
[0006] By adopting the above technical solution, the operator can place electronic products that work for a long time and have poor heat dissipation performance on the top surface of the placement board. The up and down lifting height of the placement board can be determined by adjusting the lifting component so that the operator can adjust to a suitable height for use. After the electronic product is placed on the top surface of the placement board, the temperature sensor in the storage slot can detect the heat on the surface of the electronic product and transfer the temperature to the signal transceiver and controller, and the heat dissipation component is started to continuously and effectively cool down and dissipate the heat of the electronic product above, thereby solving the problem of poor heat dissipation and low heat dissipation efficiency of the electronic product itself.
[0007] Further arrangement: the heat dissipation component includes a U-shaped groove opened on the top surface of the placement plate, a U-shaped cooling pipe is matched and placed in the U-shaped groove, a heat conductive plate is fixedly connected to the top of the U-shaped cooling pipe, the top of the heat conductive plate extends to the outside of the U-shaped groove, one end of the U-shaped cooling pipe is connected to a water inlet pipe, the end of the U-shaped cooling pipe away from the water inlet pipe is connected to a water outlet pipe, a cooling box is connected between the water inlet pipe and the water outlet pipe, the cooling box is fixedly connected to the outer wall of the placement plate, a liquid pump is placed in the cooling box, and the water outlet of the liquid pump is connected to the water outlet pipe.
[0008] By adopting the above technical solution, during the heat dissipation process, the liquid pump is started to pump the coolant in the cooling box to the water inlet pipe, and then transferred to the U-shaped cooling tube through the water inlet pipe. At this time, the heat conductive sheet arranged on the top of the U-shaped cooling tube contacts the surface of the electronic product to cool and dissipate heat. The cooled coolant is drained into the cooling box through the water outlet pipe, which can be conveniently used for circulating cooling.
[0009] It is further configured that: a plurality of heat dissipation holes are provided through the bottom of the U-shaped groove.
[0010] By adopting the above technical solution, when the U-shaped cooling pipe in the U-shaped groove cooperates with other components to dissipate heat and cool the surface of the electronic product, the temperature of the surface of the U-shaped cooling pipe increases accordingly. The setting of the heat dissipation holes plays a role in heat dissipation and ventilation, thereby reducing the surface temperature of the U-shaped cooling pipe and improving the heat dissipation efficiency.
[0011] Further configuration: the lifting assembly includes a lifting cylinder fixedly connected to the top surface of the base, a lifting plate fixedly connected to the top of the output end of the lifting cylinder, and the lifting plate is fixedly connected to the bottom of the placement plate on the side away from the lifting cylinder.
[0012] By adopting the above technical solution, when the operator places electronic products that work for a long time and have poor heat dissipation performance on the top surface of the placement board, the lifting cylinder can be turned on and the lifting plate can be used to lift the placement board and the electronic products on the placement board up and down to a suitable height for use and observation.
[0013] Further configuration: a non-slip pad is fixedly connected to the bottom of the base.
[0014] By adopting the above technical solution, when the entire device is placed on the operating table, the anti-skid pad arranged at the bottom of the base contacts the operating table, thereby playing an anti-skid role and avoiding affecting the use.
[0015] Further configuration: the outer wall of the base is also provided with a control display screen electrically connected to the temperature control component and the heat dissipation component.
[0016] By adopting the above technical solution, the control display screen can timely display the temperature data detected by the temperature sensor, and the staff can control the temperature control component and the heat dissipation component through the control display screen.
[0017] In summary, the utility model has the following beneficial effects:
[0018] The utility model is equipped with a temperature control component. When the electronic product is placed on the top surface of the placement plate, the temperature sensor in the storage slot can detect the heat on the surface of the electronic product and transmit the temperature to the signal transceiver and the controller, and the heat dissipation component is started to continuously and effectively cool and dissipate the electronic product above, thereby solving the problem of poor heat dissipation and low heat dissipation efficiency of the electronic product itself.
[0019] The utility model is equipped with a heat dissipation component. During the heat dissipation process, the liquid pump is started to pump the coolant in the cooling box to the water inlet pipe, and then transferred to the U-shaped cooling tube through the water inlet pipe. At this time, the heat conductive sheet arranged on the top of the U-shaped cooling tube contacts the surface of the electronic product to play a cooling and heat dissipation role. The cooled coolant is drained into the cooling box through the water outlet pipe, which can be used for convenient circulation cooling. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present application, but do not constitute an improper limitation of the present invention. In the drawings:
[0021] Figure 1 It is a main structural schematic diagram of the utility model;
[0022] Figure 2 It is a schematic diagram of the top view of the placement plate of the utility model.
[0023] In the figure, 1. base; 2. support plate; 3. lifting slot; 4. lifting block; 5. placement plate; 6. lifting assembly; 7. storage slot; 8. temperature control assembly; 9. temperature sensor; 10. signal transceiver; 11. controller; 12. heat dissipation assembly; 13. U-shaped slot; 14. U-shaped cooling pipe; 15. heat conductive sheet; 16. water inlet pipe; 17. water outlet pipe; 18. cooling box; 19. liquid pump; 20. heat dissipation hole; 21. lifting cylinder; 22. lifting plate; 23. anti-slip mat; 24. control display screen. DETAILED DESCRIPTION
[0024] The above and other technical contents, features and functions of the present invention are described in detail below with reference to the attached Figure 1 To Attachment Figure 2 The detailed description of the embodiments will clearly show that the structural contents mentioned in the following embodiments are all based on the drawings in the specification.
[0025] Various exemplary embodiments of the present utility model will be described below with reference to the accompanying drawings.
[0026] Embodiment 1: An electronic temperature control and heat dissipation component, such as Figure 1 , 2 As shown, it includes a base 1, a non-slip pad 23 is fixedly connected to the bottom of the base 1, symmetrical support plates 2 are vertically fixedly connected on both sides of the top of the base 1, and symmetrical lifting grooves 3 are opened on the adjacent sides of the support plates 2. Lifting blocks 4 are slidably fitted in the lifting grooves 3, and placement plates 5 are fixedly connected between the lifting blocks 4. A lifting component 6 for driving the placement plate 5 to move up and down is provided on the top surface of the base 1 between the support plates 2. The lifting component 6 includes a lifting cylinder 21 fixedly connected to the top surface of the base 1, and a lifting plate 22 is fixedly connected to the top of the output end of the lifting cylinder 21. The lifting plate 22 is fixedly connected to the bottom of the placement plate 5 on the side away from the lifting cylinder 21.
[0027] like Figure 1 , 2 As shown, a storage groove 7 is provided on the top surface of the placement plate 5, and a temperature control component 8 is also provided in the storage groove 7. The temperature control component 8 includes a temperature sensor 9 located in the installation groove, a signal transceiver 10 located on the outer wall of the placement plate 5, and a controller 11 located on one side of the signal transceiver 10. A heat dissipation component 12 electrically connected to the controller 11 is also provided on the top surface of the placement plate 5. The heat dissipation component 12 includes a U-shaped groove 13 provided on the top surface of the placement plate 5, and a U-shaped cooling pipe 14 is matched and placed in the U-shaped groove. A heat conductive sheet 15 is fixedly connected to the top of the U-shaped cooling pipe 14, and the top of the heat conductive sheet 15 extends to the outside of the U-shaped groove 13. One end of the U-shaped cooling pipe 14 is connected to a water inlet pipe 16, and the end of the U-shaped cooling pipe 14 away from the water inlet pipe 16 is connected to a water outlet pipe 17. A cooling box 18 is connected between the water inlet pipe 16 and the water outlet pipe 17. The cooling box 18 is fixedly connected to the outer wall of the placement plate 5, and a liquid pump 19 is placed in the cooling box 18, and the water outlet of the liquid pump 19 is connected to the water outlet pipe 17.
[0028] like Figure 2 As shown, a plurality of heat dissipation holes 20 are formed through the bottom of the U-shaped groove 13 .
[0029] like Figure 1 As shown, the outer wall of the base 1 is also provided with a control display screen 24 electrically connected to the temperature control component 8 and the heat dissipation component 12.
[0030] In the implementation mode of the utility model, the operator can place the electronic products that work for a long time and have poor heat dissipation performance on the top surface of the placement plate 5, and can determine the up and down lifting height of the placement plate 5 by adjusting the lifting component 6, so that the operator can adjust to a suitable height for use. After the electronic product is placed on the top surface of the placement plate 5, the temperature sensor 9 in the storage tank 7 can detect the heat on the surface of the electronic product and transfer the temperature to the signal transceiver 10 and the controller 11, and start the liquid pump 19 to pump the coolant in the cooling box 18 to the water inlet pipe 16, and transfer it to the U-shaped cooling pipe 14 through the water inlet pipe 16. At this time, the heat conductive sheet 15 arranged on the top of the U-shaped cooling pipe 14 contacts the surface of the electronic product to play a role in cooling and dissipating heat. The cooled coolant is drained into the cooling box 18 through the outlet pipe 17, which can be conveniently circulated for cooling and cooling, and can perform continuous and effective cooling and heat dissipation treatment on the electronic product, solving the problem of poor heat dissipation and low heat dissipation efficiency of the electronic product itself.
[0031] The above is a further detailed description of the present invention in combination with a specific implementation method, and it cannot be determined that the specific implementation of the present invention is limited to this; for technical personnel in the field of the present invention and related technical fields, based on the technical solution of the present invention, the expansion and replacement of operating methods and data should all fall within the protection scope of the present invention.
Claims
1. An electronic temperature control and heat dissipation component, comprising a base (1), characterized in that: Symmetrical support plates (2) are vertically fixedly connected to both sides of the top of the base (1); symmetrical lifting grooves (3) are provided on adjacent sides of the support plates (2); lifting blocks (4) are slidably fitted in the lifting grooves (3); a placement plate (5) is fixedly connected between the lifting blocks (4); a lifting component (6) for driving the placement plate (5) to move up and down is provided on the top surface of the base (1) between the support plates (2); a storage groove (7) is provided on the top surface of the placement plate (5); a temperature control component (8) is also provided in the storage groove (7); the temperature control component (8) comprises a temperature sensor (9) located in the installation groove, a signal transceiver (10) located on the outer wall of the placement plate (5), and a controller (11) located on one side of the signal transceiver (10); and a heat dissipation component (12) electrically connected to the controller (11) is also provided on the top surface of the placement plate (5).
2. The electronic temperature control and heat dissipation assembly according to claim 1, characterized in that: The heat dissipation component (12) comprises a U-shaped groove (13) opened on the top surface of the placement plate (5), a U-shaped cooling pipe (14) is matched and placed in the U-shaped groove, a heat conducting plate (15) is fixedly connected to the top of the U-shaped cooling pipe (14), the top of the heat conducting plate (15) extends to the outside of the U-shaped groove (13), one end of the U-shaped cooling pipe (14) is connected to a water inlet pipe (16), the end of the U-shaped cooling pipe (14) away from the water inlet pipe (16) is connected to a water outlet pipe (17), a cooling box (18) is connected between the water inlet pipe (16) and the water outlet pipe (17), the cooling box (18) is fixedly connected to the outer wall of the placement plate (5), a liquid pump (19) is placed in the cooling box (18), and the water outlet of the liquid pump (19) is connected to the water outlet pipe (17).
3. The electronic temperature control and heat dissipation assembly according to claim 2, characterized in that: A plurality of heat dissipation holes (20) are provided through the bottom of the U-shaped groove (13).
4. The electronic temperature control and heat dissipation assembly according to claim 1, characterized in that: The lifting assembly (6) comprises a lifting cylinder (21) fixedly connected to the top surface of the base (1), a lifting plate (22) fixedly connected to the top of the output end of the lifting cylinder (21), and a side of the lifting plate (22) away from the lifting cylinder (21) is fixedly connected to the bottom of the placement plate (5).
5. The electronic temperature control and heat dissipation assembly according to claim 1, characterized in that: An anti-skid pad (23) is fixedly connected to the bottom of the base (1).
6. The electronic temperature control and heat dissipation assembly according to claim 1, characterized in that: The outer wall of the base (1) is also provided with a control display screen (24) electrically connected to the temperature control component (8) and the heat dissipation component (12).