The invention provides a circuit board manufacturing method, a circuit board, and a mobile terminal. The method comprises the steps: providing a metal plate; forming a first groove, corresponding to apreset pattern, on the first surface of the metal plate; Setting first insulating layers on the first surface of the metal plate and the first groove, and setting a first conductive layer at one side, far from the metal plate, of each first insulating layer; forming a second groove, corresponding to the preset pattern, on the second surface of the metal plate, wherein the second groove is communicated with the first groove; forming a plurality of metal heat dissipation blocks; setting second insulating layers on the second surface of the metal plate and the second groove, setting a second conductive layer at one side, far from the metal plate, of each second insulating layer, and forming an initial circuit board; forming a first circuit connected with the metal heat dissipation blocks onthe first conductive layer of the initial circuit board, forming a second circuit connected with the metal heat dissipation blocks on the second conductive layer, and obtaining a circuit board. Therefore, the method can solve a problem that a conventional circuit board is warped because of the non-uniform stress.