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A PCB and a mobile terminal with the same

A PCB board and printed circuit technology, which is applied in the field of mobile terminals, can solve problems such as unfavorable centralization and miniaturization of mobile terminals, increase the overall volume of circuit boards, etc., and achieve good heat dissipation effect, high operation reliability, and good heat dissipation performance Effect

Inactive Publication Date: 2016-12-14
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, additional heat dissipation devices will increase the overall volume of the circuit board, which is not conducive to the development of centralization and miniaturization of mobile terminals.

Method used

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  • A PCB and a mobile terminal with the same
  • A PCB and a mobile terminal with the same

Examples

Experimental program
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Embodiment Construction

[0026] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0027] In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, so as to Specific orient...

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PUM

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Abstract

The invention provides a PCB and a mobile terminal with the same. The PCB comprises a plurality of printed circuit layers, insulation layers, and a plurality of heat dissipation layers. Each printed circuit layer is formed from printed circuits. The printed circuit layers are stacked successively from top to bottom. The top-layer printed circuit layer of the multiple printed circuit layers is connected with an electronic component. Each insulation layer is arranged between every two adjacent printed circuit layers. The multiple heat dissipation layers and the multiple printed circuit layers are arranged on the corresponding insulation layers in one-to-one correspondence. Each heat dissipation layer is located right below the electronic component. The multiple heat dissipation layers are arranged right below the electronic component in the PCB, so that rapid and effective heat dissipation of the electronic component is achieved and the operation reliability of the electronic component and a mobile terminal is improved.

Description

technical field [0001] The invention relates to the technical field of mobile terminals, in particular to a PCB board and a mobile terminal with the PCB board. Background technique [0002] As people's requirements for the performance of mobile terminals are getting higher and higher, the operation speed of various devices inside the mobile terminal is also getting faster and faster, and the power consumption of various devices is also increasing sharply, resulting in the internal circuit board of the mobile terminal when it is working. Some electronic components on the computer, such as processor chips, transistors, resistors and capacitors, etc., can generate a lot of heat. When the heat accumulates, it will cause abnormal operation of electronic components, burn out or short circuit of the circuit board and the electronic components on it. Therefore, it is very important to dissipate heat quickly and efficiently from the electronic components on the circuit board. [00...

Claims

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Application Information

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IPC IPC(8): H05K1/02
CPCH05K1/0207H05K1/0204H05K2201/06
Inventor 凌绪衡
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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