Manufacture method for manufacturing high-thermal-conductivity and single-sided aluminum substrate

Abstract

The invention provides a manufacture method for manufacturing a high-thermal-conductivity and single-sided aluminum substrate. The method comprises the steps of preparing a high-thermal-conductivity and single-sided aluminum substrate by using a conventional single-sided aluminum substrate; forming patterns on the outer layer of the high-thermal-conductivity and single-sided aluminum substrate; etching the high-thermal-conductivity and single-sided aluminum substrate after the patterns on the outer layer of the high-thermal-conductivity and single-sided aluminum substrate are well formed; and forming a circuit on the copper foil layer of the high-thermal-conductivity and single-sided aluminum substrate. According to the technical scheme of the manufacture method for manufacturing the high-thermal-conductivity and single-sided aluminum substrate, the depth-controlled hole drilling process is conducted and then holes are prepared as copper paste plugholes. In this way, an aluminum substrate is directly connected with the patterns of a circuit, so that the heat dissipation function is realized through a heat-conducting and insulating layer during the operation of elements welded on the patterns of the circuit. Meanwhile, the rapid heat dissipation function is realized through the connection of the copper paste plugholes with the aluminum substrate. Therefore, the thermal conductivity of the single-sided aluminum substrate is greatly improved, and the heat dissipation effect is effectively ensured.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board manufacturing, and specifically relates to a method for manufacturing a high thermal conductivity single-sided aluminum substrate. Background technique [0002] Single-sided aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. It consists of a unique three-layer structure, which are circuit layer (copper foil), insulating layer and metal base layer. Widely used in LED lighting, audio, power supply, communication electronics, office automation, automobiles, computers, power modules and other industries with high power and heat dissipation requirements. [0003] The structure of the existing single-sided aluminum substrate is as follows: the upper surface of the aluminum substrate is a thermally conductive insulating layer, and the thermally conductive insulating layer is a copper foil layer. The thermally conductive insulating layer is the core...

AI Technical Summary

Problems solved by technology

[0004] However, more and more high-power products on the market require the heat to be dissipated quickly. If the heat cannot be dissipated quickly, electronic components will fail.

Therefore, it is required that the thermal conductivity of the PCB board must be ≥100 W / (m K) to meet the heat dissipation requirements of its products, and the current thermal conductivity of single-sided aluminum substrates cannot meet the heat dissipation requirements of its products.

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