1926results about "Printed element electric connection formation" patented technology

The invention relates to the technical field of printed embedded PCBs, and discloses an embedded PCB and a manufacturing method thereof.The embedded PCB comprises a daughter board, a first dielectric layer and a first circuit layer which are sequentially arranged in a stacked mode in the first direction, a device is embedded in the daughter board, the device is located on the side, close to the first dielectric layer, of the daughter board, and the first dielectric layer is located on the first circuit layer. One side, close to the first dielectric layer, of the device is provided with a first part, and the first part is provided with a first protection part; a first connection hole is formed in the first dielectric layer, a first conductive part is filled in the first connection hole, the first protection part is connected and electrically conducted with the first conductive part, and the first conductive part is connected and electrically conducted with the first circuit layer. The embedded PCB and the manufacturing method thereof provided by the invention are used for improving the problem of poor hole filling in the electroplating hole filling process in the related technology.

The invention relates to a printed circuit board multilayer interconnection method, which comprises the following steps: firstly, automatically identifying and dividing interconnection channel areas of a circuit board, acquiring multi-dimensional parameters such as materials, thermal expansion coefficients and thermal cycle working conditions, realizing differential distribution and accurate preparation of a nano composite sensing material based on the multi-dimensional parameters, and obtaining the multi-dimensional parameters of the circuit board through an in-situ physical parameter acquisition and self-adaptive discrimination algorithm. Dynamic discrimination of stress abnormity and reverse driving of a micro heater are realized, the structure is induced to generate directional deformation so as to realize local automatic compensation, multi-point parameter data before and after compensation are used for health state modeling and residual life prediction, and big data archiving is combined to feed back manufacturing process optimization.

Disclosed is a printed circuit board and a manufacturing method for manufacturing the same, the printed circuit board including: a first insulating layer; a through-hole penetrating through the first insulating layer; a via conductor layer disposed in the through-hole, and having first and second groove portions recessed inwardly of the through-hole from an upper surface and a lower surface of the first insulating layer, respectively; a cavity penetrating through at least a portion of the first insulating layer; an electronic component disposed in the cavity; and a second insulating layer covering at least a portion of the first insulating layer, and disposed in at least a portion of each of the through-hole and the cavity.

The invention discloses a circuit board production method and a circuit board. The method comprises the following steps: laminating at least two substrates and at least one prepreg to obtain a first circuit board; performing drilling and copper deposition treatment on the first circuit board to obtain at least one target via hole; performing resin hole plugging on the target via hole to obtain a second circuit board; performing uniform copper deposition electroplating on the target surface with the target via hole on the second circuit board to obtain a third circuit board; grinding and polishing the hole filling copper layer on the third circuit board to obtain a fourth circuit board with a target copper layer; and performing line forming processing on the fourth circuit board to obtain a target circuit board. The generated hole filling copper layer is filled with the first groove generated after the resin is cooled, and the hole filling copper layer is ground and polished to obtain the target copper layer, so that the flatness of the surface of the circuit board can be improved, and the welding quality of the chip is ensured.

The invention discloses a method for manufacturing a surface flexible layer rigid-flexible combined board for an intelligent video module, which comprises the following steps of: taking a double-sided flexible copper-clad plate, and windowing a first surface copper layer corresponding to a first via hole to form a flexible core board; taking the first cover film and windowing corresponding to the first via hole to form a windowing cover film; correspondingly attaching the windowing covering film to one side of the second copper layer of the flexible core plate to form a covering film core plate; taking a prepreg, manufacturing a glue-blocking film corresponding to a flexible area of the prepreg, forming a glue-blocking prepreg, and manufacturing a rigid core plate; sequentially stacking and laminating the plates from top to bottom, enabling the glue blocking film to face the covering film core plate, then manufacturing a through hole in the rigid region, performing laser ablation on an insulating medium layer corresponding to a copper layer windowing pattern, electroplating, performing uncovering processing, removing a second copper layer at the bottom of a blind hole, forming a first via hole, and performing molding to form the rigid-flexible combined plate. The metallization process of the flexible area and the metallization process of the rigid area are combined into one-time electroplating, so that the consistency of the thickness of a copper plating layer is ensured.

The invention discloses a high-reliability hole copper control method for an automobile circuit board, and the method comprises the steps: adjusting the drilling parameters according to the hole diameter and the thickness-diameter ratio, improving the roughness of a hole wall through optimizing a drilling technology, and enabling the copper thickness of the hole wall after copper plating to meet the production requirements. According to the method, after the drilling technology is optimized, the hole wall roughness is smaller than or equal to 25 micrometers, and after electroplating, the hole wall copper thickness is larger than or equal to 25 micrometers.

The invention relates to the technical field of printed circuit boards, and discloses an asymmetric PCB manufacturing method and an asymmetric PCB, and the asymmetric PCB manufacturing method comprises the steps: providing a substrate, the substrate comprises an embedded layer, a first dielectric layer and a first conductive layer, the embedded layer is internally provided with a power module, and the substrate is also provided with a first connecting hole; the substrate is electroplated to obtain a first conductive part, a first electroplated layer and a second electroplated layer, the first conductive part fills the first connecting hole, the electronic element and the first conductive layer are both connected with the first conductive part, the first electroplated layer covers the first conductive part and the first conductive layer, the first electroplated layer and the first conductive layer form a first circuit layer, and the second electroplated layer covers the second conductive layer; the second electroplated layer covers one surface, deviating from the first dielectric layer, of the embedded layer. The manufacturing method of the asymmetric PCB and the asymmetric PCB provided by the invention are used for solving the problem that a circuit board embedded with a power module is easy to warp in the manufacturing process in the related technology.

The invention discloses a conductive paste, a metallized substrate and a metallization process for manufacturing the metallized substrate, the conductive paste comprises metal particles, the particle size of the metal particles is 0.1-10 [mu] m, and the mass ratio of the metal particles is 80-98%; in the metallization process, a copper layer is arranged on the hole wall of a through hole or a blind hole of a substrate, then conductive slurry is filled in the hole with the copper layer, heating sintering treatment is carried out, and after heating sintering is carried out in an inert gas atmosphere at the temperature of less than or equal to 300 DEG C, metal particles can be fused to form a connection structure or a eutectic structure. A reinforcing layer can be formed between the nano metal particles and the copper layer, and the reinforcing layer is a metal bonding layer or an intermetallic compound layer. The metallization mode is suitable for a through hole or a blind hole of a glass / silicon / ceramic substrate with a high aspect ratio and a micro aperture, and the technical problems that complete filling is difficult to achieve and filling defects exist in an existing electroplating process, the electrical resistivity of conductive paste is high, and the interface bonding force is insufficient can be solved.

An electronic device is provided. The electronic device includes a substrate, a through hole, a first circuit structure, and an electronic unit. The substrate includes a first side and a second side opposite to the first side. The through hole penetrates the substrate and connects the first side to the second side. The first circuit structure is disposed on the first side and includes a first metal layer and a first dielectric layer. The first metal layer overlaps a first portion of the first side. The first dielectric layer overlaps a second portion of the first side. The first portion is connected to the second portion. The electronic unit is electrically connected to the first circuit structure. Moreover, a surface roughness of the first portion is lower than a surface roughness of the second portion.

To provide a laminated substrate capable of ensuring a long-term reliability by preventing stress from being applied to a conductive paste for electrical connection when the laminated substrate is manufactured by laminating a plurality of multilayer substrates.SOLUTION: In a laminated substrate 100 formed by laminating a plurality of multilayer substrates 10, in each multilayer substrate 10, a through hole 30 penetrating through each multilayer substrate 10 and having an inner wall surface plated and filled with a resin 32 therein, and bonding lands 34 electrically connected to the through hole 30 are formed on an upper surface and a lower surface of the through hole 30. An insulating adhesive layer 40 and a conductive paste via 50 for electrically connecting the bonding lands 34 of the opposed multilayer substrates to each other by a conductive paste filled in a through hole 46 formed in the insulating adhesive layer 40 are provided between the multilayer substrates 10, and the conductive paste via 50 is provided at a position different from the position where the through hole 30 is formed.SELECTED DRAWING: Figure 1

The invention discloses a Tenting process-based system-level vehicle-mounted packaging substrate and a processing method thereof. The processing method comprises the following steps of: providing a first PNL plate provided with an outer-layer copper foil and a through hole; a connecting copper layer is formed on the inner wall of the through hole, and the connecting copper layer extends to the outer copper foil and surrounds a preset area outside the two ports of the through hole to form a ring hole copper layer; performing resin hole plugging on the through hole; grinding two ports of the through hole, reducing copper of the ring hole copper layer and grinding the whole plate in sequence so as to form a micro step between the outer copper foil and the ring hole copper layer; a thickened copper layer is formed on the outer copper foil and the ring hole copper layer, an outer pattern is manufactured on the thickened copper layer, and a second PNL plate is obtained; and after solder mask treatment is carried out on the second PNL, gold plating treatment is carried out in the mode of arranging false gold plating fingers on the edge of the second PNL and between the SET and the SET by adopting the optimal control current density, and an outer layer pattern finished product with the thickness consistency is manufactured. According to the processing method, the size consistency of the outer-layer pattern finished product is remarkably improved, and the market requirement is met.

The invention discloses an interconnection structure layer, a manufacturing method of the interconnection structure layer and a circuit board, the interconnection structure layer can be overlaid between two circuit layers with interconnection requirements, and the interconnection structure layer comprises an insulating layer and a conductive column; the conductive columns are embedded in the whole insulating layer at a preset hole density. According to the invention, the distribution density and the diameter of the conductive columns embedded in the insulating layer are limited, so that the bonding pads needing to be interconnected with the outside in the circuit layer can be at least in contact with one conductive column used for interlayer conduction, and the region between any two bonding pads in the same circuit layer is not only in contact with the conductive column. In this way, any interconnection between layers can be achieved, and meanwhile it is guaranteed that short circuit of a single circuit layer cannot be caused. High-precision alignment is not needed, random interconnection between the circuit layers is achieved, the number of pressing times accumulated on one board is reduced, and therefore the machining difficulty is reduced, and the yield is improved.

The invention discloses a preparation method and structure of a multilayer board based on a ceramic substrate. A ceramic substrate is used as a core substrate and is laminated with a conventional FR4 core plate and a prepreg to form a multi-layer plate laminated structure, and all layers of circuits are connected through drilling and electroplating. Meanwhile, the components are printed or / and mounted on the ceramic substrate in a surface-mounted manner, so that the components are pre-embedded, the performance and the integration level of the circuit board are improved, and the development requirements of miniaturization and high performance of electronic equipment are met; therefore, better heat management can be realized. Due to the fact that the periphery is made of the conventional FR4 plate, the production difficulty is reduced, the production efficiency is improved, and the production cost is reduced due to the mature technology and large-size production.

To form a conductive film on an inner peripheral surface (inner wall) of a hole penetrating to a rear surface from a front surface of an insulating board by an ink jet method without troubles.SOLUTION: When forming at least a conductive ground layer on an inner wall of a hole 13 on an insulating board 11 having the hole 13 penetrating to a rear surface from a front surface, a method executes: a charging step of charging ink 15 into the hole 13 by discharging conductive ink droplets into the hole 13 by an ink jet method in such a state that the hole 13 is blocked by a closing member 17 from the lower side of the board 11; a discharging step of discharging the ink charged into the hole 13 to the outside; and a drying step of drying at least an inner wall ink layer remaining on the inner wall of the hole 13 after the discharging step.SELECTED DRAWING: Figure 1

The invention relates to the technical field of printed circuit boards, and discloses a printed circuit board with an embedded ceramic part and a manufacturing method thereof.The manufacturing method of the printed circuit board with the embedded ceramic part comprises the steps that a laminated board is provided and comprises a first sub-board, a first dielectric layer, an embedded layer, a second dielectric layer and a second sub-board which are sequentially arranged in a stacked mode, the embedded layer comprises an embedded substrate and a ceramic part, the embedded substrate is provided with an embedded groove, the embedded substrate comprises a convex part arranged on the inner wall of the embedded groove, the ceramic part is arranged in the embedded groove, the edge of the ceramic part is provided with a concave part, and the convex part is accommodated in the concave part in a clearance manner; and processing a first via hole in the laminated plate, wherein the first via hole penetrates through the first sub-plate, the first dielectric layer, the lug boss, the second dielectric layer and the second sub-plate. According to the printed circuit board of the buried ceramic piece and the manufacturing method thereof, the problem that the quality of a subsequently drilled through hole is affected due to the fact that the pre-drilled hole located in the edge of the ceramic block is prone to the phenomena of insufficient glue filling and glue filling cavity in the prior art is solved.

The invention discloses a method and system for improving drilling deviation of a printed circuit board, and the method comprises the steps: carrying out the first lamination of a multi-layer printed circuit board, and obtaining a first laminated board; performing global scanning on the first laminated plate by using X-ray imaging equipment to obtain actual coordinates of an inner-layer bonding pad; the actual coordinates are compared with the design coordinates, and the offset of each area is calculated; generating a regionalized pre-compensation matrix according to the offset; and writing the pre-compensation matrix into follow-up engineering data of the same batch, and performing reverse compensation on the inner-layer graph, so that the corresponding relation between the inner-layer circuit bonding pad and the center of the drill hole after lamination is recovered. According to the method, the deviation can be predicted and adjusted at the initial stage of production, high-precision alignment of the plates in the whole production process is ensured, scrapping caused by deviation is remarkably reduced, and the overall reliability of a production line is improved.

Electromagnetic shields for electronic devices, and particularly electromagnetic shields with bonding wires for sub-modules of electronic devices are disclosed. Electronic modules are disclosed that include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged on or over the sub-modules. Bonding wires are disclosed that form one or more bonding wire walls along the substrate. The one or more bonding wire walls may be located between sub-modules of a module and about peripheral boundaries of the module. The electromagnetic shield may be electrically coupled to ground by way of the one or more bonding wire walls. Portions of the electromagnetic shield and the one or more bonding wire walls may form divider walls that are configured to reduce electromagnetic interference between the sub-modules or from external sources.

The invention discloses a BGA fan-out structure of a PCB and a manufacturing method of the BGA fan-out structure, at least one surface of the PCB is provided with a plurality of BGA bonding pads which are distributed in a square array mode, no wiring is conducted between the BGA bonding pads, the circle of BGA bonding pads arranged on the outermost periphery are peripheral bonding pads, the other BGA bonding pads are inner bonding pads, the center of each inner bonding pad is provided with an in-disc hole with an internal partition, and the in-disc hole is formed in the center of each inner bonding pad. The hole diameter of the in-plate hole is smaller than the outer diameter of the BGA bonding pad, and each inner circuit layer of the PCB is provided with a row of hole rings which are arranged around the in-plate hole in a one-to-one correspondence manner and are communicated with the in-plate hole, and a plurality of fan-out wires which are communicated with the hole rings in a one-to-one correspondence manner. The fan-out wires transversely penetrate through the middle of a gap between every two adjacent in-plate holes which are longitudinally arranged or transversely penetrate through the outer sides of the in-plate holes, and the hole rings in the different inner circuit layers are in one-to-one correspondence with the inner bonding pads in the different columns respectively. According to the invention, the design of fan-out of the BGA bonding pad from the inner layer is realized through the via in the pad and the inner layer wiring, and the problem of difficult fan-out wiring of the high-density bonding pad is solved.

The invention discloses a manufacturing method of a small-spacing lamp panel. The manufacturing method comprises the following steps: pressing; drilling is conducted, specifically, through holes are mechanically drilled, and the hole diameter is 0.2-0.3 mm; copper deposition: the thickness of a hole wall copper plating layer is 0.3-0.5 [mu] m; electroplating through holes, wherein the copper thickness in the holes is greater than or equal to 18 microns; the through holes are filled with epoxy resin with the shrinkage rate smaller than 0.5%, and curing is conducted; ceramic board grinding is conducted, an aluminum oxide ceramic grinding wheel is adopted for board grinding, the resin surface in the hole is flush with the surface of the outer layer copper foil of the multi-layer circuit board, the surface roughness Ra is smaller than 0.1 micrometer, and board grinding technological parameters are as follows: the pressure is 5-8 N / cm < 2 >, the rotating speed is 200-300 rpm, and the linear speed is 1-2 m / min; secondary copper deposition: copper deposition is carried out on the surface of the hole plugging resin to form a copper plating layer, and the thickness of the copper plating layer is 0.3-0.5 [mu] m; the whole board is electroplated, and the copper thickness on the resin is larger than or equal to 12 micrometers; and manufacturing an outer-layer circuit. The manufacturing method of the small-spacing lamp panel has the advantages of being low in cost, high in yield, simple in process and the like.

Described herein are methods and systems for additive manufacturing of parts comprising electrolytic deposits and electrophoretic deposits. Such methods and methods provide various new ways for integrating different materials into composite parts. Specifically, an additive manufacturing system comprises an electrode array with individually-addressable electrodes. Each individually-addressable electrode is coupled to a separate deposition control circuit, which selectively connects this electrode to a power supply. When forming a composite part, the electrode array can control the location of each electrolytic deposit (by controlling the current flow through each individually-addressable electrode) and each electrophoretic deposit (by controlling the electric field distribution). An electrolyte solution or an electrophoretic suspension is provided between the electrode array and deposition electrode to form corresponding deposits. In addition to the electrode-array provided control, alternating the electrolytic and electrophoretic deposition operations can be used to locate the corresponding deposits within a composite part.

The invention relates to a flexible circuit board and a manufacturing method thereof, the manufacturing method of the flexible circuit board comprises a typesetting step, an electroplating step, a through hole step and an insulation step, the typesetting step is to provide a base material and form a bottom layer circuit on the base material; in the electroplating step, the bottom layer circuit is electroplated so as to thicken or widen the bottom layer circuit into a conductive circuit; in the through hole step, a through hole is formed in a port of the conductive circuit or at a position adjacent to the port, the through hole penetrates through the base material and the conductive circuit, and a section is formed on the conductive circuit at the through hole; in the insulation step, an insulation structure is provided, the insulation structure is arranged on the base material to cover the conductive circuit, and part of the insulation structure is located in the through hole and covers the fracture surface; therefore, the use of an etching process can be avoided to reduce environmental pollution, metal consumption and power consumption, and the conductive circuit can be effectively prevented from being exposed to influence reliability.

The invention relates to the technical field of printed circuit boards, and discloses a circuit board and a manufacturing method thereof, and the circuit board comprises an embedded layer, a buffer layer and a pressing layer. A heat dissipation base is arranged in the embedded layer, and a power device is arranged on the side, facing the pressing layer, of the heat dissipation base. The buffer layer is provided with an accommodating groove, the orthographic projection of the buffer layer on the surface, deviating from the buffer layer, of the laminated circuit layer and the orthographic projection of the heat dissipation seat on the surface, deviating from the buffer layer, of the laminated circuit layer have an overlapped part, and the power device is lower than the surface, deviating from the embedded layer, of the buffer layer or flush with the surface, deviating from the embedded layer, of the buffer layer; the press-fit layer comprises a press-fit circuit layer and a press-fit connecting layer, part of the press-fit connecting layer is located between the press-fit circuit layer and the buffer layer, the press-fit connecting layer is provided with a first hole, and a first conductive part is arranged in the first hole. The circuit board and the manufacturing method thereof provided by the invention are used for solving the problem that the power device is easy to damage in the process of laminating the embedded layer and the laminating layer together in the related technology.

A wiring circuit board includes a metal supporting layer, a first metal thin film, an insulating layer including a through hole, a second metal thin film disposed on the first metal thin film in the through hole, and a conductive pattern electrically connected to the metal supporting layer through the first metal thin film and the second metal thin film in the through hole. The first metal thin film includes an oxide coating at least on a contact surface in contact with the insulating layer. In the central part of the through hole, the oxide coating has a thickness of 0 or a thickness smaller than a thickness of the oxide coating on the contact surface.

The invention discloses a circuit board and a back drilling method thereof, and the method comprises the steps: placing a to-be-drilled circuit board on a drilling machine platform, enabling a back drilling surface to be located at one side, away from the drilling machine platform, of a non-back drilling surface, and placing a conductive plate between a first metal layer and an induction mushroom head; the to-be-drilled circuit board comprises a first via hole, and the first via hole is located between the second metal layer and the non-drillable layer; a drill bit is controlled to move towards the conductive plate, and when it is detected that the drill bit makes contact with the conductive plate, the distance between the Z-axis direction original point of the main shaft of the drilling machine and the first metal layer is obtained as the first height; an insulating layer is placed between the conductive plate and the induction mushroom head, and the induction mushroom head is electrically connected with the second metal layer; the distance between the Z-axis direction original point of the main shaft of the drilling machine and the non-drillable layer is obtained as a second height; and according to the first height and the second height, carrying out drilling, electroplating and back drilling on the to-be-drilled circuit board to form the circuit board. According to the technical scheme, the back drilling precision and the back drilling quality can be improved.

One embodiment of the present invention provides a tin electroplating solution and a method for forming tin solder bumps using same. The tin electroplating solution according to an embodiment of the present invention includes a novel nucleation accelerator and a particle growth inhibitor, enabling the formation of uniform tin solder bumps with few voids, and thus has excellent performance.

A high reliability ceramic circuit board and method for producing the same are provided. The high reliability ceramic circuit board includes a ceramic substrate, a copper pillar structure, two printed copper layers, and two direct plated copper (DPC) structures. The ceramic substrate has a first surface and a second surface and has a through hole penetrating through the ceramic substrate. The copper pillar structure is formed in the through hole of the ceramic substrate. The two printed copper layers are respectively formed on the first surface and the second surface of the ceramic substrate, and the two printed copper layers are in contact with the copper pillar structure. The two direct plated copper (DPC) structures are respectively formed on the two printed copper layers. Each of the direct plated copper (DPC) structures includes a sputtered layer, a chemical plated copper layer, and an electroplated copper layer.

The invention relates to a method for realizing in-hole signal isolation based on chemical copper deposition resisting ink and a selective chemical copper deposition process, which comprises the following steps of: coating the chemical copper deposition resisting ink at preset hole opening positions on two sides of a PCB (Printed Circuit Board) core board to form chemical copper deposition resisting ink film layers; a palladium poisoning agent and a surface active agent for inhibiting palladium adsorption are added into the chemical copper deposition resisting ink; laminating the PCB core board to be separated with other boards to form a pretreated board; performing trepanning treatment on a preset trepanning position of the pretreatment plate to form a via hole; and performing chemical copper deposition treatment on the pre-treated board to form a copper layer on the side wall of the via hole of the pre-treated board, and removing the chemical copper deposition resistant ink film layer from the pre-treated board to form the PCB. Therefore, due to the fact that the palladium poisoning agent and the surface active agent for inhibiting palladium adsorption are added into the anti-electroless copper deposition printing ink, the formed anti-electroless copper deposition printing ink film layer is resistant to attack of chemical copper series liquid medicine, the problem of copper coating on a separation layer can be effectively reduced or eliminated, and in-hole signal separation can be effectively achieved.