3464results about "Printed element electric connection formation" patented technology

The invention relates to the technical field of printed embedded PCBs, and discloses an embedded PCB and a manufacturing method thereof.The embedded PCB comprises a daughter board, a first dielectric layer and a first circuit layer which are sequentially arranged in a stacked mode in the first direction, a device is embedded in the daughter board, the device is located on the side, close to the first dielectric layer, of the daughter board, and the first dielectric layer is located on the first circuit layer. One side, close to the first dielectric layer, of the device is provided with a first part, and the first part is provided with a first protection part; a first connection hole is formed in the first dielectric layer, a first conductive part is filled in the first connection hole, the first protection part is connected and electrically conducted with the first conductive part, and the first conductive part is connected and electrically conducted with the first circuit layer. The embedded PCB and the manufacturing method thereof provided by the invention are used for improving the problem of poor hole filling in the electroplating hole filling process in the related technology.

The invention discloses a manufacturing method of a high-precision bearing type rigid-flexible combined circuit board, a forming line is designed in a processing process board, the manufacturing method comprises the following steps: manufacturing a flexible board comprising a flexible area and a rigid combined area, taking a rigid copper-clad plate, and manufacturing a circuit pattern, the circuit pattern comprises an auxiliary circuit pattern corresponding to a bonding pad pattern of the flexible board, a first groove body is manufactured on the outline of the flexible area, a first connecting position is arranged between the first groove body and the auxiliary area, a second groove body is manufactured on the outline of the rigid combination area, a second connecting position is arranged between the second groove body and the auxiliary area, a rigid bearing plate is formed, the flexible plate and the rigid bearing plate are pressed and formed, and the high-precision bearing type rigid-flexible combined circuit board is formed. The flexible plate and the rigid bearing plate are manufactured independently, the rigid bearing plate is manufactured according to the forming line to form the groove body, then overall pressing is conducted, the flexible plate is formed through laser cutting, the problems of pulling, tearing and the like of the flexible plate caused by milling forming of the overall plate body are effectively solved, and the machining quality and reliability are improved.

The invention discloses a structure and a manufacturing method of a circuit board with interconnection of any layers of through holes, two ends of an isolation strip which needs to be insulated between layers at the through holes of the circuit board are respectively provided with a concave etching position, the concave etching positions serve as isolation rings, and the concave etching positions are formed after an isolation disc arranged on an inner-layer core plate is etched in a concave mode; the manufacturing method comprises the following steps that a circuit board is provided, a drilling position is arranged on the circuit board, and the drilling position is a position needing to be drilled in subsequent processing; the two ends of the interlayer isolation strip needing insulation at the drilling position of the circuit board are each provided with an isolation disc with the outer diameter larger than the outer diameter of the drilling position. A through hole is drilled in the position, corresponding to the drilling position, of the circuit board, so that the isolation disc on the inner layer is exposed in the through hole, then the isolation disc in the hole is removed through concave etching, and a concave etching position serving as an isolation ring is formed; and after the circuit board is subjected to copper deposition and electroplating, a structure of interconnection of any layers of the through holes is formed. According to the method, a plurality of signals can be transmitted in the same hole, and the purpose of interconnection of any layer in the through hole can be achieved.

The invention discloses a processing method of a millimeter wave radar circuit board, which adopts a continuous blind slot to replace a plurality of independent blind hole structures in a traditional structure, so that a continuous radio frequency circuit pattern can be formed, the signal shielding area is effectively increased, and the millimeter wave radar circuit board has a better signal shielding effect. Besides, the processing method of the embodiment of the invention also cancels the procedures of repeated electroplating, single-side copper reduction, circuit etching and the like in the traditional processing method, and can directly realize the manufacturing of the outer circuit, the first copper layer and the second copper layer through activation and copper deposition, thereby greatly shortening the processing flow of the millimeter wave radar circuit board, and improving the production efficiency of the millimeter wave radar circuit board. And the production efficiency of the millimeter wave radar circuit board is improved. In addition, the invention further discloses the millimeter-wave radar circuit board formed by the processing method of the millimeter-wave radar circuit board.

A circuit board structure includes a core, a wiring layer and a buried passive component. The wiring layer and the buried passive component are disposed on the core, and the buried passive component is electrically connected to the wiring layer. The buried passive component includes a first spiral metal layer, a second spiral metal layer and a dielectric interlayer. The first spiral metal layer is intertwined with the second spiral metal layer. The dielectric interlayer is disposed between the first spiral metal layer and the second spiral metal layer. The first spiral metal layer and the second spiral metal layer are spaced apart by the dielectric interlayer at least in the core.

The invention discloses a cross-level laser drilling method utilizing UV laser and carbon dioxide laser, and belongs to the technical field of printed circuit boards. The cross-level laser drilling method utilizing the UV laser and the carbon dioxide laser burns through a required penetrating layer with a copper layer through high-energy UV laser drilling; the dielectric layer on the reserved layer bottom copper is burnt out and subjected to hole finishing by adopting carbon dioxide laser drilling, so that no adhesive residue is ensured under the condition that the hole bottom is not burnt through, the conduction connection performance of the printed circuit board is ensured, the processing quality stability of the printed circuit board is improved, and the production cost is reduced. And the problems of burning through and burning loss of a bottom copper layer caused by high energy of UV laser can be well improved.

The invention provides a multilayer circuit board and a processing method thereof, a chip system and electronic equipment, and the processing method comprises the steps: processing a second hole channel, a first conductive pattern and a second conductive pattern on a first substrate, and processing a third hole channel on a second substrate; the first substrate, the second substrate and the first insulating layer are stacked, pressed and fixed; the processing method further comprises the following steps: carrying out electroplating hole filling on the first substrate to form a second conductive channel; the processing method further comprises the steps that the second substrate is electroplated so that a sixth conductive pattern and a third conductive channel can be formed, the first insulating layer comprises a first conductive part, and the first conductive pattern, the second conductive pattern and the sixth conductive pattern are electrically connected with the second conductive channel through the third conductive channel and the first conductive part. The second hole channel and the third hole channel are filled in an electroplating hole filling mode, so that the wiring density and the chip signal transmission capability of the multilayer circuit board are improved, and the electrical performance and the thermal performance of the multilayer circuit board are improved; electroplating hole filling is suitable for mass production, and the process yield is stable.

The invention relates to a printed circuit board multilayer interconnection method, which comprises the following steps: firstly, automatically identifying and dividing interconnection channel areas of a circuit board, acquiring multi-dimensional parameters such as materials, thermal expansion coefficients and thermal cycle working conditions, realizing differential distribution and accurate preparation of a nano composite sensing material based on the multi-dimensional parameters, and obtaining the multi-dimensional parameters of the circuit board through an in-situ physical parameter acquisition and self-adaptive discrimination algorithm. Dynamic discrimination of stress abnormity and reverse driving of a micro heater are realized, the structure is induced to generate directional deformation so as to realize local automatic compensation, multi-point parameter data before and after compensation are used for health state modeling and residual life prediction, and big data archiving is combined to feed back manufacturing process optimization.

The invention discloses a double-sided semi-embedded packaging substrate and a processing method thereof, and the processing method comprises the steps: carrying out the N times of double-sided circuit manufacturing and the N-1 times of double-sided layer adding of a multi-layer substrate alternately, and obtaining an operation board with two groups of symmetrical circuit structures; the circuit structure is provided with an outer circuit layer and (N-1) inner circuit layers which are communicated with each other, and the inner circuit layer located on the innermost side is provided with a bonding pad. Performing laser groove burning on the working board, and processing a blind groove which is provided with an opening at the outer circuit layer and takes the other inner circuit layer adjacent to the innermost inner circuit layer as the groove bottom locally on each group of circuit structure; removing the copper foil on the bottom of the blind groove; the bonding pads are completely exposed in the blind grooves corresponding to the bonding pads, the blind grooves in the two sets of circuit structures are communicated, and a through groove structure is obtained; and cleaning the surface of the bonding pad to obtain the double-sided semi-embedded packaging substrate. The processing method is simple and reasonable, the processing cost is low, the processing efficiency is high, and the reliability of the obtained double-sided semi-embedded packaging substrate is very high.

A heat sink component can include a body including a thermally conductive material that is electrically non-conductive, a lower conductive layer formed over a bottom surface of the body and electrically connected with the ground plane layer, and an upper conductive layer formed over a top surface of the body. The heat sink component can have a length in an X-direction that is parallel with the top surface of the body and a thickness in a direction perpendicular to the top surface. A ratio of the length to the thickness can be greater than about 7.

The invention discloses a PCB blind hole machining method and device, laser drilling equipment and a storage medium, the laser drilling equipment comprises a picosecond or femtosecond laser device and a CO2 laser device, after a first machining parameter of the picosecond or femtosecond laser device and a second machining parameter of the CO2 laser device are determined, on one hand, the first machining parameter of the picosecond or femtosecond laser device and the second machining parameter of the CO2 laser device are determined; the picosecond or femtosecond laser performs cold machining on the surface copper layer to form the annular heat insulation groove, the surface copper layer can be prevented from generating suspended copper at the opening of the blind hole, on the other hand, heat generated when the CO2 laser machines the blind hole can be prevented from being diffused to the opening of the blind hole in the surface copper layer through the annular heat insulation groove, suspended copper is further prevented from being generated, and on the other hand, the heat dissipation efficiency is improved. The picosecond or femtosecond laser device with low processing efficiency is adopted for annularly cutting the annular heat insulation groove in the surface copper layer, then the CO2 laser device with high processing efficiency is used for removing materials in the area in the outer contour of the annular heat insulation groove to achieve drilling, the processing efficiency of the two laser devices with different processing efficiency is considered, and the laser drilling efficiency is improved.

The invention discloses a manufacturing method of a multi-layer thermoelectric separation buried copper plate, which comprises the steps of preparing an inner-layer core plate, slotting and burying a copper block, roughly drilling a through hole, filling resin, manufacturing a secondary outer-layer pattern, preparing an outer-layer core plate, drilling a conductive hole and a heat dissipation hole and the like, and is characterized in that the copper block is divided into a heat dissipation area and a conductive area; thermoelectric separation is achieved through the design of independent through holes and blind holes, components needing to conduct electricity and components needing to conduct heat can be added on the copper block at the same time, and meanwhile efficient heat conduction and stable signal transmission are achieved and do not interfere with each other. Due to the partition design, the copper block is not only used for heat dissipation, but also used for electric conduction, the utilization rate of the copper block is improved, the design area of the PCB is reduced, and the development requirements of high-density and miniaturized electronic equipment are met.

To provide a ceramic board which has good heat dissipation, and in which an integration density is high.SOLUTION: According to an embodiment, the present invention discloses a manufacturing method of an ultrathin high-density multilayer interconnection ceramic board, containing steps of: preparing a ceramic wafer, performing a laser punching to the ceramic wafer, and forming a via hole; performing a vacuum magnetron sputtering to the ceramic wafer, and forming a seed titan layer and a copper layer onto a front surface of the ceramic wafer and on a wall of the via hole by the sputtering; manufacturing a ceramic double-layer core plate; manufacturing a multilayer substrate; manufacturing a vertical interconnection multilayer substrate; and manufacturing a high-end multilayer HDI ceramic board. The multilayer ceramic plate manufactured in the above mentioned processing can be easily processed as compared with LTCC and HTCC, and an energy consumption amount for the processing is deteriorated. A heat conductivity of a finished product is improved. A wiring is more accurate; a conductive resistance is low; and a signal transmission loss is low.SELECTED DRAWING: Figure 1

Disclosed is a printed circuit board and a manufacturing method for manufacturing the same, the printed circuit board including: a first insulating layer; a through-hole penetrating through the first insulating layer; a via conductor layer disposed in the through-hole, and having first and second groove portions recessed inwardly of the through-hole from an upper surface and a lower surface of the first insulating layer, respectively; a cavity penetrating through at least a portion of the first insulating layer; an electronic component disposed in the cavity; and a second insulating layer covering at least a portion of the first insulating layer, and disposed in at least a portion of each of the through-hole and the cavity.

A circuit carrier includes a substrate, a first build-up circuit structure, a second build-up circuit structure, a fine redistribution structure and at least one conductive through hole. The substrate has a top surface and a bottom surface opposite to each other. The first build-up circuit structure is disposed on the top surface of the substrate and electrically connected to the substrate. The second build-up circuit structure is disposed on the bottom surface of the substrate and electrically connected to the substrate. The fine redistribution structure is directly attached on the first build-up circuit structure, wherein a line width and a line spacing of the fine redistribution structure are smaller than those of the first build-up circuit structure. The conductive through hole penetrates the fine redistribution structure and a portion of the first build-up circuit structure and is electrically connected to the fine redistribution structure and the first build-up circuit structure.

The invention relates to the technical field of automobiles and industrial electronics, in particular to a power device embedded circuit board integrated with a ceramic plate and a preparation method of the power device embedded circuit board, and the power device embedded circuit board comprises the ceramic plate, a power device, a conductor layer, an insulating layer, a metal conduction blind hole, a bottom copper plating layer, an assembly welding layer and a blind groove. Compared with a traditional power module, the switching speed is higher, the switching loss is smaller, and the design is more flexible; compared with a power device embedded circuit board in the market, the circuit board has the advantages of lower thermal resistance, lower temperature rise and higher current output capability. The advantages of a traditional power module and an embedded circuit board are integrated, switching loss is small, thermal resistance is small, and the current output capacity can be greatly improved.

The invention discloses a K / Ka band circularly polarized transmit-receive common aperture phased array antenna and phased array, comprising: a multilayer stacked substrate structure, the substrate comprising a metal layer, a dielectric layer and a bonding layer; the K-band array element comprises a K-band radiation patch, a K-band feed structure and a K-band filtering structure, the K-band radiation patch, the K-band feed structure and the K-band filtering structure are arranged on part of the metal layer, and the K-band filtering structure comprises a first filtering structure, a second filtering structure and a third filtering structure; the Ka wave band array element comprises a Ka wave band parasitic patch, a Ka wave band radiation patch and a Ka wave band filtering structure which are arranged on part of the metal layer; each common-aperture phased-array antenna comprises a K-band array element and five Ka-band array elements. The common-caliber antenna provided by the invention can realize conical wide-angle scanning in the K / Ka wave band, and solves the problems of poor same-frequency and different-frequency isolation of the common-caliber antenna and poor scanning axial ratio performance of a circular polarization array.

The invention discloses a circuit board production method and a circuit board. The method comprises the following steps: laminating at least two substrates and at least one prepreg to obtain a first circuit board; performing drilling and copper deposition treatment on the first circuit board to obtain at least one target via hole; performing resin hole plugging on the target via hole to obtain a second circuit board; performing uniform copper deposition electroplating on the target surface with the target via hole on the second circuit board to obtain a third circuit board; grinding and polishing the hole filling copper layer on the third circuit board to obtain a fourth circuit board with a target copper layer; and performing line forming processing on the fourth circuit board to obtain a target circuit board. The generated hole filling copper layer is filled with the first groove generated after the resin is cooled, and the hole filling copper layer is ground and polished to obtain the target copper layer, so that the flatness of the surface of the circuit board can be improved, and the welding quality of the chip is ensured.

The invention discloses a method for manufacturing a double-sided sandwich aluminum substrate, which comprises the following steps of: taking an aluminum substrate, manufacturing an aluminum substrate through hole, and carrying out nickel electroplating processing; a mold is arranged on the first face, powder filling holes corresponding to the through holes of the aluminum substrate are formed in the mold, and a supporting plate is arranged on the second face; taking resin powder, and filling the resin powder into the through hole of the aluminum substrate; removing the mold, arranging a glue filling plate on the first surface, and carrying out glue filling pressing, etching processing and polishing processing to form an aluminum substrate core plate; respectively arranging circuit substrates on the upper surface and the lower surface of the aluminum substrate core plate, and carrying out pressing, through hole drilling, copper deposition, full-plate electroplating and post-process processing to form a double-sided sandwich aluminum substrate; the resin powder is filled, the supporting plate and the glue filling plate are used for compensation, a good insulating solid hole is formed after glue filling and pressing, the double-face sandwich aluminum substrate is formed through machining, and the related problems that a through hole insulating layer in the hole is hollow and falls off, glue filling is not full, and short circuit occurs are solved.

The invention discloses a method for manufacturing a surface flexible layer rigid-flexible combined board for an intelligent video module, which comprises the following steps of: taking a double-sided flexible copper-clad plate, and windowing a first surface copper layer corresponding to a first via hole to form a flexible core board; taking the first cover film and windowing corresponding to the first via hole to form a windowing cover film; correspondingly attaching the windowing covering film to one side of the second copper layer of the flexible core plate to form a covering film core plate; taking a prepreg, manufacturing a glue-blocking film corresponding to a flexible area of the prepreg, forming a glue-blocking prepreg, and manufacturing a rigid core plate; sequentially stacking and laminating the plates from top to bottom, enabling the glue blocking film to face the covering film core plate, then manufacturing a through hole in the rigid region, performing laser ablation on an insulating medium layer corresponding to a copper layer windowing pattern, electroplating, performing uncovering processing, removing a second copper layer at the bottom of a blind hole, forming a first via hole, and performing molding to form the rigid-flexible combined plate. The metallization process of the flexible area and the metallization process of the rigid area are combined into one-time electroplating, so that the consistency of the thickness of a copper plating layer is ensured.

The present invention provides a method for metallizing graphene oxide holes in a flexible copper-clad laminate, wherein the flexible copper-clad laminate with through holes is immersed in a graphene oxide aqueous solution and then subjected to chemical copper plating. The hole wall produced by the hole metallization method is smooth and flat, has no defects, and does not cause the problem of missed plating.

The invention discloses a high-reliability hole copper control method for an automobile circuit board, and the method comprises the steps: adjusting the drilling parameters according to the hole diameter and the thickness-diameter ratio, improving the roughness of a hole wall through optimizing a drilling technology, and enabling the copper thickness of the hole wall after copper plating to meet the production requirements. According to the method, after the drilling technology is optimized, the hole wall roughness is smaller than or equal to 25 micrometers, and after electroplating, the hole wall copper thickness is larger than or equal to 25 micrometers.

The invention belongs to the technical field of circuit board manufacturing, and particularly relates to a forming method of a conductive hole in a circuit board and the circuit board. The invention discloses a forming method of a conductive hole in a circuit board. The forming method comprises the steps of obtaining the circuit board; drilling a base hole in a to-be-drilled area on the circuit board along the thickness direction of the to-be-drilled area; forming a conductive layer on the hole wall of the base hole; and removing part of the material of the conductive layer along the thickness direction of the circuit board to obtain a plurality of conductive wires which are mutually spaced along the circumferential direction of the base hole and extend along the thickness direction of the circuit board so as to prepare the conductive hole. According to the invention, a part of material of a circle of conductive layer of a common whole conductive hole is removed to obtain a plurality of conductive wires which are mutually spaced, and one conductive wire can transmit one signal, so that one conductive hole can be connected with a plurality of signals, the utilization rate is high, and the number of conductive holes can be reduced.

The invention relates to the technical field of printed circuit boards, and discloses an asymmetric PCB manufacturing method and an asymmetric PCB, and the asymmetric PCB manufacturing method comprises the steps: providing a substrate, the substrate comprises an embedded layer, a first dielectric layer and a first conductive layer, the embedded layer is internally provided with a power module, and the substrate is also provided with a first connecting hole; the substrate is electroplated to obtain a first conductive part, a first electroplated layer and a second electroplated layer, the first conductive part fills the first connecting hole, the electronic element and the first conductive layer are both connected with the first conductive part, the first electroplated layer covers the first conductive part and the first conductive layer, the first electroplated layer and the first conductive layer form a first circuit layer, and the second electroplated layer covers the second conductive layer; the second electroplated layer covers one surface, deviating from the first dielectric layer, of the embedded layer. The manufacturing method of the asymmetric PCB and the asymmetric PCB provided by the invention are used for solving the problem that a circuit board embedded with a power module is easy to warp in the manufacturing process in the related technology.

The invention relates to the technical field of circuit board preparation, and discloses a multilayer composite circuit board preparation method and a multilayer composite circuit board, and the method comprises the steps: mixing ceramic-based powder with nano metal particles, and carrying out sintering to form a heat-conducting microporous ceramic material with a continuous heat-conducting network and a microporous structure; a plurality of heat-conducting microporous ceramic materials are laminated and then pressed into a composite substrate through vacuum hot pressing, and through heat-conducting through holes are formed in the composite substrate; the composite substrates with the heat conduction through holes are stacked, a micropore layer used for heat conduction and shock absorption is arranged between every two adjacent composite substrates, and the stacked composite substrates and the micropore layers are subjected to vacuum hot pressing to form a multi-layer structure. According to the multi-layer composite circuit board preparation method and the multi-layer composite circuit board, through the continuous heat conduction network, the micropore structure and the micropore layer, the heat conduction performance is remarkably improved, thermal stress and mechanical stress are effectively released through the elastic characteristic of the micropore structure, and the overall stability of the multi-layer composite circuit board is enhanced.

A method of manufacturing a via-in-via vertical interconnect in a printed circuit board (PCB), including: drilling a first hole through the PCB and through internal conductive layer 504; drilling a second hole into a top side of the PCB; plating the first hole and the second hole with a conductive material to form an outer layer 512; drilling a third hole through the PCB wherein a portion of the plating is removed between the first hole and the second hole; filling the first, second, and third holes with an outer filler 516; drilling a fourth hole through the outer filler; plating the fourth hole with a conductive material to form an inner layer 520; filling the fourth hole with an inner filler 522; forming a via-in-via pad 528 on top of the inner filler connected to the inner layer 520; and drilling a fifth hole 530 through the bottom of the PCB along the fourth hole to remove a portion of the inner filler and inner layer wherein the top of the fifth hole is below the internal layer 504.

The invention discloses a conductive paste, a metallized substrate and a metallization process for manufacturing the metallized substrate, the conductive paste comprises metal particles, the particle size of the metal particles is 0.1-10 [mu] m, and the mass ratio of the metal particles is 80-98%; in the metallization process, a copper layer is arranged on the hole wall of a through hole or a blind hole of a substrate, then conductive slurry is filled in the hole with the copper layer, heating sintering treatment is carried out, and after heating sintering is carried out in an inert gas atmosphere at the temperature of less than or equal to 300 DEG C, metal particles can be fused to form a connection structure or a eutectic structure. A reinforcing layer can be formed between the nano metal particles and the copper layer, and the reinforcing layer is a metal bonding layer or an intermetallic compound layer. The metallization mode is suitable for a through hole or a blind hole of a glass / silicon / ceramic substrate with a high aspect ratio and a micro aperture, and the technical problems that complete filling is difficult to achieve and filling defects exist in an existing electroplating process, the electrical resistivity of conductive paste is high, and the interface bonding force is insufficient can be solved.

The invention discloses a multilayer circuit board preparation method and system based on via hole filling optimization and a multilayer circuit board, and relates to the technical field of circuit board preparation, and the method comprises the steps: obtaining the size of a via hole, calculating the depth-to-width ratio, constructing a viscosity gradient function, taking a via hole filling quality evaluation index as a first optimization target, and solving an optimal ratio; designing a vacuum degree control strategy; the current capillary pressure is obtained, differential pressure driving force is calculated according to the current through hole gas pressure intensity, the time needed for filling and the preset ultrasonic vibration duration are calculated in combination with the through hole diameter, the hole depth and the viscosity gradient function, and ultrasonic auxiliary filling is carried out while through hole filling is carried out; filling the via hole, and controlling the vacuum degree according to the vacuum degree adjusting curve; and the real-time filling rate and the cavity volume are obtained, a second target function is constructed with the difference between the minimum target filling rate and the actual filling rate and the filling cost as a second optimization target, and the optimal filling step number and the optimal single injection material volume are solved.

The present invention relates to a copper-clad plate with plated-through holes, a circuit board with plated-through holes, and manufacturing methods therefor. Specifically, a method for manufacturing a copper-clad plate with plated-through holes comprises the following steps: drilling an insulating substrate; performing a pre-treatment on the substrate with holes; simultaneously treating the surface and hole walls of the substrate by means of a combination of a plurality of physical vapor deposition methods, so as to form conductive seed layers on the surface and hole walls of the substrate, thereby obtaining a metallized substrate with plated-through holes; and performing electroplating thickening on the metallized substrate, so as to obtain a copper-clad plate with plated-through holes.