812results about "Printed element electric connection formation" patented technology

The invention discloses a BGA fan-out structure of a PCB and a manufacturing method of the BGA fan-out structure, at least one surface of the PCB is provided with a plurality of BGA bonding pads which are distributed in a square array mode, no wiring is conducted between the BGA bonding pads, the circle of BGA bonding pads arranged on the outermost periphery are peripheral bonding pads, the other BGA bonding pads are inner bonding pads, the center of each inner bonding pad is provided with an in-disc hole with an internal partition, and the in-disc hole is formed in the center of each inner bonding pad. The hole diameter of the in-plate hole is smaller than the outer diameter of the BGA bonding pad, and each inner circuit layer of the PCB is provided with a row of hole rings which are arranged around the in-plate hole in a one-to-one correspondence manner and are communicated with the in-plate hole, and a plurality of fan-out wires which are communicated with the hole rings in a one-to-one correspondence manner. The fan-out wires transversely penetrate through the middle of a gap between every two adjacent in-plate holes which are longitudinally arranged or transversely penetrate through the outer sides of the in-plate holes, and the hole rings in the different inner circuit layers are in one-to-one correspondence with the inner bonding pads in the different columns respectively. According to the invention, the design of fan-out of the BGA bonding pad from the inner layer is realized through the via in the pad and the inner layer wiring, and the problem of difficult fan-out wiring of the high-density bonding pad is solved.

The invention relates to a flexible circuit board and a manufacturing method thereof, the manufacturing method of the flexible circuit board comprises a typesetting step, an electroplating step, a through hole step and an insulation step, the typesetting step is to provide a base material and form a bottom layer circuit on the base material; in the electroplating step, the bottom layer circuit is electroplated so as to thicken or widen the bottom layer circuit into a conductive circuit; in the through hole step, a through hole is formed in a port of the conductive circuit or at a position adjacent to the port, the through hole penetrates through the base material and the conductive circuit, and a section is formed on the conductive circuit at the through hole; in the insulation step, an insulation structure is provided, the insulation structure is arranged on the base material to cover the conductive circuit, and part of the insulation structure is located in the through hole and covers the fracture surface; therefore, the use of an etching process can be avoided to reduce environmental pollution, metal consumption and power consumption, and the conductive circuit can be effectively prevented from being exposed to influence reliability.

A method of making an interconnect substrate includes forming a first insulating layer containing a filler and covering a first interconnect layer, forming a via hole in the first insulating layer by laser processing, the via hole exposing the first interconnect layer, performing a heat treatment, plasma processing, and a desmear process in this order with respect to the first insulating layer, and forming, after the desmear process, a second interconnect layer including both an interconnect pattern formed on an upper surface of the first insulating layer and a via interconnect formed in the via hole.

The invention provides a double-sided conduction AMB ceramic substrate and a manufacturing method thereof, and belongs to the technical field of ceramic substrates for power modules. The manufacturing method comprises the following steps: punching holes in a ceramic substrate; filling conductive metal slurry into the holes by using a screen printing machine and sintering at high temperature; brazing materials are printed on the two faces of the ceramic; the copper layer and the ceramic layer are laminated and then subjected to vacuum brazing; manufacturing a circuit; etching the solder layer of the AMB line groove to expose the ceramic; performing surface treatment; laser cutting; and conducting test and inspection. Two-sided conduction is realized through metal slurry hole filling and a high-temperature sintering process, the problem that conduction of an upper copper layer and a lower copper layer of a traditional AMB ceramic substrate cannot be realized is solved, the assembling size of a power module is reduced, the three-dimensional integration requirement of a high-end module is met, meanwhile, the technological process is reasonable, and the production cost is reduced.

An additively manufactured electronics packaging assembly including a build substrate formed from a plurality of additively printed layers. One or more additively printed electrical interconnects can be positioned within the plurality of layers. The assembly can include an electronics housing built along the build substrate. The electronics housing can include one or more additively printed walls extending around a component cavity and a housing lid enclosing and sealing the cavity. One or more additively printed electrical circuits can be included within the component cavity, which can be electrically connected with the additively printed electrical interconnects. One or more electronic components can be positioned within the cavity and can be electrically connected to the additively printed electrical interconnects. The additively printed electrical circuits can be used to indicate a leak in the additively manufactured electronics packaging assembly.

The invention discloses an automatic liquid supplementing device used in the TGV electroplating process and an electroplating system and method. The automatic liquid supplementing device comprises an electroplating cavity, an external tank body, a circulating system, a potential applying assembly, a conductivity sensor and a control module. The external tank body is divided into a left cavity (provided with a soluble anode) and a right cavity (communicated with the electroplating cavity) through an ionic membrane, and the cation concentration of the right cavity is the same as that of the electroplating cavity; the potential applying assembly can adjust the potential difference of the left and right chambers according to electroplating working conditions; the conductivity sensor detects the conductivity of the electroplating liquid in real time, the control module determines the cation consumption based on the conductivity, and the flow velocity and potential difference of the circulating system are adjusted in a closed-loop mode. According to the method, automatic, continuous and accurate supplement of positive ions is achieved through the synergistic effect of concentration difference diffusion and potential difference in combination with closed-loop control, the problems that in the prior art, manual supplement is tedious, concentration fluctuation is large, supplement lags behind and the like are solved, and the stability of the electroplating liquid, the TGV hole filling yield and the uniformity of a plating layer are effectively improved.

The invention relates to the field of integrated circuit manufacturing, in particular to the technical field of manufacturing of semiconductor device special equipment such as a photoetching machine and an etching machine special for production, and provides a through hole filling electroplating method and system for a printed circuit board. The method comprises the following steps: carrying out laser micro-through-hole processing on the printed circuit board; carrying out glue removal treatment on the printed circuit board with the micro through hole; carrying out black hole treatment or direct electroplating treatment on the degummed printed circuit board; performing porefilling electroplating on the treated printed circuit board by using an acidic copper plating porefilling special liquid medicine; in the hole filling electroplating process, a multi-stage electroplating current parameter program is adopted, in-hole pre-plating is carried out at low current density in the initial stage, it is ensured that hole walls are evenly covered, after the main hole filling stage is started, pulse or periodic reverse current is adopted, the current density is increased in a stepped mode, and through holes are filled with acid copper plating hole filling special liquid medicine; and parameters are adjusted at the last stage of filling to ensure that the copper thickness of the hole surface is uniform, and dished pits or excessive recesses are avoided.

The invention discloses a printed circuit board, a layout method thereof and a vehicle, and relates to the technical field of printed circuit board layout. The method comprises the following steps: connecting a capacitor in series on a differential signal line of a physical layer chip; carrying out hollowing processing on the adjacent layer corresponding to the pin bonding pad based on a preset hollowing strategy; carrying out region division on the inner layer of the printed circuit board so as to divide the inner layer into a plurality of different regions; a plurality of backflow via holes are formed beside layer changing via holes of a circuit of the printed circuit board based on a preset setting strategy, and the backflow via holes are used for providing layer changing channels for backflow currents of the circuit on a reference plane when layers of the circuit are changed. By implementing the PCB design measures of capacitor series filtering, pad adjacent layer hollowing, inner layer segmentation and isolation and backflow via hole optimization, the problem that electromagnetic compatibility radiation and conducted emission exceed the standard due to PHY circuit filtering loss, impedance mismatch, power ground noise coupling and unreasonable high-speed signal backflow path in the traditional TBOX design is effectively solved.

This invention discloses a method for manufacturing a flexible circuit board and a flexible circuit board, relating to the field of integrated circuit manufacturing technology. The method includes the following steps: providing a flexible copper-clad laminate (CCL) having a pre-processed area; drilling holes in the CCL to form positioning holes, the positioning holes partially overlapping with the pre-processed area and forming a semi-circular notch in the overlapping area; providing a punching die to punch the flexible CCL, the area covered by the projection of the punching die along the punching direction forming a first projection pattern, the first projection pattern partially overlapping with the pre-processed area and forming a pad half-hole in the overlapping area, the pad half-hole completely covering the semi-circular notch, and the sidewall of the pad half-hole forming a sidewall copper-plated area. By forming a larger sidewall copper-plated area formed by the sidewall of the pad half-hole, sufficient and stable solder volume can be provided for soldering, reducing the risk of cold solder joints and improving the yield of integrated circuit manufacturing, production of dedicated lithography machines, and etching machines.

Provided in the present application are a multilayer circuit board and an electronic device. The multilayer circuit board comprises a circuit unit layer, wherein the circuit unit layer comprises at least two circuit layers arranged parallel to and spaced apart from each other, and an insulating layer sandwiched between adjacent circuit layers; surfaces arranged opposite each other in the direction of thickness of the circuit unit layer are a first side surface and a second side surface; the circuit unit layer is provided with via holes penetrating the circuit unit layer in the direction of thickness thereof; the via holes are defined by inner side walls; the first side surface or the second side surface is provided with a first copper plating layer; second copper plating layers connected to the first copper plating layer are plated on the inner side walls; and the at least two circuit layers are connected in parallel by means of the second copper plating layers. The multilayer circuit board of the present application achieves parallel connection between the circuit layers, effectively controls the resistance value of the circuit board and meets performance requirements while reducing the overall thickness of the multilayer circuit board and lowering the space requirements for mounting the multilayer circuit board.

A method to form a plurality of inductors in a single process by stacking multiple magnetic sheets, wherein each sheet is made to form a particular part in quantities, which can be a base part, a pillar part, a hollow part, or a cover part, for forming a magnetic body of an inductor.

A manufacturing method of a rigid-flex printed circuit board for a visual perception module comprises the following steps: manufacturing a flexible board layer with a conducting bonding pad on one side, and manufacturing a conductive prepreg filled with conductive slurry at a position corresponding to a buried hole; manufacturing a first laminated board, manufacturing a resin plug via hole at a position corresponding to the buried hole, and manufacturing a circuit pattern to form a first core board; a second semi-solidified layer and a second copper foil are taken, and the plates are sequentially stacked and laminated for the second time to form a second laminated plate; wherein the conduction bonding pad is adjacent to one end of the corresponding conductive hole, and the other end of the conductive hole is adjacent to the corresponding resin plug hole conduction hole, so that a buried hole in conduction connection is formed; manufacturing a via hole in the second laminated plate, and performing post-process processing to form the rigid-flex printed circuit board; the manufacturing of the buried holes is divided into three parts, and the buried holes connected through conduction are formed through stacking and pressing, so that the problems of polishing rupture, overlarge or non-uniform expansion and contraction and the like generated in the polishing process of the flexible layer are effectively avoided.

The invention discloses a PCB and a production method and application thereof, the PCB comprises a PCB substrate, the PCB substrate is provided with a plurality of pads, a planar transformer and a plurality of lines, the PCB substrate is provided with first grooves corresponding to the pads one by one, and the PCB substrate is provided with second grooves corresponding to the planar transformer; copper foil layers are deposited on the inner wall of the first groove and the surface of the PCB substrate corresponding to the plurality of lines, so that a bonding pad and lines are formed, and a tin alloy layer is arranged on the copper foil layer corresponding to the bonding pad area; the planar transformer is embedded in the second groove, the planar transformer comprises a magnetic core and a coil, and the coil is electrically connected with the copper foil layer. According to the invention, the generation of welding spot bubbles can be effectively avoided, the welding quality and the heat dissipation performance can be improved, the production process can be simplified, the production cost can be reduced, and the product integration can be improved.

This method for manufacturing a photoelectric composite wiring board includes: a step for forming an optical waveguide by laminating a plurality of layers of different materials on a substrate having a first wiring layer, and while doing so, exposing and developing one layer of the plurality of layers; a step for forming a though-via hole in an insulating layer formed by laminating the plurality of layers; and a step for forming a second wiring layer on the insulating layer, and also forming in the through-via hole a through-via conductor for connecting the first wiring layer and the second wiring layer.

The invention discloses a circuit board structure and a manufacturing method thereof, the circuit board structure comprises a first copper foil layer, an insulating layer, a second copper foil layer, a connecting hole and a first conductive layer, the first copper foil layer and the second copper foil layer are stacked in the thickness direction, the insulating layer is located between the first copper foil layer and the second copper foil layer, and the connecting hole is located between the first copper foil layer and the second copper foil layer. The connecting hole penetrates through the first copper foil layer and the insulating layer, the second copper foil layer is exposed at the bottom of the connecting hole, and the first conductive layer covers part of the surface, deviating from the insulating layer, of the first copper foil layer and the first inner side wall of the connecting hole.

To provide a printed circuit board that can realize circuits with fine line widths and spacing. [Solution] One embodiment of the present invention provides a printed circuit board comprising: a first insulating layer having a first surface and a second surface facing each other in the thickness direction; a conductive via disposed in a through hole formed in the thickness direction in the first insulating layer; and a first pad disposed on the first surface side of the first insulating layer and including a first conductor layer and a first conductor layer disposed on the first conductor layer and the conductive via, wherein the conductive via is configured to protrude further outward from the first surface of the first insulating layer than the first conductor layer.

The present invention provides a component carrier and a method of manufacturing a component carrier. The component carrier (100) comprises a carrier body (102) having a hole (104) filled partially with a metal structure (106) delimited by an exterior dimple (108), an electrically conductive dimple filling (110) at least partially filling the dimple (108), a dielectric layer structure (112) on at least part of the carrier body (102) and on part of the dimple filling (110), and a conductive element (114) extending through the dielectric layer structure (112) and being in contact with the dimple filling (110).

The invention relates to a method (100) for manufacturing a multilayer composite article (10) with an integrated conductor arrangement (20). It is proposed to integrate a laser radiation-reflecting reflector element (30) under a cover layer (13) of the multilayer composite article (10). The reflector element (30) thus defines a processing path along which the cover layer (13) can be reliably ablated by means of laser ablation.

Methods and apparatus for single side filling of through-vias in a substrate are provided herein. In some embodiments, a method of filling through-vias in a substrate includes: coupling a first side of the substrate having through-vias to a carrier plate with an adhesive layer; exposing the through-vias to a conductive layer disposed between the carrier plate and the first side of the substrate; and plating the substrate using the conductive layer as a conductive seed layer to fill the through- vias with a conductive material.

The embodiment of the invention relates to the technical field of PCB manufacturing, in particular to a device-embedded circuit board bonding pad manufacturing method and device.The device-embedded circuit board bonding pad manufacturing method comprises the steps that a multi-layer PCB is obtained, and a device-embedded area of the multi-layer PCB is uncovered to manufacture an embedded groove; performing solder mask pretreatment on the PCB multilayer board, performing low solder mask ink spraying treatment on the embedding groove of the PCB multilayer board, and forming ink layers on the surface of the PCB board and the surface of the embedding groove; and performing DI exposure processing, developing processing and curing processing on the PCB multilayer board in sequence to form a target bonding pad at the bottom of the embedded groove. According to the method, the target bonding pad is formed by forming the ink layer on the surface of the embedding groove of the PCB multilayer board and performing exposure, development and curing treatment, so that the stability of a protective layer of the inner bonding pad in the multilayer pressing process is improved, and the welding reliability and the product quality are ensured.

The application discloses an improved semi-additive process based on customized ultra-thin copper foil flexible copper-clad plate and a fine circuit board, and belongs to the technical field of flexible printed circuit boards. The process adopts a customized ultra-thin copper foil FCCL substrate, and the circuit is prepared through substrate selection pretreatment, pattern size pre-compensation, laser drilling and black shadow process hole metallization, pattern transfer and selective electroplating thickening, film stripping and flash etching forming. The micro-etching amount is cooperatively controlled throughout the process, and combined with optimized plasma cleaning and high hole filling electroplating, the fine circuit production with a minimum line width and line spacing of 45 microns or less can be stably realized, and the highest fine circuit production can reach 25 / 25 microns. The application solves the problems of traditional process, such as large side etching, low precision, poor yield and the like, and the circuit board prepared has the advantages of excellent size stability, strong heat resistance and uniform micro-hole filling, is suitable for high-density interconnection and high-end consumer electronic demand, and has significant advantages of precision, yield and reliability compared with existing processes.

The application discloses a circuit board and a plating method. The plating method comprises the following steps: providing a substrate, forming a through hole on the substrate; providing a metal piece, the metal piece comprises a main body and an elastic part, the elastic part protrudes from the surface of the main body; inserting the metal piece into the through hole, and the elastic part abuts against the inner wall of the through hole; plating the substrate to form a plating layer, and the plating layer fills the through hole.

A method of manufacturing a packaging substrate according to the present disclosure includes a preparing step of preparing a panel-level packaging substrate comprising a core substrate, a first redistribution layer disposed on the core substrate, and a second redistribution layer disposed under the core substrate, and an electroless surface treatment step of forming terminals by simultaneously performing electroless surface treatment on an upper surface and a lower surface of the panel-level packaging substrate. The packaging substrate comprises a core layer, the first redistribution layer disposed on the core layer, the second redistribution layer disposed under the core layer, and the terminals disposed on an upper surface of the first redistribution layer and a lower surface of the second redistribution layer. A difference between a maximum thickness value and a minimum thickness value of the terminals formed on the packaging substrate is 5 µm or less. In such a case, terminals having improved thickness uniformity may be formed, and process efficiency during terminal formation may be promoted.

The invention discloses a three-dimensional multilayer circuit board and a production process thereof, the circuit board comprises a power supply mainboard and high-frequency transformer winding integrated press-fit structure and a thick copper circuit layer, the power supply mainboard and the high-frequency transformer winding are both PCBs with at least two layers, the high-frequency transformer winding forms a three-dimensional structure through pre-forming processing, and the thick copper circuit layer is arranged between the high-frequency transformer winding and the power supply mainboard. The circuit alignment tolerance is controlled within 100 [mu] m, and copper foils or / and copper plates are laminated on the upper surface and the lower surface of the integrated structure to form thick copper circuit layers. According to the invention, integration of the two parts is realized, assembly gaps are eliminated, volume power density is improved, accurate butt joint of lines is guaranteed, stability and reliability are improved, large-current bearing capacity is enhanced, conversion efficiency is improved, heat resistance is reduced through thick copper heat dissipation, conversion energy efficiency is improved, electromagnetic shielding performance is optimized, interference is reduced, and copper usage amount is reduced. And the assembly process is simplified and the cost is reduced.

This invention discloses a method for back-drilling printed circuit boards (PCBs). The method includes: forming a first metallized via and a second metallized via on the PCB; obtaining the actual board thickness at the location of the first metallized via; controlling a drill bit to drill stepwise from a first surface conductive layer to a first distance from the upper surface of a reference conductive layer at the location of the first metallized via, based on the actual board thickness; controlling the drill bit to drill down to the reference conductive layer at the first distance from the upper surface of the reference conductive layer; and obtaining a continuity or disconnection signal of a continuity detection circuit based on the drill bit; setting a back-drilling depth based on the actual board thickness at the location of the first metallized via; and controlling the drill bit to drill down to the back-drilling depth after obtaining a disconnection signal of the continuity detection circuit to form a back-drilled hole. The technical solution of this invention improves the back-drilling accuracy and the quality of the back-drilled hole.

A production method for a flip-chip pressure sensor for back pressure, the flip-chip pressure sensor for back pressure comprising a main chip portion (1) and a cover plate portion (2), wherein a Wheatstone bridge (12) and a first electrical connection structure (13) are provided on a main body (11) of the main chip portion (1), the first electrical connection structure (13) being electrically connected to the Wheatstone bridge (12); and the cover plate portion (2) comprises a cover plate (21) and a second electrical connection structure (22), the cover plate (21) being bonded to the main body (11), and realizing electrical connection between the second electrical connection structure (22) and the first electrical connection structure (13). The second electrical connection structure (22) passes through the cover plate (21) and extends to the side surface of the cover plate (21) facing away from the main body (11), enabling direct soldering packaging of the second electrical connection structure (22) and an external substrate by means of SMT, and thereby facilitating packaging, improving the packaging efficiency and reliability of the flip-chip pressure sensor for back pressure.

The invention discloses a large-aperture and high-board-thickness plug-in blind hole manufacturing method and a PCB, and the manufacturing method comprises the steps: providing a first optical core board and a substrate with a through hole A, enabling the first optical core board to be laminated and fixed on one side of the substrate, machining a through hole B in the first optical core board, and enabling the through hole B and the through hole A to be aligned and communicated to form a blind hole base hole; plating a conducting copper layer on the inner wall of the base hole of the blind hole; sealing one port, back on to the first optical core plate, of the blind hole base hole by using a protective film, and filling the blind hole base hole with resin; removing the protective film after the resin is cured or semi-cured, and laminating and fixing a second optical core plate on one side, back to the first optical core plate, of the substrate; and cutting the resin for multiple times until the conductive copper layer arranged on the inner wall of the blind hole base hole is completely exposed, and cutting the conductive copper layer into a set thickness to obtain the plug-in blind hole. The manufacturing method is reasonable, simple and easy to operate and implement, and the obtained plug-in blind hole has the advantages of being high in size precision, good in structural stability, good in conduction performance and the like.

A method of manufacturing a component carrier (100), wherein the method comprises providing a stack (102) comprising electrically conductive layer structures (104) and at least one electrically insulating layer structure (106), embedding a magnetic inlay (108) in the stack (102) by the steps of forming an opening (190) in the stack (102), attaching a sticky layer (130) to a bottom of the stack (102) for closing the opening (190), adhering the magnetic inlay (108) on the sticky layer (130); and fixing the magnetic inlay (108) in place in the opening (190) by adhesive material (132), in particular by lamination, and forming an electrically conductive coil structure (110) at least partially based on the electrically conductive layer structures (104) and surrounding at least part of the magnetic inlay (108).