2524results about "Printed element electric connection formation" patented technology

The invention relates to the technical field of printed embedded PCBs, and discloses an embedded PCB and a manufacturing method thereof.The embedded PCB comprises a daughter board, a first dielectric layer and a first circuit layer which are sequentially arranged in a stacked mode in the first direction, a device is embedded in the daughter board, the device is located on the side, close to the first dielectric layer, of the daughter board, and the first dielectric layer is located on the first circuit layer. One side, close to the first dielectric layer, of the device is provided with a first part, and the first part is provided with a first protection part; a first connection hole is formed in the first dielectric layer, a first conductive part is filled in the first connection hole, the first protection part is connected and electrically conducted with the first conductive part, and the first conductive part is connected and electrically conducted with the first circuit layer. The embedded PCB and the manufacturing method thereof provided by the invention are used for improving the problem of poor hole filling in the electroplating hole filling process in the related technology.

The invention discloses a structure and a manufacturing method of a circuit board with interconnection of any layers of through holes, two ends of an isolation strip which needs to be insulated between layers at the through holes of the circuit board are respectively provided with a concave etching position, the concave etching positions serve as isolation rings, and the concave etching positions are formed after an isolation disc arranged on an inner-layer core plate is etched in a concave mode; the manufacturing method comprises the following steps that a circuit board is provided, a drilling position is arranged on the circuit board, and the drilling position is a position needing to be drilled in subsequent processing; the two ends of the interlayer isolation strip needing insulation at the drilling position of the circuit board are each provided with an isolation disc with the outer diameter larger than the outer diameter of the drilling position. A through hole is drilled in the position, corresponding to the drilling position, of the circuit board, so that the isolation disc on the inner layer is exposed in the through hole, then the isolation disc in the hole is removed through concave etching, and a concave etching position serving as an isolation ring is formed; and after the circuit board is subjected to copper deposition and electroplating, a structure of interconnection of any layers of the through holes is formed. According to the method, a plurality of signals can be transmitted in the same hole, and the purpose of interconnection of any layer in the through hole can be achieved.

The invention discloses a processing method of a millimeter wave radar circuit board, which adopts a continuous blind slot to replace a plurality of independent blind hole structures in a traditional structure, so that a continuous radio frequency circuit pattern can be formed, the signal shielding area is effectively increased, and the millimeter wave radar circuit board has a better signal shielding effect. Besides, the processing method of the embodiment of the invention also cancels the procedures of repeated electroplating, single-side copper reduction, circuit etching and the like in the traditional processing method, and can directly realize the manufacturing of the outer circuit, the first copper layer and the second copper layer through activation and copper deposition, thereby greatly shortening the processing flow of the millimeter wave radar circuit board, and improving the production efficiency of the millimeter wave radar circuit board. And the production efficiency of the millimeter wave radar circuit board is improved. In addition, the invention further discloses the millimeter-wave radar circuit board formed by the processing method of the millimeter-wave radar circuit board.

The invention discloses a cross-level laser drilling method utilizing UV laser and carbon dioxide laser, and belongs to the technical field of printed circuit boards. The cross-level laser drilling method utilizing the UV laser and the carbon dioxide laser burns through a required penetrating layer with a copper layer through high-energy UV laser drilling; the dielectric layer on the reserved layer bottom copper is burnt out and subjected to hole finishing by adopting carbon dioxide laser drilling, so that no adhesive residue is ensured under the condition that the hole bottom is not burnt through, the conduction connection performance of the printed circuit board is ensured, the processing quality stability of the printed circuit board is improved, and the production cost is reduced. And the problems of burning through and burning loss of a bottom copper layer caused by high energy of UV laser can be well improved.

The invention provides a multilayer circuit board and a processing method thereof, a chip system and electronic equipment, and the processing method comprises the steps: processing a second hole channel, a first conductive pattern and a second conductive pattern on a first substrate, and processing a third hole channel on a second substrate; the first substrate, the second substrate and the first insulating layer are stacked, pressed and fixed; the processing method further comprises the following steps: carrying out electroplating hole filling on the first substrate to form a second conductive channel; the processing method further comprises the steps that the second substrate is electroplated so that a sixth conductive pattern and a third conductive channel can be formed, the first insulating layer comprises a first conductive part, and the first conductive pattern, the second conductive pattern and the sixth conductive pattern are electrically connected with the second conductive channel through the third conductive channel and the first conductive part. The second hole channel and the third hole channel are filled in an electroplating hole filling mode, so that the wiring density and the chip signal transmission capability of the multilayer circuit board are improved, and the electrical performance and the thermal performance of the multilayer circuit board are improved; electroplating hole filling is suitable for mass production, and the process yield is stable.

The invention relates to a printed circuit board multilayer interconnection method, which comprises the following steps: firstly, automatically identifying and dividing interconnection channel areas of a circuit board, acquiring multi-dimensional parameters such as materials, thermal expansion coefficients and thermal cycle working conditions, realizing differential distribution and accurate preparation of a nano composite sensing material based on the multi-dimensional parameters, and obtaining the multi-dimensional parameters of the circuit board through an in-situ physical parameter acquisition and self-adaptive discrimination algorithm. Dynamic discrimination of stress abnormity and reverse driving of a micro heater are realized, the structure is induced to generate directional deformation so as to realize local automatic compensation, multi-point parameter data before and after compensation are used for health state modeling and residual life prediction, and big data archiving is combined to feed back manufacturing process optimization.

The invention discloses a double-sided semi-embedded packaging substrate and a processing method thereof, and the processing method comprises the steps: carrying out the N times of double-sided circuit manufacturing and the N-1 times of double-sided layer adding of a multi-layer substrate alternately, and obtaining an operation board with two groups of symmetrical circuit structures; the circuit structure is provided with an outer circuit layer and (N-1) inner circuit layers which are communicated with each other, and the inner circuit layer located on the innermost side is provided with a bonding pad. Performing laser groove burning on the working board, and processing a blind groove which is provided with an opening at the outer circuit layer and takes the other inner circuit layer adjacent to the innermost inner circuit layer as the groove bottom locally on each group of circuit structure; removing the copper foil on the bottom of the blind groove; the bonding pads are completely exposed in the blind grooves corresponding to the bonding pads, the blind grooves in the two sets of circuit structures are communicated, and a through groove structure is obtained; and cleaning the surface of the bonding pad to obtain the double-sided semi-embedded packaging substrate. The processing method is simple and reasonable, the processing cost is low, the processing efficiency is high, and the reliability of the obtained double-sided semi-embedded packaging substrate is very high.

The invention discloses a PCB blind hole machining method and device, laser drilling equipment and a storage medium, the laser drilling equipment comprises a picosecond or femtosecond laser device and a CO2 laser device, after a first machining parameter of the picosecond or femtosecond laser device and a second machining parameter of the CO2 laser device are determined, on one hand, the first machining parameter of the picosecond or femtosecond laser device and the second machining parameter of the CO2 laser device are determined; the picosecond or femtosecond laser performs cold machining on the surface copper layer to form the annular heat insulation groove, the surface copper layer can be prevented from generating suspended copper at the opening of the blind hole, on the other hand, heat generated when the CO2 laser machines the blind hole can be prevented from being diffused to the opening of the blind hole in the surface copper layer through the annular heat insulation groove, suspended copper is further prevented from being generated, and on the other hand, the heat dissipation efficiency is improved. The picosecond or femtosecond laser device with low processing efficiency is adopted for annularly cutting the annular heat insulation groove in the surface copper layer, then the CO2 laser device with high processing efficiency is used for removing materials in the area in the outer contour of the annular heat insulation groove to achieve drilling, the processing efficiency of the two laser devices with different processing efficiency is considered, and the laser drilling efficiency is improved.

The invention discloses a manufacturing method of a multi-layer thermoelectric separation buried copper plate, which comprises the steps of preparing an inner-layer core plate, slotting and burying a copper block, roughly drilling a through hole, filling resin, manufacturing a secondary outer-layer pattern, preparing an outer-layer core plate, drilling a conductive hole and a heat dissipation hole and the like, and is characterized in that the copper block is divided into a heat dissipation area and a conductive area; thermoelectric separation is achieved through the design of independent through holes and blind holes, components needing to conduct electricity and components needing to conduct heat can be added on the copper block at the same time, and meanwhile efficient heat conduction and stable signal transmission are achieved and do not interfere with each other. Due to the partition design, the copper block is not only used for heat dissipation, but also used for electric conduction, the utilization rate of the copper block is improved, the design area of the PCB is reduced, and the development requirements of high-density and miniaturized electronic equipment are met.

To provide a ceramic board which has good heat dissipation, and in which an integration density is high.SOLUTION: According to an embodiment, the present invention discloses a manufacturing method of an ultrathin high-density multilayer interconnection ceramic board, containing steps of: preparing a ceramic wafer, performing a laser punching to the ceramic wafer, and forming a via hole; performing a vacuum magnetron sputtering to the ceramic wafer, and forming a seed titan layer and a copper layer onto a front surface of the ceramic wafer and on a wall of the via hole by the sputtering; manufacturing a ceramic double-layer core plate; manufacturing a multilayer substrate; manufacturing a vertical interconnection multilayer substrate; and manufacturing a high-end multilayer HDI ceramic board. The multilayer ceramic plate manufactured in the above mentioned processing can be easily processed as compared with LTCC and HTCC, and an energy consumption amount for the processing is deteriorated. A heat conductivity of a finished product is improved. A wiring is more accurate; a conductive resistance is low; and a signal transmission loss is low.SELECTED DRAWING: Figure 1

Disclosed is a printed circuit board and a manufacturing method for manufacturing the same, the printed circuit board including: a first insulating layer; a through-hole penetrating through the first insulating layer; a via conductor layer disposed in the through-hole, and having first and second groove portions recessed inwardly of the through-hole from an upper surface and a lower surface of the first insulating layer, respectively; a cavity penetrating through at least a portion of the first insulating layer; an electronic component disposed in the cavity; and a second insulating layer covering at least a portion of the first insulating layer, and disposed in at least a portion of each of the through-hole and the cavity.

A circuit carrier includes a substrate, a first build-up circuit structure, a second build-up circuit structure, a fine redistribution structure and at least one conductive through hole. The substrate has a top surface and a bottom surface opposite to each other. The first build-up circuit structure is disposed on the top surface of the substrate and electrically connected to the substrate. The second build-up circuit structure is disposed on the bottom surface of the substrate and electrically connected to the substrate. The fine redistribution structure is directly attached on the first build-up circuit structure, wherein a line width and a line spacing of the fine redistribution structure are smaller than those of the first build-up circuit structure. The conductive through hole penetrates the fine redistribution structure and a portion of the first build-up circuit structure and is electrically connected to the fine redistribution structure and the first build-up circuit structure.

The invention discloses a K / Ka band circularly polarized transmit-receive common aperture phased array antenna and phased array, comprising: a multilayer stacked substrate structure, the substrate comprising a metal layer, a dielectric layer and a bonding layer; the K-band array element comprises a K-band radiation patch, a K-band feed structure and a K-band filtering structure, the K-band radiation patch, the K-band feed structure and the K-band filtering structure are arranged on part of the metal layer, and the K-band filtering structure comprises a first filtering structure, a second filtering structure and a third filtering structure; the Ka wave band array element comprises a Ka wave band parasitic patch, a Ka wave band radiation patch and a Ka wave band filtering structure which are arranged on part of the metal layer; each common-aperture phased-array antenna comprises a K-band array element and five Ka-band array elements. The common-caliber antenna provided by the invention can realize conical wide-angle scanning in the K / Ka wave band, and solves the problems of poor same-frequency and different-frequency isolation of the common-caliber antenna and poor scanning axial ratio performance of a circular polarization array.

The invention discloses a circuit board production method and a circuit board. The method comprises the following steps: laminating at least two substrates and at least one prepreg to obtain a first circuit board; performing drilling and copper deposition treatment on the first circuit board to obtain at least one target via hole; performing resin hole plugging on the target via hole to obtain a second circuit board; performing uniform copper deposition electroplating on the target surface with the target via hole on the second circuit board to obtain a third circuit board; grinding and polishing the hole filling copper layer on the third circuit board to obtain a fourth circuit board with a target copper layer; and performing line forming processing on the fourth circuit board to obtain a target circuit board. The generated hole filling copper layer is filled with the first groove generated after the resin is cooled, and the hole filling copper layer is ground and polished to obtain the target copper layer, so that the flatness of the surface of the circuit board can be improved, and the welding quality of the chip is ensured.

The invention discloses a method for manufacturing a surface flexible layer rigid-flexible combined board for an intelligent video module, which comprises the following steps of: taking a double-sided flexible copper-clad plate, and windowing a first surface copper layer corresponding to a first via hole to form a flexible core board; taking the first cover film and windowing corresponding to the first via hole to form a windowing cover film; correspondingly attaching the windowing covering film to one side of the second copper layer of the flexible core plate to form a covering film core plate; taking a prepreg, manufacturing a glue-blocking film corresponding to a flexible area of the prepreg, forming a glue-blocking prepreg, and manufacturing a rigid core plate; sequentially stacking and laminating the plates from top to bottom, enabling the glue blocking film to face the covering film core plate, then manufacturing a through hole in the rigid region, performing laser ablation on an insulating medium layer corresponding to a copper layer windowing pattern, electroplating, performing uncovering processing, removing a second copper layer at the bottom of a blind hole, forming a first via hole, and performing molding to form the rigid-flexible combined plate. The metallization process of the flexible area and the metallization process of the rigid area are combined into one-time electroplating, so that the consistency of the thickness of a copper plating layer is ensured.

The invention discloses a high-reliability hole copper control method for an automobile circuit board, and the method comprises the steps: adjusting the drilling parameters according to the hole diameter and the thickness-diameter ratio, improving the roughness of a hole wall through optimizing a drilling technology, and enabling the copper thickness of the hole wall after copper plating to meet the production requirements. According to the method, after the drilling technology is optimized, the hole wall roughness is smaller than or equal to 25 micrometers, and after electroplating, the hole wall copper thickness is larger than or equal to 25 micrometers.

The invention belongs to the technical field of circuit board manufacturing, and particularly relates to a forming method of a conductive hole in a circuit board and the circuit board. The invention discloses a forming method of a conductive hole in a circuit board. The forming method comprises the steps of obtaining the circuit board; drilling a base hole in a to-be-drilled area on the circuit board along the thickness direction of the to-be-drilled area; forming a conductive layer on the hole wall of the base hole; and removing part of the material of the conductive layer along the thickness direction of the circuit board to obtain a plurality of conductive wires which are mutually spaced along the circumferential direction of the base hole and extend along the thickness direction of the circuit board so as to prepare the conductive hole. According to the invention, a part of material of a circle of conductive layer of a common whole conductive hole is removed to obtain a plurality of conductive wires which are mutually spaced, and one conductive wire can transmit one signal, so that one conductive hole can be connected with a plurality of signals, the utilization rate is high, and the number of conductive holes can be reduced.

The invention relates to the technical field of printed circuit boards, and discloses an asymmetric PCB manufacturing method and an asymmetric PCB, and the asymmetric PCB manufacturing method comprises the steps: providing a substrate, the substrate comprises an embedded layer, a first dielectric layer and a first conductive layer, the embedded layer is internally provided with a power module, and the substrate is also provided with a first connecting hole; the substrate is electroplated to obtain a first conductive part, a first electroplated layer and a second electroplated layer, the first conductive part fills the first connecting hole, the electronic element and the first conductive layer are both connected with the first conductive part, the first electroplated layer covers the first conductive part and the first conductive layer, the first electroplated layer and the first conductive layer form a first circuit layer, and the second electroplated layer covers the second conductive layer; the second electroplated layer covers one surface, deviating from the first dielectric layer, of the embedded layer. The manufacturing method of the asymmetric PCB and the asymmetric PCB provided by the invention are used for solving the problem that a circuit board embedded with a power module is easy to warp in the manufacturing process in the related technology.

The invention discloses a conductive paste, a metallized substrate and a metallization process for manufacturing the metallized substrate, the conductive paste comprises metal particles, the particle size of the metal particles is 0.1-10 [mu] m, and the mass ratio of the metal particles is 80-98%; in the metallization process, a copper layer is arranged on the hole wall of a through hole or a blind hole of a substrate, then conductive slurry is filled in the hole with the copper layer, heating sintering treatment is carried out, and after heating sintering is carried out in an inert gas atmosphere at the temperature of less than or equal to 300 DEG C, metal particles can be fused to form a connection structure or a eutectic structure. A reinforcing layer can be formed between the nano metal particles and the copper layer, and the reinforcing layer is a metal bonding layer or an intermetallic compound layer. The metallization mode is suitable for a through hole or a blind hole of a glass / silicon / ceramic substrate with a high aspect ratio and a micro aperture, and the technical problems that complete filling is difficult to achieve and filling defects exist in an existing electroplating process, the electrical resistivity of conductive paste is high, and the interface bonding force is insufficient can be solved.

The present invention relates to a copper-clad plate with plated-through holes, a circuit board with plated-through holes, and manufacturing methods therefor. Specifically, a method for manufacturing a copper-clad plate with plated-through holes comprises the following steps: drilling an insulating substrate; performing a pre-treatment on the substrate with holes; simultaneously treating the surface and hole walls of the substrate by means of a combination of a plurality of physical vapor deposition methods, so as to form conductive seed layers on the surface and hole walls of the substrate, thereby obtaining a metallized substrate with plated-through holes; and performing electroplating thickening on the metallized substrate, so as to obtain a copper-clad plate with plated-through holes.

An electronic device is provided. The electronic device includes a substrate, a through hole, a first circuit structure, and an electronic unit. The substrate includes a first side and a second side opposite to the first side. The through hole penetrates the substrate and connects the first side to the second side. The first circuit structure is disposed on the first side and includes a first metal layer and a first dielectric layer. The first metal layer overlaps a first portion of the first side. The first dielectric layer overlaps a second portion of the first side. The first portion is connected to the second portion. The electronic unit is electrically connected to the first circuit structure. Moreover, a surface roughness of the first portion is lower than a surface roughness of the second portion.

The invention provides a printed circuit board ultrathin prepreg laser hole processing method and system, and relates to the field of communication manufacturing, and the method comprises the steps: providing a PCB core board, manufacturing an inner layer circuit board, then carrying out a pressing technology, carrying out laser browning and laser processing drilling, forming a plurality of blind holes, and carrying out automatic optical detection. And the processing intelligence is improved, and the quality risk is controllable. According to the laser processing link, a traditional multi-step hole repairing mode is abandoned, and blind hole forming with the hole diameter smaller than or equal to 75 micrometers is achieved directly through single-time high-precision laser copper breaking. And in the quality control link, abnormal blind holes deviating from group characteristics are automatically identified based on blind hole image data acquired by an AOI system, standardized and large-scale adaptation of defect detection is realized, and manual inspection of whether the positions of the holes deviate or not, whether the hole diameters meet requirements or not and whether residues or pollutants exist in the holes or not is assisted.

A printed circuit board (PCB) serves as a core basic component of the electronic information industry, and the manufacturing process of the PCB faces double challenges of rapid iteration and customization requirements of electronic products. A traditional PCB manufacturing technology (such as mechanical board manufacturing, silk-screen printing and the like) is suitable for large-scale production, but has the defects of long production period, high cost, minimum order quantity limitation and the like, and is difficult to meet the market requirements of small batch and high flexibility. Under the background, the 3D printing technology is completely exposed by means of the efficient customized production capacity, the supply efficiency of a minimum batch of PCBs (such as test single boards and concept verification boards) can be remarkably improved, the production batch constraint of a traditional method is avoided, and the comprehensive cost advantage is shown in the design verification stage. However, the current 3D printing PCB technology is still limited by the circuit complexity and the number of layers and is mostly limited by single / double panel manufacturing, and the performance of the conductive slurry and the base material needs to be optimized urgently. The key technical bottlenecks of interlayer vertical interconnection, multilayer medium lamination manufacturing and the like need to be broken through in the future, so that 3D printing of high-density and multilayer arbitrary interconnection PCBs is achieved, deep application of the technology in the field of intelligent manufacturing and new materials is promoted, and an innovative development opportunity is created for the PCB industry.

To provide a laminated substrate capable of ensuring a long-term reliability by preventing stress from being applied to a conductive paste for electrical connection when the laminated substrate is manufactured by laminating a plurality of multilayer substrates.SOLUTION: In a laminated substrate 100 formed by laminating a plurality of multilayer substrates 10, in each multilayer substrate 10, a through hole 30 penetrating through each multilayer substrate 10 and having an inner wall surface plated and filled with a resin 32 therein, and bonding lands 34 electrically connected to the through hole 30 are formed on an upper surface and a lower surface of the through hole 30. An insulating adhesive layer 40 and a conductive paste via 50 for electrically connecting the bonding lands 34 of the opposed multilayer substrates to each other by a conductive paste filled in a through hole 46 formed in the insulating adhesive layer 40 are provided between the multilayer substrates 10, and the conductive paste via 50 is provided at a position different from the position where the through hole 30 is formed.SELECTED DRAWING: Figure 1

The invention discloses a Tenting process-based system-level vehicle-mounted packaging substrate and a processing method thereof. The processing method comprises the following steps of: providing a first PNL plate provided with an outer-layer copper foil and a through hole; a connecting copper layer is formed on the inner wall of the through hole, and the connecting copper layer extends to the outer copper foil and surrounds a preset area outside the two ports of the through hole to form a ring hole copper layer; performing resin hole plugging on the through hole; grinding two ports of the through hole, reducing copper of the ring hole copper layer and grinding the whole plate in sequence so as to form a micro step between the outer copper foil and the ring hole copper layer; a thickened copper layer is formed on the outer copper foil and the ring hole copper layer, an outer pattern is manufactured on the thickened copper layer, and a second PNL plate is obtained; and after solder mask treatment is carried out on the second PNL, gold plating treatment is carried out in the mode of arranging false gold plating fingers on the edge of the second PNL and between the SET and the SET by adopting the optimal control current density, and an outer layer pattern finished product with the thickness consistency is manufactured. According to the processing method, the size consistency of the outer-layer pattern finished product is remarkably improved, and the market requirement is met.

Various embodiments of a wireless connector system are described. The system has a transmitter module and a receiver module that are configured to wirelessly transmit electrical energy and / or data via near field magnetic coupling. The wireless connector system is designed to increase the amount of wirelessly transmitted electrical power over a greater separation distance. The system is configured with various sensing circuits that alert the system to the presence of the receiver module to begin transfer of electrical power as well as undesirable objects and increased temperature that could interfere with the operation of the system. The wireless connector system is a relatively small footprint that is designed to be surface mounted.

The invention discloses an interconnection structure layer, a manufacturing method of the interconnection structure layer and a circuit board, the interconnection structure layer can be overlaid between two circuit layers with interconnection requirements, and the interconnection structure layer comprises an insulating layer and a conductive column; the conductive columns are embedded in the whole insulating layer at a preset hole density. According to the invention, the distribution density and the diameter of the conductive columns embedded in the insulating layer are limited, so that the bonding pads needing to be interconnected with the outside in the circuit layer can be at least in contact with one conductive column used for interlayer conduction, and the region between any two bonding pads in the same circuit layer is not only in contact with the conductive column. In this way, any interconnection between layers can be achieved, and meanwhile it is guaranteed that short circuit of a single circuit layer cannot be caused. High-precision alignment is not needed, random interconnection between the circuit layers is achieved, the number of pressing times accumulated on one board is reduced, and therefore the machining difficulty is reduced, and the yield is improved.

The utility model discloses a full-automatic circuit board horizontal copper deposition connecting wire VCP electroplating device. Comprising a horizontal copper deposition incoming plate placing station, a horizontal copper deposition wire, an intelligent plate placing machine arranged at the feeding end of the horizontal copper deposition wire, an intelligent plate collecting machine arranged at the discharging end of the horizontal copper deposition wire, a VCP plating line, an intelligent feeding machine arranged at the feeding end of the VCP plating line, an intelligent discharging machine arranged at the discharging end of the VCP plating line, and a temporary storage station arranged between the horizontal copper deposition wire and the VCP plating line. The intelligent transport vehicle is used for conveying the circuit board collected by the intelligent board collecting machine of the horizontal copper deposition line to a temporary storage station for partitioned temporary storage and conveying the circuit board at the temporary storage station to a VCP plating line; and the memory is used for storing processing information of the circuit board. According to the full-automatic circuit board horizontal copper deposition connecting wire VCP electroplating device provided by the utility model, intelligent board placement and collection are realized, the working efficiency is improved, and the probability of misoperation of personnel is reduced.

The invention discloses a preparation method and structure of a multilayer board based on a ceramic substrate. A ceramic substrate is used as a core substrate and is laminated with a conventional FR4 core plate and a prepreg to form a multi-layer plate laminated structure, and all layers of circuits are connected through drilling and electroplating. Meanwhile, the components are printed or / and mounted on the ceramic substrate in a surface-mounted manner, so that the components are pre-embedded, the performance and the integration level of the circuit board are improved, and the development requirements of miniaturization and high performance of electronic equipment are met; therefore, better heat management can be realized. Due to the fact that the periphery is made of the conventional FR4 plate, the production difficulty is reduced, the production efficiency is improved, and the production cost is reduced due to the mature technology and large-size production.