Chip, circuit board and mobile terminal

Abstract

The invention discloses a chip comprising a body and a heat absorbing and heat radiating member. The body is provided with multiple pins which are used for being plugged on a circuit board. The heat absorbing and heat radiating member is arranged on the body. The heat absorbing and heat radiating member comprises hybrid material having the material property of heat absorbing, heat storing and heat radiating functions. The hybrid material is formed by mixing of heat absorbing and heat storing material and heat conducting and heat radiating material. The heat conducting and heat radiating material is used for transferring heat on the body to the heat absorbing and heat storing material. The heat absorbing and heat storing material is used for absorbing and storing heat on the body and storing heat conducted by the heat conducting and heat radiating material. According to the chip, the heat absorbing and heat radiating member is arranged on the body, the heat absorbing and heat radiating member comprises the hybrid material having the heat absorbing, heat storing and heat radiating functions, and heat on the body is absorbed, stored and radiated by utilizing the hybrid material so that temperature of the body of the chip can be reduced, and normal operation of the circuit board and a mobile terminal having the chip can be guaranteed. The invention also provides the circuit board and the mobile terminal.

Description

technical field [0001] The invention relates to the field of electronic equipment, in particular to a chip, a circuit board and a mobile terminal. Background technique [0002] With the development of the mobile phone industry, the configuration of mobile phones is getting higher and higher, the main frequency of the central processing unit (Central Processing Unit / CPU) is getting higher and higher, and the power consumption is increasing, resulting in a corresponding increase in the heat generated by the mobile phone. To control or transfer, there will be two impacts: 1. The temperature of the mobile phone chip is too high, resulting in slow operation of the mobile phone, or even freezes, affecting the use of the mobile phone; 2. The temperature of the mobile phone chip is transmitted to the mobile phone shell, causing the shell The temperature is high, and there will be problems such as hot hands and ears when using it. [0003] In order to solve the heating problem of th...

AI Technical Summary

Problems solved by technology

[0002] With the development of the mobile phone industry, the configuration of mobile phones is getting higher and higher, the main frequency of the central processing unit (Central Processing Unit / CPU) is getting higher and higher, and the power consumption is increasing, resulting in a corresponding increase in the heat generated by the mobile phone. To control or transfer, there will be two impacts: 1. The temperature of the mobile phone chip is too high, resulting in slow operation of the mobile phone, or even freezes, affecting the use of the mobile phone; 2. The temperature of the mobile phone chip is transmitted to the mobile phone shell, causing the shell The temperature is high, and there will be problems such as hot hands and ears when using it

[0003] In order to solve the heating problem of the mobile phone, the heat-dissipating graphite sheet is generally arranged on the inner wall of the casing or the shielding cover of the mobile phone to indirectly dissipate heat from the chip. The location is limited, and it is impossible to directly dissipate heat at locations with high heat generation, resulting in poor heat dissipation performance

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