15019results about "Printed circuit non-printed electric components association" patented technology

A flex circuit optical sensor has an integrated Faraday shield. A conductive trace layer disposed on a substrate is used to form a conductive grid which shields the face of a photodetector. A conductive ink layer is formed on a substrate side opposite the trace layer. The back and sides of the detector are shielded by flex circuit flaps that have the conductive ink layer but substantially exclude the trace layer so as to fold over and closely adhere to the detector body. The shielded substrate flaps advantageously eliminate a separate detector shield, which is typically fabricated with an etched copper part that must be attached to a flex circuit before mounting the detector.

An imaging module in one embodiment includes at least one multiple color emitting light source comprising a plurality of different colored LED dies each independently driveable so that the overall color emitted by the light source can be controlled and varied. The multiple color emitting light source can be controlled so that the color emitted by the light source is optimized for imaging or reading in a present application environment of the module. Further, the module can be configured so that control of the multiple color emitting light source automatically varies depending on a sensed condition, such a color present in a field of view of the module, the distance of the module to a target, and / or a predetermined criteria being met so that feedback is provided to a user. The module in a further aspect can include illumination light sources and aiming light sources which project light in different wavelength emission bands.

A noninvasive optical probe has an electrical connector for connecting the optical probe to a cable connector. According to one embodiment, the electrical connector includes a durable flexible tab suspended between the housing of the optical probe and a protective cover. The electrical connector also advantageously forms, according to various embodiments, a flexible, plugable, lockable, removable, and sealable electrical connection.

An optical probe, which is particularly suited to reduce noise in measurements taken on an easily compressible material, such as a finger, a toe, a forehead, an earlobe, or a lip, measures characteristics of the material. A neonatal and adult disposable embodiment of the probe include adhesive coated surfaces to securely affix the probe onto the patient. In addition, the surface of the probe is specially constructed to reduce the effect of ambient noise.

Circuit structures and methods of fabrication are provided for facilitating implementing a complete electronic system in a compact package. The circuit structure includes, in one embodiment, a chips-first multichip base layer with conductive structures extending therethrough. An interconnect layer is disposed over the front surface of the multichip layer and includes interconnect metallization electrically connected to contact pads of the chips and to conductive structures extending through the structural material. A redistribution layer, disposed over the back surface of the multichip layer, includes a redistribution metallization also electrically connected to conductive structures extending through the structural material. Input / output contacts are arrayed over the redistribution layer, including over the lower surfaces of at least some integrated circuit chips within the multichip layer, and are electrically connected through the redistribution metallization, conductive structures, and interconnect metallization to contact pads of the integrated circuit chips of the multichip layer.

A wearable computing device includes computing-device component modules and flexible circuitry passing into the modules. The modules can include a top module portion and a bottom module portion, the flexible circuitry passing between the top and bottom portions. Wireless communication, e.g. by radio frequency, with a peripheral and / or a local area network is also contemplated.

System-in packages, or multichip modules, are described which can include multi-layer chips and multi-layer dummy substrates over a carrier, multiple through vias blindly or completely through the multi-layer chips and completely through the multi-layer dummy substrates, multiple metal plugs in the through vias, and multiple metal interconnects, connected to the metal plugs, between the multi-layer chips. The multi-layer chips can be connected to each other or to an external circuit or structure, such as mother board, ball grid array (BGA) substrate, printed circuit board, metal substrate, glass substrate, or ceramic substrate, through the metal plugs and the metal interconnects.

Embodiment relate to a structure for supporting a bending portion of a flexible display panel in an unfolded state so that the bending portion does not flex when pressed. The structure also enables the bending portion of the flexible display panel to bend at a predetermined curvature in a folded state. The structure includes two rotating plates rotating about two axes that slide relative to flexible supporting members extending from portions of the flexible display panel that do not bend as the flexible display panel is bent. As the flexible display panel is bent, the distance between ends of the rotating plates are increased so that the bending portion of the flexible display panel would have an increased radius of curvature.

Abstract of the Disclosure Integrated circuits utilizing standard commercial packaging are arranged on a printed circuit board to allow the production of one-Gigabyte, two-Gigabyte, and four-Gigabyte capacity memory modules. A first row of integrated circuits is oriented in an opposite orientation to a second row of integrated circuits. The integrated circuits in the first row on a first lateral portion of the printed circuit board and in the second row on the first lateral portion are connected to a first addressing register with two register integrated circuits. The integrated circuits in the first row on the second lateral portion and in the second row on the second lateral portion are connected to a second addressing register with two register integrated circuits. Each addressing register processes a non-contiguous subset of the bits in each data word.

The present invention relates to a system for retrieving data from remote difficult to reach terrain, such as wilderness areas, etc. and in particular to a system comprised of one or more surface based data collectors in communication with one or more wireless transceivers adapted to transmit the collected data to an unmanned aerial vehicle adapted to fly within a predetermined distance from the data collector and receive data collected therefrom. The present invention further relates to an unmanned aerial vehicle adapted to fly a flight pattern relative to a moveable surface object or for controlling the position of a moveable surface object relative to the flight path of the unmanned aerial vehicle. Finally, the present invention relates to an improved unmanned aerial vehicle having airframe structural elements with electrical circuits adhered to the surfaces of the structural elements.

A method for packaging a semiconductor device includes connecting a plurality of wire leads to a corresponding plurality of electrical connection pads on the semiconductor device, covering at least a portion of the semiconductor device and at least a portion of each of the wire leads with an encapsulating material, and removing a portion of the encapsulating material and a portion of each of the wire leads to form a packaged semiconductor device wherein each of the wire leads has an exposed portion only at an end. The invention also includes a packaged semiconductor device having an integrated circuit device with a plurality of electrical connection pads, a plurality of wire leads coupled to the plurality of electrical connection pads, and a covering of encapsulating material covering at least a portion of the integrated circuit device and covering each of the wire leads, wherein each of the wire leads has an exposed end. The present invention contemplates wire bonding and encapsulation of individual die as well as multiple die on a single wafer.

Various sensors and methods of assembling sensors are described. In some embodiments, the sensor assembly includes a first end, a body portion, and a second end. The first end can include a neck portion and a connector portion and the second end can include a flap, a first component, a neck portion, and a second component. A method is also described for sensor folding. The method can include using a circuit with an attached emitter and a detector that is separated by a portion of the circuit. The method can also include folding the portion of the circuit such that a first fold is created through the emitter and folding the portion of the circuit such that a second fold is created such that the first fold and second fold form an angle.

Method and apparatus are provided for thermally coupling one or more electronic devices to a heatsink. The apparatus comprises a heatsink having a substantially planar upper surface, a wiring board (PWB) with a through-hole for receiving the device such that a principal face thereof is in thermal contact with the heatsink, its electrical leads are captured between at least a portion of the wiring board and the heatsink, and a top of the device protrudes through the PWB. The method comprises placing the device in the through-hole with its base exposed on and protruding from the underside of the PWB, attaching its electrical leads to contacts on the wiring board and pressing the PWB toward the heatsink with the leads captured there between. An electrically insulating thermally conducting layer is desirably placed between the wiring board and the heatsink.

An imaging module in one embodiment includes at least one multiple color emitting light source comprising a plurality of different colored LED dies each independently driveable so that the overall color emitted by the light source can be controlled and varied. The multiple color emitting light source can be controlled so that the color emitted by the light source is optimized for imaging or reading in a present application environment of the module. Further, the module can be configured so that control of the multiple color emitting light source automatically varies depending on a sensed condition, such a color present in a field of view of the module, the distance of the module to a target, and / or a predetermined criteria being met so that feedback is provided to a user. The module in a further aspect can include illumination light sources and aiming light sources which project light in different wavelength emission bands.

The invention is an optical reader having a plurality of image sensors. Each image sensor of a plural image sensor optical reader can be disposed on an imaging module that can include a light source. In one embodiment, a frame of image data captured via actuation of an image sensor of a first imaging module and actuation of illumination of a second imaging module is subjected to decoding. The various modules of a multiple imaging module reader can be adapted to have different best focus positions so that a field depth of the reader is improved.

An indicia decoding device can have an image sensor and a laser diode assembly configured to project laser light onto a substrate. When a trigger signal is received by the indicia decoding device, the device can calculate a delay and enable the laser diode assembly if a delay threshold is satisfied. The indicia decoding device, in one embodiment, can include a hand held housing and an imaging module carrying the image sensor.

An object of the present invention is to provide a substrate for mounting an IC chip which is a component for optical communication having an IC chip and an optical component integrally provided thereon, which can ensure a short distance between the IC chip and the optical component, which is excellent in electric signal transmission reliability and which can transmit optical signal through an optical path for transmitting optical signal. The substrate for mounting an IC chip of the present invention is a substrate for mounting an IC chip comprising: a substrate and, as serially built up on both faces thereof, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition; a solder resist layer formed as an outermost layer; and an optical element mounted thereto, wherein an optical path for transmitting optical signal, which penetrates the substrate for mounting an IC chip, is disposed.

A circuit component built-in module includes: a first electrical insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a plurality of wiring patterns formed at least on a principal surface of the first electrical insulating substrate; a semiconductor chip incorporated in the first electrical insulating substrate and connected electrically with the wiring patterns; and inner vias electrically connecting the plurality of wiring patterns with one another, the inner vias passing through the first electrical insulating substrate. In the circuit component built-in module, the semiconductor chip has a thickness of not less than 30 mum and not more than 100 mum, and has a non-wired surface ground, and the circuit component built-in module has a thickness in a range of not less than 80 mum and not more than 200 mum. With this configuration, the high-performance and compact-size circuit component built-in module in which circuit components are mounted at a high density is provided so as to be used suitably in various types of electronic information devices.

A chainable Universal-Serial-Bus (USB) flash-memory drive has both a female USB connector and a male USB connector mounted on a printed-circuit board (PCB) substrate. A USB hub mounted on the substrate connects to a host through the male USB connector. One of the ports of the USB hub is connected to the female USB connector to allow the host to connect to downstream USB devices connected to the chainable USB flash-memory drive. Other ports of the USB hub connect to one or more flash controller chips that drive flash memory chips. The flash memory chips may be mounted on the substrate, or may be on daughter-cards that plug into sockets on the chainable USB flash-memory drive's substrate. The flash controller chip may be mounted on the drive substrate or on the daughter-cards. Several chainable USB flash-memory drives may be connected together in a daisy chain.

Integrated circuits utilizing standard commercial packaging are arranged on a printed circuit board to allow the production of 1-Gigabyte and 2-Gigabyte capacity memory modules. A first row of integrated circuits is oriented in an opposite orientation to a second row of integrated circuits. The integrated circuits in a first half of the first row and in the corresponding half of the second row are connected via a signal trace to a first register. The integrated circuits in a second half of the first row and in the corresponding half of the second row are connected to a second register. Each register processes a non-contiguous subset of the bits in each data word.

A double-sided or multilayer wiring board having high-density wiring is obtained by embedding a spherical semiconductor element in an electrically insulating substrate which composes the wiring board, and a thin electronic device can be provided using such a wiring board. Furthermore, a flexible double-sided or multilayer wiring board which is capable of being housed in a limited space while keeping a desired form can be provided by embedding the spherical semiconductor element, and a thin electronic device can be provided using a variety of such wiring boards by imparting different types of flexibility to desired parts of such a wiring board as required.

A capacitor-built-in-type printed wiring substrate which can reliably eliminate noise and attain extremely low resistance and low inductance in connections between an IC chip and the capacitor, and a printed wiring substrate and capacitor for use in the same. A capacitor-built-in-type printed wiring substrate 100 on which an IC chip is mounted includes a capacitor-built-in-type printed wiring substrate 110 and an IC chip 101 mounted on the capacitor-built-in-type printed wiring substrate 110. A printed wiring substrate 120 includes a number of connection-to-IC substrate bumps 152 and a closed-bottomed capacitor accommodation cavity 121 formed therein. A capacitor 130 is disposed in the cavity 121 and includes a pair of electrode groups 133E and 133F and a number of connection-to-IC capacitor bumps 131 connected to either one of the paired electrode groups 133E and 133F. The connection-to-IC capacitor bumps 131 are flip-chip-bonded to corresponding connection-to-capacitor bumps 103 on the IC chip 101. The connection-to-IC substrate bumps 152 are flip-chip-bonded to corresponding connection-to-substrate bumps 104 on the IC chip 101.

A video system for providing a large number of video streams. The video system includes a video server and dividing means. Storage means, a switch and control means are located at the video server. The video server has a plurality of central-processing units (CPUs). The dividing means divides a plurality of input video-streams entering the video system, and sends the divided plurality of input-video streams, with each divided video stream identified with a separate Ethernet address, to the video server. The storage means stores an input video-stream of the plurality of input video-streams as a stored-video stream. The switch routes an input-video stream of the plurality of input-video streams to the storage means. The control means controls the storage means to replay the stored-video stream and to control portions of the stored-video stream at an appropriate time, and controls the plurality of CPUs at the video server to work in parallel.

An optical probe, which is particularly suited to reduce noise in measurements taken on an easily compressible material, such as a finger, a toe, a forehead, an earlobe, or a lip, measures characteristics of the material. A neonatal and adult disposable embodiment of the probe include adhesive coated surfaces to securely affix the probe onto the patient. In addition, the surface of the probe is specially constructed to reduce the effect of ambient noise.

An IC Card includes a microchip having memory portions storing programs and a plurality of electrical contacts including a first set of electrical contacts connected to the microchip for supporting respective and predetermined functions, according to a predetermined ISO 7816 standard that reserves a second set of the electrical contacts for future use. At least one electrical contact of the second set is further connected to the microchip and is configured by one or more of the programs for supporting respective additional functions.

An imaging module in one embodiment includes an aiming system having a light source, an aperture and an optical element positioned optically forward of the aperture wherein the aiming system projects a crisp and sharp aiming pattern onto a target over a wide range of distances. In one embodiment, an aiming system is configured so that a lens operates as an aperture to project a crisp sharp aiming pattern over a wide range of distances including distances at which the aiming pattern is less than optimally focused. In another embodiment an aiming system is configured so that light emanating from a thin aperture is imaged in such manner that a crisp, sharp aiming pattern is defined over a wide range of distances. The aiming pattern in one embodiment includes sharply defined lateral edges which are useful in sighting target indicia.

A substrate for mounting a semiconductor chip having bumps using an adhesive thereon, said substrate being, for instance, provided with an insulating coating having an opening in the semiconductor chip mounting area so that the wiring conductors will not be exposed to the substrate surface near the boundary of the semiconductor chip mounting area, is improved in connection reliability and has high mass productivity.