302results about "Conductive pattern reinforcement" patented technology

The invention relates to a method for manufacturing a carbon oil filled single-layer metal substrate, which comprises the following steps of: cutting a metal substrate, and providing the metal substrate with a preset size; performing first-time drilling processing, performing back drilling processing on the metal substrate to form a grounding hole, and synchronously processing a first positioning hole for positioning an outer-layer circuit; filling holes with carbon oil; curing treatment: baking the metal substrate filled with the carbon oil; manufacturing an outer layer circuit pattern; drilling for the second time, namely processing a second positioning hole for carbon oil printing positioning on the metal substrate; carbon oil printing, wherein carbon oil printing operation is carried out based on the second positioning hole; and a post-treatment process: carrying out subsequent treatment on the metal substrate subjected to carbon oil printing to obtain a finished product of the metal-based circuit board. The metal substrate is subjected to processing operations of secondary drilling and secondary carbon oil printing, so that accurate positioning can be realized, and deviation of the circuit board caused by telescopic deformation after circuit manufacturing etching is prevented.

The invention relates to the technical field of circuit boards, in particular to a method for improving local thickness unevenness of a rigid-flex board and the rigid-flex board. The method comprises the following steps: S1, extracting residual copper rate distribution, setting a residual copper rate threshold value, and identifying a glue filling area and a non-glue filling area of a rigid-flex board plane according to the residual copper rate threshold value; s2, windowing parameters are obtained according to the hole ring height and diameter of the non-glue-filling area, and windowing is conducted on the cover film according to the windowing parameters; after windowing is completed, the covering film is attached to the corresponding position, the hole ring is sleeved with the window, and the local thickness of the rigid-flex board is consistent; or dividing a high-voltage region and a low-voltage region in the non-glue filling region according to the voltage level and the signal characteristic in the circuit design; the copper is thickened in the high-voltage area, and a step is formed by the thickened copper layer in the high-voltage area; when the glue filling area is filled with glue, pressure difference is formed, the glue layer flows towards the low-pressure area, uniform filling of the glue layer is achieved, and the local thickness of the rigid-flex board is consistent. According to the invention, uneven local thickness of the rigid-flex board is improved.

The invention relates to the technical field of circuit board manufacturing, in particular to a manufacturing process of a high-performance touch screen circuit board, which comprises an electroplating rack, a cart, a placing frame, a partition plate and the like, a cart is arranged below the two electroplating racks; a placing frame is fixedly connected to the trolley; a plurality of partition plates are fixedly connected in the placing frame at equal intervals, and a placing space used for placing circuit boards is formed between every two adjacent partition plates. Through cooperation of the electric sliding rail, the electric sliding block, the motor and the electric clamp, clamping of circuit boards is automatically completed, the situation that manual feeding and discharging operation of the circuit boards is conducted for a long time is avoided, the situation that the circuit boards need to be clamped on an electroplating frame one by one is avoided, manual feeding and discharging operation is time-consuming and tedious, and the electroplating efficiency of the circuit boards is reduced; and the circuit boards in the placing frame are clamped in two batches, namely an odd number of batches and an even number of batches, so that the circuit boards in each batch are prevented from being interfered by the circuit boards in the other batch when being clamped.

The present invention provides a method for electroplating gold on the surface of a circuit board. The method comprises the following steps: (1) first printing ink on the surface of the circuit board to form an ink layer; (2) slotting the ink layer to form grooves; (3) second printing a conductive silver paste in the grooves and curing the paste, then grinding the circuit board to remove the ink; and (4) electroplating the circuit board after the ink is removed with gold, and then removing the conductive silver paste. The method can effectively solve problems such as residual conductive wires or gaps in the gold plating pattern that occur during the gold plating process for drawing conductive wires, and does not require etching, thereby reducing costs and improving efficiency.

The invention relates to the technical field of glue filling between PCB thick copper wires, in particular to a method for filling glue between PCB thick copper wires. Comprising the following steps that a CCL incoming material is subjected to positioning cutting, the CCL incoming material is cut into the consistent production size, the cutting precision is + / -0.1 mm, it is guaranteed that the sizes of cut plates are consistent, and follow-up machining is facilitated; manufacturing an inner-layer circuit; performing inner layer AOI (Automatic Optic Inspection); carrying out inter-line resin printing; according to the method, through the accurate resin printing and baking curing steps, it can be guaranteed that the space between the thick copper wires is fully and evenly filled with the resin, the problems of lack of glue and bubbles are effectively avoided, through the whole board coating, even and flat brushing of the resin and the accurate baking curing process, the uniformity of the board thickness can be guaranteed, and the production efficiency is improved. Through the steps of accurate exposure energy control, developing etching, film removing treatment and the like, the definition and accuracy of a circuit pattern can be ensured.

A printed circuit board includes: an insulating portion; a first pad disposed on the bottom of the insulating portion; a first solder resist layer disposed on the bottom of the insulating portion, covering at least a portion of the first pad, and having a first opening in at least a portion of the first pad; a first barrier layer disposed on a portion of the first pad corresponding to the first opening; a first surface treatment layer disposed on the first barrier layer; a second pad disposed on the top of the insulating portion; a second solder resist layer disposed on the top of the insulating portion, covering at least a portion of the second pad; a metal post disposed on the second pad; and a second barrier layer disposed between the second pad and the metal post.

The invention relates to the technical field of micro-nano additive manufacturing and electronic manufacturing, in particular to a non-deployable curved surface micro conformal circuit additive manufacturing method based on electric field driving. A circuit pattern mask is needed at any non-deployable three-dimensional curved surface conformal manufacturing position, and an imprinting working soft mold consistent with the female mold plate in structure is prepared through secondary mold turning; secondly, conformal imprinting and shape restoring are carried out, and a groove structure consistent with the geometric pattern of the circuit is obtained on the curved-surface base material in the modes of etching, roughening treatment and the like; then, the groove is filled with a seed layer, and the groove is filled with high-conductivity metal through the electroplating technology; afterwards, dissimilar metal in the groove is molten and strengthened through laser, after the metal is cooled, the metal and the coarsened microstructure in the groove form an interlocking structure, and the binding force between the metal layer and the base material is greatly enhanced; and finally, performing post-treatment on the surface of the sample piece through processes such as polishing and the like to obtain the final curved surface conformal circuit with the embedded conductive circuit.

To provide an organic interposer and a method for manufacturing the organic interposer capable of improving insulation reliability.SOLUTION: An organic interposer 10 includes: an organic insulating laminate 12 comprising a plurality of organic insulating layers; and a plurality of wires 13 arranged in the organic insulating laminate 12, where the wires 13 and the organic insulating layers are separated by a barrier metal film 14. The organic insulating laminate 12 may include: a first organic insulating layer 21 having a plurality of grooves 21a having the wires 13 disposed therein; and a second organic insulating layer 22 laminated on the first organic insulating layer 21 in such a way as to embed the wires 13.SELECTED DRAWING: Figure 2

A communication device comprises: a digital predistortion (DPD) circuit; a digital-to-analog converter (DAC) configured to convert output signals of the DPD circuit into analog signals; a power amplifier configured to amplify the analog signals; and an antenna configured to transmit the amplified analog signals, wherein the DPD circuit may be configured to: generate first predistortion signals by performing a convolution operation on digital signals of a reference time unit over a time interval including a first set of time units before the reference time unit and a second set of time units after the reference time unit; generate second predistortion signals by performing predistortion on the digital signals; and generate the output signals of the DPD circuit on the basis of the first predistortion signals and the second predistortion signals.

The invention discloses an ultraviolet alkaline developing resin curing oven, and particularly relates to the technical field of resin curing, the ultraviolet alkaline developing resin curing oven comprises a bottom plate, the bottom plate extends upwards to form two vertical optical shafts, the two optical shafts are jointly and fixedly connected with a lower hemispherical shell, and the two optical shafts are jointly and slidably connected with an upper hemispherical shell matched with the lower hemispherical shell; a lifting assembly used for lifting the upper hemispherical shell is installed on the cross rod, an inner cavity formed by the upper hemispherical shell and the lower hemispherical shell is communicated with a first ventilation pipe and a second ventilation pipe, ultraviolet lamp beads are evenly distributed on the spherical wall of the inner cavity formed by the upper hemispherical shell and the lower hemispherical shell, and the first ventilation pipe is communicated with a switcher; the first ventilation pipe is communicated with the round pipe at one end of the switcher, the second ventilation pipe is communicated with the round pipe at one end of the switcher, the two ends of the switcher are in sliding connection with switching bases respectively, the two switching bases are jointly and fixedly connected with a temperature adjusting box, and the circuit board manufacturing method is suitable for manufacturing special circuit boards with complex curved surfaces or multiple surfaces.

To improve the connection reliability.SOLUTION: A wiring board includes a wiring layer, an insulating layer laminated on the wiring layer, an opening that penetrates the insulating layer to the wiring layer, and a conductor film formed in the opening of the insulating layer. The surface of the insulating layer includes a smooth portion exposed from the conductor film, and a roughened portion including an inner wall surface of the opening covered with the conductor film and having a surface roughness larger than that of the smooth portion.SELECTED DRAWING: Figure 2

A circuit board and a method for manufacturing the circuit board, a functional backplate, a backlight module, a display apparatus, and a display panel are provided. The circuit board includes: a base substrate; a wire arranged on the base substrate, where the wire includes a first conductive layer; and at least one insulating layer arranged on a side of the first conductive layer away from the base substrate, where the at least one insulating layer covers the first conductive layer. The first conductive layer includes a first stacked structure on a side away from the base substrate and a second stacked structure proximate to the base substrate, and the first stacked structure includes at least an etch stop layer covering the second stacked structure.

A method of manufacturing a component carrier, includes stamping a surface profile in a design layer, forming an electrically conductive seed layer on the stamped design layer, forming a patterned electroplating protection structure on portions of the seed layer apart from indentations of the profiled design layer, and electroplating an electroplating structure selectively on or above portions of the seed layer exposed with respect to the electroplating protection structure.

The invention discloses a circuit board selective dry film technology and a circuit board, and the technology comprises the steps: feeding a target circuit board semi-finished product into character jet printing equipment, carrying out the jet printing of characters on the surface of the target circuit board semi-finished product, and carrying out the pre-curing of the characters through a first ultraviolet lamp disposed in the character jet printing equipment, and obtaining a first semi-finished product; the first semi-finished product is sent into an oven to be baked, the characters are solidified for the second time, and a second semi-finished product is obtained; the characters of the second semi-finished product are cured for the third time through a second ultraviolet lamp, a third semi-finished product is obtained, the energy density of the second ultraviolet lamp is 600 + / -50 mJ / cm < 2 >, and the curing time is 60 seconds; a dry film is attached to the third semi-finished product, and after selection treatment is conducted, a fourth semi-finished product is obtained; and the fourth semi-finished product is fed into a film stripping assembly line, the dry film is subjected to film stripping treatment, a fifth semi-finished product is obtained, and the linear speed of the film stripping assembly line is larger than or equal to 2.0 m / min. Dry film residues can be effectively avoided, and the appearance quality of a product is improved.

A method of manufacturing a packaging substrate according to the present disclosure includes a preparing step of preparing a panel-level packaging substrate comprising a core substrate, a first redistribution layer disposed on the core substrate, and a second redistribution layer disposed under the core substrate, and an electroless surface treatment step of forming terminals by simultaneously performing electroless surface treatment on an upper surface and a lower surface of the panel-level packaging substrate. The packaging substrate comprises a core layer, the first redistribution layer disposed on the core layer, the second redistribution layer disposed under the core layer, and the terminals disposed on an upper surface of the first redistribution layer and a lower surface of the second redistribution layer. A difference between a maximum thickness value and a minimum thickness value of the terminals formed on the packaging substrate is 5 µm or less. In such a case, terminals having improved thickness uniformity may be formed, and process efficiency during terminal formation may be promoted.

The utility model relates to a golden finger and an electroplating lead structure thereof, the golden finger comprises a first golden finger and a second golden finger which are arranged on a substrate, the first golden finger is connected with a lateral ground hole located in the first direction of the first golden finger, and the electroplating lead structure comprises an electroplating bus and an electroplating branch line; the electroplating bus is connected with at least part of the ground holes in one side of the golden finger in the first direction, and the electroplating branch line is connected with the second golden finger and the electroplating bus; the electroplating lead structure further comprises a blind hole used for disconnecting the electroplating branch line and the electroplating bus of the second golden finger. According to the electroplating lead structure, the electroplating branch lines between the second golden fingers and the electroplating bus are cut off through the blind holes, the performance of high-speed signals borne by the golden fingers is prevented from being affected, and meanwhile, due to the adoption of the blind hole structure, the structure of the other side face of the substrate cannot be damaged.

A power supply module is provided for powering an integrated circuit chip located at a first side of a first carrier board, including: a first-stage power supply unit; and a second-stage power supply unit, where one or more power input terminals of the second-stage power supply unit is electrically connected with one or more corresponding power output terminals of the first-stage power supply unit through a second carrier board; the second carrier board is configured to transmit power from the first-stage power supply unit to the second-stage power supply unit, and the second-stage power supply unit further supplies the power to the integrated circuit chip; one or more power output terminals of the second-stage power supply unit is electrically connected with one or more corresponding power terminals of the integrated circuit chip.

The invention discloses a PCB surface treatment process based on local gold plating and nickel and gold immersion, and relates to the technical field of surface treatment processes. The method is used for processing a PCB which needs local hard gold plating and nickel gold immersion at other positions, and comprises the following steps: S1, pre-processing: processing the PCB to a copper thickness before electroplating; s2, first-layer pattern processing: pasting a dry film on the CS surface of the PCB and etching to form a pattern; s3, gold plating preparation; s4, local gold plating; s5, removing the film and processing a second layer of pattern; s6, removing the wire; s7, resistance welding and protection; and S8, nickel and gold immersion treatment. According to the surface treatment process, the microcosmic roughness of the surface of the substrate is accurately controlled through multi-step pretreatment, and high-pressure water washing and plasma cleaning are combined, so that the mechanical embedding force of a plating layer and a copper layer is ensured, and the problem that the plating layer is not uniform due to too large roughness is avoided. And meanwhile, the current distribution is regulated and controlled by adopting pulse current and a magnetic mask in the copper deposition and electroplating stages, so that the compactness and thickness uniformity of the coating are improved.

This application relates to the field of substrate processing technologies, and particularly to a method for preparing a glass substrate. The preparation method includes the following steps: providing an initial glass substrate; preparing a conductive pattern on one surface of the initial glass substrate; coating aluminum paste on the back surface of the initial glass substrate with the conductive pattern formed thereon, performing a drying treatment, and then co-sintering to obtain a glass substrate. This preparation method has a simple process, is easy to operate, has a low cost, is environmentally friendly and pollution-free. The finally obtained glass substrate has significantly improved thermal conductivity and can be used for the packaging of high-power LED chips with high luminous efficiency, high heat dissipation and high integration. It can better improve the light-emitting and heat-dissipating performance and has good application prospects.

In the present invention, a substrate for a printed wiring board comprises: a base film having a first main surface and a second main surface; a first electrically conductive layer disposed on the first main surface; a second electrically conductive layer disposed on the second main surface; a first electroless copper plating layer disposed on the first electrically conductive layer; a second electroless copper plating layer disposed on the second electrically conductive layer; and a third electroless copper plating layer. A through-hole penetrating through the base film along the thickness direction is formed in the base film. The third electroless copper plating layer is disposed on the inner wall surface of the through hole. The palladium content of the base film in the first main surface and the second main surface is smaller than palladium content of the base film in the inner wall surface.

Method for creating an electrode on a substrate (10) using a laser assisted deposition process. A metal paste (14) is printed and dried (15) on the substrate to form a conductive layer (16), and by 2D or 3D inspection, the dimensions of the conductive layer are measured. The substrate is subject to a pretreatment process (12) so as to increase adhesion and / or conduction of the conductive layer to the substrate. An electrode that is produced according to the present method may be used in flexible devices.

The invention relates to the technical field of circuit board manufacturing, and discloses a circuit board manufacturing method suitable for an Msap process and a circuit board, and the method comprises the steps: S100, pasting a dry film at a position corresponding to an etching line on one side or two sides of a laminated board; s200, pattern electroplating is conducted on the laminated board till the difference value between the height of the laminated board and the height of the dry film is within a preset value range; s300, the surface, subjected to pattern electroplating, of the laminated board is leveled, and the horizontal plane of the leveled laminated board coincides with the end face of the leveled dry film; and S400, removing the dry film attached to the surface of the laminated board, and carrying out surface treatment to obtain a finished product carrier board. According to the method, the electroplated layer is removed through leveling with the dry film, so that the electroplated layer is overlapped with the end face of the dry film, the micro step difference between the electroplated layer and the dry film is eliminated, defects formed on the surface of the electroplated layer are removed, and secondary defects such as uneven solder infiltration and blind hole deviation can be fundamentally eliminated.

A method for manufacturing potted electronic assemblies are described. Embodiments of the method and system may provide a potting compound having a first coefficient of thermal expansion different from a second coefficient of thermal expansion for a circuit board, provide a fiber reinforcement having a third coefficient of thermal expansion selected so that when the potting compound is combined with the fiber reinforcement the combined coefficient of thermal expansion is closer to the second coefficient of thermal expansion than the first coefficient of thermal expansion is to the second coefficient of thermal expansion, and apply the fiber reinforcement and the potting compound to the circuit board.

The present invention provides various methods and systems for forming a flexible circuit (1300). In one example, a method includes forming a flexible circuit (1300) that includes a plurality of contact pads (908, 1112, 1122) arranged in a plurality of rows, each contact pad (908, 1112, 1122) in a given row being electrically coupled to each other via an electrical trace (406), and each contact pad including a via hole (902, 1110, 1120), electroplating the flexible circuit (1300) with at least a first material, including electroplating each via hole (902, 1110, 1120), and at least partially cutting (1302, 1304, 1306) at least some of the electrical traces (406) while verifying the connectivity of each via hole.

Disclosed is a substrate for printed circuits, which comprises a base film having polyimide as a main component and a conductor layer formed on at least one side of the base film, the conductor layer having a metal sintered layer formed on the base film and an electrolysis-free plating layer formed on the metal sintered layer, wherein the number of voids having a maximum width of 5 μm or more in plan view in the base film is 10 or less per 0.25 mm 2 of the reference unit area on the surface of the base film.

The invention relates to a method for producing a via (12) in a carrier foil (10) which is printed with conductive paths (11) on both sides, said carrier foil (10) comprising a first side (21) and a second side (22). The method has the following steps: printing the first side (21) of the carrier foil (10) with electrically conductive material (13), the region of the provided via (12) being covered; introducing at least one through-hole (14) into the carrier foil (10) in the region of the provided via by means of a laser using at least one diffractive optical system; and printing the second side (22) of the carrier foil (10) with electrically conductive material (13), wherein the at least one through-hole (14) is filled with electrically conductive material (13).

The present invention discloses a gold plating treatment process for the surface of incoming substrate in an EBGA process, which belongs to the field of semiconductor packaging, including a cleaning treatment process for a copper substrate and a gold plating process for the cleaned copper substrate, wherein the cleaning treatment process for the copper substrate includes preparing a cleaning solution, wherein the cleaning solution includes component A and component B; component A includes the following components in parts by weight: 10-12 parts of N-hydroxyphthalimide p-toluenesulfonate, 24-25 parts of visible light alkali generator wrapped in a microcapsule shell, and 10-12 parts of anionic surfactant, wherein the spectral absorption range of the visible light alkali generator is 200-500nm; component B includes the following components in parts by weight: 10-12 parts of plant protein, composite protease, and TG enzyme, wherein the mass ratio of plant protein to composite enzyme is 1:3-3.2, and the amount of TG enzyme added is 0.3-0.4% of the mass of plant protein. A protective film is formed on the surface of the copper substrate after cleaning by the present invention, which has a good protective effect on the copper substrate.

The present invention discloses an energy-saving nozzle and an electroplating device, wherein the energy-saving nozzle includes a nozzle assembly; the nozzle assembly includes a mounting part, a channel part and a nozzle part, a channel is formed inside the channel part, a reflux port connected to the channel is opened on the side wall of the channel part, one end of the channel part is arranged on the mounting part, the nozzle part is arranged on the mounting part and is located in the channel, the nozzle of the nozzle part extends toward the other end of the channel part, and the nozzle of the nozzle part is opposite to the reflux port. The present application forms a negative pressure difference at the reflux port through the corresponding arrangement of the nozzle of the nozzle part and the reflux port on the channel part, and the electroplating liquid around the nozzle quickly refluxes into the channel through the reflux port, thereby increasing the flow rate of the nozzle during the spraying, and increasing the spraying volume of the nozzle without increasing the power of the pressure pump, with low cost for continuous production, energy saving and environmental protection.

To improve the HAST resistance of a wiring board.SOLUTION: The wiring board has: an insulating layer; a first pad and a second pad for external connection that are provided on the insulating layer and each include a first surface in contact with the insulating layer, a second surface on the opposite side of the first surface, and a side surface connecting the first surface and the second surface; and a protective insulating layer provided on the insulating layer. Each of the first pad and the second pad has a part exposed in an opening of the protective insulating layer. The first pad has a part facing the second pad without having the protective insulating layer therebetween. A region exposed from the protective insulating layer of the second surface of each of the first pad and the second pad is covered with a plating layer. A region exposed from the protective insulating layer of the side surface of each of the first pad and the second pad is exposed from the plating layer.SELECTED DRAWING: Figure 1