142results about "Conductive pattern reinforcement" patented technology

The invention relates to the technical field of circuit boards, in particular to a method for improving local thickness unevenness of a rigid-flex board and the rigid-flex board. The method comprises the following steps: S1, extracting residual copper rate distribution, setting a residual copper rate threshold value, and identifying a glue filling area and a non-glue filling area of a rigid-flex board plane according to the residual copper rate threshold value; s2, windowing parameters are obtained according to the hole ring height and diameter of the non-glue-filling area, and windowing is conducted on the cover film according to the windowing parameters; after windowing is completed, the covering film is attached to the corresponding position, the hole ring is sleeved with the window, and the local thickness of the rigid-flex board is consistent; or dividing a high-voltage region and a low-voltage region in the non-glue filling region according to the voltage level and the signal characteristic in the circuit design; the copper is thickened in the high-voltage area, and a step is formed by the thickened copper layer in the high-voltage area; when the glue filling area is filled with glue, pressure difference is formed, the glue layer flows towards the low-pressure area, uniform filling of the glue layer is achieved, and the local thickness of the rigid-flex board is consistent. According to the invention, uneven local thickness of the rigid-flex board is improved.

A communication device comprises: a digital predistortion (DPD) circuit; a digital-to-analog converter (DAC) configured to convert output signals of the DPD circuit into analog signals; a power amplifier configured to amplify the analog signals; and an antenna configured to transmit the amplified analog signals, wherein the DPD circuit may be configured to: generate first predistortion signals by performing a convolution operation on digital signals of a reference time unit over a time interval including a first set of time units before the reference time unit and a second set of time units after the reference time unit; generate second predistortion signals by performing predistortion on the digital signals; and generate the output signals of the DPD circuit on the basis of the first predistortion signals and the second predistortion signals.

The invention discloses a circuit board selective dry film technology and a circuit board, and the technology comprises the steps: feeding a target circuit board semi-finished product into character jet printing equipment, carrying out the jet printing of characters on the surface of the target circuit board semi-finished product, and carrying out the pre-curing of the characters through a first ultraviolet lamp disposed in the character jet printing equipment, and obtaining a first semi-finished product; the first semi-finished product is sent into an oven to be baked, the characters are solidified for the second time, and a second semi-finished product is obtained; the characters of the second semi-finished product are cured for the third time through a second ultraviolet lamp, a third semi-finished product is obtained, the energy density of the second ultraviolet lamp is 600 + / -50 mJ / cm < 2 >, and the curing time is 60 seconds; a dry film is attached to the third semi-finished product, and after selection treatment is conducted, a fourth semi-finished product is obtained; and the fourth semi-finished product is fed into a film stripping assembly line, the dry film is subjected to film stripping treatment, a fifth semi-finished product is obtained, and the linear speed of the film stripping assembly line is larger than or equal to 2.0 m / min. Dry film residues can be effectively avoided, and the appearance quality of a product is improved.

A method of manufacturing a packaging substrate according to the present disclosure includes a preparing step of preparing a panel-level packaging substrate comprising a core substrate, a first redistribution layer disposed on the core substrate, and a second redistribution layer disposed under the core substrate, and an electroless surface treatment step of forming terminals by simultaneously performing electroless surface treatment on an upper surface and a lower surface of the panel-level packaging substrate. The packaging substrate comprises a core layer, the first redistribution layer disposed on the core layer, the second redistribution layer disposed under the core layer, and the terminals disposed on an upper surface of the first redistribution layer and a lower surface of the second redistribution layer. A difference between a maximum thickness value and a minimum thickness value of the terminals formed on the packaging substrate is 5 µm or less. In such a case, terminals having improved thickness uniformity may be formed, and process efficiency during terminal formation may be promoted.

The utility model relates to a golden finger and an electroplating lead structure thereof, the golden finger comprises a first golden finger and a second golden finger which are arranged on a substrate, the first golden finger is connected with a lateral ground hole located in the first direction of the first golden finger, and the electroplating lead structure comprises an electroplating bus and an electroplating branch line; the electroplating bus is connected with at least part of the ground holes in one side of the golden finger in the first direction, and the electroplating branch line is connected with the second golden finger and the electroplating bus; the electroplating lead structure further comprises a blind hole used for disconnecting the electroplating branch line and the electroplating bus of the second golden finger. According to the electroplating lead structure, the electroplating branch lines between the second golden fingers and the electroplating bus are cut off through the blind holes, the performance of high-speed signals borne by the golden fingers is prevented from being affected, and meanwhile, due to the adoption of the blind hole structure, the structure of the other side face of the substrate cannot be damaged.

A power supply module is provided for powering an integrated circuit chip located at a first side of a first carrier board, including: a first-stage power supply unit; and a second-stage power supply unit, where one or more power input terminals of the second-stage power supply unit is electrically connected with one or more corresponding power output terminals of the first-stage power supply unit through a second carrier board; the second carrier board is configured to transmit power from the first-stage power supply unit to the second-stage power supply unit, and the second-stage power supply unit further supplies the power to the integrated circuit chip; one or more power output terminals of the second-stage power supply unit is electrically connected with one or more corresponding power terminals of the integrated circuit chip.

The invention discloses a PCB surface treatment process based on local gold plating and nickel and gold immersion, and relates to the technical field of surface treatment processes. The method is used for processing a PCB which needs local hard gold plating and nickel gold immersion at other positions, and comprises the following steps: S1, pre-processing: processing the PCB to a copper thickness before electroplating; s2, first-layer pattern processing: pasting a dry film on the CS surface of the PCB and etching to form a pattern; s3, gold plating preparation; s4, local gold plating; s5, removing the film and processing a second layer of pattern; s6, removing the wire; s7, resistance welding and protection; and S8, nickel and gold immersion treatment. According to the surface treatment process, the microcosmic roughness of the surface of the substrate is accurately controlled through multi-step pretreatment, and high-pressure water washing and plasma cleaning are combined, so that the mechanical embedding force of a plating layer and a copper layer is ensured, and the problem that the plating layer is not uniform due to too large roughness is avoided. And meanwhile, the current distribution is regulated and controlled by adopting pulse current and a magnetic mask in the copper deposition and electroplating stages, so that the compactness and thickness uniformity of the coating are improved.

Method for creating an electrode on a substrate (10) using a laser assisted deposition process. A metal paste (14) is printed and dried (15) on the substrate to form a conductive layer (16), and by 2D or 3D inspection, the dimensions of the conductive layer are measured. The substrate is subject to a pretreatment process (12) so as to increase adhesion and / or conduction of the conductive layer to the substrate. An electrode that is produced according to the present method may be used in flexible devices.

Disclosed is a substrate for printed circuits, which comprises a base film having polyimide as a main component and a conductor layer formed on at least one side of the base film, the conductor layer having a metal sintered layer formed on the base film and an electrolysis-free plating layer formed on the metal sintered layer, wherein the number of voids having a maximum width of 5 μm or more in plan view in the base film is 10 or less per 0.25 mm 2 of the reference unit area on the surface of the base film.

To provide a printed wiring board that includes a flying lead part having excellent electrical connection reliability.SOLUTION: A printed wiring board according to one aspect of the present disclosure includes: a base layer; and a conductive pattern on the base layer, having a conductive core, the conductive pattern having a flying lead part protruding from the base layer in a plan view, the flying lead part including the conductive core and a plating layer covering an entire outer surface of the conductive core.SELECTED DRAWING: Figure 1

An electronic board includes: a stack including at least one electrically insulating layer structure and a plurality of electrically conductive layer structures, where one of the plurality of electrically conductive layer structures is disposed on one major surface of the at least one electrically insulating layer structure, and the other of the plurality of electrically conductive layer structures is disposed on the other major surface of the at least one electrically insulating layer structure; and another electrically conductive layer structure of the plurality of electrically conductive layer structures is disposed on another opposite major surface of the at least one electrically insulating layer structure; a via formed in the stack and laterally delimited by a conductive material; at least one plating layer disposed on at least portions of the two opposite major surfaces of the stack and on the sidewalls of the stack; an axial annular projection disposed at one end of the through hole; and a radial annular projection disposed at a sidewall of the stack. The invention also provides a method for manufacturing the electronic board.

The invention relates to the technical field of printed circuit board manufacturing, and discloses a method for improving poor gold surface of nickel immersion gold. The method comprises the following steps: sequentially carrying out board grinding and sand blasting pretreatment on the copper surface of the circuit board, carrying out automatic visual inspection to identify defects of the copper surface, overhauling and sorting based on defect identification, carrying out secondary sand blasting treatment and carrying out nickel-gold immersion treatment. According to the method, a closed-loop process of automatic visual inspection and maintenance sorting is embedded before the main process of nickel and gold immersion of the circuit board, so that the conversion from passive scrapping to active prevention is realized, the copper surface defects can be accurately identified and repaired on line, the poor gold surface caused by the defects is completely eradicated from the source, and the product rejection rate is remarkably reduced; and meanwhile, the unrepairable units are blocked, so that invalid consumption of precious metal materials is avoided, and the production cost is saved. In addition, a process optimization closed loop is formed based on feedback adjustment of detection data, and the quality stability and the production yield are improved.

The present application relates to the technical field of 3D printing, and particularly relates to a printing device and forming method of a circuit protection layer of a display device. The printing device of the present application comprises: a main support; the main support has a front end and a rear end along a horizontal direction; at least two barrier wall printing units, which are adapted to print and form barrier walls on the surface of the connection area and / or non-connection area of a flexible circuit board respectively; the printing unit comprises a printing needle; the printing units are arranged at intervals in the direction from the front end to the rear end; a filling glue printing unit is arranged at intervals with the barrier wall printing units in the direction from the front end to the rear end, is located between the rear end and the barrier wall printing units, and is adapted to print filling glue in the space between the multiple barrier walls formed by the multiple printing units to form a circuit protection layer; the circuit protection layer covers at least the connection area. The present application can effectively solve the problems of poor uniformity of the film layer thickness of the circuit protection layer, influence on packaging, and even possible influence on the display effect.

The present invention provides: a ceramic circuit substrate comprising a unidirectional porous metal thermal interface material layer, which exhibits excellent heat dissipation performance by having a unidirectional porous metal applied thereto; and a power module equipped with the ceramic circuit substrate. The ceramic circuit substrate according to an embodiment of the present invention comprises: a ceramic substrate comprising a ceramic layer, a first substrate copper layer disposed on a first surface of the ceramic layer, and a second substrate copper layer disposed on a second surface of the ceramic layer; and a unidirectional porous metal thermal interface material layer disposed on the second substrate copper layer and having a plurality of pores extending unidirectionally in the vertical direction from the second substrate copper layer.

This invention discloses a method for electroplating soft gold onto a circuit board, and also discloses the circuit board. The method includes the following steps: S1: Obtaining a circuit board with a copper layer on its surface; S2: Electroplating a nickel layer on the surface of the copper layer, wherein the surface of the nickel layer has gold bonding lines and non-gold bonding lines; S3: Forming multiple arrayed and spaced bump structures in the gold bonding lines, each bump structure including a nickel substrate and a gold surface layer disposed on the surface of the nickel substrate; S4: Electroplating the circuit board with gold to form a first gold layer on the gold bonding lines and a second gold layer on the non-gold bonding lines, wherein the thickness of the first gold layer is greater than the thickness of the second gold layer. In this way, selective thickening of the gold bonding lines is achieved during the gold plating process, ensuring that the gold bonding lines have a sufficiently thick gold layer to guarantee the reliability of the gold bonding lines, while the non-gold bonding lines maintain a relatively thin gold layer, which can reduce the amount of gold used and lower the production cost of the circuit board.

The invention relates to the technical field of circuit board processing, in particular to a method for saving soft gold salt in a PCB / SUB processing process, which comprises the following steps of: after an AOI (Automatic Optic Inspection) detection of a SUB jointed board is finished, cutting off electroplating lead connection between the unqualified Units and qualified Units in the SUB jointed board; and then, only qualified Units are subjected to soft gold electroplating treatment, and unqualified Units do not participate in the subsequent electroplating process. Selective electrical isolation is implemented before soft gold electroplating, so that the scrapped Units are completely separated from an electroplating loop and are prevented from participating in current distribution in the electroplating process, invalid deposition of gold salt on the scrapped Units is prevented, electroplating resources are intensively used for qualified Units, and the overall electroplating efficiency and consistency are improved. On the premise of not adding an extra complex electroplating process, the material cost is obviously saved, and good economic benefits are achieved.

To provide a copper clad laminate excellent in folding endurance and a method for manufacturing the copper clad laminate.SOLUTION: A copper clad laminate 1 includes a base material 10 and a copper plating film 20 formed on the surface of the base material 10. The copper plating film 10 is obtained by laminating four layers of high current density layers 21 formed by electroplating at a high current density and three layers of low current density layers 22 formed by electroplating at a low current density alternately. The spacing of the low current density layers 22 is 0.3 to 0.6 μm or 0.8 to 1.1 μm. Alternatively, the spacing of the low current density layer 22 is 3.5 to 7.1% or 9.4 to 12.9% of the copper plating thickness.SELECTED DRAWING: Figure 1

A micro power distribution box is provided which includes a device, a connector / housing and a cover. The device has a substrate, at least one first finger, at least one second finger, and at least one electrical component. The at least one first finger and the at least one second finger are electrically connected to one another. The at least one first finger has first, second and third portions. The at least one second finger has first and second portions. The substrate in overmolded to the first portions of the at least one first and second fingers. The substrate is not overmolded to the second portions of the at least one first and second fingers or to the third portion of the at least one first finger. The second portions of the at least one first and second fingers extend outwardly from the substrate. The second portion of the at least one first finger is a high current contact. The second portion of the at least one second finger is a contact pin. The third portion of the at least one first finger is exposed via an aperture provided through the substrate. The at least one electrical component is directly mounted to the third portion of the at least one first finger in order to electrically connect the at least one electrical component to the at least one first finger. The connector / housing is configured to house the device therein and is configured to be connected to a mating connector. The cover is configured to be secured to the connector / housing in a manner which prevents the device from being removed from the connector / housing.

A transparent article has a transparent laminating film; and an electrically-conductive, metal-containing pattern disposed over a surface of the transparent laminating film (or transparent polymeric film). The electrically-conductive, metal-containing pattern has a metallic pattern comprising a first surface facing the transparent laminating film and an opposing second surface. Such articles can be prepared using steps A) and B'), in order: A) providing a metallic pattern on a surface of a first substrate; and B') transferring the metallic pattern to a surface of a second substrate (transparent laminating film), thereby providing an electrically-conductive metal-containing pattern on the surface of the second substrate, wherein the second substrate is a transparent laminating film. Catalytic inks can also be used to prepare the electrically-conductive, metal-containing pattern. Such articles can also be incorporated between two panes of rigid materials such as glass to form a composite article such as a windshield with an invisible antenna.

The purpose of this invention is to provide a copper film-forming ink according to which high printability and high printing stability can be achieved. Specifically, disclosed is a copper film-forming ink, which contains a copper complex composed of copper formate and a five-membered or six-membered nitrogen-containing heterocyclic compound having one alkyl substituent composed of 2-5 carbon atoms or two or more alkyl substituents composed of 1-5 carbon atoms and having 1-3 nitrogen atoms, and a monovalent alcohol having 2-6 carbon atoms and optionally having an ether bond.

The utility model discloses a PCB (Printed Circuit Board) electroplating floating frame which comprises a first fixing plate and a second fixing plate which are oppositely arranged, a connecting beam for connecting the first fixing plate and the second fixing plate, a first side plate and a second side plate which are distributed on two sides of the connecting beam, and a plurality of connecting blocks which are symmetrically distributed on two sides of the connecting beam and are used for clamping and fixing a plating piece, one end of the connecting block is connected with the first side plate or the second side plate, the other end of the connecting block is connected with the connecting beam, the height of the first side plate and the height of the second side plate are 22-24 cm, the first side plate and the second side plate are provided with hole opening areas, a plurality of through holes are formed in the hole opening areas, and the through holes are communicated with the first side plate and the second side plate. The opening area is located in the area from the top face of the first side plate and the top face of the second side plate to the area 7-8 cm away from the top face. According to the PCB electroplating floating frame provided by the utility model, the shielding area of a high-potential region of the floating frame is increased by increasing the heights of the vertical plates on the two sides of the floating frame and optimizing the positions of the through holes in the vertical plates, so that the copper plating uniformity of a circuit board is improved.

The invention relates to the field of integrated circuit manufacturing, in particular to the technical field of manufacturing of semiconductor device special equipment such as a photoetching machine and an etching machine special for production, and provides a windowing-free Mark point structure for a PCB cover film and a manufacturing method of the windowing-free Mark point structure. The method comprises the following steps: preparing a PCB substrate and pre-processing a copper surface; for a yellow covering film area of the PCB substrate, the yellow covering film is attached to the corresponding position of the PCB substrate, windowing processing is not carried out on the covering film at the Mark point position, and the color of the yellow covering film and a background copper surface are utilized to form a contrast ratio for SMT equipment identification; for the black covering film area, white ink points are manufactured at the Mark point positions of the substrate, and the black covering film is attached to the corresponding positions of the PCB substrate; and after the lamination is completed, carrying out curing treatment on the cover film. By means of the windowing-free design of the yellow covering film area, the drilling / laser cutting procedure and the nickel-gold immersion process are omitted, and consumption of precious metal is avoided.

The invention relates to a method for producing a solderable circuit board (1) comprising a substrate (2) made of an electrically insulating material, conductor paths (3) arranged on the substrate, having connecting surfaces (3.1) for SMD components, wherein the conductor paths and the connecting surfaces are made of aluminium or an aluminium alloy. According to the invention, in order to easily allow for the reproducible production of soldered connections of SMD components to the connecting surfaces of conductor paths made of aluminium on the circuit board, the connecting surfaces of the conductor paths made of aluminium are to be selectively metallised, in particular with nickel or a nickel-tin alloy, in a single-stage process, wherein the metallisation method is compatible with the commonly used plastics and composite materials of flexible and rigid circuit boards, and the metallised connecting surfaces provide a suitable surface for the subsequent soldering process, in particular in the form of reflow soldering.

The invention relates to the technical field of circuit board manufacturing processes, in particular to a processing method of a local thick gold plating and tin immersion surface, which comprises the following steps: S100, providing a copper-clad plate, and forming a first bonding pad and a second bonding pad on the copper-clad plate; s200, plating thick gold on the first bonding pad; s300, forming a solder mask layer on the surface of the thick gold plated bonding pad; s400, carrying out tin immersion on the second bonding pad; s500, removing the solder mask layer on the first bonding pad by using carbon dioxide laser to expose the thick gold plated bonding pad; after the thick gold is plated on the first bonding pad, the first bonding pad is covered with the solder mask layer, then the second bonding pad is subjected to tin immersion, and the first bonding pad is formed through carbon dioxide laser windowing after tin immersion, so that the process distance between the first bonding pad and the second bonding pad can be smaller, and the problems of short tin immersion process time and blue glue residue can be effectively avoided.

To provide a circuit board that can be properly created by a non-sub subtractive method using metal particle ink even on rigid base materials, and a method for manufacturing the same.SOLUTION: A circuit board 10 is composed of a substrate 11 made of glass epoxy, a resin layer 12 formed on the substrate 11 and containing epoxy resin, an electrical conductive film 13 consisting of a photo-sintered layer of metal particles formed on the resin layer 12, and a plating layer 14 formed on the electrical conductive film 13. In one aspect, the resin comprising the resin layer has a curing temperature in the range from room temperature to 190°C and has an endothermic peak within the region of more than 360°C and less than 450°C in a TG-DTA analysis of the resin.SELECTED DRAWING: Figure 10

A method for generating stencil openings, including: extracting pieces of pad pattern data from a solder-paste printing layer of a PCB and encoding graphical features of the pad pattern data; searching for candidate component packages in a stencil opening library based on pad pattern codes; matching pad pattern data of the candidate component packages with the pad pattern data of the PCB; generating a stencil opening layer of the PCB based on stencil opening data of the successfully matched candidate component packages, to process a stencil template according to the stencil opening layer. The present disclosure allows for the automatic identification of component packages based solely on pad pattern data without manual recognition. Subsequently, corresponding stencil opening patterns are found in the stencil opening library based on the component packages, achieving automated design of stencil openings and solving the problem of inefficiency in the stencil template manufacturing process.

A method for forming a printed circuit board includes: forming on a substrate a first conductive layer for a first edge connector pin and a first conductive layer for a second edge connector pin, wherein the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin are electrically coupled to one another via a first conductive layer for an electrical bridging element; electroplating a second conductive layer onto both the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin via a plating current conductor; and removing at least a portion of the electrical bridging element to electrically separate the first edge connector pin from the second edge connector pin.