489results about "Conductive pattern reinforcement" patented technology

The invention relates to the technical field of PCBs (printed circuit boards), in particular to an intelligent PCB detection and repair method, which comprises the following steps: S1, initializing module configuration: automatically identifying the type and structure information of a PCB; s2, a dynamic detection stage: collecting electrical parameters of the PCB, and generating fault position information; s3, circuit dynamic characteristic compensation: analyzing the nonlinear distortion characteristic of the circuit, and calculating and executing dynamic compensation; s4, an automatic repair stage: generating a repair scheme, including solder joint repair, line reconstruction or signal compensation; and S5, an intelligent recheck stage: performing comprehensive retest on the repaired PCB, verifying the performance of the repaired area, and generating a repair evaluation report. According to the invention, the repair precision and efficiency are improved, the whole repair process is intelligent and automatic, the risk of manual intervention is reduced, and the overall repair efficiency and the long-term reliability of the PCB circuit are improved.

The present disclosure relates to a high-precision multilayer PCB and a 3D printing preparation method thereof. The method includes: S1, forming a 3D circuit layer on an upper surface of a substrate; S2, forming a metal pillar at a preset position of the current 3D circuit layer by stacking; S3, forming an insulating layer on an upper surface of the current 3D circuit layer, and leading the corresponding metal pillar out of the formed insulating layer in advance by drilling a hole in the insulating layer and filling the drilled hole with the nanoscale metal slurry; S4, forming a pad layer on an upper surface of the current insulating layer and executing step S5 if the current insulating layer is a top layer; repeatedly executing steps S1 and S2 by using the current insulating layer as a new substrate and executing step S6 if not; S5, connecting the corresponding metal pillar or leading it out in advance and connecting to the pad layer, to complete the preparation of the multilayer PCB; and S6, connecting the corresponding metal pillar or leading it out in advance and connecting to the current 3D circuit layer, and returning to step S3. According to the present disclosure, the high-precision multilayer PCB with high interconnect precision can be prepared.

An article is provided to have a transparent substrate; and an electrically-conductive, metal-containing pattern disposed on a surface the transparent substrate. The electrically-conductive, metal-containing pattern has, in order outwardly from a surface of the transparent substrate: a first darkening agent; a metallic pattern; and a second darkening agent. The first darkening agent substantially conforms to a first surface of the metallic pattern, forming a first darkened surface on the metallic pattern. In addition, the second darkening agent is disposed over at least a portion of a second surface of the metallic pattern, forming a second darkened surface on the metallic pattern.

The invention relates to a method for manufacturing a carbon oil filled single-layer metal substrate, which comprises the following steps of: cutting a metal substrate, and providing the metal substrate with a preset size; performing first-time drilling processing, performing back drilling processing on the metal substrate to form a grounding hole, and synchronously processing a first positioning hole for positioning an outer-layer circuit; filling holes with carbon oil; curing treatment: baking the metal substrate filled with the carbon oil; manufacturing an outer layer circuit pattern; drilling for the second time, namely processing a second positioning hole for carbon oil printing positioning on the metal substrate; carbon oil printing, wherein carbon oil printing operation is carried out based on the second positioning hole; and a post-treatment process: carrying out subsequent treatment on the metal substrate subjected to carbon oil printing to obtain a finished product of the metal-based circuit board. The metal substrate is subjected to processing operations of secondary drilling and secondary carbon oil printing, so that accurate positioning can be realized, and deviation of the circuit board caused by telescopic deformation after circuit manufacturing etching is prevented.

The invention relates to the technical field of circuit boards, in particular to a method for improving local thickness unevenness of a rigid-flex board and the rigid-flex board. The method comprises the following steps: S1, extracting residual copper rate distribution, setting a residual copper rate threshold value, and identifying a glue filling area and a non-glue filling area of a rigid-flex board plane according to the residual copper rate threshold value; s2, windowing parameters are obtained according to the hole ring height and diameter of the non-glue-filling area, and windowing is conducted on the cover film according to the windowing parameters; after windowing is completed, the covering film is attached to the corresponding position, the hole ring is sleeved with the window, and the local thickness of the rigid-flex board is consistent; or dividing a high-voltage region and a low-voltage region in the non-glue filling region according to the voltage level and the signal characteristic in the circuit design; the copper is thickened in the high-voltage area, and a step is formed by the thickened copper layer in the high-voltage area; when the glue filling area is filled with glue, pressure difference is formed, the glue layer flows towards the low-pressure area, uniform filling of the glue layer is achieved, and the local thickness of the rigid-flex board is consistent. According to the invention, uneven local thickness of the rigid-flex board is improved.

The invention provides a preparation method of a three-dimensional pattern circuit board and the three-dimensional pattern circuit board, and the method comprises the steps: obtaining a power-on carrier as a substrate, covering a layer of insulating material above a conductive surface of the substrate, so as to enable a pattern insulating layer to be formed above the conductive surface of the substrate; the method comprises the following steps of: firstly, carrying out full-board electroplating treatment on exposed patterns of a pattern insulating layer to obtain a first semi-finished circuit board, then, carrying out three-dimensional circuit layer preparation and multi-layer stacking treatment above a pattern bonding pad layer of the first semi-finished circuit board to obtain a second semi-finished circuit board, and finally, assembling a circuit protection layer above the second semi-finished circuit board to obtain the three-dimensional circuit board. And obtaining the three-dimensional pattern circuit board. And the pattern bonding pad layer is formed through full-board electroplating treatment, so that the copper thickness of the three-dimensional circuit layer formed through subsequent electroplating is more uniform, the copper thickness precision error of stacking among the multiple three-dimensional circuit layers is reduced, and the preparation fineness of the multi-layer three-dimensional stacked circuit board is improved.

The invention provides a light-conversion photosensitive laminate, a cured film, a circuit board and an electronic device. The light-conversion photosensitive laminated body provided by the invention comprises a supporting layer, a photosensitive layer and an optional protective layer which are sequentially laminated, the light-conversion photosensitive laminated body contains a light conversion agent, the absorption wavelength of the light conversion agent is greater than 390nm, and the emission wavelength of the light conversion agent is less than or equal to 390nm. The light conversion agent is added into the light conversion photosensitive laminated body provided by the invention, and the light conversion agent has an up-conversion function, can trigger an anti-Stokes phenomenon, absorbs long wavelength and low energy, and releases short wavelength and high energy, so that when the light conversion photosensitive laminated body is irradiated by an exposure machine, the light conversion effect is good, and the light conversion effect is good. According to the invention, long-wave-band light emitted by the exposure machine is absorbed and converted into short-wave-band light which can be absorbed by the photoinitiator by the light conversion agent, so that the high utilization rate of the light source is realized under the condition that the conventional photoinitiator is still used, the selectivity of the photoinitiator is expanded, and the photocuring speed and the photocuring effect of the photosensitive layer are improved.

The present invention discloses a thin film / thick film hybrid integrated ceramic substrate, which specifically includes a thin film ceramic substrate prepared by a semiconductor thin film process and a thick film ceramic substrate prepared by a graphic electroplating process. The two share the same ceramic substrate and are electrically connected through a surface metal layer. The thin film ceramic substrate contains thin film multilayer wiring, metal through holes and a gold-tin alloy layer, which is used as a digital / control circuit such as a resistor, inductor, capacitor, etc.; the thick film ceramic substrate contains a thick metal layer and metal through holes, which is used for power device packaging. The patent of the present invention also discloses a method for preparing a thin film / thick film hybrid integrated ceramic substrate. Through the present invention, thin film and graphic electroplating processes are implemented on the same ceramic substrate to achieve hybrid integration of thin film / thick film ceramic substrates and improve device integration and reliability.

An electronic component includes a main body provided with a first surface and a plurality of electrodes arranged on the first surface. The plurality of electrodes include first-type electrodes individually arranged on the first surface and connected to each other through an interconnection that passes through the inside of the main body and a second-type electrode not connected to other electrodes individually arranged on the first surface. The first-type electrodes each include a first underlying electrode and a first plated film that covers the first underlying electrode. The second-type electrode includes a second underlying electrode and a second plated film that covers the second underlying electrode. The first underlying electrode sinks into the main body as compared with the second underlying electrode.

The invention relates to the technical field of circuit board manufacturing, in particular to a manufacturing process of a high-performance touch screen circuit board, which comprises an electroplating rack, a cart, a placing frame, a partition plate and the like, a cart is arranged below the two electroplating racks; a placing frame is fixedly connected to the trolley; a plurality of partition plates are fixedly connected in the placing frame at equal intervals, and a placing space used for placing circuit boards is formed between every two adjacent partition plates. Through cooperation of the electric sliding rail, the electric sliding block, the motor and the electric clamp, clamping of circuit boards is automatically completed, the situation that manual feeding and discharging operation of the circuit boards is conducted for a long time is avoided, the situation that the circuit boards need to be clamped on an electroplating frame one by one is avoided, manual feeding and discharging operation is time-consuming and tedious, and the electroplating efficiency of the circuit boards is reduced; and the circuit boards in the placing frame are clamped in two batches, namely an odd number of batches and an even number of batches, so that the circuit boards in each batch are prevented from being interfered by the circuit boards in the other batch when being clamped.

The present invention provides a method for electroplating gold on the surface of a circuit board. The method comprises the following steps: (1) first printing ink on the surface of the circuit board to form an ink layer; (2) slotting the ink layer to form grooves; (3) second printing a conductive silver paste in the grooves and curing the paste, then grinding the circuit board to remove the ink; and (4) electroplating the circuit board after the ink is removed with gold, and then removing the conductive silver paste. The method can effectively solve problems such as residual conductive wires or gaps in the gold plating pattern that occur during the gold plating process for drawing conductive wires, and does not require etching, thereby reducing costs and improving efficiency.

In an embodiment, a smart connector includes an Application Specific Electronics Packaging device formed by an Application Specific Electronic Packaging manufacturing process, and a separate printed circuit board electrically connected to electrical components of the Application Specific Electronic Packaging device. The ASEP Application Specific Electronic Packaging manufacturing process includes forming a continuous carrier web having a plurality of lead frames, overmolding a substrate onto the fingers of each lead frame, each substrate having a plurality of openings which exposes a portion of the fingers, electroplating the traces, and electrically attaching at least one electrical component to the traces to form a plurality of Application Specific Electronic Packaging devices. In some embodiments, the printed circuit board has electrical components configured to control the functionality of the electrical components. In some embodiments, the printed circuit board has electrical components configured to modify properties of the smart connector.

The invention relates to the technical field of glue filling between PCB thick copper wires, in particular to a method for filling glue between PCB thick copper wires. Comprising the following steps that a CCL incoming material is subjected to positioning cutting, the CCL incoming material is cut into the consistent production size, the cutting precision is + / -0.1 mm, it is guaranteed that the sizes of cut plates are consistent, and follow-up machining is facilitated; manufacturing an inner-layer circuit; performing inner layer AOI (Automatic Optic Inspection); carrying out inter-line resin printing; according to the method, through the accurate resin printing and baking curing steps, it can be guaranteed that the space between the thick copper wires is fully and evenly filled with the resin, the problems of lack of glue and bubbles are effectively avoided, through the whole board coating, even and flat brushing of the resin and the accurate baking curing process, the uniformity of the board thickness can be guaranteed, and the production efficiency is improved. Through the steps of accurate exposure energy control, developing etching, film removing treatment and the like, the definition and accuracy of a circuit pattern can be ensured.

The invention discloses a PCB processing technology for printing multi-layer stepped thick gold plating, and belongs to the field of multi-layer PCB processing. The PCB processing technology for printing multi-layer stepped thick gold plating comprises the following steps: designing a PCB, and carrying out hierarchical planning; overlapping and laminating the insulating material and the copper foil layer according to the design, and performing interlayer alignment by using an optical alignment system; laser drilling equipment is adopted to drill holes in the laminated plate for electrical connection and hole penetrating; a chemical nickel-copper plating process is used, and plating is carried out in the hole wall; forming a circuit pattern on the surface of the plating layer by using a photoetching technology; redundant materials are removed by using an etching technology; plating thick gold on the copper layer by using an electroplating technology; and measuring the thickness of the gold-plated layer, assembling the processed PCB, and carrying out electrical test. In the laminating process, the optical alignment system is used for carrying out interlayer alignment, so that the alignment precision is ensured, and the problems of signal transmission loss, short circuit or open circuit and the like are avoided.

A printed circuit board includes: an insulating portion; a first pad disposed on the bottom of the insulating portion; a first solder resist layer disposed on the bottom of the insulating portion, covering at least a portion of the first pad, and having a first opening in at least a portion of the first pad; a first barrier layer disposed on a portion of the first pad corresponding to the first opening; a first surface treatment layer disposed on the first barrier layer; a second pad disposed on the top of the insulating portion; a second solder resist layer disposed on the top of the insulating portion, covering at least a portion of the second pad; a metal post disposed on the second pad; and a second barrier layer disposed between the second pad and the metal post.

The invention relates to the technical field of micro-nano additive manufacturing and electronic manufacturing, in particular to a non-deployable curved surface micro conformal circuit additive manufacturing method based on electric field driving. A circuit pattern mask is needed at any non-deployable three-dimensional curved surface conformal manufacturing position, and an imprinting working soft mold consistent with the female mold plate in structure is prepared through secondary mold turning; secondly, conformal imprinting and shape restoring are carried out, and a groove structure consistent with the geometric pattern of the circuit is obtained on the curved-surface base material in the modes of etching, roughening treatment and the like; then, the groove is filled with a seed layer, and the groove is filled with high-conductivity metal through the electroplating technology; afterwards, dissimilar metal in the groove is molten and strengthened through laser, after the metal is cooled, the metal and the coarsened microstructure in the groove form an interlocking structure, and the binding force between the metal layer and the base material is greatly enhanced; and finally, performing post-treatment on the surface of the sample piece through processes such as polishing and the like to obtain the final curved surface conformal circuit with the embedded conductive circuit.

Encapsulated electronic modules having complex contact structures may be formed by encapsulating panels containing a substrate comprising pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within terminal holes and other holes drilled in the panel within the boundaries of the cut lines. Slots may be cut in the panel along the cut lines. The interior of the holes, as well as surfaces within the slots and on the surfaces of the panel may be metallized, e.g. by a series of processes including plating. Terminals may be inserted into the terminal holes and connected to conductive features or plating within the holes. A conductive element may be provided on the substrate to connect to a terminal. Alternatively solder may be dispensed into the holes for surface mounting.

The invention discloses a circuit board packaging structure and a manufacturing method of the circuit board packaging structure, the circuit board packaging structure comprises a plurality of circuit boards, each circuit board is provided with an interconnection bonding pad, and the plurality of circuit boards comprise a first circuit board; a second circuit board; and a dielectric layer. Therefore, the conductive paste sintered body electrically connected with the first bonding pad of the first circuit board and the third bonding pad of the second circuit board is arranged in the dielectric layer, and the dielectric layer is made of the insulating material, so that the dielectric layer can realize the bonding of the first circuit board and the second circuit board at the preset temperature; according to the circuit board packaging structure, the first circuit board, the dielectric layer and the second circuit board are pressed, connected and fixed at the preset temperature, so that the first circuit board and the second circuit board are electrically connected, the reliability of the circuit board packaging structure can be improved, the circuit board can be prevented from being dislocated or disengaged in the packaging process, and the packaging quality is improved. The normal work of the circuit on the circuit board packaging structure and the stability of the circuit during working can be ensured.

To provide an organic interposer and a method for manufacturing the organic interposer capable of improving insulation reliability.SOLUTION: An organic interposer 10 includes: an organic insulating laminate 12 comprising a plurality of organic insulating layers; and a plurality of wires 13 arranged in the organic insulating laminate 12, where the wires 13 and the organic insulating layers are separated by a barrier metal film 14. The organic insulating laminate 12 may include: a first organic insulating layer 21 having a plurality of grooves 21a having the wires 13 disposed therein; and a second organic insulating layer 22 laminated on the first organic insulating layer 21 in such a way as to embed the wires 13.SELECTED DRAWING: Figure 2

The invention discloses a golden finger manufacturing method and a PCB, and the method comprises the steps: providing a substrate which is provided with a circuit layer, and the circuit layer at least comprises a bonding pad or a hole exposed out of the surface of the substrate; pasting a conductive film on the surface of the substrate so as to enable the conductive film to be connected with a bonding pad or a hole on the surface of the substrate; windowing the surface of the conductive film to remove the conductive film on the surface of the golden finger area; connecting an electroplating power supply to the conductive film so as to plate gold on the golden finger area; and removing the conductive film. By adopting the golden finger manufacturing method, the problem of copper leakage and nickel gold suspension caused by lead etching can be solved, the technological process can be shortened, and the problem of copper surface glue dirt can be solved.

A communication device comprises: a digital predistortion (DPD) circuit; a digital-to-analog converter (DAC) configured to convert output signals of the DPD circuit into analog signals; a power amplifier configured to amplify the analog signals; and an antenna configured to transmit the amplified analog signals, wherein the DPD circuit may be configured to: generate first predistortion signals by performing a convolution operation on digital signals of a reference time unit over a time interval including a first set of time units before the reference time unit and a second set of time units after the reference time unit; generate second predistortion signals by performing predistortion on the digital signals; and generate the output signals of the DPD circuit on the basis of the first predistortion signals and the second predistortion signals.

The invention discloses an ultraviolet alkaline developing resin curing oven, and particularly relates to the technical field of resin curing, the ultraviolet alkaline developing resin curing oven comprises a bottom plate, the bottom plate extends upwards to form two vertical optical shafts, the two optical shafts are jointly and fixedly connected with a lower hemispherical shell, and the two optical shafts are jointly and slidably connected with an upper hemispherical shell matched with the lower hemispherical shell; a lifting assembly used for lifting the upper hemispherical shell is installed on the cross rod, an inner cavity formed by the upper hemispherical shell and the lower hemispherical shell is communicated with a first ventilation pipe and a second ventilation pipe, ultraviolet lamp beads are evenly distributed on the spherical wall of the inner cavity formed by the upper hemispherical shell and the lower hemispherical shell, and the first ventilation pipe is communicated with a switcher; the first ventilation pipe is communicated with the round pipe at one end of the switcher, the second ventilation pipe is communicated with the round pipe at one end of the switcher, the two ends of the switcher are in sliding connection with switching bases respectively, the two switching bases are jointly and fixedly connected with a temperature adjusting box, and the circuit board manufacturing method is suitable for manufacturing special circuit boards with complex curved surfaces or multiple surfaces.

To improve the connection reliability.SOLUTION: A wiring board includes a wiring layer, an insulating layer laminated on the wiring layer, an opening that penetrates the insulating layer to the wiring layer, and a conductor film formed in the opening of the insulating layer. The surface of the insulating layer includes a smooth portion exposed from the conductor film, and a roughened portion including an inner wall surface of the opening covered with the conductor film and having a surface roughness larger than that of the smooth portion.SELECTED DRAWING: Figure 2

A circuit board and a method for manufacturing the circuit board, a functional backplate, a backlight module, a display apparatus, and a display panel are provided. The circuit board includes: a base substrate; a wire arranged on the base substrate, where the wire includes a first conductive layer; and at least one insulating layer arranged on a side of the first conductive layer away from the base substrate, where the at least one insulating layer covers the first conductive layer. The first conductive layer includes a first stacked structure on a side away from the base substrate and a second stacked structure proximate to the base substrate, and the first stacked structure includes at least an etch stop layer covering the second stacked structure.

A method of manufacturing a component carrier, includes stamping a surface profile in a design layer, forming an electrically conductive seed layer on the stamped design layer, forming a patterned electroplating protection structure on portions of the seed layer apart from indentations of the profiled design layer, and electroplating an electroplating structure selectively on or above portions of the seed layer exposed with respect to the electroplating protection structure.

The invention discloses a circuit board selective dry film technology and a circuit board, and the technology comprises the steps: feeding a target circuit board semi-finished product into character jet printing equipment, carrying out the jet printing of characters on the surface of the target circuit board semi-finished product, and carrying out the pre-curing of the characters through a first ultraviolet lamp disposed in the character jet printing equipment, and obtaining a first semi-finished product; the first semi-finished product is sent into an oven to be baked, the characters are solidified for the second time, and a second semi-finished product is obtained; the characters of the second semi-finished product are cured for the third time through a second ultraviolet lamp, a third semi-finished product is obtained, the energy density of the second ultraviolet lamp is 600 + / -50 mJ / cm < 2 >, and the curing time is 60 seconds; a dry film is attached to the third semi-finished product, and after selection treatment is conducted, a fourth semi-finished product is obtained; and the fourth semi-finished product is fed into a film stripping assembly line, the dry film is subjected to film stripping treatment, a fifth semi-finished product is obtained, and the linear speed of the film stripping assembly line is larger than or equal to 2.0 m / min. Dry film residues can be effectively avoided, and the appearance quality of a product is improved.

A method of manufacturing a packaging substrate according to the present disclosure includes a preparing step of preparing a panel-level packaging substrate comprising a core substrate, a first redistribution layer disposed on the core substrate, and a second redistribution layer disposed under the core substrate, and an electroless surface treatment step of forming terminals by simultaneously performing electroless surface treatment on an upper surface and a lower surface of the panel-level packaging substrate. The packaging substrate comprises a core layer, the first redistribution layer disposed on the core layer, the second redistribution layer disposed under the core layer, and the terminals disposed on an upper surface of the first redistribution layer and a lower surface of the second redistribution layer. A difference between a maximum thickness value and a minimum thickness value of the terminals formed on the packaging substrate is 5 µm or less. In such a case, terminals having improved thickness uniformity may be formed, and process efficiency during terminal formation may be promoted.

The utility model relates to a golden finger and an electroplating lead structure thereof, the golden finger comprises a first golden finger and a second golden finger which are arranged on a substrate, the first golden finger is connected with a lateral ground hole located in the first direction of the first golden finger, and the electroplating lead structure comprises an electroplating bus and an electroplating branch line; the electroplating bus is connected with at least part of the ground holes in one side of the golden finger in the first direction, and the electroplating branch line is connected with the second golden finger and the electroplating bus; the electroplating lead structure further comprises a blind hole used for disconnecting the electroplating branch line and the electroplating bus of the second golden finger. According to the electroplating lead structure, the electroplating branch lines between the second golden fingers and the electroplating bus are cut off through the blind holes, the performance of high-speed signals borne by the golden fingers is prevented from being affected, and meanwhile, due to the adoption of the blind hole structure, the structure of the other side face of the substrate cannot be damaged.

A power supply module is provided for powering an integrated circuit chip located at a first side of a first carrier board, including: a first-stage power supply unit; and a second-stage power supply unit, where one or more power input terminals of the second-stage power supply unit is electrically connected with one or more corresponding power output terminals of the first-stage power supply unit through a second carrier board; the second carrier board is configured to transmit power from the first-stage power supply unit to the second-stage power supply unit, and the second-stage power supply unit further supplies the power to the integrated circuit chip; one or more power output terminals of the second-stage power supply unit is electrically connected with one or more corresponding power terminals of the integrated circuit chip.