224results about "Conductive pattern reinforcement" patented technology

The invention relates to the technical field of circuit boards, in particular to a method for improving local thickness unevenness of a rigid-flex board and the rigid-flex board. The method comprises the following steps: S1, extracting residual copper rate distribution, setting a residual copper rate threshold value, and identifying a glue filling area and a non-glue filling area of a rigid-flex board plane according to the residual copper rate threshold value; s2, windowing parameters are obtained according to the hole ring height and diameter of the non-glue-filling area, and windowing is conducted on the cover film according to the windowing parameters; after windowing is completed, the covering film is attached to the corresponding position, the hole ring is sleeved with the window, and the local thickness of the rigid-flex board is consistent; or dividing a high-voltage region and a low-voltage region in the non-glue filling region according to the voltage level and the signal characteristic in the circuit design; the copper is thickened in the high-voltage area, and a step is formed by the thickened copper layer in the high-voltage area; when the glue filling area is filled with glue, pressure difference is formed, the glue layer flows towards the low-pressure area, uniform filling of the glue layer is achieved, and the local thickness of the rigid-flex board is consistent. According to the invention, uneven local thickness of the rigid-flex board is improved.

The present invention provides a method for electroplating gold on the surface of a circuit board. The method comprises the following steps: (1) first printing ink on the surface of the circuit board to form an ink layer; (2) slotting the ink layer to form grooves; (3) second printing a conductive silver paste in the grooves and curing the paste, then grinding the circuit board to remove the ink; and (4) electroplating the circuit board after the ink is removed with gold, and then removing the conductive silver paste. The method can effectively solve problems such as residual conductive wires or gaps in the gold plating pattern that occur during the gold plating process for drawing conductive wires, and does not require etching, thereby reducing costs and improving efficiency.

To provide an organic interposer and a method for manufacturing the organic interposer capable of improving insulation reliability.SOLUTION: An organic interposer 10 includes: an organic insulating laminate 12 comprising a plurality of organic insulating layers; and a plurality of wires 13 arranged in the organic insulating laminate 12, where the wires 13 and the organic insulating layers are separated by a barrier metal film 14. The organic insulating laminate 12 may include: a first organic insulating layer 21 having a plurality of grooves 21a having the wires 13 disposed therein; and a second organic insulating layer 22 laminated on the first organic insulating layer 21 in such a way as to embed the wires 13.SELECTED DRAWING: Figure 2

A communication device comprises: a digital predistortion (DPD) circuit; a digital-to-analog converter (DAC) configured to convert output signals of the DPD circuit into analog signals; a power amplifier configured to amplify the analog signals; and an antenna configured to transmit the amplified analog signals, wherein the DPD circuit may be configured to: generate first predistortion signals by performing a convolution operation on digital signals of a reference time unit over a time interval including a first set of time units before the reference time unit and a second set of time units after the reference time unit; generate second predistortion signals by performing predistortion on the digital signals; and generate the output signals of the DPD circuit on the basis of the first predistortion signals and the second predistortion signals.

The invention discloses an ultraviolet alkaline developing resin curing oven, and particularly relates to the technical field of resin curing, the ultraviolet alkaline developing resin curing oven comprises a bottom plate, the bottom plate extends upwards to form two vertical optical shafts, the two optical shafts are jointly and fixedly connected with a lower hemispherical shell, and the two optical shafts are jointly and slidably connected with an upper hemispherical shell matched with the lower hemispherical shell; a lifting assembly used for lifting the upper hemispherical shell is installed on the cross rod, an inner cavity formed by the upper hemispherical shell and the lower hemispherical shell is communicated with a first ventilation pipe and a second ventilation pipe, ultraviolet lamp beads are evenly distributed on the spherical wall of the inner cavity formed by the upper hemispherical shell and the lower hemispherical shell, and the first ventilation pipe is communicated with a switcher; the first ventilation pipe is communicated with the round pipe at one end of the switcher, the second ventilation pipe is communicated with the round pipe at one end of the switcher, the two ends of the switcher are in sliding connection with switching bases respectively, the two switching bases are jointly and fixedly connected with a temperature adjusting box, and the circuit board manufacturing method is suitable for manufacturing special circuit boards with complex curved surfaces or multiple surfaces.

To improve the connection reliability.SOLUTION: A wiring board includes a wiring layer, an insulating layer laminated on the wiring layer, an opening that penetrates the insulating layer to the wiring layer, and a conductor film formed in the opening of the insulating layer. The surface of the insulating layer includes a smooth portion exposed from the conductor film, and a roughened portion including an inner wall surface of the opening covered with the conductor film and having a surface roughness larger than that of the smooth portion.SELECTED DRAWING: Figure 2

A circuit board and a method for manufacturing the circuit board, a functional backplate, a backlight module, a display apparatus, and a display panel are provided. The circuit board includes: a base substrate; a wire arranged on the base substrate, where the wire includes a first conductive layer; and at least one insulating layer arranged on a side of the first conductive layer away from the base substrate, where the at least one insulating layer covers the first conductive layer. The first conductive layer includes a first stacked structure on a side away from the base substrate and a second stacked structure proximate to the base substrate, and the first stacked structure includes at least an etch stop layer covering the second stacked structure.

The invention discloses a circuit board selective dry film technology and a circuit board, and the technology comprises the steps: feeding a target circuit board semi-finished product into character jet printing equipment, carrying out the jet printing of characters on the surface of the target circuit board semi-finished product, and carrying out the pre-curing of the characters through a first ultraviolet lamp disposed in the character jet printing equipment, and obtaining a first semi-finished product; the first semi-finished product is sent into an oven to be baked, the characters are solidified for the second time, and a second semi-finished product is obtained; the characters of the second semi-finished product are cured for the third time through a second ultraviolet lamp, a third semi-finished product is obtained, the energy density of the second ultraviolet lamp is 600 + / -50 mJ / cm < 2 >, and the curing time is 60 seconds; a dry film is attached to the third semi-finished product, and after selection treatment is conducted, a fourth semi-finished product is obtained; and the fourth semi-finished product is fed into a film stripping assembly line, the dry film is subjected to film stripping treatment, a fifth semi-finished product is obtained, and the linear speed of the film stripping assembly line is larger than or equal to 2.0 m / min. Dry film residues can be effectively avoided, and the appearance quality of a product is improved.

A method of manufacturing a packaging substrate according to the present disclosure includes a preparing step of preparing a panel-level packaging substrate comprising a core substrate, a first redistribution layer disposed on the core substrate, and a second redistribution layer disposed under the core substrate, and an electroless surface treatment step of forming terminals by simultaneously performing electroless surface treatment on an upper surface and a lower surface of the panel-level packaging substrate. The packaging substrate comprises a core layer, the first redistribution layer disposed on the core layer, the second redistribution layer disposed under the core layer, and the terminals disposed on an upper surface of the first redistribution layer and a lower surface of the second redistribution layer. A difference between a maximum thickness value and a minimum thickness value of the terminals formed on the packaging substrate is 5 µm or less. In such a case, terminals having improved thickness uniformity may be formed, and process efficiency during terminal formation may be promoted.

The utility model relates to a golden finger and an electroplating lead structure thereof, the golden finger comprises a first golden finger and a second golden finger which are arranged on a substrate, the first golden finger is connected with a lateral ground hole located in the first direction of the first golden finger, and the electroplating lead structure comprises an electroplating bus and an electroplating branch line; the electroplating bus is connected with at least part of the ground holes in one side of the golden finger in the first direction, and the electroplating branch line is connected with the second golden finger and the electroplating bus; the electroplating lead structure further comprises a blind hole used for disconnecting the electroplating branch line and the electroplating bus of the second golden finger. According to the electroplating lead structure, the electroplating branch lines between the second golden fingers and the electroplating bus are cut off through the blind holes, the performance of high-speed signals borne by the golden fingers is prevented from being affected, and meanwhile, due to the adoption of the blind hole structure, the structure of the other side face of the substrate cannot be damaged.

A power supply module is provided for powering an integrated circuit chip located at a first side of a first carrier board, including: a first-stage power supply unit; and a second-stage power supply unit, where one or more power input terminals of the second-stage power supply unit is electrically connected with one or more corresponding power output terminals of the first-stage power supply unit through a second carrier board; the second carrier board is configured to transmit power from the first-stage power supply unit to the second-stage power supply unit, and the second-stage power supply unit further supplies the power to the integrated circuit chip; one or more power output terminals of the second-stage power supply unit is electrically connected with one or more corresponding power terminals of the integrated circuit chip.

The invention discloses a PCB surface treatment process based on local gold plating and nickel and gold immersion, and relates to the technical field of surface treatment processes. The method is used for processing a PCB which needs local hard gold plating and nickel gold immersion at other positions, and comprises the following steps: S1, pre-processing: processing the PCB to a copper thickness before electroplating; s2, first-layer pattern processing: pasting a dry film on the CS surface of the PCB and etching to form a pattern; s3, gold plating preparation; s4, local gold plating; s5, removing the film and processing a second layer of pattern; s6, removing the wire; s7, resistance welding and protection; and S8, nickel and gold immersion treatment. According to the surface treatment process, the microcosmic roughness of the surface of the substrate is accurately controlled through multi-step pretreatment, and high-pressure water washing and plasma cleaning are combined, so that the mechanical embedding force of a plating layer and a copper layer is ensured, and the problem that the plating layer is not uniform due to too large roughness is avoided. And meanwhile, the current distribution is regulated and controlled by adopting pulse current and a magnetic mask in the copper deposition and electroplating stages, so that the compactness and thickness uniformity of the coating are improved.

Method for creating an electrode on a substrate (10) using a laser assisted deposition process. A metal paste (14) is printed and dried (15) on the substrate to form a conductive layer (16), and by 2D or 3D inspection, the dimensions of the conductive layer are measured. The substrate is subject to a pretreatment process (12) so as to increase adhesion and / or conduction of the conductive layer to the substrate. An electrode that is produced according to the present method may be used in flexible devices.

The invention relates to the technical field of circuit board manufacturing, and discloses a circuit board manufacturing method suitable for an Msap process and a circuit board, and the method comprises the steps: S100, pasting a dry film at a position corresponding to an etching line on one side or two sides of a laminated board; s200, pattern electroplating is conducted on the laminated board till the difference value between the height of the laminated board and the height of the dry film is within a preset value range; s300, the surface, subjected to pattern electroplating, of the laminated board is leveled, and the horizontal plane of the leveled laminated board coincides with the end face of the leveled dry film; and S400, removing the dry film attached to the surface of the laminated board, and carrying out surface treatment to obtain a finished product carrier board. According to the method, the electroplated layer is removed through leveling with the dry film, so that the electroplated layer is overlapped with the end face of the dry film, the micro step difference between the electroplated layer and the dry film is eliminated, defects formed on the surface of the electroplated layer are removed, and secondary defects such as uneven solder infiltration and blind hole deviation can be fundamentally eliminated.

A method for manufacturing potted electronic assemblies are described. Embodiments of the method and system may provide a potting compound having a first coefficient of thermal expansion different from a second coefficient of thermal expansion for a circuit board, provide a fiber reinforcement having a third coefficient of thermal expansion selected so that when the potting compound is combined with the fiber reinforcement the combined coefficient of thermal expansion is closer to the second coefficient of thermal expansion than the first coefficient of thermal expansion is to the second coefficient of thermal expansion, and apply the fiber reinforcement and the potting compound to the circuit board.

The present invention provides various methods and systems for forming a flexible circuit (1300). In one example, a method includes forming a flexible circuit (1300) that includes a plurality of contact pads (908, 1112, 1122) arranged in a plurality of rows, each contact pad (908, 1112, 1122) in a given row being electrically coupled to each other via an electrical trace (406), and each contact pad including a via hole (902, 1110, 1120), electroplating the flexible circuit (1300) with at least a first material, including electroplating each via hole (902, 1110, 1120), and at least partially cutting (1302, 1304, 1306) at least some of the electrical traces (406) while verifying the connectivity of each via hole.

Disclosed is a substrate for printed circuits, which comprises a base film having polyimide as a main component and a conductor layer formed on at least one side of the base film, the conductor layer having a metal sintered layer formed on the base film and an electrolysis-free plating layer formed on the metal sintered layer, wherein the number of voids having a maximum width of 5 μm or more in plan view in the base film is 10 or less per 0.25 mm 2 of the reference unit area on the surface of the base film.

To improve the HAST resistance of a wiring board.SOLUTION: The wiring board has: an insulating layer; a first pad and a second pad for external connection that are provided on the insulating layer and each include a first surface in contact with the insulating layer, a second surface on the opposite side of the first surface, and a side surface connecting the first surface and the second surface; and a protective insulating layer provided on the insulating layer. Each of the first pad and the second pad has a part exposed in an opening of the protective insulating layer. The first pad has a part facing the second pad without having the protective insulating layer therebetween. A region exposed from the protective insulating layer of the second surface of each of the first pad and the second pad is covered with a plating layer. A region exposed from the protective insulating layer of the side surface of each of the first pad and the second pad is exposed from the plating layer.SELECTED DRAWING: Figure 1

The invention discloses a fine circuit structure and a manufacturing method thereof. The fine circuit structure comprises a circuit substrate, a circuit pattern layer and a fixing layer, the first surface of the circuit substrate is provided with a plurality of concave parts. The circuit pattern layer is formed on the first surface of the circuit substrate, the circuit pattern layer comprises a plurality of circuit patterns, the gap between the circuit substrates is smaller than 10 [mu] m, and each circuit pattern is located between two of the sunken parts. The fixing layer is formed between the first surface of the circuit substrate and the circuit pattern, and the second surface of the circuit pattern is exposed out of the third surface of the fixing layer. By arranging the concave parts between the circuit patterns, residual metal substances can be removed, and the problems of short circuit and electron migration caused by conduction are avoided.

To provide a printed wiring board that includes a flying lead part having excellent electrical connection reliability.SOLUTION: A printed wiring board according to one aspect of the present disclosure includes: a base layer; and a conductive pattern on the base layer, having a conductive core, the conductive pattern having a flying lead part protruding from the base layer in a plan view, the flying lead part including the conductive core and a plating layer covering an entire outer surface of the conductive core.SELECTED DRAWING: Figure 1

An electronic board includes: a stack including at least one electrically insulating layer structure and a plurality of electrically conductive layer structures, where one of the plurality of electrically conductive layer structures is disposed on one major surface of the at least one electrically insulating layer structure, and the other of the plurality of electrically conductive layer structures is disposed on the other major surface of the at least one electrically insulating layer structure; and another electrically conductive layer structure of the plurality of electrically conductive layer structures is disposed on another opposite major surface of the at least one electrically insulating layer structure; a via formed in the stack and laterally delimited by a conductive material; at least one plating layer disposed on at least portions of the two opposite major surfaces of the stack and on the sidewalls of the stack; an axial annular projection disposed at one end of the through hole; and a radial annular projection disposed at a sidewall of the stack. The invention also provides a method for manufacturing the electronic board.

The invention relates to the technical field of printed circuit board manufacturing, and discloses a method for improving poor gold surface of nickel immersion gold. The method comprises the following steps: sequentially carrying out board grinding and sand blasting pretreatment on the copper surface of the circuit board, carrying out automatic visual inspection to identify defects of the copper surface, overhauling and sorting based on defect identification, carrying out secondary sand blasting treatment and carrying out nickel-gold immersion treatment. According to the method, a closed-loop process of automatic visual inspection and maintenance sorting is embedded before the main process of nickel and gold immersion of the circuit board, so that the conversion from passive scrapping to active prevention is realized, the copper surface defects can be accurately identified and repaired on line, the poor gold surface caused by the defects is completely eradicated from the source, and the product rejection rate is remarkably reduced; and meanwhile, the unrepairable units are blocked, so that invalid consumption of precious metal materials is avoided, and the production cost is saved. In addition, a process optimization closed loop is formed based on feedback adjustment of detection data, and the quality stability and the production yield are improved.

The present invention discloses a reaction tank and a production line for desmearing, copper plating, electroplating, and chemical nickel-gold plating, comprising a tank body; a first liquid spray assembly and a second liquid spray assembly, the first liquid spray assembly and the second liquid spray assembly being symmetrically arranged in the tank body, a reaction chamber being formed between the first liquid spray assembly and the second liquid spray assembly, the first liquid spray assembly and the second liquid spray assembly both comprising a baffle and a water outlet pipe located on the side of the baffle facing away from the reaction chamber, the water outlet pipe being fixedly arranged on the baffle; the first water inlet channel being arranged on the tank body; the second water inlet channel being arranged on the tank body, the water outlet pipes of the first liquid spray assembly and the second water inlet channel being connected respectively; the water outlet channel being arranged at the lower part of the tank body, the water outlet channel being connected to the reaction chamber. The present invention solves the problem in the prior art of insufficient flow rate of the water spray pipes on both sides caused by diversion through a water inlet channel.

The present application relates to the technical field of 3D printing, and particularly relates to a printing device and forming method of a circuit protection layer of a display device. The printing device of the present application comprises: a main support; the main support has a front end and a rear end along a horizontal direction; at least two barrier wall printing units, which are adapted to print and form barrier walls on the surface of the connection area and / or non-connection area of a flexible circuit board respectively; the printing unit comprises a printing needle; the printing units are arranged at intervals in the direction from the front end to the rear end; a filling glue printing unit is arranged at intervals with the barrier wall printing units in the direction from the front end to the rear end, is located between the rear end and the barrier wall printing units, and is adapted to print filling glue in the space between the multiple barrier walls formed by the multiple printing units to form a circuit protection layer; the circuit protection layer covers at least the connection area. The present application can effectively solve the problems of poor uniformity of the film layer thickness of the circuit protection layer, influence on packaging, and even possible influence on the display effect.

A transparent conductive film (TCF) and methods for creating the TCF. The TCF includes a substrate having a surface, a metal mesh layer over at least a portion of the surface of the substrate, and a conductive layer over the metal mesh layer. The conductive layer includes carbon nanotubes and a binder.

The present invention belongs to the technical field of rolled copper foil surfaces, and specifically relates to a rolled copper foil surface treatment method, copper foil for adhesive-free flexible copper-clad laminates, and their applications. The rolled copper foil surface treatment method comprises the following steps: using the rolled copper foil as a cathode, performing a micro-roughening treatment in an electrolyte, thereby obtaining a micro-roughened layer on the copper foil; the electrolyte being an acidic solution of copper and nickel ions; immersing the copper foil with the micro-roughened layer in an alloy solution containing nickel ions for alloying treatment to obtain an alloyed layer; immersing the copper foil with the alloyed layer in an anti-oxidation solution containing chromium ions, zinc ions, and sodium sulfate for anti-oxidation treatment to obtain an anti-oxidation layer; and spraying a coupling agent solution on the surface of the anti-oxidation layer. A two-layer flexible copper-clad laminate prepared from the surface-treated rolled copper foil has a high oxidation resistance temperature and peel strength, and the polyimide film has high transparency after etching.

The present invention provides: a ceramic circuit substrate comprising a unidirectional porous metal thermal interface material layer, which exhibits excellent heat dissipation performance by having a unidirectional porous metal applied thereto; and a power module equipped with the ceramic circuit substrate. The ceramic circuit substrate according to an embodiment of the present invention comprises: a ceramic substrate comprising a ceramic layer, a first substrate copper layer disposed on a first surface of the ceramic layer, and a second substrate copper layer disposed on a second surface of the ceramic layer; and a unidirectional porous metal thermal interface material layer disposed on the second substrate copper layer and having a plurality of pores extending unidirectionally in the vertical direction from the second substrate copper layer.