Method for manufacturing pyroelectric separation LED plate

Abstract

The invention provides a method for manufacturing a pyroelectric separation LED plate. For the structural characteristics of the pyroelectric separation LED plate, the method employs steps different from the steps of a manufacturing method for a common LED plate, and comprises a step of optimizing a thermal conduction part at steps of copper plate etching and insulating layer manufacturing: pasting a film before the etching of a copper plate, carrying out the exposing and development, enabling other parts, expect the thermal conduction part, of the copper plate to be exposed, and carrying out the half-etching of the copper plate, thereby improving the half-etching precision. The method also comprises a step of carrying out the groove milling of a PP piece corresponding to the thermal conduction part of the copper plate during the manufacturing of the insulating layer, wherein the slot size of the groove milling is 0.2mm greater than the length of the single side of the thermal conduction part of the copper plate, thereby guaranteeing that the PP piece can be sleeved by the copper piece after groove milling, preventing slight deviation from affecting the machining quality during stitching, and effectively improving the product quality through the above means.

Description

technical field [0001] The invention relates to the field of manufacturing circuit boards, in particular to a method for manufacturing thermoelectric separation LED boards. Background technique [0002] With the development of science and technology in the field of lighting, advanced technology is continuously applied to semiconductor production, so that the luminous efficiency of LED is continuously improved, but the heat dissipation bottleneck of LED lamps is the insulating layer on the metal substrate. The thermoelectric separation technology on the substrate makes the heat and electricity of the LED completely separated. After the thermoelectric separation, the thermal conductivity is 100 times higher than that of the ordinary aluminum substrate, which successfully overcomes the problem of poor thermal conductivity of the current LED lamp and extends the life of the LED lamp. service life. [0003] Due to the difference in structural design, the production process of th...

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Problems solved by technology

[0003] Due to the difference in structural design, the production process of the thermoelectric separation LED board used in this new thermoelectric separation technology is very different from that of ordinary metal substrates. The raw materials of ordinary metal substrates can be purchased directly, and only need to undergo conventional etching processing The production of the substrate can be completed, but the thermoelectric separation LED board cannot directly purchase the pressed substrate, the metal substrate, the FR4 insulating layer, and the outer copper foil need to be purchased separately, and the copper plate and the FR4 insulating layer need to be processed separately. Then it is pressed and pressed, so the production process is more complicated, and the product quality is difficult to control

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