279 results about "Copper substrate" patented technology

The invention provides a preparation method of a copper-clad substrate and the copper-clad substrate. The preparation method comprises the following steps: providing a copper-clad substrate for forming an inner-layer core plate; the copper-clad substrate comprises a copper-clad plate base material and a copper foil arranged on the surface of the copper-clad plate base material; executing an interface modification process on the surface of the copper foil; forming a dry film photoetching film on the surface of the copper foil after interface modification; performing exposure and development processing on the dry film photoetching film to form a dry film photoetching film with a circuit pattern; and the dry film photoetching film is used as a mask to execute an etching process so as to form a circuit pattern on the copper-clad substrate, so that the technical effect of improving the wiring precision is realized.

The invention relates to a method for constructing a composite super-hydrophobic coating through double bonding. The preparation method comprises the following steps: taking a clean copper sheet which is not pretreated as a substrate, dipping the copper sheet in a suspension consisting of nanoparticles and sulfydryl-containing siloxane ethanol, taking out, washing, drying, dipping in a perfluoromercaptan ethanol solution, taking out, washing, and drying to obtain the copper-based super-hydrophobic surface coating. The coating prepared by the method has excellent super-hydrophobicity, icing resistance and stability. Different from an existing conventional preparation method, the method has the advantages that pretreatment operation such as abrasive paper polishing, strong acid etching or anodic oxidation does not need to be carried out on a copper sheet, and micro-nano roughening and low-surface-energy self-assembly can be completed on the copper surface only through two-step normal-temperature dipping. The method is simple in preparation process, mild in condition, free of expensive equipment, thin in coating thickness and small in influence on electric conduction and heat conduction of the copper substrate, intrinsic performance of copper can be reserved, the electric conduction / heat conduction characteristic of the copper substrate is considered, and the method has wide application value and prospects.

The invention discloses a composite two-phase flow micro-channel radiator for high-density heat flow, and belongs to the technical field of heat dissipation, the composite two-phase flow micro-channel radiator for high-density heat flow comprises a vapor chamber for heat transfer, a manifold copper substrate is arranged on the vapor chamber, a diversion trench is formed in the bottom surface of the manifold copper substrate, a liquid inlet is formed in one side surface of the manifold copper substrate, and the liquid inlet is communicated with the diversion trench; a flow guide groove is formed in one side face of the manifold copper substrate, a liquid outlet is formed in the other side face of the manifold copper substrate and communicated with the flow guide groove, protruding strips are arranged on the temperature equalizing plate and arranged in the flow guide groove, a liquid conveying groove is formed between every two adjacent protruding strips, a first cavity is formed in the temperature equalizing plate, a second cavity is formed in each protruding strip, and the first cavity is communicated with the second cavity. The heat dissipation device has the advantages that heat rapidly increased in unit area of equipment can be timely and effectively dissipated, and the overall heat dissipation efficiency and the heat dissipation effect are improved.

The invention is suitable for the technical field of heat pipe experiment systems, and provides a heat pipe experiment system and method based on visual visualization and dual-seal temperature control, and the system comprises a visual heat pipe, a temperature adjustment module, a data collection module, a liquid injection module and a glass temperature monitoring feedback module. The visual heat pipe adopts an aluminum alloy cover plate, visual glass and a copper substrate to form a double-sealing structure. The system integrates a glass temperature monitoring and feedback mechanism, prevents the observation window from fogging, prevents the temperature of the observation window from being too high, and guarantees high-definition visual observation. And the data acquisition module synchronously records the thermal parameters and the dynamic image of the condensed liquid drop, and quantitatively analyzes the behavior of the liquid drop through an image processing technology. The system can realize high-definition observation, high-precision temperature control and quantitative analysis of the internal condensation process of the flat heat pipe at different inclination angles and under different working conditions, and is suitable for in-depth research of a phase-change heat exchange mechanism and heat pipe performance.

The invention relates to the technical field of composite metal materials, in particular to a silver-coated graphene copper composite material and a preparation method thereof, and aims at solving the problems that traditional silver-coated copper powder is high in silver consumption, copper is oxidized due to the fact that a silver layer is prone to being damaged, and conductivity is insufficient. The method comprises the steps that a graphene coating layer is formed on a copper powder substrate in situ through chemical vapor deposition, and graphene copper powder is obtained; performing etching treatment on the graphene copper powder to controllably expose part of the copper substrate so as to form anchoring points for silver ion deposition; carrying out reduction treatment on the etched graphene copper powder so as to ensure that an anchoring site has chemical activity; in a reductive liquid phase environment, enabling a chemical silver plating solution to react with the graphene copper powder subjected to reduction treatment, and guiding silver ion deposition by utilizing an anchoring point, so as to form a silver coating layer on the surface of the graphene coating layer; and separating and drying the reacted system to obtain the silver-coated graphene copper composite material. The material is better in oxidation resistance and conductivity, and the process is free of waste liquid.

A power device electronics system includes a thermal management configuration in which a power electronics chip is attached to a copper substrate and a single crystal diamond substrate attached to the copper substrate. The copper substrate is sandwiched between a first side of the diamond substrate and the power electronics chip.

The invention discloses a double-frequency constant-temperature crystal oscillator and a manufacturing method thereof, and relates to the technical field of crystal oscillators, and the double-frequency constant-temperature crystal oscillator comprises a ceramic base and a ceramic bottom plate which are integrally formed by adopting an LTCC (Low Temperature Co-Fired Ceramic) process; the high-frequency quartz crystal and the low-frequency quartz crystal are respectively arranged in independent closed cavities, and unified heating and accurate temperature control are realized through the high-heat-conduction diamond copper substrate, the metalized heat conduction holes and the partitioned temperature sensing chips; the two paths of signals are output through independent interconnection paths, and the crosstalk is lower than-50dBm. According to the invention, the dual-frequency high-stability low-noise output is realized under the similar volume, and the requirements of a flight control system on a high-integration-level and high-reliability frequency source are met.

The invention discloses an accelerator neutron source solid-state lithium target cooling device, and relates to the technical field of accelerator neutron source medical application. An annular heat pipe is arranged on the outer ring of the side portion of an oxygen-free copper substrate, a plurality of liquid absorption cores are arranged on the inner wall of the heat pipe, and meanwhile an inner cavity of the heat pipe is filled with a working medium; when heat is generated, the heat is firstly transferred to the oxygen-free copper substrate, the evaporation section of the heat pipe is heated, the working medium in the wick is quickly evaporated and gasified, the generated steam flows to the condensation section under the driving of differential pressure and is condensed into liquid in the condensation section and releases heat, and the liquid generated by condensation returns to the evaporation section again under the capillary action of the wick. The space of the arranged heat pipe is large, and in the aspect of heat dissipation, the working medium is subjected to gas-liquid phase change in the heat pipe under the action of the liquid absorption core, so that the accelerator is rapidly dissipated, heat on the solid target material film can be rapidly taken away, and the cooling effect on the accelerator is greatly improved.

This utility model relates to an ultra-thin rolled copper stamped fuse assembly. The fuse assembly includes a sheet copper substrate made of rolled copper with a thickness in the micrometer range, a first PI thermosetting film and a second PI thermosetting film respectively covering the upper and lower surfaces of the sheet copper substrate; the sheet copper substrate has a wavy fuse portion with a line width of 0.15±0.02mm. This utility model uses a high-precision die-cutting method to punch the ultra-thin rolled copper foil, directly forming a fuse semi-finished product. In particular, the extremely fine fuse portion is punched in one step, avoiding defects such as edge deformation caused by multiple punchings, ensuring stable dimensions and performance of the fuse portion. High-speed rotary die-cutting is then used for efficient and precise production, encapsulating the fuse portion within the film material, exposing the opening area and end area for electrical connection, improving production efficiency and subsequent use efficiency. The overall production efficiency can be increased to 5000pcs / H, and the yield rate to approximately 95%.

The application discloses a packaging structure with a selective copper-coated and chip-integrated unit and a preparation method thereof, and relates to the technical field of electronic packaging. The preparation method comprises the following steps: patterning a ceramic substrate, and attaching a first green body layer and a second green body layer to the surface of a first metallized layer of the patterning ceramic substrate and the surface of a heat dissipation plate, respectively; the first green body layer and the second green body layer are composed of solid-state diffusible metal particles, the conductive circuit area is stacked with a copper sheet through the first green body layer, the chip attaching area is stacked with a chip through the first green body layer, and bagging, sealing and sintering are performed. The four process steps of patterning a ceramic substrate, attaching a chip, copper-coating a conductive circuit and integrating a substrate and a heat dissipation plate are integrated into a one-time pressure sintering process, integrated packaging is realized, the packaging process is simplified, the production efficiency is improved, the thermal stress control is excellent, and the device performance and reliability are improved.

This invention provides a battery. The battery includes a negative electrode sheet, which includes a negative electrode current collector and a negative electrode active material layer disposed on at least one surface of the negative electrode current collector. The negative electrode active material layer includes a first negative electrode active material layer and a second negative electrode active material layer, with the first negative electrode active material layer located between the negative electrode current collector and the second negative electrode active material layer. The first negative electrode active material layer includes a carbon-based active material, and the second negative electrode active material layer includes a silicon-based active material. The particle size Dv90 of the silicon-based active material is smaller than the thickness Bμm of the first negative electrode active material layer. The negative electrode current collector includes a copper substrate and a protective layer disposed on at least one surface of the copper substrate. The thickness Anm of the protective layer satisfies: 20≤A≤100. The negative electrode sheet satisfies: 0.5≤A / B≤6. The battery provided by this invention has a low interface resistance of the negative electrode sheet, a low degree of copper deposition, good structural stability of the negative electrode current collector, and high cycle performance.

The application discloses a copper-bismuth bimetallic catalyst and a preparation method and application thereof. The copper-bismuth bimetallic catalyst comprises a copper substrate and copper-bismuth nanowires grown on the copper substrate, the copper-bismuth nanowires comprise copper nanowires and a metal bismuth layer loaded on the copper nanowires, and the mass fraction of bismuth in the copper-bismuth nanowires is 40% to 60%. The preparation method of the catalyst comprises the following steps: after in-situ growth of copper hydroxide nanowires on the copper substrate, the copper-bismuth bimetallic catalyst is prepared through heat treatment, electrochemical reduction treatment and bismuth deposition. Meanwhile, the copper-bismuth bimetallic catalyst can not only make full use of the copper and bismuth bimetallic effect, effectively improve the activity, stability and selectivity of electrocatalytic reduction of carbon dioxide, but also has the advantages of simple and controllable preparation, wide application potential window and wide application environment.

The utility model provides a cold plate of the base structure of the even temperature plate for high -power consumption chip heat dissipation, including cold plate lower cover, cold plate spade tooth bottom board and cold plate upper cover, wherein, cold plate lower cover is opposite with high -power consumption chip, cold plate lower cover is away from high -power consumption chip one end with cold plate spade tooth bottom board fixed connection, cold plate spade tooth bottom board is away from cold plate lower cover one end with cold plate upper cover fixed connection, and cold plate spade tooth bottom board is equipped with cold plate spade tooth fin, the utility model discloses a cold plate of the base structure of the even temperature plate for high -power consumption chip heat dissipation, utilizes the base structure of even temperature plate to replace pure copper base plate and is more applicable to high -power consumption high heat flux density's chip to high -power consumption chip surface even temperature nature is better, in addition directly takes cold plate spade tooth bottom board as even temperature plate upper cover, has saved traditional even temperature plate upper cover and the thermal resistance of soldering tin cream, has reduced the thermal resistance of whole heat transfer path, has improved heat transfer efficiency.

The invention discloses a high-density large-current LED (light-emitting diode) module based on an improved copper substrate circuit, which is characterized in that a traditional single'lane 'is widened into a plurality of'lanes' by additionally arranging a third bonding pad which is not electrically connected with an anode and a cathode at the bottom of a lamp bead and an auxiliary current path which is arranged on a copper substrate and corresponds to the third bonding pad; a low-resistance path is provided for current, and the current capacity, the packaging density, the heat dissipation performance and the welding yield are remarkably improved. Meanwhile, the adjacent welding bosses belonging to the same electrical network are connected through one or more solder paste flowing channels. The solder paste flowing channel is an exposed copper foil channel formed after etching. In the reflow soldering process, molten soldering tin can flow in the boss and the channel system which are communicated with each other to automatically compensate the tin quantity difference on each bonding pad, so that the uniformity of the welding height is realized, and the defects of tombstone standing, deviation, pseudo soldering and the like are effectively prevented.

The utility model discloses an efficient grinding device for a ceramic copper-clad substrate. The efficient grinding device comprises a workbench, and a containing table is fixedly installed in the middle of the surface of the workbench. The placing table is used for bearing the ceramic copper-clad substrate; polishing devices are arranged on the surface of the workbench and located on the two sides of the containing table in the first direction correspondingly, and a moving assembly is arranged on the workbench and used for driving the two polishing devices to get close to each other or get away from each other. Positioning assemblies are arranged on the surface of the workbench and located on the two sides, in the second direction, of the containing table correspondingly. The two positioning assemblies are used in cooperation and used for clamping and fixing the ceramic copper-clad substrate. The second direction is perpendicular to the first direction, and the positioning assembly is arranged, so that the two sides, which are not polished, of the copper-clad plate can be positioned and extruded, the stability of the copper-clad plate can be ensured, and the copper-clad plate cannot move when the polishing assembly polishes the two sides of the copper-clad plate.

The application discloses a preparation method of an alumina copper-clad plate with reduced black spots, and belongs to the field of advanced ceramic preparation. The alumina copper-clad plate is obtained through a direct copper-cladding sintering method and black spot removal. The black spot proportion of the alumina copper-clad plate is less than 1%, and the bending strength reduction proportion is 0, so that the product yield is greatly improved, and the overall manufacturing cost is reduced.

The invention belongs to the technical field of printed circuit board materials, and discloses a heat-resistant high-toughness PCB and a preparation method thereof. The preparation method comprises the following steps: carrying out hydrosilylation polymerization reaction on epoxy-terminated polybutadiene and polymethylhydrosiloxane in the presence of a catalyst and an organic solvent to obtain a polysiloxane modified epoxy-terminated polybutadiene solution, then uniformly mixing the polysiloxane modified epoxy-terminated polybutadiene solution with epoxy resin, an amino silsesquioxane curing agent and an inorganic filler, and carrying out extrusion molding to obtain the epoxy-terminated polybutadiene modified epoxy resin. A modified epoxy resin glue solution is obtained; the obtained modified epoxy resin glue solution is adopted to conduct glue dipping treatment on a non-conductive base material, then single-face or double-face copper foil coating is conducted, hot pressing curing is conducted, and a copper-coated base plate is obtained; and then cutting, drilling, copper deposition, etching and surface treatment are carried out to obtain the heat-resistant high-toughness PCB. The epoxy resin is modified by polysiloxane modified epoxy-terminated polybutadiene, so that the heat resistance and toughness of the obtained copper-clad substrate and PCB can be remarkably improved, and relatively high adhesive property can be kept.

The invention discloses a manufacturing method, particularly discloses a manufacturing method for a high-thermal-conductivity silicon nitride copper-clad substrate, and belongs to the technical field of design and manufacturing of ceramic electronic devices. The invention provides the manufacturing method for the high-thermal-conductivity silicon nitride copper-clad substrate, which can be used for effectively manufacturing a precise circuit on the ceramic substrate bonded with the copper foil. The manufacturing method comprises a ceramic bottom plate, and comprises the following steps: firstly, compounding a layer of high-strength copper foil metal bottom layer on two side surfaces of the ceramic bottom plate by adopting a copper brazing process, and then carrying out graphical processing on the high-strength copper foil metal bottom layer by adopting a photoetching process to at least partially remove the high-strength copper foil metal bottom layer except a graph, and thickening a dam layer on the high-strength copper foil metal bottom layer obtained by photoetching by adopting an electroplating process, and finally, removing the manufacturability brazing material layer and / or the manufacturability electroplating conductive layer outside the pattern by adopting an etching process to obtain the high-thermal-conductivity silicon nitride copper-clad substrate with the pattern meeting the requirement.

The copper base substrate of the present invention is a copper base substrate in which a copper substrate, an insulating layer, and a circuit layer are sequentially stacked, the ratio of the thickness (unit: μm) of the insulating layer to the elastic modulus (unit: GPa) of the insulating layer at 100°C is 50 or more, and the elastic modulus of the circuit layer at 100°C is 100 GPa or less.

The utility model discloses a kind of high-precision RGB edge-emitting laser lamp group module, it is related to optoelectronic packaging technical field, including copper substrate, the top of copper substrate is fixedly connected with chip bracket, the top of chip bracket is fixedly connected with several T table type silicon prism, the top of chip bracket is fixedly connected with edge-emitting laser chip assembly, the top of copper substrate is installed with glass optical window, the bottom of glass optical window is coated with metal plating, the device is through structural integration design, optical integration optimization and all inorganic packaging process, effectively improve the light path precision of edge-emitting laser chip assembly, structural stability, packaging reliability and thermal management performance, while significantly improve the automation assembly efficiency and reduce manufacturing cost, especially suitable for high-resolution display, complex environment lighting and laser system in the scene with higher precision and reliability requirement.

The invention discloses a preparation method of a high-stability bronze-process niobium-tin wire, and relates to the technical field of superconducting wire preparation, and the preparation method comprises the following steps: assembling a composite ingot according to a composite structure which sequentially comprises an outer copper matrix, an outer barrier layer, a bronze-based CuNb layer, an inner barrier layer and an inner copper matrix from outside to inside; the composite ingot is sequentially subjected to heat preservation extrusion and multi-pass cold drawing, and a composite wire is obtained; carrying out heat treatment on the composite wire to obtain a Ni3Sn wire; the outer blocking layer and the inner blocking layer are made of Nb or Ta or Nb alloy or Ta alloy or Ta / Nb alternating composite layers. The Ni3Sn wire is prepared by designing a composite structure with double barrier layers and combining heat preservation extrusion, multi-pass cold drawing and heat treatment, the critical current density and the residual resistance ratio of the wire are increased, and then the stability of the wire is improved.

The invention discloses a hollow code verification radian detection device, which comprises a bottom plate, a mounting box, a detection frame, a visual sensor, a code scanner and a bearing plate, and is characterized in that the mounting box and the detection frame are arranged on the top surface of the bottom plate, the bearing plate is arranged on the top surface of the mounting box, and a hollow detection hole is formed in the bearing plate; the installation box is provided with a first corresponding opening corresponding to the hollow detection hole, the visual sensor is arranged on the detection frame, the detection end of the visual sensor is arranged downwards and corresponds to the bearing plate in the vertical direction, and the code scanner is arranged in the installation box. The detection end of the code scanner vertically extends upwards and is arranged corresponding to the hollow detection hole in the vertical direction. The copper substrate detection device has the effect of improving the copper substrate detection efficiency.

The present application relates to the technical field of semiconductor, especially to a kind of DBC copper-clad plate automatic positioning silk screen printing equipment, there is no equipment that can adapt to DBC copper-clad plate automatic positioning silk screen printing in current market or prior art, provide a kind of DBC copper-clad plate automatic positioning silk screen printing equipment, including operation platform, the rear side of the upper end of the operation platform is equipped with silk screen printing device, silk screen printing device includes the support box of being fixedly connected with operation platform, support box is equipped with rotatable cylindrical cam, cylindrical cam front end is equipped with suction wafer plate, when the cylindrical cam rotates, it can form the structure that suction wafer plate moves up and down intermittently and swings intermittently again;The right side of the upper end of the operation platform is equipped with the carrier base that can move forward and backward, the upper end of carrier base is equipped with the carrier holder that can move left and right, the upper end of carrier holder is equipped with carrier plate;Instead of manual installation, save human resources, form automatic production.

The invention relates to the field of terahertz metamaterial devices, and provides a reconfigurable broadband / multi-frequency terahertz wave absorber based on vanadium dioxide. The wave absorber is composed of metamaterial square units which are arranged periodically, and adjacent units are gapless. Each unit is composed of six layers of structures including a vanadium dioxide resonance layer, an upper polyimide dielectric layer, a vanadium dioxide thin film layer, a copper resonance layer, a lower polyimide dielectric layer and a copper substrate layer. Vanadium dioxide can realize reversible phase change between a metal state and an insulation state through external excitation. In a metal state, the wave absorber has an ultra-wideband terahertz wave absorption function; and in an insulated state, a double-narrow-band absorption function is shown. According to the invention, the reconstruction of the absorption frequency and the bandwidth of the terahertz wave absorber is effectively realized, the problems of complex structure and fixed function of a traditional terahertz sensor are solved, and the potential of the terahertz wave absorber in sensing application of a single narrow-band wave absorber is further discussed.

The invention discloses a circuit board capable of reducing line transmission loss and a manufacturing method thereof, and the specific steps are as follows: a copper-clad substrate is provided, the copper-clad substrate comprises a first metal layer and a dielectric layer which are stacked in sequence, the copper-clad substrate is provided with a cavity, the cavity at least penetrates through a part of the first metal layer, and the bottom surface of the cavity is the first metal layer; forming a first conductive layer on the bottom surface and the side wall of the cavity, wherein the conductivity of the first conductive layer is higher than that of the first metal layer; filling the cavity with a removable substance; a second conductive layer is formed on the side, away from the dielectric layer, of the cavity, the second conductive layer is connected to the first conductive layer, and the conductivity of the second conductive layer is higher than that of the first metal layer; a second metal layer is formed on the first metal layer, the second metal layer further covers a second conductive layer, the first metal layer and the second metal layer jointly form a metal conductive layer, the metal conductive layer comprises a first area and a second area which are connected, and the first area comprises a cavity; and carrying out graphical etching on the second region and removing the removable substance.

This application discloses an acceleration structure, welding process, and cooling system for a particle linear accelerator, relating to the field of particle acceleration equipment technology. The acceleration structure includes a left-shaped component and a right-shaped component, whose joint surfaces are welded together using alloy gaskets. The corresponding first and second acceleration half-cavities inside are assembled to form a complete disk-loaded acceleration cavity. A buffer gap is reserved between the mating edges of the two half-cavities. A vacuum maintenance component is provided above to extract the internal vacuum, and an radio frequency energy feeding component is provided on the outside to feed in external microwave energy. The supporting welding process employs local deposition of a metal barrier layer and a wetting layer, combined with alloy gaskets for temperature-controlled brazing, avoiding softening of the oxygen-free copper substrate during annealing. Furthermore, a semiconductor-based cooling system is provided around the acceleration structure to control heat deformation. This invention effectively avoids extrusion deformation of critical internal structures after welding, reduces the risk of high-frequency arcing, and significantly improves the integration and structural stability of the entire device.

The present disclosure belongs to the technical field of electrical engineering. Disclosed are a composite coating structure and a preparation method therefor, a conductive terminal and a connector. The composite coating structure comprises a substrate, an intermediate coating stacked on the substrate and a noble metal coating stacked on the intermediate coating, wherein the substrate is a copper substrate or a copper alloy substrate; and the intermediate coating comprises first intermediate coatings and second intermediate coatings which are alternately stacked, each of the first intermediate coatings and the second intermediate coatings is a nickel-tungsten coating or a cobalt-tungsten coating, and the tungsten content of the first intermediate coating is different from that of the second intermediate coating. The composite coating structure can be used for a terminal of a connector, and endows the terminal with good electrical contact performance, good corrosion resistance, good insertion / withdrawal endurance, relatively low internal stress of a coating, and relatively low costs.

The application discloses an etching method of a printed circuit board, and particularly relates to the technical field of printed circuit board etching, and comprises the following steps: step one: preparing a copper-clad substrate, and pretreating the copper-clad substrate, wherein the pretreatment at least comprises oil removal, micro-etching, cleaning and drying, and a surface-cleaned to-be-etched substrate is obtained after the pretreatment; step two: forming an etching-resistance pattern layer on the surface of the to-be-etched substrate, wherein the etching-resistance pattern layer is used for defining a circuit area to be reserved. The application improves the stability and uniformity of the etching process by synergistically controlling etching parameters, reduces side etching, improves the circuit edge precision and line width consistency by segmented etching and fine etching control, improves the etching liquid utilization rate by cyclic filtration and on-line liquid supplement, reduces the production cost, improves the product reliability by the water washing, neutralization and detection steps, and is suitable for high-density and high-precision printed circuit board manufacturing by reducing over-etching, under-etching and residual copper defects.

A copper base substrate of the present invention, in which a copper substrate, an insulating layer, and a circuit layer, are laminated in an order in the copper substrate, a ratio of a thickness (unit: μm) to an elastic modulus (unit: GPa) at 100° C. is 50 or more in the insulating layer, and the circuit layer has an elastic modulus at 100° C. of 100 GPa or less.

The utility model discloses a novel composite substrate which comprises a circuit area and a chip arrangement area. The circuit area comprises a first copper foil, a resin layer and a second copper foil which are sequentially arranged from top to bottom, and the first copper foil, the resin layer and the second copper foil are respectively provided with one or more openings with preset sizes at corresponding positions according to preset design requirements; the openings of the first copper foil, the resin layer and the second copper foil are laminated to form one or more windows; the X chip arrangement area comprises a ceramic copper-clad substrate, and the ceramic copper-clad substrate is provided with a first surface parallel to the upper surface of the first copper foil and a second surface parallel to the lower surface of the second copper foil; wherein a copper-clad substrate is arranged in the one or more windows, and the first copper foil, the resin layer, the second copper foil and the copper-clad substrate form the circuit area and the chip arrangement area through high-temperature lamination. By adopting the composite substrate provided by the utility model, the usage amount of the ceramic copper-clad substrate can be reduced, so that the cost is reduced.