The present invention provides a rolled copper foil or an electrolytic copper foil for an electronic circuit, wherein the circuit is formed by etching, wherein the rolled copper foil or electrolytic copper foil has a nickel alloy layer formed on the etched side with a lower etching rate than copper , the nickel alloy layer contains zinc. The subject of the present invention is that, when forming a circuit by etching the copper foil of a copper-clad laminate, it is possible to prevent the downward bending caused by etching, to form a circuit with a uniform width of the target circuit, and to shorten the circuit formation time by etching as much as possible. Time, and the thickness of the nickel alloy layer can be reduced as much as possible, and oxidation can be suppressed when heated, and discoloration commonly known as "burning" can be prevented, and etchability in pattern etching can be improved, and short circuit or poor circuit width can be prevented.