3175 results about "Nickel alloy" patented technology

A method for coating a surface of a component formed from aluminum or an alloy thereof includes the step of cold gas-dynamic spraying a powder material on the component surface to form a coating, the powder material comprising at least one alloy from the group consisting of titanium, a titanium alloy, nickel, a nickel alloy, iron, an iron alloy, aluminum, an aluminum alloy, copper, a copper alloy, cobalt, and a cobalt alloy. In one embodiment, the method further includes the step of heat treating the turbine component after the cold gas-dynamic spraying.

An inexpensive, highly catalytic material preferably formed by a leaching process. The catalyst comprises a finely divided metal particulate and a support. The active material may be a nickel and/or nickel nickel alloy particulate having a particle size less than about 100 Angstroms. The support may be one or more metal oxides.

A conductive electrolessly plated powder used, for example, for bonding a small electrode of an electronic device, its producing method, and a conductive material containing the plated powder. Conventionally, there has been known, as conductive powders, metallic powders such as of nickel, carbon powders, and conductive plating powders the resin core particles of which are coated with a metal, e.g., nickel. However, there has been no conductive electrolessly plated powders having a good conductivity with respect to connection between conductive patterns having an oxide coating thereon or between electrodes and no methods for producing such powders industrially. The conductive electrolessly plated powder of the present invention consists of resin spherical core particles the average size of which is 1 to 20 mum and each of which has a nickel or nickel alloy coating formed by electroless plating. The coating includes small projections of 0.05 to 4 mum on its outermost layer and the coating is substantially continuous with the small projections. A method of producing such a powder is also disclosed.

The present invention relates to an aqueous zinc-nickel electroplating bath, including water; nickel ion; zinc ion; at least one complexing agent; and at least one non-ionogenic, surface active polyoxyalkylene compound, wherein the bath has an alkaline pH. In one embodiment, the zinc ion, the nickel ion and the non-ionogenic surface active polyoxyalkylene compound are present at concentrations sufficient to deposit a zinc-nickel alloy comprising a substantially gamma phase.

In an LW-reverse-type monolithic ceramic capacitor including external terminal electrodes each including a resistance component, internal electrodes include nickel or a nickel alloy, and the external terminal electrodes each include a first layer, a second layer provided on the first layer, and a third layer provided on the second layer. The first layer has a wrap-around portion extending from an end surface to principal surfaces and side surfaces of a capacitor main body, and contains a glass component and a compound oxide that reacts with Ni or the Ni alloy. The second layer covers the first layer such that the edge of the wrap-around portion of the first layer remains exposed, and contains a metal. The third layer covers the edge of the wrap-around portion of the first layer and the second layer, and is formed by plating.

The invention relates to an essentially metallic target of a cathodic sputtering device, in particular a magnetic-field-assisted device, the said target mainly comprising nickel alloyed with at least one other minor element in order to reduce or eliminate its ferromagnetism. The invention also relates to the use of the target to manufacture an electrochromic material with anodic colourization as a thin layer based on alloyed nickel oxide.

The alloy contains, by weight, less than 0.05% of carbon, from 0.015% to 0.5% of silicon, from 0.4% to 1.4% of manganese, from 28% to 31.5% of chromium, from 8% to 12% of iron, from 2% to 7% of molybdenum, from 0% to 0.75% of aluminium, from 0% to 0.8% of titanium, from 0.6% to 2% in total of niobium and tantalum, the ratio of percentages of niobium plus tantalum and of silicon being at least 4, less than 0.04% of nitrogen, from 0.0008% to 0.0120% of zirconium, from 0.0010% to 0.0100% of boron, less than 0.01% of sulphur, less than 0.020% of phosphorus, less than 0.30% of copper, less than 0.15% of cobalt and less than 0.10% of tungsten, the remainder of the alloy, with the exception of unavoidable impurities of which the total content is at most 0.5%, consisting of nickel. The alloy is used, in particular, for the production of wires for the electro-gas welding of units or components of nuclear reactors and, more particularly, of pressurised water-cooled nuclear reactors.

A semiconductor device fabrication method by which the thermal stability of nickel silicide can be improved. Nickel (or a nickel alloy) is formed over a semiconductor substrate on which a gate region, a source region, and a drain region are formed. Dinickel silicide is formed by performing a first annealing step, followed by a selective etching step. By performing a plasma treatment step, plasma which contains hydrogen ions is generated and the hydrogen ions are implanted in the dinickel silicide or the gate region, the source region, and the drain region under the dinickel silicide. The dinickel silicide is phase-transformed into nickel silicide by performing a second annealing step.

An electronic component includes external electrodes formed on a base member, each external electrode including a plurality of layers of which the outermost layer is a tin plating layer. The tin plating layer has a polycrystalline structure, and atoms of a metal other than tin are diffused into the tin crystal grain boundaries. Alternatively, each external electrode includes a plurality of layers including a thick-film electrode formed on the base member, a nickel layer or a nickel alloy layer formed on the thick-film electrode and a tin plating layer formed on the nickel layer or the nickel alloy layer. The tin plating layer has a polycrystalline structure and nickel atoms are diffused into the tin crystal grain boundaries. Methods for fabricating electronic components and a circuit board provided with a plurality of electronic components are also disclosed.

The invention provides an aqueous zinc-nickel alloy electroplating composition particularly useful in an electroplating method for depositing a zinc-nickel alloy layer on a substrate, wherein the deposited layer exhibits uniform nickel concentration and good aesthetics across a broad range of current densities. The electroplating composition comprises an electrolyte composition and an organic composition. In one embodiment, the electrolyte composition comprises a zinc ion source, a nickel ion source, a pH buffering agent and at least one additional salt, and the organic composition comprises a Class I nickel brightener, a Class II nickel brightener, an aromatic carboxylic acid, an aldehyde or ketone compound, and a non-ionic or anionic surfactant. The electroplating composition is particularly free of chelators and free ammonium-producing agents.

This invention relates to a preparation of electroplating double-deck zinc-nickel alloy coatings on surface of NdfeB magnet, firstly progress treatment before plating; Then pre-plate zinc-nickel alloy; And electroplate zinc-nickel alloy that is high corrosion resistance; At last progress treatment after plating, Its noncorrodibility is well, combination is firm, cost is low, influence toward magnet is small, make it has effect that decreases corroding NdfeB magnet in electroplating process.

An electrochemical fabrication process for producing three-dimensional structures from a plurality of adhered layers is provided where each layer comprises at least one structural material (e.g. nickel or nickel alloy) and at least one sacrificial material (e.g. copper) that will be etched away from the structural material after the formation of all layers have been completed. An etchant containing chlorite (e.g. Enthone C-38) is combined with a corrosion inhibitor (e.g. sodium nitrate) to prevent pitting of the structural material during removal of the sacrificial material. A simple process for drying the etched structure without the drying process causing surfaces to stick together includes immersion of the structure in water after etching and then immersion in alcohol and then placing the structure in an oven for drying.

The invention discloses a method for electroplating alkaline Zn-Ni alloy, comprising the steps of: preparing alkali wash and acid wash, preparing electroplating Zn-Ni alloy plating solution, mechanical grinding, degreasing with organic solvent or water-based detergent, alkali washing, acid washing and electroplating. The invention provides a stable electroplating solution formula and complete electroplating process. The coating electroplated by the method is proved to have good flat surface, uniform coating distribution and alloy distribution, the coating is single gamma-phase, the nickel has a content of 10% to 15%; the coating has superior corrosion resistance, red rust appears on the non-passivated Zn-Ni coating after 1500 hours in a neutral salt spray test; compared with general alkali electroplating solution, the coating has high current efficiency, reaching up to 80% to 90%.

The present invention includes an improved ejector sleeve (5) having thinner side-walls than prior sleeves. The sleeves generally include a ring (31) for mounting the sleeve, a central bore (42) for receiving a core pin (1), a tube portion extending from the ring to a tube end portion. The side-walls defining the tube end portion have a thickness of less than forty thousandths, and preferably thirty thousandths of an inch. Preferably, the coated ejector sleeve is provided in which a thin, lubricous coating of nickel, chromium or alloys of chromium or nickel is applied to at least a portion of the sleeve. The coating is applied in thickness of less than 0.0001 inch which improves the wear characteristics of the pins and sleeves as well as allowing the coated pins and sleeves to be stocked and used as nominal thickness parts.

Mold tooling formed of suitable iron-nickel alloys and provided with a hard electroless nickel coating on the mold cavity surface are useful for high volume production of carbon fiber reinforced, polymer matrix, composites. The iron and nickel alloy provides thermal expansion properties for the molding of dimensionally accurate parts. The nickel alloy coating provides a durable surface, without adversely affecting the expansion properties of the mold, and remains adherent to the base metal during the repeated thermal cycling encountered in high volume production of substantially identical molded carbon composite parts.

An electrode for an ignition device is made from a dilute nickel alloy which has improved resistance to high temperature oxidation, sulfidation, corrosive wear, deformation and fracture and includes at least 90% by weight of nickel; zirconium; boron and at least one element from the group consisting of aluminum, magnesium, silicon, chromium, titanium and manganese. The weight ratio of Zr/B may range from about 0.5 to 150, and may include amounts of, by weight of the alloy, 0.05-0.5% zirconium and 0.001-0.01% boron. The oxidation resistance of the alloy may also be improved by the addition of hafnium to the alloy in an amount that is comparable to the amount of zirconium, which may include an amount of, by weight of the alloy, 0.005-0.2% hafnium. Electrodes of dilute nickel alloys which include aluminum and silicon, as well as those which include chromium, silicon, manganese and titanium, are particularly useful as spark plug electrodes. These electrode alloys of the may also include at least one of cobalt, niobium, vanadium, molybdenum, tungsten, copper, iron, carbon, calcium, phosphorus or sulfur as trace elements, generally with specified maximum amounts. The ignition device may be a spark plug which includes a ceramic insulator, a conductive shell, center electrode and ground electrode. The center electrode, ground electrode, or both, may be made from the dilute nickel alloy of the invention. These electrodes may also include a core with thermal conductivity greater than that of the dilute nickel alloy, such as copper or silver or their alloys.

A (MEMS)-based gas sensor assembly for detecting a fluorine-containing species in a gas containing same, e.g., an effluent of a semiconductor processing tool undergoing etch cleaning with HF, NF3, etc. Such gas sensor assembly in a preferred embodiment comprises a free-standing silicon carbide support structure having a layer of a gas sensing material, preferably nickel or nickel alloy, coated thereon. Such gas sensor assembly is preferably fabricated by micro-molding techniques employing sacrificial molds that are subsequently removable for forming structure layers.

Provided is a copper foil for printed circuit comprising a roughened layer on a surface of a copper foil by way of copper-cobalt-nickel alloy plating, a cobalt-nickel alloy plated layer formed on the roughened layer, and a zinc-nickel alloy plated layer formed on the cobalt-nickel alloy plated layer, wherein the total amount of the zinc-nickel alloy plated layer is 150 to 500 μg/dm², the lower limit of the nickel ratio in the alloy layer is 0.16, the upper limit thereof is 0.40, and the nickel content is 50 μg/dm² or more.

With the development of electronic equipment, the miniaturization and high integration of semiconductor devices have advanced further. This tendency has led to a demand for the adoption of a higher temperature in treatment in a production process of printed circuits and has led to heat generation during the use of electronic equipment after the productization. The present invention provides a technique that, even under these circumstances, the adhesive strength between a copper foil and a resin base material does not decrease and the penetration into a circuit edge part can be effectively prevented when performing the soft etching of a copper foil circuit.

The invention discloses a method for preparing dihydric alcohol from crop straw. The method comprises steps of steeping raw material crop straw into diluted acid, pretreating for a short time at high temperature, then carrying out refining treatments such as cellulose hydrolyzing, decoloring and filtering, ion exchanging and high efficiently concentrating, so as to prepare straw sugar, in the presence of a special nickel alloy catalyst, continuously hydrocracking the straw sugar under high pressure so as to obtain a mixture of dihydric alcohol and polyhydric alcohols, rectifying the split product at reduced pressure and separating so as to obtain products such as ethylene glycol and propylene glycol. The method has the advantage of unique and novel and advance process; non-grain biomass resource is taken as the raw material, so that the grain risk is thoroughly avoided; the non-grain biomass resource can substitute for non-renewable resources such as petroleum or coal, so that the method has significance to development of circular economy.

The invention discloses a composite coating material and preparing method and equipment in the metallurgical conticaster crystallizer, which is composed of nickel-based composite material or nickel alloy composite material, which consists of base metal and large scale of particle or fiber in the base with polyphase structure, wherein the DC composite plating or composite pulse plating equipment is composed of plating power, plating groove, nickel anode or nickel alloy anode, metallurgical conticaster crystallizer, stirring device, liquid circulating device, heating and temperature-controlling device.

The present invention relates to a method for forming self-aligned metal silicide contacts over at least two silicon-containing semiconductor regions that are spaced apart from each other by an exposed dielectric region. Preferably, each of the self-aligned metal silicide contacts so formed comprises at least nickel silicide and platinum silicide with a substantially smooth surface, and the exposed dielectric region is essentially free of metal and metal silicide. More preferably, the method comprises the steps of nickel or nickel alloy deposition, low-temperature annealing, nickel etching, high-temperature annealing, and aqua regia etching.