343 results about "Tin plating" patented technology

The invention discloses a copper wire tinning method for tinned copper stranded wire production, which relates to the technical field of metal surface treatment, and comprises the following steps: releasing a copper wire to an ionic liquid electrophoresis tank, applying an electric field to strip surface oxides, and then carrying out three-stage countercurrent rinsing to generate a clean copper wire; putting the clean copper wire into a composite plating tank, monitoring the tin liquid viscosity and the copper wire linear speed in real time, calculating the magnetic field gradient, and controlling tin crystal oriented growth according to the magnetic field gradient to generate an oriented crystallization tinned copper wire; the surface temperature of the directionally crystallized tinned copper wire is monitored in real time and compared with a preset temperature threshold value, a temperature permission trigger signal is generated, the annular array spray gun is triggered to work according to the temperature permission trigger signal, and a densified tinned copper wire is generated; and the densified tinned copper wire is scanned through a micro-focus CT scanner, a gap three-dimensional point cloud picture is generated, the gap size and the normal angle of the gap three-dimensional point cloud picture are analyzed, the optimal spraying parameters are recognized, and the passivation film tinned copper wire is generated.

The invention discloses an inductor paint removing and tin plating machine and a tin plating method thereof, and relates to the technical field of spectrum detection, the inductor paint removing and tin plating machine comprises a machine body as well as a feeding mechanism, a paint removing module, a tin plating module, a transferring mechanism and a material receiving mechanism which are arranged in the machine body, the feeding mechanism is used for supplying an inductance coil, the paint removing module is used for carrying out paint removing treatment on a pin of the inductance coil, and the tin plating module is used for carrying out tin plating treatment on the pin. The tin plating module is used for carrying out tin plating treatment on the inductance coil subjected to paint removal, the transferring mechanism is used for transferring the inductance coil subjected to pin paint removal at the paint removal module to the tin plating module and transferring the inductance coil treated by the tin plating module to the material receiving mechanism, and the material receiving mechanism is used for receiving the inductance coil subjected to tin plating treatment. And discharging is completed. By the adoption of the technical scheme, a wave soldering machine is not needed, the occupied area and the purchase cost of equipment are greatly reduced, meanwhile, the energy consumption and the maintenance cost of the equipment are remarkably reduced, and the good market popularization value is achieved.

The invention relates to the field of circuit board production and manufacturing, in particular to a method for manufacturing patterns with different copper thicknesses on the same layer of a circuit board. According to the method, a dry film covering protection pattern is replaced by a tin plating protection pattern, a tin layer does not have a gap at the connection position of a thick copper region and a thin copper region due to the height difference between the thick copper region and the thin copper region during tin plating, and tight combination with a thick copper region pattern part and a thin copper region pattern part is always kept; manufacturing of the thick copper area pattern part and the thin copper area pattern part is completed, and the production yield is improved.

The invention discloses an electroplated part, an electroplated part manufacturing method and a connector. The electroplated part comprises a base material; a nickel plating layer formed on the surface of the base material; the tin-graphite composite plating layer is formed on the nickel plating layer; the nickel plating layer is formed on the base material, the tin-graphite composite plating layer is formed on the nickel plating layer, the tin plating layer is formed on the tin-graphite composite plating layer, the nickel plating layer serves as a bottom plating layer of the base material, the tin plating layer serves as an outer plating layer of the base material, and the tin-graphite composite plating layer serves as a middle plating layer of the base material. According to the invention, the graphite particles exposed from the tin-graphite composite coating are partially or completely wrapped by the outermost tin coating, so that the graphite particles are not easy to fall off, the wear resistance and corrosion resistance of the electroplated part are improved, and the service life of the electroplated part is prolonged. In addition, the plating layer structure also has a relatively low friction coefficient, so that the insertion and extraction force of the electroplated part in the use process can be greatly reduced.

The invention relates to the technical field of thermoelectric material surface treatment, and provides a bismuth telluride-based thermoelectric material wafer surface treatment method which comprises the following steps: acquiring multi-dimensional data such as current density distribution, temperature field distribution, solution concentration gradient and plating thickness increment in real time through a sensor array; performing iterative calculation on the data based on a thermoelectric performance parameter optimization model to generate an optimal parameter combination of chemical oil removal, activation, nickel plating and tin and bismuth plating processes; dynamically adjusting the anode plate area ratio, the current density threshold value and the solution temperature fluctuation range of the electroplating equipment; a self-adaptive feedback mechanism is used for correcting parameter deviation, so that a uniform thermoelectric function layer structure is formed on the surface of the wafer. According to the method, the uniformity and the thermoelectric performance stability of the surface coating of the bismuth telluride thermoelectric wafer can be improved, the defect rate is reduced, and the production efficiency and the product consistency are improved.

A positioning tool for a deflection angle shaft is used for clamping and fixing workpieces of deflection angle shafts, and each workpiece comprises a straight shaft section and an inclined shaft section. The tool comprises a first positioning part and a second positioning part which are located on the two end faces of the deflection angle shaft piece respectively. The workpiece achieves positioning of the straight shaft section and the inclined shaft section through the straight shaft center hole and the inclined shaft center hole, the straight shaft center hole is located in the center axis of the straight shaft section, and the inclined shaft center hole is located in the center axis of the inclined shaft section. The inclined shaft center hole is located in the outward end face of the first positioning part and the outward end face of the second positioning part. The surface, making contact with the workpiece, of the tool is subjected to nickel plating or tin plating treatment. During machining, the tool is installed on a clamp of a rotary workbench of a fourth shaft of the vertical machining center. Compared with the prior art, the method has the following beneficial effects that the machining precision is high, the cost is low, and precise grinding can be achieved.

The invention provides tinning and gold-removing integrated equipment which comprises a rack, a rotating part, an adsorption part and a tinning and gold-removing mechanism, and the rotating part is used for driving a device to rotate; the adsorption part is used for adsorbing the device and can drive the device to approach the rotating part until the device abuts against the rotating part; the tinning and gold removing mechanism comprises a heating piece, a tin sucking piece and a tin material supplying piece; the tin material feeding piece is used for conveying a tin wire to the position between the heating piece and the device, the heating piece is used for heating the tin wire to melt the tin wire and cover the periphery of the device, and the tin sucking piece is used for sucking redundant soldering tin on the periphery of the device. According to the tin coating and gold removing integrated equipment, reliable clamping of a small-size device is achieved through cooperation of the adsorption part and the rotating part, uniform tin coating and gold removing are achieved through cooperation of the tin coating and gold removing mechanism on the basis that the rotating part drives the device to rotate, the problem that traditional manual operation is large in difficulty is solved, the quality stability is guaranteed, and the production efficiency is improved. And the treatment efficiency is obviously improved.

The invention discloses a high-flame-retardant temperature-resistant corrosion-resistant optical fiber composite cable and a preparation method thereof, and belongs to the technical field of cable manufacturing, and the high-flame-retardant temperature-resistant corrosion-resistant optical fiber composite cable sequentially comprises an optical fiber unit, a conductor layer, an insulating layer, a shielding layer, a corrosion-resistant layer and a sheath layer from inside to outside. The optical fiber unit adopts a ceramic silicone rubber buffer layer; the conductor layer is a nickel-plated copper alloy stranded wire, and the oxidation resistance is enhanced through nano titanium dioxide sol treatment; the insulating layer is of a three-layer co-extrusion structure; the shielding layer adopts an aluminum-plastic composite belt and tinned copper wire braided composite structure; the anti-corrosion layer is a polytetrafluoroethylene film subjected to plasma treatment; the sheath layer is made of two-component ceramic silicone rubber, is flexible after being vulcanized at normal temperature, and is converted into a ceramic body at high temperature. According to the optical fiber composite cable, through the collaborative design of a multi-layer structure, the performance of excellent continuous use stability, high salt mist environment corrosion resistance and the like is achieved, the optical fiber composite cable is suitable for high-temperature, corrosion, fire and other severe environments, and the safety and durability of the composite cable are remarkably improved.

The invention discloses a manufacturing method of a single-layer circuit flexible circuit board for an intelligent visual module, and the method comprises the steps: taking a copper layer, pasting a first dry film and a protection film respectively, making a window on the first dry film corresponding to a hollowed-out circuit pattern, and electroplating a tin layer to form a tin plate; a single-face copper-clad plate is taken, a circuit pattern is manufactured in the area corresponding to a tin layer, a copper-clad plate copper pattern is formed, and a first pattern plate is formed; correspondingly laminating the tin-plated plate and the first pattern plate to form a laminated plate; removing the protective film in the laminated plate, manufacturing a circuit pattern, forming a copper layer windowing pattern and a hollow circuit pattern, and forming a second pattern plate; removing an area, corresponding to the copper pattern of the copper-clad plate, of the insulating dielectric layer in the second pattern plate, then performing tin stripping processing, and performing post-process processing to hollowed out the circuit pattern to form a hollowed-out circuit so as to form the flexible circuit board; and the tin layer provides protection for etching, creates a release condition for a copper pattern of the copper-clad plate, lays a foundation for uncovering the insulating layer, and finally realizes efficient and high-precision processing of the flexible circuit board.

The invention provides interval type tin plating equipment for a battery module busbar, which relates to the field of busbar processing, and comprises the following steps: dividing a target tin layer into a plurality of sub tin layers deposited in sequence, and dynamically selecting a deposition strategy in the deposition process to correct interlayer deposition deviation in real time; comprising the following steps: acquiring state data of a busbar substrate or currently deposited N sub-tin layers; determining a deposition mode used for depositing the (N + 1) th sub tin layer through a contour and temperature difference dual-threshold judgment mechanism based on state data collected by the sensor group; forming an (N + 1) th sub tin layer according to the determined deposition mode and a spraying compensation strategy generated based on the state data; according to deposition data collected in real time, the fusion degree and the thickness conformity of the local area of the (N + 1) th sub tin layer are evaluated; partial area supplementary spraying is carried out; if abnormity is detected, outputting equipment intervention measures; according to the invention, the thickness uniformity and interlayer fusion quality of the tin layer in the direct injection tin plating process of the battery module busbar are improved.

The invention discloses an electroplating method of a low-porosity nanoscale bright tin layer, which comprises the following steps: placing a clean metal substrate in an activating solution containing a surface modifier, and applying high pulse current for short-time impact to form a transition layer to obtain a target substrate; a target base material is placed in the nano-composite tin plating solution, electroplating is carried out under the cooperation of a continuous ultrasonic field and target waveform pulse current, and a low-porosity nano-scale bright tin layer is formed; the nanometer composite tin plating solution comprises stannous methanesulfonate, methanesulfonic acid, nanometer silicon carbide, nanometer silicon dioxide, a grain refiner, a dispersing agent, cinnamyl aldehyde, a vinyl pyrrolidone copolymer, ascorbic acid, a wetting agent and the balance deionized water. The binding force of a plating layer without a base coat is improved, the plating layer is strengthened, compact and bright, and the process is environmentally friendly.

This utility model relates to an industrial electronic wire in the field of electronic wires, comprising a split stepped conductor, an insulating layer, and a composite shielding layer. The insulating layer is disposed on the outside of the split stepped conductor, and the composite shielding layer is disposed on the outside of the split stepped conductor. The split stepped conductor comprises a corrugated conductor, a first copper core, and a second copper core, with the first and second copper cores spirally wound in opposite directions on the surface of the corrugated conductor. The insulating layer comprises a layer of nano-ceramic modified polyolefin, an aramid fiber reinforced epoxy resin layer, and a fluororubber layer, all layered and laminated. The aramid fiber reinforced epoxy resin layer has embedded protrusions. The composite shielding layer comprises a tin-plated copper wire braided mesh, an aluminum foil strip, and a hot-melt conductive adhesive, with the tin-plated copper wire braided mesh and the aluminum foil strip spirally wound alternately. This utility model enhances mechanical strength through the split stepped conductor structure, and improves interface bonding and electromagnetic shielding durability through multi-layer composite and anchoring design.

The invention relates to the technical field of wire rod processing, in particular to a wire rod tin plating device and method.The wire rod tin plating device comprises a wire inlet assembly, an air inflation assembly, a wire guide pipeline, a tin plating assembly, a tin immersion assembly and a wire cooling assembly, the wire inlet assembly comprises a rack and an atmosphere protection box, the atmosphere protection box is obliquely arranged above the rack, and the air inflation assembly is arranged in the rack; the inflation valve is used for inflating the wire pipeline; the tin plating assembly is provided with a tin furnace, one end of the wire pipeline is connected with the atmosphere protection box, the other end of the wire pipeline extends into the tin furnace, the tin immersion assembly is provided with a tin immersion wire support, and one end of the tin immersion wire support is immersed into the tin furnace, is opposite to the outlet end of the wire pipeline and is used for guiding wires towards the cooling wire assembly. The cooling wire assembly is used for leading out the wire. The electrical performance of a finished product and the adaptability of a subsequent processing process are improved; tin consumption and pollution emission are reduced through overall sealing and gas control, the productivity and the product percent of pass are improved, and the device is suitable for high-speed continuous production.

This invention discloses an environmentally friendly, green, halogen-free flame-retardant cable and its preparation method, relating to the field of cable technology. The cable includes a tin-plated copper conductor at its center. An inner shielding layer, an insulation layer, and an outer shielding layer are extruded onto the conductor using a three-layer co-extrusion process to form an insulated core. The insulated core is then wrapped with an oxygen-free soft copper strip as a metallic shielding layer, followed by a semi-conductive water-resistant tape pad, then longitudinally wrapped with an aluminum-plastic composite tape and extruded with polyethylene. A waterproof layer is wrapped with a double-layer high-strength corrosion-resistant alloy tape as an armor layer. The outermost layer of the cable is extruded with a flame-retardant outer sheath. This sheath uses polyethylene as a base material, adding maleic anhydride-modified oleic acid and peroxide, and incorporating zinc oxide and magnesium oxide to form an ion network structure, while also incorporating flame-retardant fillers. This invention exhibits good tensile strength, electrical insulation performance, compressive and tensile strength, and bending performance, while also possessing excellent elongation at break, low-temperature crack resistance, and halogen-free flame-retardant characteristics.

The invention relates to a long rod grinding machine and an anti-static system and a grounding method thereof, and belongs to the technical field of electric tools. The anti-static system provided by the invention comprises the three-core power line and the anti-oxidation electric connection structure arranged on the aluminum long rod, and the anti-oxidation electric connection structure is in compression joint with the grounding wire by adopting the metal wiring buckle with the tinned surface and is connected with the threaded hole in the aluminum rod through the stainless steel screw assembly; copper-aluminum contact is blocked by the tin-plated layer, and the stainless steel material reduces the potential difference, so that electrochemical corrosion is inhibited, and long-term reliability of grounding is ensured. Meanwhile, the system provides safe operation guidance in a matched mode, guides a user to confirm socket grounding and regularly check the connection state before use, and executes an emergency electrostatic discharge program when grounding fails, for example, a temporary discharge path is established through contact between a metal grounding plate and the wet ground. According to the invention, a grounding scheme with simple structure, corrosion resistance and reliable connection is realized, and a complete safety system from hardware protection to a use method is formed.

This utility model discloses a highly flexible, electromagnetic interference-resistant cable for robots, comprising a double-layer conductor bundle with a Kevlar fiber rope at its center. The space between the inner and outer conductor bundles, and between the inner and outer conductor bundles and the Kevlar fiber rope, is filled with thermoplastic elastomer and foamed silicone. The conductor bundles are spirally twisted in opposite directions at different pitches. The cable is surrounded by braided aramid fibers, an insulation layer, an inner shielding layer, an outer shielding layer, and a sheath layer. The sheath has semi-circular ribs and embedded elastic polyurethane strips. The thermoplastic elastomer is a polyurethane-based material, the foamed silicone is phenyl silicone rubber, the insulation layer is nano-silica modified methyl vinyl silicone rubber, the inner shielding layer is copper foil wrapped with a polytetrafluoroethylene self-lubricating coating, the outer shielding layer is tin-plated copper wire braid, and the sheath layer is a blend of polyurethane and silicone rubber coated with a nano-ceramic coating. This cable exhibits a long dynamic bending life under extreme environments, improves high-frequency shielding effectiveness, and is suitable for high-frequency movements of industrial robots and complex electromagnetic environments.

The invention belongs to the technical field of chemical tin plating, and particularly relates to a micro-nano powder surface tin plating method which comprises the following steps: pretreating powder, adding main salt, a reducing agent, a coordination agent and an antioxidant into water, and stirring until the main salt, the reducing agent, the coordination agent and the antioxidant are completely dissolved; and the pretreated powder is added into the cylinder opening liquid to be subjected to a reaction, when the surface of the solution is subjected to the reaction, the supplementing liquid is added, stirring continues to be conducted till the reaction is completed, and the micro-nano powder with the tin-plated surface is obtained. According to the method for plating tin on the surface of the micro-nano powder, tin is plated on the surface of the micro-nano split body, so that the surface energy of the material can be effectively reduced, the material can be more easily infiltrated and combined with welding flux in the welding process, the welding performance of the material is remarkably improved, and the material is high in oxidation resistance, high in conductivity, high in dispersity and high in corrosion resistance. The whole process is simple, stable and suitable for large-scale production and application.

The utility model discloses a copper wire tinning device which comprises a device main body, a tinning bath, a cleaning roller, a drying box and a U-shaped pipe, the tinning bath is arranged on one side of the bottom of the device main body, a filter is installed in the device main body above the tinning bath, and a hollow filter element is arranged in the filter. A liquid collecting tank is arranged on the other side of the bottom of the device body, the cleaning rollers are all arranged above the liquid collecting tank, the outer walls of the cleaning rollers are sleeved with sponge sleeves, motors are installed on the inner walls, at the cleaning rollers, of the device body, and the U-shaped pipes are arranged on the outer sides of the cleaning rollers. The two inner walls of the U-shaped pipe are provided with nozzles at equal intervals, and the drying box is installed at the top of the device body. According to the tin plating device, copper wire cleaning and self-cleaning are simultaneously carried out through the sponge sleeve, the cleaning effect is guaranteed, sediment impurities in a plating solution can be removed, and the tin plating quality of the copper wire is guaranteed.

The invention relates to the technical field of tin plating wastewater recovery treatment, and particularly discloses tin plating wastewater recovery treatment equipment and a tin plating wastewater recovery treatment process. The side face of a filtering part is fixedly connected with a feeding part, the side face of a precipitation part is fixedly connected with the filtering part, and the filtering part comprises a filtering shell; and the other end of the feeding opening is fixedly connected with the feeding component, and the inner side of the filtering shell is fixedly connected with a first net plate. According to the tin plating wastewater recovery treatment equipment and process, the separation mechanism is arranged, an inclined filter screen is arranged in the separation shell, an entered mixture can be intercepted and separated, impurities are intercepted by the filter screen, wastewater penetrates through the filter screen and is collected to the bottom of an inner cavity of the separation shell, and at the moment, a first water pump is started; the wastewater at the bottom of the separation shell is conveyed back to the filter shell through the return pipe and participates in the chemical mixing procedure again, so that wastewater waste caused in the impurity intercepting process is avoided.

The application provides a chip on film, a display device and a preparation method. The chip on film comprises a substrate, a patterned metal trace arranged on the substrate, an encapsulation layer arranged on a side of the metal trace away from the substrate, a metal pin arranged on a side of the encapsulation layer away from the substrate and fixedly connected to a side of the metal trace away from the substrate, and a barrier layer arranged on a side of the encapsulation layer away from the substrate and connected to the metal pin and configured to seal a gap between the metal pin and the encapsulation layer. The barrier layer can seal the gap between the encapsulation layer and the metal pin, avoid corrosion of the metal pin by acid liquid during a tin plating process, prevent the metal pin from peeling or separating from the surface, and improve the bending performance of the chip on film.

The utility model discloses a coil framework, a coil assembly and a motor, and the coil framework comprises a first winding part which is cylindrical and is used for winding a winding wire; the first blade-shaped part is arranged at one axial end of the first winding part, and the second blade-shaped part is arranged at the other axial end of the first winding part; the mounting part is arranged on the outer periphery of the first edge-shaped part, a first through hole is formed in the mounting part, and the first through hole is used for mounting a contact pin; the blocking part protrudes out of the surface of the side, away from the second edge-shaped part, of the mounting part and is located on the side, close to the axis direction of the first winding part, of the first through hole, and the blocking part can prevent metal beads generated during metal treatment of the contact pin from rolling towards the axis direction of the first winding part. The coil framework has the advantage of preventing the tin beads from rolling into the gear assembly when the tin coating process is carried out on the contact pins.

The manufacturing method of the composite metal film comprises the following steps: cleaning a metal substrate; plating a nickel film on the surface of the metal substrate; performing ion etching on the nickel film to form a honeycomb surface; plating a tin film on the nickel film; and performing ion etching on the tin film to form a honeycomb surface. The method is simple in process and low in cost, and can form a film body on the metal substrate, which is stable in combination and performance, resistant to corrosion and low in stress, thereby prolonging the service life.

The invention discloses a surface strengthening treatment method for an inner hole of a main connecting rod of a piston type aero-engine. The surface strengthening treatment method comprises the following steps that S100, the main connecting rod is subjected to oil removal treatment; s200, performing waxing treatment on the non-plated surface on the main connecting rod to form an insulating protection layer; s300, weak corrosion activation treatment is conducted on an inner hole of the main connecting rod; s400, a tool clamp is used for installing and hanging the main connecting rod, then a lead and tin plating solution is poured into an inner hole of the main connecting rod for out-groove electroplating treatment, and the lead and tin plating solution comprises 110 g / L to 275 g / L of lead fluoroborate, 30 g / L to 65 g / L of stannous fluoroborate, 1 g / L to 2 g / L of hydroquinone and 1.5 g / L to 2.0 g / L of oxhide gelatin; and S500, the main connecting rod is detached from the tool clamp and then subjected to wax removal and cleaning treatment, and then whether the lead-tin layer is qualified or not is checked. According to the surface strengthening treatment method for the inner hole of the main connecting rod of the piston type aero-engine, the uniformity of a plating layer can be improved, the tin content in a lead-tin layer is increased, and the wear-resisting and lubricating capacity is enhanced.

The invention relates to the technical field of circuit board tin plating, and provides a tin plating device for microwave circuit board processing, the tin plating device comprises a tin liquid box, a substrate mounted on the upper side of the interior of the tin liquid box and a plurality of transverse frame openings formed in the substrate and used for placing circuit boards, and the top of the tin liquid box is provided with a pushing assembly used for clamping the downwards-conveyed circuit boards; a plurality of groups of flooding tinning assemblies are arranged on the lower side of the interior of the tin liquid box, a plurality of plate positive hot blowing assemblies are arranged at the bottom of the base plate, the flooding tinning assemblies and the plate positive hot blowing assemblies are vertically arranged in an aligned mode on the same axis, and magnetic opening assemblies are arranged on the plate positive hot blowing assemblies. When the device is used, through the flooding tin plating effect formed by the plating cavity box, the partition thick plate and the bottom-wrapping sealing plate, instant and synchronous surrounding flooding of molten tin liquid on the microwave circuit board from top to bottom and from bottom to top is achieved, and the problem that the thickness distribution of a tin plating layer is not uniform due to the infiltration time difference of the circuit board is solved.

The utility model discloses a film capacitor for flexible direct current power transmission, which belongs to the technical field of capacitors and comprises a shell, a plurality of capacitor cores and extraction electrodes, the shell is made of metal materials, the plurality of capacitor cores are grouped to form a plurality of capacitor core independent groups, and the extraction electrodes are arranged in the shell. Each capacitor core independent group is connected with a tinned copper plate, the lead-out electrode is provided with a laminated busbar and is connected with the tinned copper plate in a matched manner through the laminated busbar, and the plurality of capacitor core independent groups are packaged in the shell through a potting material. The thin-film capacitor can simultaneously meet the performance requirements of low self-inductance, low temperature rise, high energy density, light weight and long service life, thereby effectively improving the safety and reliability of the thin-film capacitor for flexible direct-current power transmission.

The application belongs to the technical field of tinning machines, and discloses a tinning machine coating uniformity control device, which comprises a stirring barrel, a spray piece is fixedly connected to the lower end of the stirring barrel in communication, a first ring groove is formed in the outer surface of the stirring barrel, a second ring groove is formed in the inner wall of the stirring barrel, a first circular block is arranged at the inner center of the stirring barrel, a second circular block is rotatably connected to the lower end of the first circular block, first fan-shaped pieces are fixedly connected to the outer surface of the first circular block uniformly, and second fan-shaped pieces are fixedly connected to the outer surface of the second circular block uniformly; the second fan-shaped pieces can be attached to the lower end of the first fan-shaped pieces to rotate, so as to adjust the gap between the second fan-shaped pieces and the first fan-shaped pieces, thereby adjusting the rate and flow of tinning liquid discharge; through the magnetic connection of the magnetic attraction ring and the magnetic attraction plate, the rotating ring and the arc-shaped block can be connected into a whole, so that the rotation of the rotating ring can synchronously drive the second fan-shaped pieces to rotate at the lower end of the first fan-shaped pieces.

A method of manufacturing a lead frame package device includes providing a lead frame including at least one lead bonding area and a plurality of leads extending from the at least one lead bonding area, where each lead bonding area includes a plurality of bonding pads; depositing a nickel-plated layer on each lead bonding area to form a nickel-plated bonding pad; depositing a plating layer shielding material on the nickel plating layer so as to form a shielding layer on the nickel plating layer; depositing a tin plating layer on the lead frame, including on the plurality of leads, in which the plating layer shielding material prevents the tin plating layer from contacting the nickel plating layer; removing the shielding layer from the lead frame to expose the nickel plating layer on each lead bonding area; attaching a die to the lead frame; and forming wire bonding between the tube core and the nickel plating bonding pad.

The utility model discloses wire drawing equipment for tinned copper stranded wire production, which comprises a rack, a mounting plate is arranged on the inner wall of the bottom of the rack, and a pay-off rack, a take-up rack, two wire drawing wheels, a mounting port and a wire drawing die holder are arranged on the outer wall of one side of the mounting plate. The limiting mechanism comprises a supporting plate, an adjusting assembly is arranged on the outer wall of one side of the supporting plate, eleven mounting grooves are formed in the outer walls of the two sides of the wire drawing die base, and two supporting frames are arranged on the outer wall of the side, close to the wire drawing die base, of the mounting plate. The wire drawing equipment for tinned copper stranded wire production disclosed by the utility model is provided with the wire holes which can be flexibly adjusted and configured according to actual production requirements, so that the production cost and the time cost are reduced, and the practicability of the device is improved.

The utility model relates to the technical field of cables, in particular to a wire core main body with an anti-falling coating. The utility model relates to a wire core main body with an anti-falling coating. The wire core main body comprises a core wire and a side wire. A plurality of side wires are arranged in the circumferential direction of the core wire, the side wires are uniformly spaced, and grooves are formed among different side wires. The outer layer of the wire core main body is provided with a tin plating layer, and the tin plating layer fills the groove. And a nickel plating layer is arranged on the outer layer of the tin plating layer. The bonding effect of the tin plating layer and the wire core main body is stable, the tin plating layer is protected through the wear resistance of the nickel plating layer, the plating layer of the wire core main body is effectively prevented from falling off, and the stable form of the wire core main body is kept.