548 results about "Tin plating" patented technology

The invention discloses an automatic tin plating device for circuit board chip welding, and relates to the technical field of chip welding, the automatic tin plating device comprises a tin liquid pool, a chip feeding workbench, a four-way conveying mechanism and a thermal resistance mechanism, a chip stacking cylinder is vertically installed on the chip feeding workbench, the thermal resistance mechanism comprises a rack, a lifting seat, a finger air cylinder and a cold sheet, and the lifting seat is connected with the finger air cylinder. The lifting seat is installed on the rack, a finger air cylinder is installed at one end of the lifting seat, two clamping jaws of the finger air cylinder are each provided with a cold piece, cold air is introduced into the cold pieces, the four-way conveying mechanism comprises a portal frame, a three-way conveying mechanism and an overturning plate, and the three-way conveying mechanism is installed on the portal frame; the three-direction conveying mechanism has moving freedom degrees in the X direction, the Y direction and the Z direction in a space coordinate system, the overturning plate is rotationally installed on the three-direction conveying mechanism, a rotating disc is rotationally installed at the bottom of the overturning plate, and a negative pressure suction cup is arranged on the rotating disc. And the cold sheet can isolate high temperature from being transmitted to the chip, so that the chip can be well protected from being influenced in the tin plating process.

The invention discloses sewage treatment equipment and process for tinning of an LED pin frame, and relates to the technical field of sewage treatment. In the dosing flocculation process, flocculated sewage is generally and directly guided into filtering equipment, a solid-liquid mixture is not pre-separated, the workload of the filtering equipment is heavy, and the sewage treatment efficiency is influenced, and through cooperation of a conical cover and a through groove disc, in the process of stirring the sewage by utilizing a stirring mechanism and mixing a medicament with the sewage, the sewage is stirred by utilizing the stirring mechanism, so that the sewage treatment efficiency is greatly improved. By means of rotation of the sewage under stirring, floccules in the sewage are concentrated on the outer side and cannot penetrate through the through grooves of the through groove disc, primary solid-liquid separation is conducted on the sewage while flocculation is conducted, the amount of sewage entering the filtering equipment is reduced, the content of the floccules in the sewage guided out by the water outlet pipe is increased, and the situation that the floccules cannot penetrate through the through grooves of the through groove disc after dosing flocculation is avoided. A large amount of sewage and floccules enter filtering equipment at the same time, so that the workload of the filtering equipment is large, and the sewage treatment efficiency is influenced.

The utility model discloses matte electroplating tin thin copper foil production equipment which comprises a tin plating bracket and a plurality of tin plating devices arranged at the rear end of the tin plating bracket, the tin plating device comprises an upper tin plating mechanism, a lower tin plating mechanism, an electroplating liquid temporary storage tank and an electroplating liquid circulating mechanism; the upper electrotinning mechanism, the lower electrotinning mechanism and the electroplating liquid temporary storage tank are sequentially distributed from top to bottom; electroplating liquid in the upper electrotinning mechanism and the lower electrotinning mechanism flows into the electroplating liquid temporary storage tank from top to bottom; and the electroplating liquid circulating mechanism filters the electroplating liquid in the electroplating liquid temporary storage tank and then re-injects the electroplating liquid into the upper electrotinning mechanism and the lower electrotinning mechanism. The whole electroplating device is shortened by half, so that the moving distance of electroplating liquid is shortened, and driving parts such as a pump body are reduced.

The invention provides a preparation method of a BC solar cell and the BC solar cell prepared by the preparation method, and relates to the technical field of solar cells. The preparation method comprises the following steps: forming a patterned groove in the surface of a back coating layer of a BC battery silicon substrate; and sequentially carrying out oxide layer removal treatment, activation treatment, chemical nickel plating, copper electroplating and chemical tin plating on the patterned groove of the BC cell silicon substrate to obtain the BC solar cell. According to the preparation method of the BC solar cell, the conversion efficiency of the BC cell can be effectively improved, the production cost is reduced, and the reliability, the adhesive force and the weldability of a plating layer are enhanced.

The invention discloses a copper wire tinning method for tinned copper stranded wire production, which relates to the technical field of metal surface treatment, and comprises the following steps: releasing a copper wire to an ionic liquid electrophoresis tank, applying an electric field to strip surface oxides, and then carrying out three-stage countercurrent rinsing to generate a clean copper wire; putting the clean copper wire into a composite plating tank, monitoring the tin liquid viscosity and the copper wire linear speed in real time, calculating the magnetic field gradient, and controlling tin crystal oriented growth according to the magnetic field gradient to generate an oriented crystallization tinned copper wire; the surface temperature of the directionally crystallized tinned copper wire is monitored in real time and compared with a preset temperature threshold value, a temperature permission trigger signal is generated, the annular array spray gun is triggered to work according to the temperature permission trigger signal, and a densified tinned copper wire is generated; and the densified tinned copper wire is scanned through a micro-focus CT scanner, a gap three-dimensional point cloud picture is generated, the gap size and the normal angle of the gap three-dimensional point cloud picture are analyzed, the optimal spraying parameters are recognized, and the passivation film tinned copper wire is generated.

The invention discloses an inductor paint removing and tin plating machine and a tin plating method thereof, and relates to the technical field of spectrum detection, the inductor paint removing and tin plating machine comprises a machine body as well as a feeding mechanism, a paint removing module, a tin plating module, a transferring mechanism and a material receiving mechanism which are arranged in the machine body, the feeding mechanism is used for supplying an inductance coil, the paint removing module is used for carrying out paint removing treatment on a pin of the inductance coil, and the tin plating module is used for carrying out tin plating treatment on the pin. The tin plating module is used for carrying out tin plating treatment on the inductance coil subjected to paint removal, the transferring mechanism is used for transferring the inductance coil subjected to pin paint removal at the paint removal module to the tin plating module and transferring the inductance coil treated by the tin plating module to the material receiving mechanism, and the material receiving mechanism is used for receiving the inductance coil subjected to tin plating treatment. And discharging is completed. By the adoption of the technical scheme, a wave soldering machine is not needed, the occupied area and the purchase cost of equipment are greatly reduced, meanwhile, the energy consumption and the maintenance cost of the equipment are remarkably reduced, and the good market popularization value is achieved.

The utility model discloses copper bar acid tinning equipment for electrical parts, which relates to the technical field of copper bar acid tinning equipment, and comprises an acid pickling box, a circular ring is arranged in the acid pickling box in a lifting manner, a hanging assembly for fixing a copper bar is arranged at the bottom of the circular ring, and the hanging assembly comprises a hanging rope and a grabbing clamp. The hanging rope is fixedly connected to the bottom of the circular ring, the grabbing clamp is fixedly connected to the bottom end of the hanging rope, a liquid spraying assembly used for cleaning the copper bar is arranged on the upper half section of the pickling box, and the liquid spraying assembly comprises a third liquid pipe and a spraying cover. According to the copper bar acid tinning equipment for the electrical parts, by arranging the pickling box, the hanging assembly, the liquid spraying assembly and other structures, soaking and shaking pickling is conducted on the lower half section of the pickling box, flushing is conducted on the upper half section of the pickling box, residual impurities on the surface of a copper bar are removed, and the machining efficiency is improved.

The invention relates to the field of circuit board production and manufacturing, in particular to a method for manufacturing patterns with different copper thicknesses on the same layer of a circuit board. According to the method, a dry film covering protection pattern is replaced by a tin plating protection pattern, a tin layer does not have a gap at the connection position of a thick copper region and a thin copper region due to the height difference between the thick copper region and the thin copper region during tin plating, and tight combination with a thick copper region pattern part and a thin copper region pattern part is always kept; manufacturing of the thick copper area pattern part and the thin copper area pattern part is completed, and the production yield is improved.

The invention discloses an easy-to-bend copper bar cable which comprises a flat copper bar conductor with the section thickness of 2.95 mm to 3.05 mm, the section width of 15.90 mm to 16.10 mm and the sectional area of 48 mm < 2 >, and an insulating layer which is made of a nylon material and wraps the copper bar conductor, the average thickness of the insulating layer is 0.55 mm to 0.65 mm, the minimum local thickness of the insulating layer is larger than or equal to 0.48 mm, the height of the outer contour of the insulating layer is 4.2 mm, and the thickness of the outer contour of the insulating layer is 4.2 mm. The width of the insulating layer is 17.2 mm, and the surface roughness Ra of the insulating layer is less than or equal to 0.8 [mu] m. The electric connector has the characteristics of temperature resistance, aging resistance and chemical corrosion resistance, supports customized designs such as end stamping and tin plating, is convenient to mount, reduces the occupied space by 30%, and remarkably improves the reliability and durability of electrical connection and the system integration efficiency.

The invention discloses a PSA electrotinning insoluble anode system and a production method of an electrotinning plate, and relates to the technical field of electrotinning. The PSA tin electroplating insoluble anode system comprises an electroplating additive which is composed of benzotriazole, N-oleoyl sarcosine, S-carboxyethyl thiosuccinic acid and sodium citrate. The problems of serious black ash and poor coating performance of an electroplated tin plate product are solved, the tin plating stability of a plating solution in an electroplating bath is improved, the black ash on the surface of the electroplated tin plate product can be effectively reduced, the requirements of low black ash and high adhesive force on the surface of an electroplated tin plate of a PSA (Pressure Swing Adsorption) electroplated tin insoluble anode system are met, and the service life of the electroplated tin plate is prolonged. The electroplated tin plate produced through the PSA electroplated tin insoluble anode system is bright and clean in plating layer surface, and after the tin layer surface with the thickness of 8.4 g / m < 2 > and below is wiped through test paper, the reduction percentage of the test paper whiteness caused by black ash is smaller than or equal to 10%.

The invention relates to the technical field of copper wire production, and provides a hot tinning device and process for a superfine copper wire, the hot tinning device comprises a tinning box, one side of the tinning box is provided with a cooling tank communicated with the outside, the bottom and the top of the cooling tank are both provided with holes communicated with the tinning box, and the copper wire can penetrate out and penetrate in through the holes; a heating pipe is arranged at the top of the interior of the tinning box, and a guide roller assembly is arranged in the tinning box. The device overcomes the defects in the prior art and is reasonable in design and compact in structure, the copper wire is cooled after tinning, a tin layer is stabilized and then heated again, after the tin layer is close to a molten state, tin on the surface of the copper wire is scraped through the die cutter assembly, redundant tin on the surface of the copper wire is scraped off and smoothed, and the copper wire surface quality is improved. And the uniformity and the conductivity of the copper wire surface coating are improved. And a plurality of die cutter assemblies which are horizontally arranged are arranged in the tin plating box, so that the die cutter assemblies are prevented from being overheated due to long-time continuous use, a copper wire tin plating layer is prevented from being molten accidentally, and the service life of the die cutter assemblies is prolonged.

The invention discloses an electroplated part, an electroplated part manufacturing method and a connector. The electroplated part comprises a base material; a nickel plating layer formed on the surface of the base material; the tin-graphite composite plating layer is formed on the nickel plating layer; the nickel plating layer is formed on the base material, the tin-graphite composite plating layer is formed on the nickel plating layer, the tin plating layer is formed on the tin-graphite composite plating layer, the nickel plating layer serves as a bottom plating layer of the base material, the tin plating layer serves as an outer plating layer of the base material, and the tin-graphite composite plating layer serves as a middle plating layer of the base material. According to the invention, the graphite particles exposed from the tin-graphite composite coating are partially or completely wrapped by the outermost tin coating, so that the graphite particles are not easy to fall off, the wear resistance and corrosion resistance of the electroplated part are improved, and the service life of the electroplated part is prolonged. In addition, the plating layer structure also has a relatively low friction coefficient, so that the insertion and extraction force of the electroplated part in the use process can be greatly reduced.

The invention discloses a manufacturing method of an anti-oxidation corrosion-resistant red copper plate, and relates to the technical field of red copper plate manufacturing. S2, alloying treatment is carried out; s3, cold rolling and intermediate annealing; s4, coating treatment is carried out; and S5, quality detection. According to the method, the titanium nitride coating is deposited through the magnetron sputtering technology, the organic silicon resin coating is coated, various parameters in the sputtering process can be accurately controlled through the magnetron sputtering technology, the thickness and uniformity of the coating can be more accurately controlled, the problem that the thickness is not uniform in the similar hot-dip tinning process is avoided, tin-containing waste water is reduced, and the production cost is reduced. Meanwhile, the organic silicon resin coating is coated, so that the quality of the whole protective layer can be further guaranteed, the oxidation resistance and corrosion resistance of the red copper plate are improved, residual water stains on the top of the blank can be wiped through the water absorption roller, the blank is symmetrically heated through the hot-air blower and the heating strip, the heating and drying speed of the blank can be increased, and the service life of the blank is prolonged. And the overall drying time is shortened.

The invention relates to the technical field of power cables, and discloses a high-flexibility high-temperature-resistant fireproof cable which comprises a conductor, an insulating layer, a shielding layer, an inner sheath layer, a fireproof layer and an outer sheath layer which are sequentially arranged from inside to outside, the conductor is formed by twisting multiple strands of fine copper wires, the surface of each fine copper wire is plated with a layer of tin, the insulating layer is made of a silicon rubber material, and the shielding layer is made of a silicon rubber material. A nanoscale magnesium hydroxide flame retardant and a high-temperature-resistant additive are added into the silicone rubber material; the shielding layer is a copper wire braided shielding layer; the inner sheath layer is made of a polyurethane material; the fireproof layer comprises a ceramic silicone rubber layer and a mica tape wrapping layer which are arranged in sequence; according to the scheme, the conductor is stranded by multiple strands of fine copper wires, and the diameter, the stranding pitch and the tension are optimized, so that the cable keeps excellent flexibility in frequent bending and moving environments, and the conductor is prevented from being broken. The tin coating improves the oxidation resistance and the welding performance, and ensures the long-term stability of electrical connection.

The invention relates to the technical field of thermoelectric material surface treatment, and provides a bismuth telluride-based thermoelectric material wafer surface treatment method which comprises the following steps: acquiring multi-dimensional data such as current density distribution, temperature field distribution, solution concentration gradient and plating thickness increment in real time through a sensor array; performing iterative calculation on the data based on a thermoelectric performance parameter optimization model to generate an optimal parameter combination of chemical oil removal, activation, nickel plating and tin and bismuth plating processes; dynamically adjusting the anode plate area ratio, the current density threshold value and the solution temperature fluctuation range of the electroplating equipment; a self-adaptive feedback mechanism is used for correcting parameter deviation, so that a uniform thermoelectric function layer structure is formed on the surface of the wafer. According to the method, the uniformity and the thermoelectric performance stability of the surface coating of the bismuth telluride thermoelectric wafer can be improved, the defect rate is reduced, and the production efficiency and the product consistency are improved.

A positioning tool for a deflection angle shaft is used for clamping and fixing workpieces of deflection angle shafts, and each workpiece comprises a straight shaft section and an inclined shaft section. The tool comprises a first positioning part and a second positioning part which are located on the two end faces of the deflection angle shaft piece respectively. The workpiece achieves positioning of the straight shaft section and the inclined shaft section through the straight shaft center hole and the inclined shaft center hole, the straight shaft center hole is located in the center axis of the straight shaft section, and the inclined shaft center hole is located in the center axis of the inclined shaft section. The inclined shaft center hole is located in the outward end face of the first positioning part and the outward end face of the second positioning part. The surface, making contact with the workpiece, of the tool is subjected to nickel plating or tin plating treatment. During machining, the tool is installed on a clamp of a rotary workbench of a fourth shaft of the vertical machining center. Compared with the prior art, the method has the following beneficial effects that the machining precision is high, the cost is low, and precise grinding can be achieved.

The invention provides tinning and gold-removing integrated equipment which comprises a rack, a rotating part, an adsorption part and a tinning and gold-removing mechanism, and the rotating part is used for driving a device to rotate; the adsorption part is used for adsorbing the device and can drive the device to approach the rotating part until the device abuts against the rotating part; the tinning and gold removing mechanism comprises a heating piece, a tin sucking piece and a tin material supplying piece; the tin material feeding piece is used for conveying a tin wire to the position between the heating piece and the device, the heating piece is used for heating the tin wire to melt the tin wire and cover the periphery of the device, and the tin sucking piece is used for sucking redundant soldering tin on the periphery of the device. According to the tin coating and gold removing integrated equipment, reliable clamping of a small-size device is achieved through cooperation of the adsorption part and the rotating part, uniform tin coating and gold removing are achieved through cooperation of the tin coating and gold removing mechanism on the basis that the rotating part drives the device to rotate, the problem that traditional manual operation is large in difficulty is solved, the quality stability is guaranteed, and the production efficiency is improved. And the treatment efficiency is obviously improved.

The invention belongs to the technical field of coating binding force detection, and particularly relates to a tinned copper wire coating binding force detection method which comprises the steps that tinned copper wire coating binding force detection equipment controls a tinned copper wire to penetrate through a constant-temperature heating area at a first speed, and special treatment is conducted on the copper wire before the surface of the copper wire is tinned, the same envelopes are arranged at fixed intervals; after the envelopes penetrate through the constant-temperature heating area, measuring the air bag area after each envelope is bulged; and obtaining the coating binding force of the tinned copper wire at the corresponding position of each coating film according to the air bag area after each coating film is bulged. The method can solve the problem that the detection process is tedious when the tinned copper wire is detected in the prior art.

One embodiment of the present invention provides a tin electroplating solution and a method for forming tin solder bumps using same. The tin electroplating solution according to an embodiment of the present invention includes a novel nucleation accelerator and a particle growth inhibitor, enabling the formation of uniform tin solder bumps with few voids, and thus has excellent performance.

The invention mainly relates to the technical field of metal surface treatment, in particular to a tinned copper wire surface treatment process which comprises the following steps: pickling and activating: pickling and activating a copper wire by adopting a phosphoric acid-sulfuric acid mixed solution to obtain a copper wire preform; immersing the copper wire preform into a silane coupling agent solution to obtain a copper wire intermediate; the copper wire intermediate is heated and then put into a mixed solution containing rare earth La particles, dip plating is conducted, and the tinned copper wire is obtained; the tinned copper wire passes through a heat preservation area, and the tinned copper wire is led out to enter a sealed ultrasonic vibration uniform flow area; performing multi-stage hot air shaping, and enabling the tinned copper wire to sequentially pass through three groups of annular air knives; cooling the tinned copper wire in an air cooling channel; and immersing the tinned copper wire into the composite passivation solution, taking out the tinned copper wire, putting the tinned copper wire into a centrifugal device, and finally baking the tinned copper wire in an oven. The application breaks through the limitation of the traditional tinned copper wire in binding force, dimensional accuracy and environment resistance, and can meet the requirements of the fields of electronic power, communication transmission and the like on high-reliability materials.

The invention relates to the technical field of cold-resistant cables, and discloses a cold-resistant cable and a manufacturing process thereof, and the cold-resistant cable comprises a conductor which is formed by attaching a layer of plating silver to the outside of a tinned copper wire and twisting the tinned copper wire; the outer side of the conductor is provided with an aluminum foil shielding layer, and the aluminum foil shielding layer is formed by spirally winding an aluminum foil tape on the conductor through a filter tape and a wrapping device; an insulating layer II is arranged on the outer side of the heat insulating layer, the insulating layer II is made of a modified polyethylene insulating material, and a cold-resistant plasticizer and an anti-aging agent are added during manufacturing; an outer sheath layer is arranged on the outer side of the second insulating layer, the outer sheath layer is made of low-temperature-resistant silicone rubber, and an ultraviolet light absorber and an anti-rat-bite additive are added in the manufacturing process. The cable can adapt to various severe environments and low-temperature, humid and electromagnetic interference environments, various auxiliaries are added into the protective layer, good mechanical strength and protective performance are achieved, fire resistance and ultraviolet resistance are achieved, and damage caused by rat disasters is effectively avoided by adding the rat-bite-proof additive.

The invention relates to the field of electroplating of threaded couplings, in particular to an electroplating nickel-tungsten alloy process for a threaded coupling. The nickel-tungsten alloy electroplating technology for the threaded coupling comprises the following steps that S1, activating treatment is conducted; s2, nickel pre-plating treatment; s3, copper plating treatment; s4, nickel-tungsten alloy plating treatment; s5, tinned copper treatment; and S6, passivating treatment is conducted. According to the composite electroplating technology for the threaded coupling, the abrasion resistance and corrosion resistance of the threaded part are improved through multi-stage coating superposition. Bottom-layer metal nickel is formed through nickel pre-plating treatment, and the binding force of a base body and a plating layer is enhanced; the copper plating layer can improve the ductility of the plating layer and reduce internal stress; the nickel-tungsten alloy layer improves the hardness and high-temperature stability of the plating layer; the tinned copper layer further prevents extrusion deformation of the threads, reduces the friction coefficient and prevents thread gluing; a compact oxidation film is formed through passivating treatment, and the color change phenomenon on the surface is prevented. And the service life of the coupling under the working conditions of high pressure and high friction is obviously prolonged.

The utility model relates to the technical field of wire rod production, in particular to wire rod tin plating two-connection type die equipment which comprises a rack, a tin furnace, a wire rod leading-in assembly, a first tin scraping assembly, an adjusting assembly and a second tin scraping assembly. The tin furnace is arranged on the rack, the wire leading-in assembly is arranged at one end of the rack and used for guiding a wire into the tin furnace to enter the first tin scraping assembly, and the first tin scraping assembly is arranged in the tin furnace; the adjusting assembly is arranged on the rack and located at one end of the tin furnace, the second tin scraping assembly is arranged on the adjusting assembly, the tin furnace is used for tinning the wire, the first tin scraping assembly is used for conducting primary tin scraping on the wire and guiding the wire towards the second tin scraping assembly, and the second tin scraping assembly conducts secondary tin scraping on the wire. According to the tin plating device, the tin plating process is optimized, the tin plating efficiency and the product quality are improved, and the tin plating device has high universality and application range.

The invention discloses a high-flame-retardant temperature-resistant corrosion-resistant optical fiber composite cable and a preparation method thereof, and belongs to the technical field of cable manufacturing, and the high-flame-retardant temperature-resistant corrosion-resistant optical fiber composite cable sequentially comprises an optical fiber unit, a conductor layer, an insulating layer, a shielding layer, a corrosion-resistant layer and a sheath layer from inside to outside. The optical fiber unit adopts a ceramic silicone rubber buffer layer; the conductor layer is a nickel-plated copper alloy stranded wire, and the oxidation resistance is enhanced through nano titanium dioxide sol treatment; the insulating layer is of a three-layer co-extrusion structure; the shielding layer adopts an aluminum-plastic composite belt and tinned copper wire braided composite structure; the anti-corrosion layer is a polytetrafluoroethylene film subjected to plasma treatment; the sheath layer is made of two-component ceramic silicone rubber, is flexible after being vulcanized at normal temperature, and is converted into a ceramic body at high temperature. According to the optical fiber composite cable, through the collaborative design of a multi-layer structure, the performance of excellent continuous use stability, high salt mist environment corrosion resistance and the like is achieved, the optical fiber composite cable is suitable for high-temperature, corrosion, fire and other severe environments, and the safety and durability of the composite cable are remarkably improved.

The invention discloses a manufacturing method of a single-layer circuit flexible circuit board for an intelligent visual module, and the method comprises the steps: taking a copper layer, pasting a first dry film and a protection film respectively, making a window on the first dry film corresponding to a hollowed-out circuit pattern, and electroplating a tin layer to form a tin plate; a single-face copper-clad plate is taken, a circuit pattern is manufactured in the area corresponding to a tin layer, a copper-clad plate copper pattern is formed, and a first pattern plate is formed; correspondingly laminating the tin-plated plate and the first pattern plate to form a laminated plate; removing the protective film in the laminated plate, manufacturing a circuit pattern, forming a copper layer windowing pattern and a hollow circuit pattern, and forming a second pattern plate; removing an area, corresponding to the copper pattern of the copper-clad plate, of the insulating dielectric layer in the second pattern plate, then performing tin stripping processing, and performing post-process processing to hollowed out the circuit pattern to form a hollowed-out circuit so as to form the flexible circuit board; and the tin layer provides protection for etching, creates a release condition for a copper pattern of the copper-clad plate, lays a foundation for uncovering the insulating layer, and finally realizes efficient and high-precision processing of the flexible circuit board.

The invention discloses a production process for preparing a three-dimensional circuit by using laser forming and chemical etching after metallization of a plastic surface, and relates to the technical field of three-dimensional circuit preparation. The method comprises the following steps: S1, carrying out ultrasonic cleaning and oil removal on a plastic base material; s2, performing sand blasting roughening or laser treatment; s3, chemical coarsening is carried out; s4, palladium activation; s5, chemically plating a copper bottom; s6, thickening the circuit by chemical copper plating or electro-coppering; s7, plating a tin or nickel protective layer on the surface of the copper layer; s8, surface metal in a non-circuit area is cut off through laser forming; s9, copper etching is carried out; and S10, surface layer metal is plated again, and passivation hole sealing protection is carried out. According to the method, the material selection range of a three-dimensional circuit is greatly expanded, the processing limitation of a traditional process on a complex circuit structure is broken through, the circuit design requirements in different fields can be met, the process effectively solves the problem of high risk of circuit overflow plating connection when a high-precision circuit is manufactured on the surface of a plastic base material in the past, and the product quality is improved. The precision and the product yield of the three-dimensional circuit are further improved, and the method has a wide application prospect.

The invention provides interval type tin plating equipment for a battery module busbar, which relates to the field of busbar processing, and comprises the following steps: dividing a target tin layer into a plurality of sub tin layers deposited in sequence, and dynamically selecting a deposition strategy in the deposition process to correct interlayer deposition deviation in real time; comprising the following steps: acquiring state data of a busbar substrate or currently deposited N sub-tin layers; determining a deposition mode used for depositing the (N + 1) th sub tin layer through a contour and temperature difference dual-threshold judgment mechanism based on state data collected by the sensor group; forming an (N + 1) th sub tin layer according to the determined deposition mode and a spraying compensation strategy generated based on the state data; according to deposition data collected in real time, the fusion degree and the thickness conformity of the local area of the (N + 1) th sub tin layer are evaluated; partial area supplementary spraying is carried out; if abnormity is detected, outputting equipment intervention measures; according to the invention, the thickness uniformity and interlayer fusion quality of the tin layer in the direct injection tin plating process of the battery module busbar are improved.

This application relates to the technical field of steel preparation, and particularly to a tinplate for milk powder cans and a preparation method thereof. The method includes: coiling a hot-rolled sheet with a set chemical composition under the condition of a first set temperature to obtain a hot-rolled coil; pickling the hot-rolled coil and then cold rolling it to obtain a cold-rolled coil; subjecting the cold-rolled coil to bell annealing under the condition of a second set temperature and then leveling it; tin plating the leveled cold-rolled coil to obtain a tinplate. The tinplate for milk powder cans prepared by this application has a stable surface quality, the finished product performance meets the requirements for can making, and the cost is lower compared with the tinplate for milk powder cans prepared by the existing continuous annealing process.

The invention discloses a double-core water-blocking weather-proof photovoltaic direct-current cable and a preparation method thereof, and the cable comprises two cable bodies, and is characterized in that each cable body is provided with a tinned conductor, water-blocking glue, an insulating layer, a water-blocking tape and a sheath layer from inside to outside in sequence; a connecting rib is fixedly arranged between the two sheath layers; the water-blocking tape is arranged outside the insulating layer in a double-layer wrapping mode, and the double-layer water-blocking tape is composed of a PET base material and acrylic acid glue. The insulating layer is arranged in a double-layer mode, the inner layer is XLPE added with 3% of nanometer aluminum hydroxide, the outer layer is XLPE added with 5% of nanometer carbon black, the space between the tinned conductor and the insulating layer is coated with hot-melt water-blocking glue for longitudinal water blocking, the space between the tinned conductor and the insulating layer is provided with a double-layer water-blocking tape for radial water blocking, the water-blocking performance of the cable is effectively improved, the inner layer of the insulating layer is XLPE added with 3% of nanometer aluminum hydroxide, and therefore the water-blocking performance of the cable is effectively improved. And the outer layer is made of anti-ultraviolet and water-resistance XLPE added with 5% of nano carbon black, so that the water resistance and the anti-ultraviolet performance of the cable are improved.

The invention provides a method for processing a circuit board containing a plug-in hole step groove, and belongs to the technical field of printed circuit board production, and the method comprises the steps: processing a first core board and a second core board; a glue blocking film is pasted at the position of the preset step groove in the first core plate; sequentially stacking the first core board, the prepreg and the second core board from bottom to top, and then pressing the first core board, the prepreg and the second core board; a plug-in hole is drilled downwards in the preset position of the first core plate; milling a step groove in alignment with the position of the step groove preset on the first core plate, exposing the glue blocking film, and stripping the glue blocking film; carrying out copper deposition, copper plating and tin plating on the circuit board processed in the step; removing the tin layer and the copper surface on the side wall of the step groove; removing the tin layer at the base material position on the first core plate at the bottom of the step groove to expose a copper surface; and removing the exposed copper surface, and then removing the rest tin layer. The processing method can prevent excessive copper reduction when the redundant copper surface in the step groove is removed from causing corrosion to the core plate pattern at the bottom of the step groove and the hole copper of the plug-in hole.