439 results about "Tin plating" patented technology

The invention provides a preparation method of a BC solar cell and the BC solar cell prepared by the preparation method, and relates to the technical field of solar cells. The preparation method comprises the following steps: forming a patterned groove in the surface of a back coating layer of a BC battery silicon substrate; and sequentially carrying out oxide layer removal treatment, activation treatment, chemical nickel plating, copper electroplating and chemical tin plating on the patterned groove of the BC cell silicon substrate to obtain the BC solar cell. According to the preparation method of the BC solar cell, the conversion efficiency of the BC cell can be effectively improved, the production cost is reduced, and the reliability, the adhesive force and the weldability of a plating layer are enhanced.

The invention discloses a copper wire tinning method for tinned copper stranded wire production, which relates to the technical field of metal surface treatment, and comprises the following steps: releasing a copper wire to an ionic liquid electrophoresis tank, applying an electric field to strip surface oxides, and then carrying out three-stage countercurrent rinsing to generate a clean copper wire; putting the clean copper wire into a composite plating tank, monitoring the tin liquid viscosity and the copper wire linear speed in real time, calculating the magnetic field gradient, and controlling tin crystal oriented growth according to the magnetic field gradient to generate an oriented crystallization tinned copper wire; the surface temperature of the directionally crystallized tinned copper wire is monitored in real time and compared with a preset temperature threshold value, a temperature permission trigger signal is generated, the annular array spray gun is triggered to work according to the temperature permission trigger signal, and a densified tinned copper wire is generated; and the densified tinned copper wire is scanned through a micro-focus CT scanner, a gap three-dimensional point cloud picture is generated, the gap size and the normal angle of the gap three-dimensional point cloud picture are analyzed, the optimal spraying parameters are recognized, and the passivation film tinned copper wire is generated.

The invention discloses an inductor paint removing and tin plating machine and a tin plating method thereof, and relates to the technical field of spectrum detection, the inductor paint removing and tin plating machine comprises a machine body as well as a feeding mechanism, a paint removing module, a tin plating module, a transferring mechanism and a material receiving mechanism which are arranged in the machine body, the feeding mechanism is used for supplying an inductance coil, the paint removing module is used for carrying out paint removing treatment on a pin of the inductance coil, and the tin plating module is used for carrying out tin plating treatment on the pin. The tin plating module is used for carrying out tin plating treatment on the inductance coil subjected to paint removal, the transferring mechanism is used for transferring the inductance coil subjected to pin paint removal at the paint removal module to the tin plating module and transferring the inductance coil treated by the tin plating module to the material receiving mechanism, and the material receiving mechanism is used for receiving the inductance coil subjected to tin plating treatment. And discharging is completed. By the adoption of the technical scheme, a wave soldering machine is not needed, the occupied area and the purchase cost of equipment are greatly reduced, meanwhile, the energy consumption and the maintenance cost of the equipment are remarkably reduced, and the good market popularization value is achieved.

The invention relates to the field of circuit board production and manufacturing, in particular to a method for manufacturing patterns with different copper thicknesses on the same layer of a circuit board. According to the method, a dry film covering protection pattern is replaced by a tin plating protection pattern, a tin layer does not have a gap at the connection position of a thick copper region and a thin copper region due to the height difference between the thick copper region and the thin copper region during tin plating, and tight combination with a thick copper region pattern part and a thin copper region pattern part is always kept; manufacturing of the thick copper area pattern part and the thin copper area pattern part is completed, and the production yield is improved.

The invention discloses an easy-to-bend copper bar cable which comprises a flat copper bar conductor with the section thickness of 2.95 mm to 3.05 mm, the section width of 15.90 mm to 16.10 mm and the sectional area of 48 mm < 2 >, and an insulating layer which is made of a nylon material and wraps the copper bar conductor, the average thickness of the insulating layer is 0.55 mm to 0.65 mm, the minimum local thickness of the insulating layer is larger than or equal to 0.48 mm, the height of the outer contour of the insulating layer is 4.2 mm, and the thickness of the outer contour of the insulating layer is 4.2 mm. The width of the insulating layer is 17.2 mm, and the surface roughness Ra of the insulating layer is less than or equal to 0.8 [mu] m. The electric connector has the characteristics of temperature resistance, aging resistance and chemical corrosion resistance, supports customized designs such as end stamping and tin plating, is convenient to mount, reduces the occupied space by 30%, and remarkably improves the reliability and durability of electrical connection and the system integration efficiency.

The invention discloses an electroplated part, an electroplated part manufacturing method and a connector. The electroplated part comprises a base material; a nickel plating layer formed on the surface of the base material; the tin-graphite composite plating layer is formed on the nickel plating layer; the nickel plating layer is formed on the base material, the tin-graphite composite plating layer is formed on the nickel plating layer, the tin plating layer is formed on the tin-graphite composite plating layer, the nickel plating layer serves as a bottom plating layer of the base material, the tin plating layer serves as an outer plating layer of the base material, and the tin-graphite composite plating layer serves as a middle plating layer of the base material. According to the invention, the graphite particles exposed from the tin-graphite composite coating are partially or completely wrapped by the outermost tin coating, so that the graphite particles are not easy to fall off, the wear resistance and corrosion resistance of the electroplated part are improved, and the service life of the electroplated part is prolonged. In addition, the plating layer structure also has a relatively low friction coefficient, so that the insertion and extraction force of the electroplated part in the use process can be greatly reduced.

The invention relates to the technical field of power cables, and discloses a high-flexibility high-temperature-resistant fireproof cable which comprises a conductor, an insulating layer, a shielding layer, an inner sheath layer, a fireproof layer and an outer sheath layer which are sequentially arranged from inside to outside, the conductor is formed by twisting multiple strands of fine copper wires, the surface of each fine copper wire is plated with a layer of tin, the insulating layer is made of a silicon rubber material, and the shielding layer is made of a silicon rubber material. A nanoscale magnesium hydroxide flame retardant and a high-temperature-resistant additive are added into the silicone rubber material; the shielding layer is a copper wire braided shielding layer; the inner sheath layer is made of a polyurethane material; the fireproof layer comprises a ceramic silicone rubber layer and a mica tape wrapping layer which are arranged in sequence; according to the scheme, the conductor is stranded by multiple strands of fine copper wires, and the diameter, the stranding pitch and the tension are optimized, so that the cable keeps excellent flexibility in frequent bending and moving environments, and the conductor is prevented from being broken. The tin coating improves the oxidation resistance and the welding performance, and ensures the long-term stability of electrical connection.

The invention relates to the technical field of thermoelectric material surface treatment, and provides a bismuth telluride-based thermoelectric material wafer surface treatment method which comprises the following steps: acquiring multi-dimensional data such as current density distribution, temperature field distribution, solution concentration gradient and plating thickness increment in real time through a sensor array; performing iterative calculation on the data based on a thermoelectric performance parameter optimization model to generate an optimal parameter combination of chemical oil removal, activation, nickel plating and tin and bismuth plating processes; dynamically adjusting the anode plate area ratio, the current density threshold value and the solution temperature fluctuation range of the electroplating equipment; a self-adaptive feedback mechanism is used for correcting parameter deviation, so that a uniform thermoelectric function layer structure is formed on the surface of the wafer. According to the method, the uniformity and the thermoelectric performance stability of the surface coating of the bismuth telluride thermoelectric wafer can be improved, the defect rate is reduced, and the production efficiency and the product consistency are improved.

A positioning tool for a deflection angle shaft is used for clamping and fixing workpieces of deflection angle shafts, and each workpiece comprises a straight shaft section and an inclined shaft section. The tool comprises a first positioning part and a second positioning part which are located on the two end faces of the deflection angle shaft piece respectively. The workpiece achieves positioning of the straight shaft section and the inclined shaft section through the straight shaft center hole and the inclined shaft center hole, the straight shaft center hole is located in the center axis of the straight shaft section, and the inclined shaft center hole is located in the center axis of the inclined shaft section. The inclined shaft center hole is located in the outward end face of the first positioning part and the outward end face of the second positioning part. The surface, making contact with the workpiece, of the tool is subjected to nickel plating or tin plating treatment. During machining, the tool is installed on a clamp of a rotary workbench of a fourth shaft of the vertical machining center. Compared with the prior art, the method has the following beneficial effects that the machining precision is high, the cost is low, and precise grinding can be achieved.

The invention provides tinning and gold-removing integrated equipment which comprises a rack, a rotating part, an adsorption part and a tinning and gold-removing mechanism, and the rotating part is used for driving a device to rotate; the adsorption part is used for adsorbing the device and can drive the device to approach the rotating part until the device abuts against the rotating part; the tinning and gold removing mechanism comprises a heating piece, a tin sucking piece and a tin material supplying piece; the tin material feeding piece is used for conveying a tin wire to the position between the heating piece and the device, the heating piece is used for heating the tin wire to melt the tin wire and cover the periphery of the device, and the tin sucking piece is used for sucking redundant soldering tin on the periphery of the device. According to the tin coating and gold removing integrated equipment, reliable clamping of a small-size device is achieved through cooperation of the adsorption part and the rotating part, uniform tin coating and gold removing are achieved through cooperation of the tin coating and gold removing mechanism on the basis that the rotating part drives the device to rotate, the problem that traditional manual operation is large in difficulty is solved, the quality stability is guaranteed, and the production efficiency is improved. And the treatment efficiency is obviously improved.

The invention belongs to the technical field of coating binding force detection, and particularly relates to a tinned copper wire coating binding force detection method which comprises the steps that tinned copper wire coating binding force detection equipment controls a tinned copper wire to penetrate through a constant-temperature heating area at a first speed, and special treatment is conducted on the copper wire before the surface of the copper wire is tinned, the same envelopes are arranged at fixed intervals; after the envelopes penetrate through the constant-temperature heating area, measuring the air bag area after each envelope is bulged; and obtaining the coating binding force of the tinned copper wire at the corresponding position of each coating film according to the air bag area after each coating film is bulged. The method can solve the problem that the detection process is tedious when the tinned copper wire is detected in the prior art.

One embodiment of the present invention provides a tin electroplating solution and a method for forming tin solder bumps using same. The tin electroplating solution according to an embodiment of the present invention includes a novel nucleation accelerator and a particle growth inhibitor, enabling the formation of uniform tin solder bumps with few voids, and thus has excellent performance.

The invention mainly relates to the technical field of metal surface treatment, in particular to a tinned copper wire surface treatment process which comprises the following steps: pickling and activating: pickling and activating a copper wire by adopting a phosphoric acid-sulfuric acid mixed solution to obtain a copper wire preform; immersing the copper wire preform into a silane coupling agent solution to obtain a copper wire intermediate; the copper wire intermediate is heated and then put into a mixed solution containing rare earth La particles, dip plating is conducted, and the tinned copper wire is obtained; the tinned copper wire passes through a heat preservation area, and the tinned copper wire is led out to enter a sealed ultrasonic vibration uniform flow area; performing multi-stage hot air shaping, and enabling the tinned copper wire to sequentially pass through three groups of annular air knives; cooling the tinned copper wire in an air cooling channel; and immersing the tinned copper wire into the composite passivation solution, taking out the tinned copper wire, putting the tinned copper wire into a centrifugal device, and finally baking the tinned copper wire in an oven. The application breaks through the limitation of the traditional tinned copper wire in binding force, dimensional accuracy and environment resistance, and can meet the requirements of the fields of electronic power, communication transmission and the like on high-reliability materials.

The invention relates to the field of electroplating of threaded couplings, in particular to an electroplating nickel-tungsten alloy process for a threaded coupling. The nickel-tungsten alloy electroplating technology for the threaded coupling comprises the following steps that S1, activating treatment is conducted; s2, nickel pre-plating treatment; s3, copper plating treatment; s4, nickel-tungsten alloy plating treatment; s5, tinned copper treatment; and S6, passivating treatment is conducted. According to the composite electroplating technology for the threaded coupling, the abrasion resistance and corrosion resistance of the threaded part are improved through multi-stage coating superposition. Bottom-layer metal nickel is formed through nickel pre-plating treatment, and the binding force of a base body and a plating layer is enhanced; the copper plating layer can improve the ductility of the plating layer and reduce internal stress; the nickel-tungsten alloy layer improves the hardness and high-temperature stability of the plating layer; the tinned copper layer further prevents extrusion deformation of the threads, reduces the friction coefficient and prevents thread gluing; a compact oxidation film is formed through passivating treatment, and the color change phenomenon on the surface is prevented. And the service life of the coupling under the working conditions of high pressure and high friction is obviously prolonged.

The invention discloses a high-flame-retardant temperature-resistant corrosion-resistant optical fiber composite cable and a preparation method thereof, and belongs to the technical field of cable manufacturing, and the high-flame-retardant temperature-resistant corrosion-resistant optical fiber composite cable sequentially comprises an optical fiber unit, a conductor layer, an insulating layer, a shielding layer, a corrosion-resistant layer and a sheath layer from inside to outside. The optical fiber unit adopts a ceramic silicone rubber buffer layer; the conductor layer is a nickel-plated copper alloy stranded wire, and the oxidation resistance is enhanced through nano titanium dioxide sol treatment; the insulating layer is of a three-layer co-extrusion structure; the shielding layer adopts an aluminum-plastic composite belt and tinned copper wire braided composite structure; the anti-corrosion layer is a polytetrafluoroethylene film subjected to plasma treatment; the sheath layer is made of two-component ceramic silicone rubber, is flexible after being vulcanized at normal temperature, and is converted into a ceramic body at high temperature. According to the optical fiber composite cable, through the collaborative design of a multi-layer structure, the performance of excellent continuous use stability, high salt mist environment corrosion resistance and the like is achieved, the optical fiber composite cable is suitable for high-temperature, corrosion, fire and other severe environments, and the safety and durability of the composite cable are remarkably improved.

The invention discloses a manufacturing method of a single-layer circuit flexible circuit board for an intelligent visual module, and the method comprises the steps: taking a copper layer, pasting a first dry film and a protection film respectively, making a window on the first dry film corresponding to a hollowed-out circuit pattern, and electroplating a tin layer to form a tin plate; a single-face copper-clad plate is taken, a circuit pattern is manufactured in the area corresponding to a tin layer, a copper-clad plate copper pattern is formed, and a first pattern plate is formed; correspondingly laminating the tin-plated plate and the first pattern plate to form a laminated plate; removing the protective film in the laminated plate, manufacturing a circuit pattern, forming a copper layer windowing pattern and a hollow circuit pattern, and forming a second pattern plate; removing an area, corresponding to the copper pattern of the copper-clad plate, of the insulating dielectric layer in the second pattern plate, then performing tin stripping processing, and performing post-process processing to hollowed out the circuit pattern to form a hollowed-out circuit so as to form the flexible circuit board; and the tin layer provides protection for etching, creates a release condition for a copper pattern of the copper-clad plate, lays a foundation for uncovering the insulating layer, and finally realizes efficient and high-precision processing of the flexible circuit board.

The invention discloses a production process for preparing a three-dimensional circuit by using laser forming and chemical etching after metallization of a plastic surface, and relates to the technical field of three-dimensional circuit preparation. The method comprises the following steps: S1, carrying out ultrasonic cleaning and oil removal on a plastic base material; s2, performing sand blasting roughening or laser treatment; s3, chemical coarsening is carried out; s4, palladium activation; s5, chemically plating a copper bottom; s6, thickening the circuit by chemical copper plating or electro-coppering; s7, plating a tin or nickel protective layer on the surface of the copper layer; s8, surface metal in a non-circuit area is cut off through laser forming; s9, copper etching is carried out; and S10, surface layer metal is plated again, and passivation hole sealing protection is carried out. According to the method, the material selection range of a three-dimensional circuit is greatly expanded, the processing limitation of a traditional process on a complex circuit structure is broken through, the circuit design requirements in different fields can be met, the process effectively solves the problem of high risk of circuit overflow plating connection when a high-precision circuit is manufactured on the surface of a plastic base material in the past, and the product quality is improved. The precision and the product yield of the three-dimensional circuit are further improved, and the method has a wide application prospect.

The invention provides interval type tin plating equipment for a battery module busbar, which relates to the field of busbar processing, and comprises the following steps: dividing a target tin layer into a plurality of sub tin layers deposited in sequence, and dynamically selecting a deposition strategy in the deposition process to correct interlayer deposition deviation in real time; comprising the following steps: acquiring state data of a busbar substrate or currently deposited N sub-tin layers; determining a deposition mode used for depositing the (N + 1) th sub tin layer through a contour and temperature difference dual-threshold judgment mechanism based on state data collected by the sensor group; forming an (N + 1) th sub tin layer according to the determined deposition mode and a spraying compensation strategy generated based on the state data; according to deposition data collected in real time, the fusion degree and the thickness conformity of the local area of the (N + 1) th sub tin layer are evaluated; partial area supplementary spraying is carried out; if abnormity is detected, outputting equipment intervention measures; according to the invention, the thickness uniformity and interlayer fusion quality of the tin layer in the direct injection tin plating process of the battery module busbar are improved.

The invention discloses a double-core water-blocking weather-proof photovoltaic direct-current cable and a preparation method thereof, and the cable comprises two cable bodies, and is characterized in that each cable body is provided with a tinned conductor, water-blocking glue, an insulating layer, a water-blocking tape and a sheath layer from inside to outside in sequence; a connecting rib is fixedly arranged between the two sheath layers; the water-blocking tape is arranged outside the insulating layer in a double-layer wrapping mode, and the double-layer water-blocking tape is composed of a PET base material and acrylic acid glue. The insulating layer is arranged in a double-layer mode, the inner layer is XLPE added with 3% of nanometer aluminum hydroxide, the outer layer is XLPE added with 5% of nanometer carbon black, the space between the tinned conductor and the insulating layer is coated with hot-melt water-blocking glue for longitudinal water blocking, the space between the tinned conductor and the insulating layer is provided with a double-layer water-blocking tape for radial water blocking, the water-blocking performance of the cable is effectively improved, the inner layer of the insulating layer is XLPE added with 3% of nanometer aluminum hydroxide, and therefore the water-blocking performance of the cable is effectively improved. And the outer layer is made of anti-ultraviolet and water-resistance XLPE added with 5% of nano carbon black, so that the water resistance and the anti-ultraviolet performance of the cable are improved.

The utility model relates to semiconductor metal tin plating equipment, and belongs to the technical field of tin plating equipment, the semiconductor metal tin plating equipment comprises a box body, a material disc, a conveying mechanism, a cleaning tank, a first ultrasonic mechanism, a tin plating tank and a second ultrasonic mechanism, the semiconductor metal at the first tensioning wheel mechanism is located in the cleaning tank, the first ultrasonic mechanism provides ultrasonic waves for the cleaning tank, the semiconductor metal at the second tensioning wheel mechanism is located in the tin plating tank, and the second ultrasonic mechanism provides ultrasonic waves for the tin plating tank. According to the semiconductor metal tin plating equipment, pollutants on semiconductor metal can be effectively removed through ultrasonic waves, an oxide layer on the surface of the semiconductor metal is removed, and the tin plating uniformity is improved.

The invention discloses an electroplating method of a low-porosity nanoscale bright tin layer, which comprises the following steps: placing a clean metal substrate in an activating solution containing a surface modifier, and applying high pulse current for short-time impact to form a transition layer to obtain a target substrate; a target base material is placed in the nano-composite tin plating solution, electroplating is carried out under the cooperation of a continuous ultrasonic field and target waveform pulse current, and a low-porosity nano-scale bright tin layer is formed; the nanometer composite tin plating solution comprises stannous methanesulfonate, methanesulfonic acid, nanometer silicon carbide, nanometer silicon dioxide, a grain refiner, a dispersing agent, cinnamyl aldehyde, a vinyl pyrrolidone copolymer, ascorbic acid, a wetting agent and the balance deionized water. The binding force of a plating layer without a base coat is improved, the plating layer is strengthened, compact and bright, and the process is environmentally friendly.

This utility model relates to an industrial electronic wire in the field of electronic wires, comprising a split stepped conductor, an insulating layer, and a composite shielding layer. The insulating layer is disposed on the outside of the split stepped conductor, and the composite shielding layer is disposed on the outside of the split stepped conductor. The split stepped conductor comprises a corrugated conductor, a first copper core, and a second copper core, with the first and second copper cores spirally wound in opposite directions on the surface of the corrugated conductor. The insulating layer comprises a layer of nano-ceramic modified polyolefin, an aramid fiber reinforced epoxy resin layer, and a fluororubber layer, all layered and laminated. The aramid fiber reinforced epoxy resin layer has embedded protrusions. The composite shielding layer comprises a tin-plated copper wire braided mesh, an aluminum foil strip, and a hot-melt conductive adhesive, with the tin-plated copper wire braided mesh and the aluminum foil strip spirally wound alternately. This utility model enhances mechanical strength through the split stepped conductor structure, and improves interface bonding and electromagnetic shielding durability through multi-layer composite and anchoring design.

The invention relates to the technical field of wire rod processing, in particular to a wire rod tin plating device and method.The wire rod tin plating device comprises a wire inlet assembly, an air inflation assembly, a wire guide pipeline, a tin plating assembly, a tin immersion assembly and a wire cooling assembly, the wire inlet assembly comprises a rack and an atmosphere protection box, the atmosphere protection box is obliquely arranged above the rack, and the air inflation assembly is arranged in the rack; the inflation valve is used for inflating the wire pipeline; the tin plating assembly is provided with a tin furnace, one end of the wire pipeline is connected with the atmosphere protection box, the other end of the wire pipeline extends into the tin furnace, the tin immersion assembly is provided with a tin immersion wire support, and one end of the tin immersion wire support is immersed into the tin furnace, is opposite to the outlet end of the wire pipeline and is used for guiding wires towards the cooling wire assembly. The cooling wire assembly is used for leading out the wire. The electrical performance of a finished product and the adaptability of a subsequent processing process are improved; tin consumption and pollution emission are reduced through overall sealing and gas control, the productivity and the product percent of pass are improved, and the device is suitable for high-speed continuous production.

This invention discloses an environmentally friendly, green, halogen-free flame-retardant cable and its preparation method, relating to the field of cable technology. The cable includes a tin-plated copper conductor at its center. An inner shielding layer, an insulation layer, and an outer shielding layer are extruded onto the conductor using a three-layer co-extrusion process to form an insulated core. The insulated core is then wrapped with an oxygen-free soft copper strip as a metallic shielding layer, followed by a semi-conductive water-resistant tape pad, then longitudinally wrapped with an aluminum-plastic composite tape and extruded with polyethylene. A waterproof layer is wrapped with a double-layer high-strength corrosion-resistant alloy tape as an armor layer. The outermost layer of the cable is extruded with a flame-retardant outer sheath. This sheath uses polyethylene as a base material, adding maleic anhydride-modified oleic acid and peroxide, and incorporating zinc oxide and magnesium oxide to form an ion network structure, while also incorporating flame-retardant fillers. This invention exhibits good tensile strength, electrical insulation performance, compressive and tensile strength, and bending performance, while also possessing excellent elongation at break, low-temperature crack resistance, and halogen-free flame-retardant characteristics.

The utility model relates to the technical field of cable processing equipment, in particular to an automatic wire twisting, stripping and tin dipping machine. Comprising a base, a lead wire head twisting machine body and an auxiliary mechanism, a lead screw sliding table is arranged on the base, the auxiliary mechanism comprises a vertical guide rail, a vertical sliding base, a positioning base, a first electric telescopic rod, a limiting device, a peeling device and a tin plating device, the limiting device acts during machining, a cable is vertically placed in a positioning base guide sleeve, the bottom of the cable is limited through the limiting device, and the peeling device and the tin plating device are arranged on the base. The clamping assembly acts to clamp the cable, then the lead screw sliding table acts to move the positioning seat to the top of the stripping device, the first electric telescopic rod acts to push the cable to move downwards for stripping, and after stripping, the lead screw sliding table and the first electric telescopic rod cooperate to move the cable to the wire head twisting machine body to be twisted tightly. And finally, the cable is moved to the tinning device for tinning, so that the problems that the operation is tedious, the production efficiency is low and the labor intensity is high due to the fact that traditional cable stripping, twisting and tightening and tinning are mostly manually operated can be solved.

The invention relates to a long rod grinding machine and an anti-static system and a grounding method thereof, and belongs to the technical field of electric tools. The anti-static system provided by the invention comprises the three-core power line and the anti-oxidation electric connection structure arranged on the aluminum long rod, and the anti-oxidation electric connection structure is in compression joint with the grounding wire by adopting the metal wiring buckle with the tinned surface and is connected with the threaded hole in the aluminum rod through the stainless steel screw assembly; copper-aluminum contact is blocked by the tin-plated layer, and the stainless steel material reduces the potential difference, so that electrochemical corrosion is inhibited, and long-term reliability of grounding is ensured. Meanwhile, the system provides safe operation guidance in a matched mode, guides a user to confirm socket grounding and regularly check the connection state before use, and executes an emergency electrostatic discharge program when grounding fails, for example, a temporary discharge path is established through contact between a metal grounding plate and the wet ground. According to the invention, a grounding scheme with simple structure, corrosion resistance and reliable connection is realized, and a complete safety system from hardware protection to a use method is formed.

The present invention relates to a multifunctional cooling structure for rapidly cooling the tin layer of copper wire, and belongs to the technical field of tin-plated copper wire processing equipment. The multifunctional cooling structure for rapidly cooling the tin layer of copper wire comprises: a liquid storage shell, the interior of the liquid storage shell is filled with coolant, the top of the liquid storage shell is fixedly connected with two symmetrically distributed side plates, and the inner side of the liquid storage shell is embedded with two groups of evenly distributed semiconductor refrigeration plates; multiple cooling is achieved through a cooling module, and an air cooling component is used to achieve initial cooling of the tin layer of the copper wire, avoiding the problem of large-scale loss of coolant caused by large temperature differences due to large amounts of water vapor generated by directly spraying coolant on the surface of the tin layer; the air cooling component is used to reduce the temperature difference after initial cooling, and then the water cooling component is used to perform secondary cooling, which effectively improves the cooling effect, achieves the purpose of step cooling, and avoids the temperature difference caused by spraying affecting the forming effect of the tin layer.

This utility model discloses a highly flexible, electromagnetic interference-resistant cable for robots, comprising a double-layer conductor bundle with a Kevlar fiber rope at its center. The space between the inner and outer conductor bundles, and between the inner and outer conductor bundles and the Kevlar fiber rope, is filled with thermoplastic elastomer and foamed silicone. The conductor bundles are spirally twisted in opposite directions at different pitches. The cable is surrounded by braided aramid fibers, an insulation layer, an inner shielding layer, an outer shielding layer, and a sheath layer. The sheath has semi-circular ribs and embedded elastic polyurethane strips. The thermoplastic elastomer is a polyurethane-based material, the foamed silicone is phenyl silicone rubber, the insulation layer is nano-silica modified methyl vinyl silicone rubber, the inner shielding layer is copper foil wrapped with a polytetrafluoroethylene self-lubricating coating, the outer shielding layer is tin-plated copper wire braid, and the sheath layer is a blend of polyurethane and silicone rubber coated with a nano-ceramic coating. This cable exhibits a long dynamic bending life under extreme environments, improves high-frequency shielding effectiveness, and is suitable for high-frequency movements of industrial robots and complex electromagnetic environments.

The invention belongs to the technical field of chemical tin plating, and particularly relates to a micro-nano powder surface tin plating method which comprises the following steps: pretreating powder, adding main salt, a reducing agent, a coordination agent and an antioxidant into water, and stirring until the main salt, the reducing agent, the coordination agent and the antioxidant are completely dissolved; and the pretreated powder is added into the cylinder opening liquid to be subjected to a reaction, when the surface of the solution is subjected to the reaction, the supplementing liquid is added, stirring continues to be conducted till the reaction is completed, and the micro-nano powder with the tin-plated surface is obtained. According to the method for plating tin on the surface of the micro-nano powder, tin is plated on the surface of the micro-nano split body, so that the surface energy of the material can be effectively reduced, the material can be more easily infiltrated and combined with welding flux in the welding process, the welding performance of the material is remarkably improved, and the material is high in oxidation resistance, high in conductivity, high in dispersity and high in corrosion resistance. The whole process is simple, stable and suitable for large-scale production and application.

The utility model discloses a copper wire tinning device which comprises a device main body, a tinning bath, a cleaning roller, a drying box and a U-shaped pipe, the tinning bath is arranged on one side of the bottom of the device main body, a filter is installed in the device main body above the tinning bath, and a hollow filter element is arranged in the filter. A liquid collecting tank is arranged on the other side of the bottom of the device body, the cleaning rollers are all arranged above the liquid collecting tank, the outer walls of the cleaning rollers are sleeved with sponge sleeves, motors are installed on the inner walls, at the cleaning rollers, of the device body, and the U-shaped pipes are arranged on the outer sides of the cleaning rollers. The two inner walls of the U-shaped pipe are provided with nozzles at equal intervals, and the drying box is installed at the top of the device body. According to the tin plating device, copper wire cleaning and self-cleaning are simultaneously carried out through the sponge sleeve, the cleaning effect is guaranteed, sediment impurities in a plating solution can be removed, and the tin plating quality of the copper wire is guaranteed.