773 results about "Tin plating" patented technology

The invention discloses a manufacturing process of a flexible circuit board with any length, and relates to the technical field of flexible circuit boards. Comprising the steps that punching operation is conducted on a roll material base material to obtain reference holes, and the reference holes comprise a punching positioning hole and a reference exposure punching positioning hole; symmetrically punching first exposure punching positioning holes backwards based on the reference exposure punching positioning hole and a set distance; symmetrically punching an Nth exposure punching positioning hole backwards based on an (N-1) th exposure punching positioning hole and a set distance; carrying out dry film pressing-film exposure operation on the punched coiled material base material; developing the exposed coiled material base material, and removing the dry film of the exposed part through film stripping operation to form a required circuit; and after the etched circuit is subjected to chemical tinning surface treatment, positioning by using a punching positioning hole, and sequentially punching by using a die to obtain the ultra-long flexible printed circuit (FPC) with the required width. According to the process, the flexible circuit board with any length can be manufactured according to specific requirements of customers, and the production convenience and efficiency are improved.

The utility model belongs to the technical field of copper wire production, and particularly relates to an oiling device of an alloy wire annealing tinning machine, which comprises an oil tank, wire guiding mechanisms are fixedly arranged on the left side wall and the right side wall of the oil tank, a copper wire is arranged between the two wire guiding mechanisms, and a cover plate is transversely arranged at the upper end of the oil tank. The transmission mechanism drives the oil absorption sponge to rotate, so that the interior of the oil absorption sponge can be fully absorbed with lubricating oil all the time, and in the copper wire transmission process, all positions of the oil absorption sponge can make contact with the copper wire through rotation of the oil absorption sponge, so that the lubricating oil is fully absorbed in the copper wire transmission process. And the copper wire can be pressed through the two pressing wheels, so that the copper wire is completely pressed into the oil absorption sponge, the copper wire can be completely wrapped through deformation of the oil absorption sponge, the uniformity degree of grease smearing on the outer layer of the copper wire is the same, and later processing is facilitated.

The invention discloses an automatic tin plating device for circuit board chip welding, and relates to the technical field of chip welding, the automatic tin plating device comprises a tin liquid pool, a chip feeding workbench, a four-way conveying mechanism and a thermal resistance mechanism, a chip stacking cylinder is vertically installed on the chip feeding workbench, the thermal resistance mechanism comprises a rack, a lifting seat, a finger air cylinder and a cold sheet, and the lifting seat is connected with the finger air cylinder. The lifting seat is installed on the rack, a finger air cylinder is installed at one end of the lifting seat, two clamping jaws of the finger air cylinder are each provided with a cold piece, cold air is introduced into the cold pieces, the four-way conveying mechanism comprises a portal frame, a three-way conveying mechanism and an overturning plate, and the three-way conveying mechanism is installed on the portal frame; the three-direction conveying mechanism has moving freedom degrees in the X direction, the Y direction and the Z direction in a space coordinate system, the overturning plate is rotationally installed on the three-direction conveying mechanism, a rotating disc is rotationally installed at the bottom of the overturning plate, and a negative pressure suction cup is arranged on the rotating disc. And the cold sheet can isolate high temperature from being transmitted to the chip, so that the chip can be well protected from being influenced in the tin plating process.

The invention discloses automatic tin plating equipment for chip pins, and relates to the field of semiconductors, the automatic tin plating equipment comprises a base, the top surface of the base is sequentially provided with a soldering flux placing groove, a cleaning groove and a tin plating groove from front to back; an electric cabinet; a Y-axis linear motion module and a Z-axis linear motion module are arranged at the tops of the supports; a clamping jaw; a guide plate; an air knife is detachably assembled at the bottom of the Z-axis linear motion module, the two ends of the top of the air knife are each connected with an elastic telescopic hose, and the other end of each elastic telescopic hose communicates with the electric cabinet. According to the tin plating device, heat dissipation airflow generated by a heat dissipation fan of the electric control box is collected and discharged through an elastic telescopic hose and an air knife, then tin liquid and tin slag left on tinned chips and the upper surfaces of the clamping jaws are blown off, and meanwhile, a flow guide plate is used for carrying the tin liquid and the tin slag; and unnecessary pollution caused by dripping on the tinning equipment is avoided, and redundant residual tin water and tin slag are blown off, so that the cleaning effect of the cleaning tank is facilitated.

The invention relates to a preparation method of a photovoltaic welding strip, the photovoltaic welding strip, a photovoltaic module and a preparation method, and the preparation method comprises the following steps: S1, carrying out the oxide removal and annealing treatment of an oxygen-free copper wire at the same time, and obtaining an annealed copper strip after cooling; s2, in the protection environment of inert gas, the annealed copper strip is immersed in molten brazing filler metal alloy liquid for surface tin plating, and after cooling, a plated copper strip with an alloy plating layer is obtained; s3, oxide on the surface of the plated copper strip is removed; s4, immersing the plated copper strip subjected to oxide removal into a film forming substance, and drying to obtain a film forming welding strip; wherein the film forming substance does not contain carboxyl. According to the method, oxide removal and annealing treatment are carried out at the same time, the photovoltaic welding strip which is high in preparation efficiency and can be welded without participation of scaling powder can be achieved, the photovoltaic welding strip is combined with the preparation technology of a photovoltaic module, and a high-reliability module can be obtained.

The invention discloses sewage treatment equipment and process for tinning of an LED pin frame, and relates to the technical field of sewage treatment. In the dosing flocculation process, flocculated sewage is generally and directly guided into filtering equipment, a solid-liquid mixture is not pre-separated, the workload of the filtering equipment is heavy, and the sewage treatment efficiency is influenced, and through cooperation of a conical cover and a through groove disc, in the process of stirring the sewage by utilizing a stirring mechanism and mixing a medicament with the sewage, the sewage is stirred by utilizing the stirring mechanism, so that the sewage treatment efficiency is greatly improved. By means of rotation of the sewage under stirring, floccules in the sewage are concentrated on the outer side and cannot penetrate through the through grooves of the through groove disc, primary solid-liquid separation is conducted on the sewage while flocculation is conducted, the amount of sewage entering the filtering equipment is reduced, the content of the floccules in the sewage guided out by the water outlet pipe is increased, and the situation that the floccules cannot penetrate through the through grooves of the through groove disc after dosing flocculation is avoided. A large amount of sewage and floccules enter filtering equipment at the same time, so that the workload of the filtering equipment is large, and the sewage treatment efficiency is influenced.

The invention relates to the technical field of metal alloy preparation, in particular to a method for preparing a copper-tin alloy through injection molding. The method comprises the following steps of S1, chemical coating, S2, feed preparation, S3, banburying granulation, S4, injection molding and S5, thermal degreasing and sintering. According to the tin-plated copper powder prepared through chemical plating and calcination, the surface of the copper powder can be evenly coated with a tin layer, pores and defects in the sintering process can be reduced through the even plating layer, and therefore the density of a sintered body is improved, the uniformity and compactness of the tin-plated layer can be further improved through calcination treatment after chemical tin plating, and the service life of the tin-plated copper powder is prolonged. In addition, as the melting point of Sn is low, densification sintering can be carried out by adopting a liquid phase sintering method.

The utility model discloses matte electroplating tin thin copper foil production equipment which comprises a tin plating bracket and a plurality of tin plating devices arranged at the rear end of the tin plating bracket, the tin plating device comprises an upper tin plating mechanism, a lower tin plating mechanism, an electroplating liquid temporary storage tank and an electroplating liquid circulating mechanism; the upper electrotinning mechanism, the lower electrotinning mechanism and the electroplating liquid temporary storage tank are sequentially distributed from top to bottom; electroplating liquid in the upper electrotinning mechanism and the lower electrotinning mechanism flows into the electroplating liquid temporary storage tank from top to bottom; and the electroplating liquid circulating mechanism filters the electroplating liquid in the electroplating liquid temporary storage tank and then re-injects the electroplating liquid into the upper electrotinning mechanism and the lower electrotinning mechanism. The whole electroplating device is shortened by half, so that the moving distance of electroplating liquid is shortened, and driving parts such as a pump body are reduced.

The invention relates to a copper strip tin plating process. The copper strip tin plating process comprises the following steps: preparing a copper strip substrate; plating a nickel barrier layer on the copper strip substrate; plating a first tin layer on the nickel barrier layer; plating a nickel intermediate layer on the first tin layer; and plating a second tin layer on the nickel intermediate layer. In the tinned copper strip prepared through the copper strip tinning process, the thickness of the nickel barrier layer ranges from 1.5 micrometers to 5 micrometers, the thickness of the nickel middle layer ranges from 1 micrometer to 3 micrometers, the thickness of the nickel middle layer is smaller than or equal to the thickness of the nickel barrier layer, and the thickness of the second tin layer ranges from 1 micrometer to 3 micrometers. According to the process, the problem of dendritic crystal spreading on the surface of the copper strip can be effectively solved, and the adhesive strength of a tin layer on the surface is effectively improved.

The invention discloses a hot-dip tinning copper plate strip capable of reducing the surface friction coefficient of a copper strip and a manufacturing method of the hot-dip tinning copper plate strip, relates to the field of hot-dip tinning of copper plate strips, and aims to solve the problem that a product cannot have high hardness and good weldability and corrosion resistance at the same time in the prior art. The method comprises the following steps: plating a pure tin layer on the surface of a copper plate strip in a hot dipping manner, cooling to room temperature, annealing, and preserving heat, so that a Cu6Sn5 layer grows between the copper plate strip and the pure tin layer until the Cu6Sn5 layer grows to occupy more than half of the overall thickness of the plating layer, thereby improving the hardness of the tin plating layer of the copper plate strip. Therefore, the hot-dip tin-plated copper plate strip has high hardness and good weldability and corrosion resistance, and the pure tin layer on the outermost layer can enable the copper plate strip to have low friction coefficient and low insertion and extraction rate and can be used for multi-piece insertion.

The invention discloses a high-strength and high-elongation SnPbSbInAu alloy solder and a preparation method thereof. The alloy solder comprises the following components in percentage by weight: 33.0 to 36.5 percent of Pb, 2.0 to 4.0 percent of Sb, 1.5 to 3.5 percent of In, 2.0 to 3.5 percent of Au, 0.005 to 0.012 percent of P and the balance of Sn. The preparation method of the foil strip comprises the steps of vacuum pressure casting, strip cold extrusion and cold roller rolling, the wire preparation method comprises the steps of one-time extrusion forming and close-packed rewinding, and the powder paste preparation method comprises the steps of vacuum gas atomization powder preparation, airflow screening and planetary centrifugal degassing paste preparation. The solid-liquid phase temperature of the solder ranges from 180 DEG C to 185 DEG C, the solder has the advantages of being high in ductility, strength and creep resistance, excellent in low-temperature service performance and the like, and the tensile strength of a brazed joint of the solder is two times higher than that of a Sn-37Pb eutectic solder under the same welding process; and the gold etching risk is low, and a gold-plated piece can be directly welded (without tinning treatment).

The invention provides a preparation method of a BC solar cell and the BC solar cell prepared by the preparation method, and relates to the technical field of solar cells. The preparation method comprises the following steps: forming a patterned groove in the surface of a back coating layer of a BC battery silicon substrate; and sequentially carrying out oxide layer removal treatment, activation treatment, chemical nickel plating, copper electroplating and chemical tin plating on the patterned groove of the BC cell silicon substrate to obtain the BC solar cell. According to the preparation method of the BC solar cell, the conversion efficiency of the BC cell can be effectively improved, the production cost is reduced, and the reliability, the adhesive force and the weldability of a plating layer are enhanced.

The invention discloses a copper wire tinning method for tinned copper stranded wire production, which relates to the technical field of metal surface treatment, and comprises the following steps: releasing a copper wire to an ionic liquid electrophoresis tank, applying an electric field to strip surface oxides, and then carrying out three-stage countercurrent rinsing to generate a clean copper wire; putting the clean copper wire into a composite plating tank, monitoring the tin liquid viscosity and the copper wire linear speed in real time, calculating the magnetic field gradient, and controlling tin crystal oriented growth according to the magnetic field gradient to generate an oriented crystallization tinned copper wire; the surface temperature of the directionally crystallized tinned copper wire is monitored in real time and compared with a preset temperature threshold value, a temperature permission trigger signal is generated, the annular array spray gun is triggered to work according to the temperature permission trigger signal, and a densified tinned copper wire is generated; and the densified tinned copper wire is scanned through a micro-focus CT scanner, a gap three-dimensional point cloud picture is generated, the gap size and the normal angle of the gap three-dimensional point cloud picture are analyzed, the optimal spraying parameters are recognized, and the passivation film tinned copper wire is generated.

The invention discloses an inductor paint removing and tin plating machine and a tin plating method thereof, and relates to the technical field of spectrum detection, the inductor paint removing and tin plating machine comprises a machine body as well as a feeding mechanism, a paint removing module, a tin plating module, a transferring mechanism and a material receiving mechanism which are arranged in the machine body, the feeding mechanism is used for supplying an inductance coil, the paint removing module is used for carrying out paint removing treatment on a pin of the inductance coil, and the tin plating module is used for carrying out tin plating treatment on the pin. The tin plating module is used for carrying out tin plating treatment on the inductance coil subjected to paint removal, the transferring mechanism is used for transferring the inductance coil subjected to pin paint removal at the paint removal module to the tin plating module and transferring the inductance coil treated by the tin plating module to the material receiving mechanism, and the material receiving mechanism is used for receiving the inductance coil subjected to tin plating treatment. And discharging is completed. By the adoption of the technical scheme, a wave soldering machine is not needed, the occupied area and the purchase cost of equipment are greatly reduced, meanwhile, the energy consumption and the maintenance cost of the equipment are remarkably reduced, and the good market popularization value is achieved.

The utility model discloses copper bar acid tinning equipment for electrical parts, which relates to the technical field of copper bar acid tinning equipment, and comprises an acid pickling box, a circular ring is arranged in the acid pickling box in a lifting manner, a hanging assembly for fixing a copper bar is arranged at the bottom of the circular ring, and the hanging assembly comprises a hanging rope and a grabbing clamp. The hanging rope is fixedly connected to the bottom of the circular ring, the grabbing clamp is fixedly connected to the bottom end of the hanging rope, a liquid spraying assembly used for cleaning the copper bar is arranged on the upper half section of the pickling box, and the liquid spraying assembly comprises a third liquid pipe and a spraying cover. According to the copper bar acid tinning equipment for the electrical parts, by arranging the pickling box, the hanging assembly, the liquid spraying assembly and other structures, soaking and shaking pickling is conducted on the lower half section of the pickling box, flushing is conducted on the upper half section of the pickling box, residual impurities on the surface of a copper bar are removed, and the machining efficiency is improved.

The invention relates to the field of circuit board production and manufacturing, in particular to a method for manufacturing patterns with different copper thicknesses on the same layer of a circuit board. According to the method, a dry film covering protection pattern is replaced by a tin plating protection pattern, a tin layer does not have a gap at the connection position of a thick copper region and a thin copper region due to the height difference between the thick copper region and the thin copper region during tin plating, and tight combination with a thick copper region pattern part and a thin copper region pattern part is always kept; manufacturing of the thick copper area pattern part and the thin copper area pattern part is completed, and the production yield is improved.

The invention discloses an easy-to-bend copper bar cable which comprises a flat copper bar conductor with the section thickness of 2.95 mm to 3.05 mm, the section width of 15.90 mm to 16.10 mm and the sectional area of 48 mm < 2 >, and an insulating layer which is made of a nylon material and wraps the copper bar conductor, the average thickness of the insulating layer is 0.55 mm to 0.65 mm, the minimum local thickness of the insulating layer is larger than or equal to 0.48 mm, the height of the outer contour of the insulating layer is 4.2 mm, and the thickness of the outer contour of the insulating layer is 4.2 mm. The width of the insulating layer is 17.2 mm, and the surface roughness Ra of the insulating layer is less than or equal to 0.8 [mu] m. The electric connector has the characteristics of temperature resistance, aging resistance and chemical corrosion resistance, supports customized designs such as end stamping and tin plating, is convenient to mount, reduces the occupied space by 30%, and remarkably improves the reliability and durability of electrical connection and the system integration efficiency.

The invention discloses a PSA electrotinning insoluble anode system and a production method of an electrotinning plate, and relates to the technical field of electrotinning. The PSA tin electroplating insoluble anode system comprises an electroplating additive which is composed of benzotriazole, N-oleoyl sarcosine, S-carboxyethyl thiosuccinic acid and sodium citrate. The problems of serious black ash and poor coating performance of an electroplated tin plate product are solved, the tin plating stability of a plating solution in an electroplating bath is improved, the black ash on the surface of the electroplated tin plate product can be effectively reduced, the requirements of low black ash and high adhesive force on the surface of an electroplated tin plate of a PSA (Pressure Swing Adsorption) electroplated tin insoluble anode system are met, and the service life of the electroplated tin plate is prolonged. The electroplated tin plate produced through the PSA electroplated tin insoluble anode system is bright and clean in plating layer surface, and after the tin layer surface with the thickness of 8.4 g / m < 2 > and below is wiped through test paper, the reduction percentage of the test paper whiteness caused by black ash is smaller than or equal to 10%.

The invention discloses a picosecond processing method for a binding disc at the bottom of a blind slot, which comprises the following steps of: removing a tin layer: putting a circuit board to be subjected to tin removal into tin removal liquid to ensure that the tin layer is completely immersed; according to the characteristics of the tin stripping liquid and the specific condition of the circuit board, proper tin stripping time and temperature are set, the surface of the circuit board is lightly brushed with a brush, and a tin layer is helped to be removed; the dry film is cut into a proper size, it is ensured that the dry film can completely cover the circuit board, through the design that a binding disc is arranged at the bottom of a depth groove, conduction connection of an inner layer product and an outer layer product is facilitated, a component can be embedded into the depth groove, the product space is saved, the product size is reduced, and the depth groove is formed in a hard board through an inner layer adhesive tape and an outer layer uncovering cover; a pattern cannot be manufactured on a tray at the bottom of the tank by using a conventional etching mode, and the problem is solved by applying a tin plating mode and forming the pattern by laser ablation; and the inner layer pattern is protected by using the second tinning-alkaline etching, and pattern formation of other areas is completed.

The invention relates to the technical field of copper wire production, and provides a hot tinning device and process for a superfine copper wire, the hot tinning device comprises a tinning box, one side of the tinning box is provided with a cooling tank communicated with the outside, the bottom and the top of the cooling tank are both provided with holes communicated with the tinning box, and the copper wire can penetrate out and penetrate in through the holes; a heating pipe is arranged at the top of the interior of the tinning box, and a guide roller assembly is arranged in the tinning box. The device overcomes the defects in the prior art and is reasonable in design and compact in structure, the copper wire is cooled after tinning, a tin layer is stabilized and then heated again, after the tin layer is close to a molten state, tin on the surface of the copper wire is scraped through the die cutter assembly, redundant tin on the surface of the copper wire is scraped off and smoothed, and the copper wire surface quality is improved. And the uniformity and the conductivity of the copper wire surface coating are improved. And a plurality of die cutter assemblies which are horizontally arranged are arranged in the tin plating box, so that the die cutter assemblies are prevented from being overheated due to long-time continuous use, a copper wire tin plating layer is prevented from being molten accidentally, and the service life of the die cutter assemblies is prolonged.

The invention discloses an electroplated part, an electroplated part manufacturing method and a connector. The electroplated part comprises a base material; a nickel plating layer formed on the surface of the base material; the tin-graphite composite plating layer is formed on the nickel plating layer; the nickel plating layer is formed on the base material, the tin-graphite composite plating layer is formed on the nickel plating layer, the tin plating layer is formed on the tin-graphite composite plating layer, the nickel plating layer serves as a bottom plating layer of the base material, the tin plating layer serves as an outer plating layer of the base material, and the tin-graphite composite plating layer serves as a middle plating layer of the base material. According to the invention, the graphite particles exposed from the tin-graphite composite coating are partially or completely wrapped by the outermost tin coating, so that the graphite particles are not easy to fall off, the wear resistance and corrosion resistance of the electroplated part are improved, and the service life of the electroplated part is prolonged. In addition, the plating layer structure also has a relatively low friction coefficient, so that the insertion and extraction force of the electroplated part in the use process can be greatly reduced.

The invention discloses a manufacturing method of an anti-oxidation corrosion-resistant red copper plate, and relates to the technical field of red copper plate manufacturing. S2, alloying treatment is carried out; s3, cold rolling and intermediate annealing; s4, coating treatment is carried out; and S5, quality detection. According to the method, the titanium nitride coating is deposited through the magnetron sputtering technology, the organic silicon resin coating is coated, various parameters in the sputtering process can be accurately controlled through the magnetron sputtering technology, the thickness and uniformity of the coating can be more accurately controlled, the problem that the thickness is not uniform in the similar hot-dip tinning process is avoided, tin-containing waste water is reduced, and the production cost is reduced. Meanwhile, the organic silicon resin coating is coated, so that the quality of the whole protective layer can be further guaranteed, the oxidation resistance and corrosion resistance of the red copper plate are improved, residual water stains on the top of the blank can be wiped through the water absorption roller, the blank is symmetrically heated through the hot-air blower and the heating strip, the heating and drying speed of the blank can be increased, and the service life of the blank is prolonged. And the overall drying time is shortened.

The invention relates to the technical field of power cables, and discloses a high-flexibility high-temperature-resistant fireproof cable which comprises a conductor, an insulating layer, a shielding layer, an inner sheath layer, a fireproof layer and an outer sheath layer which are sequentially arranged from inside to outside, the conductor is formed by twisting multiple strands of fine copper wires, the surface of each fine copper wire is plated with a layer of tin, the insulating layer is made of a silicon rubber material, and the shielding layer is made of a silicon rubber material. A nanoscale magnesium hydroxide flame retardant and a high-temperature-resistant additive are added into the silicone rubber material; the shielding layer is a copper wire braided shielding layer; the inner sheath layer is made of a polyurethane material; the fireproof layer comprises a ceramic silicone rubber layer and a mica tape wrapping layer which are arranged in sequence; according to the scheme, the conductor is stranded by multiple strands of fine copper wires, and the diameter, the stranding pitch and the tension are optimized, so that the cable keeps excellent flexibility in frequent bending and moving environments, and the conductor is prevented from being broken. The tin coating improves the oxidation resistance and the welding performance, and ensures the long-term stability of electrical connection.

The invention relates to the technical field of thermoelectric material surface treatment, and provides a bismuth telluride-based thermoelectric material wafer surface treatment method which comprises the following steps: acquiring multi-dimensional data such as current density distribution, temperature field distribution, solution concentration gradient and plating thickness increment in real time through a sensor array; performing iterative calculation on the data based on a thermoelectric performance parameter optimization model to generate an optimal parameter combination of chemical oil removal, activation, nickel plating and tin and bismuth plating processes; dynamically adjusting the anode plate area ratio, the current density threshold value and the solution temperature fluctuation range of the electroplating equipment; a self-adaptive feedback mechanism is used for correcting parameter deviation, so that a uniform thermoelectric function layer structure is formed on the surface of the wafer. According to the method, the uniformity and the thermoelectric performance stability of the surface coating of the bismuth telluride thermoelectric wafer can be improved, the defect rate is reduced, and the production efficiency and the product consistency are improved.

A positioning tool for a deflection angle shaft is used for clamping and fixing workpieces of deflection angle shafts, and each workpiece comprises a straight shaft section and an inclined shaft section. The tool comprises a first positioning part and a second positioning part which are located on the two end faces of the deflection angle shaft piece respectively. The workpiece achieves positioning of the straight shaft section and the inclined shaft section through the straight shaft center hole and the inclined shaft center hole, the straight shaft center hole is located in the center axis of the straight shaft section, and the inclined shaft center hole is located in the center axis of the inclined shaft section. The inclined shaft center hole is located in the outward end face of the first positioning part and the outward end face of the second positioning part. The surface, making contact with the workpiece, of the tool is subjected to nickel plating or tin plating treatment. During machining, the tool is installed on a clamp of a rotary workbench of a fourth shaft of the vertical machining center. Compared with the prior art, the method has the following beneficial effects that the machining precision is high, the cost is low, and precise grinding can be achieved.

The utility model discloses a circuit board tin plating device which comprises a box body and a socket, moving assemblies are installed on the two sides of the box body, each moving assembly comprises a rail and a sliding block, a lifting assembly is installed on each sliding block, each lifting assembly comprises a hydraulic rod and a support, a clamping assembly is installed at the bottom of each support, and each clamping assembly is connected with the corresponding rail. The clamping assembly comprises a cover plate and a clamping plate, the tinning assembly is installed on the inner side of the box body and comprises a circuit board and tinning liquid, the circuit board tinning device can blow off the tinning liquid adhering to the circuit board through airflow blown out of the blowing opening, the tinning liquid is prevented from being taken away by the circuit board, and the tinning efficiency is improved. According to the tin plating device for the circuit board, tin plating liquid can be prevented from dripping on other equipment along with movement of the circuit board, waste of the tin plating liquid can be avoided, consumption of the tin plating liquid is reduced, even if an electromagnet breaks down during movement and tin plating work, the circuit board can be prevented from falling off, the clamping firmness of the circuit board is protected, and the tin plating device is suitable for tin plating work of the circuit board.

The invention provides tinning and gold-removing integrated equipment which comprises a rack, a rotating part, an adsorption part and a tinning and gold-removing mechanism, and the rotating part is used for driving a device to rotate; the adsorption part is used for adsorbing the device and can drive the device to approach the rotating part until the device abuts against the rotating part; the tinning and gold removing mechanism comprises a heating piece, a tin sucking piece and a tin material supplying piece; the tin material feeding piece is used for conveying a tin wire to the position between the heating piece and the device, the heating piece is used for heating the tin wire to melt the tin wire and cover the periphery of the device, and the tin sucking piece is used for sucking redundant soldering tin on the periphery of the device. According to the tin coating and gold removing integrated equipment, reliable clamping of a small-size device is achieved through cooperation of the adsorption part and the rotating part, uniform tin coating and gold removing are achieved through cooperation of the tin coating and gold removing mechanism on the basis that the rotating part drives the device to rotate, the problem that traditional manual operation is large in difficulty is solved, the quality stability is guaranteed, and the production efficiency is improved. And the treatment efficiency is obviously improved.

The invention belongs to the technical field of coating binding force detection, and particularly relates to a tinned copper wire coating binding force detection method which comprises the steps that tinned copper wire coating binding force detection equipment controls a tinned copper wire to penetrate through a constant-temperature heating area at a first speed, and special treatment is conducted on the copper wire before the surface of the copper wire is tinned, the same envelopes are arranged at fixed intervals; after the envelopes penetrate through the constant-temperature heating area, measuring the air bag area after each envelope is bulged; and obtaining the coating binding force of the tinned copper wire at the corresponding position of each coating film according to the air bag area after each coating film is bulged. The method can solve the problem that the detection process is tedious when the tinned copper wire is detected in the prior art.

The utility model discloses a die cavity for copper wire tinning, which relates to the technical field of copper wire tinning devices and comprises a groove body, a liquid adding box is arranged on one side of the groove body, and tin liquid in the liquid adding box is injected into the groove body through an automatic liquid adding mechanism. A cover plate is arranged above the groove body, a connecting column is arranged on one side of the cover plate, a connecting hole is formed in the top of the groove body, and the connecting column is matched with the connecting hole in an inserted mode. The liquid level sensor is used for sensing the liquid level of the tin liquid in the tank body, when the liquid level is sensed to be lower than the liquid level required by tin plating, the external PLC is used for controlling the liquid adding pump to start, the liquid adding pump pumps the tin liquid in the liquid adding box into the tank body, the liquid level of the tin liquid in the tank body reaches the required position, and automatic liquid adding into the tank body is achieved. Meanwhile, the cover plate is additionally arranged at the top of the tank body, and the opening in the top of the tank body is covered by the cover plate, so that the tank body is sealed, the loss of heat in the tank body is reduced, and the heat preservation effect of the tank body is improved.

One embodiment of the present invention provides a tin electroplating solution and a method for forming tin solder bumps using same. The tin electroplating solution according to an embodiment of the present invention includes a novel nucleation accelerator and a particle growth inhibitor, enabling the formation of uniform tin solder bumps with few voids, and thus has excellent performance.