Chemical tin plating liquor for copper and copper alloy

Abstract

The invention discloses a copper and a chemical plating tin liquor of copper alloys and each liter of chemical plating tin liquor consists of materials with the following components: organic mixed acid: 150g / 1 to 500g / 1; organic pink salt: 50g / 1 to 100g / 1; organic silver salt: 1g / 1 to 5g / 1; complex agent: 45g / 1 to 200g / 1; reducing agent: 30g / 1 to 60g / 1; stabilizing agent: 10g / 1 to 80g / 1; emulsifying agent: 5g / 1 to 20g / 1; brightening agent: 3g / 1 to 20g / 1 and de-ionized water as the rest. With the chemical plating tin liquor, the copper and alloy surfaces can simply and rapidly form a bright and flat tin layer which does not form tin whiskers and has a certain thickness only needing chemical tin plating treatment for 4 to 8 minutes. The copper and the chemical plating tin liquor are suitable for not only circuit boards which are coated with coppers or copper alloys but also tinning corrosion resistance of other copper materials, etc.

Description

technical field [0001] The invention relates to a tin plating solution suitable for direct chemical tin plating on the surface of copper and copper alloys. Background technique [0002] In the production process of printed circuit boards (PCBs) for electronic products, the traditional method mostly uses the hot air leveling (HASL) process, commonly known as "spray tin", spraying a layer of solder on the surface of the copper clad laminate to ensure that the PCB is in the assembly process. Electronic components have good solderability and other characteristics. [0003] In recent years, with the enhancement of people's awareness of environmental protection, environmental protection regulations have become more and more perfect and strict. Although tin-lead solder has excellent wettability, solderability, good mechanical properties and low price, lead and its compounds are harmful to human beings. Toxic and harmful substances to health and pollute the environment. In additio...

AI Technical Summary

Problems solved by technology

The above invention has many inconveniences in the implementation, and there are many operation steps, and the chemical tin plating solution invented by Japan Ishihara Pharmaceutical Co., Ltd. in the Japanese Patent Publication 20042777814 "Separate Preservation Method for Chemical Tin Plating Solution" is a two-component plating solution. Can be stored separately, and then mixed and prepared when used to ensure the storage performance and use performance of the plating solution