Chemical tin plating liquor for copper and copper alloy
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A technology of electroless tin plating and copper alloy, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problem of many operation steps and so on
Active Publication Date: 2009-04-08
昆山成利焊锡制造有限公司
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Problems solved by technology
The above invention has many inconveniences in the implementation, and there are many operation steps, and the chemical tin plating solution invented by Japan Ishihara Pharmaceutical Co., Ltd. in the Japanese Patent Publication 20042777814 "S
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Embodiment 1
[0018] Composition of the present invention and component content in every liter are as follows:
[0033] Composition of the present invention and component content in every liter are as follows:
[0034] Tin methanesulfonate 50g
[0035] Silver methanesulfonate 1g
[0036] Methanesulfonic acid 144g
[0037] 2-Hydroxyethanesulfonic acid 63g
[0038] Citric acid 153g
[0039] β-cyclodextrin 5g
[0040] Thiourea 45g
[0041] Hypophosphorous acid 30g
[0042] Catechol 5g
[0043] α-picolinic acid 3g
[0044] Cetylpyridinium Bromide 5g
[0045] Deionized water balance.
Embodiment 3
[0047] Composition of the present invention and component content in every liter are as follows:
[0048] Tin 2-hydroxyethanesulfonate 84g
[0049] Silver 2-hydroxyethanesulfonate 1.2g
[0050] Citric acid 195g
[0051] Lactic acid 75g
[0052] 2-Hydroxyethanesulfonic acid 230g
[0053] β-cyclodextrin 15g
[0054] Thiourea 98g
[0055] 2,4,6-Trithiotriuret 102g
[0056] Sodium hypophosphite 45g
[0057] Ascorbic acid 24g
[0058] Benzaldehyde 4g
[0059] Cetylpyridinium Chloride 10g
[0060] Deionized water balance.
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Abstract
The invention discloses a copper and a chemical plating tin liquor of copper alloys and each liter of chemical plating tin liquor consists of materials with the following components: organic mixed acid: 150g/1 to 500g/1; organic pink salt: 50g/1 to 100g/1; organic silver salt: 1g/1 to 5g/1; complex agent: 45g/1 to 200g/1; reducing agent: 30g/1 to 60g/1; stabilizing agent: 10g/1 to 80g/1; emulsifying agent: 5g/1 to 20g/1; brightening agent: 3g/1 to 20g/1 and de-ionized water as the rest. With the chemical plating tin liquor, the copper and alloy surfaces can simply and rapidly form a bright and flat tin layer which does not form tin whiskers and has a certain thickness only needing chemical tin plating treatment for 4 to 8 minutes. The copper and the chemical plating tin liquor are suitable for not only circuit boards which are coated with coppers or copper alloys but also tinning corrosion resistance of other copper materials, etc.
Description
technical field [0001] The invention relates to a tin plating solution suitable for direct chemical tin plating on the surface of copper and copper alloys. Background technique [0002] In the production process of printed circuit boards (PCBs) for electronic products, the traditional method mostly uses the hot air leveling (HASL) process, commonly known as "spray tin", spraying a layer of solder on the surface of the copper clad laminate to ensure that the PCB is in the assembly process. Electronic components have good solderability and other characteristics. [0003] In recent years, with the enhancement of people's awareness of environmental protection, environmental protection regulations have become more and more perfect and strict. Although tin-lead solder has excellent wettability, solderability, good mechanical properties and low price, lead and its compounds are harmful to human beings. Toxic and harmful substances to health and pollute the environment. In additio...
Claims
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Application Information
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