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402results about How to "Reduced growth rate" patented technology

Three-dimensional surface shot peening jet electrodeposition manufacturing method and device

The invention provides a three-dimensional surface shot peening jet electrodeposition manufacturing method and device. According to the manufacturing method and device, a deposition solution and hard particles are mixed and deposit on a conductive substrate in a spraying manner, so that the rapid manufacturing technology of electrodeposition is realized, the growth rate of grains in the electrodeposition process is slowed down, the purpose of refining the grains is reached, and the quality of a deposition layer is dramatically improved; with combination of the shot peening strengthening technology and the electrodeposition technology, the defects of loose texture, pockmarks, pits and the like of the deposition layer caused by single electrodeposited cathode hydrogen evolution and impurity adhesion can be effectively overcome, and the hardness and the compactness of the deposition layer are improved; meanwhile, by introducing a five-axis linkage numerical control machining system, processing formation of a three-dimensional space can be realized, and the uniformity and the shape accuracy of the deposition layer are improved; and the technology can be widely applied to production of noble metal devices and parts in complex shapes and can also be used for surface rapid coat-plating, a strengthening technology and the like.
Owner:JIANGSU UNIV

Vertical hydride vapor phase epitaxy growth system

The invention relates to a vertical hydride vapor phase epitaxy growth system, which comprises a reaction chamber, a graphite support, epitaxy growth substrates and a heating system, wherein the graphite support is arranged in a growth region of the reaction chamber, and the reaction chamber is of a vertical structure; a plurality of epitaxy growth substrates are arranged above the graphite support or inversely arranged below the graphite support; a tail gas outlet is positioned at the lower part of the reaction chamber, wherein the reaction chamber is of an axial sleeve structure and is formed by sleeving a chamber pipe with a gas conduit, wherein the gas conduit is positioned at the inlet part of the chamber pipe, and a plurality of separating gas path structures are arranged inside the inlet part of the gas conduit and axially and uniformly distributed and are used for conveying a reaction gas to the epitaxy growth substrates of the growth region; and the outer conduit wall of the gas conduit extends to exceed the position of the graphite support. The vertical hydride vapor phase epitaxy growth system disclosed by the invention can be used for effectively preventing deposition and blockage caused by pre-reaction and reaction of tail gases, prolonging the sustained growing time of an HVPE (Hydride Vapor Phase Epitaxy) system and obtaining a GaN body single crystal material which cannot exist naturally and cannot grow by a conventional method.
Owner:NANJING UNIV
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