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Multilayer Film, Laminate Using the Same, and Method for Producing the Laminate

Disclosed is a multilayer film for a strain-free laminate that is used for flexible TFT substrates or the like. Also disclosed are a laminate obtained by arranging such a multilayer film on a substrate made of an inorganic material, and a method for producing such a laminate. Specifically disclosed is a multilayer film wherein an adhesive resin layer that can be adhered to inorganic materials is arranged on a base film made of a resin. This multilayer film has a first average thermal expansion coefficient at temperatures from 60° C. to 80° C. measured during a first raise of the temperature of the multilayer film from 30° C. to 130° C. by heating the multilayer film, which first average thermal expansion coefficient is larger by 30 to 400 ppm/° C. than a second average thermal expansion coefficient measured at temperatures from 60 to 80° C. during a second raise of the temperature from 30° C. to 130° C. after cooling the multilayer film from 130° C. to 30° C. subsequent to the first raise. Also specifically disclosed is a laminate obtained by sticking such a multilayer film onto at least one surface of a substrate made of an inorganic material. Further specifically disclosed is a method for producing such a laminate wherein the multilayer film is stuck to the substrate of an inorganic material at a temperature of not less than 40° C. and not more than the glass temperature of the resin of the adhesive resin layer.
Owner:ZEON CORP
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