The invention related to a polyimide film with high visible light permeability, molecular structure formula of which is: (shown in figure). Preparation comprises steps of: dissolving primary diamine in a strongly polarnon-proton solvent, cooling the same by cold water to 5 DEG. C to 10 DEG. C, adding aromatic dianhydride, mixing, reacting 4h to 10h at 5 DEG. C to 10 DEG. C, acquiring homogeneous, transparent, sticky polyamic acid resin solution; wherein mol number of aromatic dianhydride is equal to that of primary diamine; adjusting viscosity of polyamic acid resin solution by N,N-dimethyl acetamide, forming film in a casting machine, heating to raise temperature, processing dehydration heat imidization, cooling, deciduating to acquire homogeneous and transparent polyimide thin film. The preparation method has mild reaction condition, sample to operate, low in cost and environmental friendly; mechanical property and thermal stability of the polyimide thin film are excellent with high visible light permeability reaching 94% and film thickness 50 micrometers.