The invention relates to the technical field of
epoxy resin preparation, and particularly discloses a modified
epoxy resin packaging material and a preparation method thereof.The modified
epoxy resin packaging material is prepared from, by weight, 96-130 parts of
resin matrix, 14-16 parts of heat conduction filler, 9-12 parts of composite
flame retardant, 4.6-5.6 parts of curing accelerator, 1.2-1.4 parts of
photoinitiator and 440-500 parts of
solvent; the hydroxyl-terminated hyperbranched
polymer and the heat-conducting filler are added into the modified epoxy resin packaging material, and the
polymer contains rich active hydroxyl,
benzene rings,-Si-O-Si bonds and sulfydryl, not only can be subjected to a curing reaction with
bisphenol A epoxy resin, but also can be subjected to a reaction with the heat-conducting filler, so that the heat-conducting property of the heat-conducting filler is improved; the overall crosslinking density of the modified epoxy resin packaging material is improved, the
dispersity of the heat-conducting filler is improved, the heat
conductivity is improved, and meanwhile the
ablation resistance and the
mechanical property of the modified epoxy resin packaging material are improved.