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Method for spectrophotometric blood oxygenation monitoring

A method and apparatus for non-invasively determining the blood oxygen saturation level within a subject's tissue is provided that utilizes a near infrared spectrophotometric (NIRS) sensor capable of transmitting a light signal into the tissue of a subject and sensing the light signal once it has passed through the tissue via transmittance or reflectance. The method includes the steps of: (1) transmitting a light signal into the subject's tissue, wherein the transmitted light signal includes a first wavelength, a second wavelength, and a third wavelength; (2) sensing a first intensity and a second intensity of the light signal, along the first, second, and third wavelengths after the light signal travels through the subject at a first and second predetermined distance; (3) determining an attenuation of the light signal for each of the first, second, and third wavelengths using the sensed first intensity and sensed second intensity of the first, second, and third wavelengths; (4) determining a difference in attenuation of the light signal between the first wavelength and the second wavelength, and between the first wavelength and the third wavelength; and (5) determining the blood oxygen saturation level within the subject's tissue using the difference in attenuation between the first wavelength and the second wavelength, and the difference in attenuation between the first wavelength and the third wavelength.
Owner:EDWARDS LIFESCIENCES CORP

Flip-chip semiconductor package and package substrate applicable thereto

A flip-chip semiconductor package structure and a package substrate applicable thereto are disclosed. The package substrate includes a body having at least a chip-attach area disposed thereon; a plurality of solder pads disposed in the chip-attach area and arranged at different intervals; and a fluid-disturbing portion disposed in the chip-attach area at a position where the solder pads are loosely arranged. A flip-chip semiconductor chip is mounted on the solder pads via conductive bumps and an underfill material is filled between the package substrate and the flip-chip semiconductor chip, the underfill material encapsulating the conductive bumps and the fluid-disturbing portion. By protrudingly disposing the fluid-disturbing portion at a position where the conductive bumps are loosely arranged, that is, the conductive bumps having bigger intervals therebetween, gap between the package substrate and the flip-chip semiconductor chip can be reduced so as to increase capillary attraction generated by capillary phenomenon, thereby balancing flow rate of the underfill material between the conductive bumps that are arranged at different intervals and thus avoiding problems of void formation, subsequent popcorn effect or delamination as encountered in the prior art.
Owner:SILICONWARE PRECISION IND CO LTD
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