Manufacturing method for plate type thin film resistor

A technology of thin film resistors and manufacturing methods, which is applied in the direction of resistor manufacturing, resistors, and resistors with lead-out terminals, etc., can solve the problems of low productivity, high production cost, and expensive photolithography process, so as to improve productivity and reduce production. Cost, the effect of omitting the photolithography process

Inactive Publication Date: 2009-12-02
CHINA ZHENHUA GRP YUNKE ELECTRONICS
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Problems solved by technology

This method has the disadvantages of low productivity and high production cost due to the use of two sputtering films, and the

Method used

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Embodiment Construction

[0021] The present invention will be further described below in conjunction with specific embodiment:

[0022] 1) Grinding the ceramic substrate with an alumina content of 96%, controlling the surface roughness to be 0.08-0.1μ;

[0023] 2) Put the above-mentioned ceramic substrate into an ultrasonic cleaning tank with a frequency of 10-20KHz and a power of 25-50W, clean it with deionized water with a resistivity above 2MΩ for 2-10min, and then dry it at 150±5°C for 25min ;

[0024] 3) Print surface electrodes on the surface of the cleaned ceramic substrate, and dry at 125°C for 10 minutes; ensure that the printing thickness reaches 13-22 μ after drying, and the electrode paste used for printing is silver paste prepared by conventional methods;

[0025] 4) Print the back electrode on the back of the cleaned ceramic substrate, and dry at 125°C for 10 minutes; ensure that the printing thickness reaches 8-17μ after drying, and the electrode paste used for printing is the same as ...

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Abstract

The invention discloses a manufacturing method for a plate type thin film resistor, which belongs to a manufacturing method for a plate type resistor. The invention aims to provide a manufacturing method for producing the plate type thin film resistor with high productivity and low cost. The manufacturing method comprises the manufacture of a gauge, a back electrode and a resistor body, encapsulating, trimming, splintering, sintering, end coating and electroplating; and the concrete steps comprise substrate burnishing and cleaning, printing for the gauge and the back electrode, electrode sintering, baffle layer printing, vacuum sputtering, baffler layer removing, thermal treatment, laser trimming, protective layer printing, protective layer curing, primary splintering, end coating for the electrode, end electrode sintering, secondary splintering, nickel plating and tinlead plating. The manufacturing method has the advantages of high productivity, low cost and the like, and is an ideal method for producing the plate type thin film resistors on a large scale.

Description

Technical field: [0001] The invention relates to a method for manufacturing a resistor, in particular to a method for manufacturing a chip thin film resistor. Background technique: [0002] Chip resistors are the basic components of chip resistor network products, and are called the "cells" of electronic equipment. The accuracy and reliability of electronic equipment depend to a large extent on the quality of chip resistors. The traditional manufacturing method of chip thin film resistors is to first sputter the resistive film layer and electrode layer on the ceramic substrate by sputtering process, then perform photolithography, and then use chemical etching or plasma sputtering to form resistive film layer and electrode layer , after heat treatment and laser trimming, it is produced according to the thick film process. This method has defects such as low productivity and high production cost due to the use of two sputtering films, and the cost of the photolithography proc...

Claims

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Application Information

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IPC IPC(8): H01C17/00H01C17/12H01C17/28H01C17/30H01C17/242
Inventor 谢强杨胜艾周瑞山张平罗向阳张青张铎罗彦军栗晓帆杨舰
Owner CHINA ZHENHUA GRP YUNKE ELECTRONICS
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