97 results about "Laser trimming" patented technology

The invention provides a femtosecond laser-based hemispherical harmonic oscillator precision trimming device and method. The femtosecond laser-based hemispherical harmonic oscillator precision trimming device comprises a vacuum system, a femtosecond laser trimming system, a clamp, a workpiece movement system and a mass imbalance test system, the femtosecond laser trimming system comprises a focusing module, a laser light path, a femtosecond laser, a femtosecond laser energy continuous regulation and control module and a femtosecond laser patterning and control system; the workpiece movement system comprises a workpiece autorotation mechanism and a workpiece translation mechanism; the workpiece autorotation mechanism is used for realizing autorotation movement of the clamp and the hemispherical harmonic oscillator; the workpiece translation mechanism is connected with the workpiece autorotation mechanism and is used for realizing three-direction translation motion of the hemispherical harmonic oscillator and the workpiece autorotation mechanism; the mass imbalance test system comprises a harmonic oscillator excitation module and a test module. The harmonic oscillator excitation module is used for exciting the hemispherical harmonic oscillator; and the test module is used for detecting the vibration of the excited hemispherical harmonic oscillator. According to the invention, the influence on the stability of the standing wave of the harmonic oscillator and the precision of the gyroscope caused by an overhaul pit is effectively reduced.

The invention discloses an ultrahigh-precision low-noise band-gap reference circuit, and relates to the technical field of integrated circuit design, the ultrahigh-precision low-noise band-gap reference circuit comprises a starting turn-off circuit, a reference core circuit, a high-order temperature compensation circuit and a digital trimming circuit, the starting turn-off circuit is connected with the reference core circuit, and the high-order temperature compensation circuit is connected with the digital trimming circuit through a Brokaw type band-gap reference topological structure. Accurate compensation of the voltage is achieved through deep negative feedback of the operational amplifier and a high-order temperature compensation circuit, and the temperature drift of the reference voltage is as low as 0.5-2 ppm / DEG C (-40 DEG C to 130 DEG C) and is increased by 5-10 times compared with a traditional band-gap reference (5-10 ppm / DEG C). The power consumption of the system can be saved by turning off the circuit when the circuit is not used, meanwhile, the digital trimming module is added to replace laser trimming in traditional engineering, the upper limit of the trimming range is improved, high-order temperature compensation and the digital trimming circuit are introduced, the precision of output voltage is improved, different devices are replaced, and the noise of the circuit is reduced. The problems that a traditional high-voltage band-gap reference temperature coefficient is high and noise is large are solved.

The invention relates to the technical field of resistor manufacturing, in particular to a manufacturing process of a high-frequency and high-precision resistor device. Comprising the following steps: S1, substrate molding: molding substrate material powder into a required substrate shape through pressing or a mold, and carrying out sintering molding; s2, depositing a conductive thin film: depositing a layer of extremely thin conductive thin film on the substrate, and manufacturing resistive layers with different thicknesses by using a nickel-chromium alloy material to adapt to various resistance values; s3, photoetching and etching: generating a pattern through photoetching or laser trimming, increasing a resistance path and calibrating a resistance value to ensure that the resistance value is within a design range; s4, adjusting a resistance value; s5, surface treatment; and S6, screening and packaging. According to the method, the precision and the performance are controlled through the steps of calibrating the resistance value in the technological process, accurately controlling the resistance pattern through laser energy and accurately controlling the size of the pattern, so that the final product can meet the requirements of high frequency and high precision.

The invention discloses a radio frequency coaxial cable outer conductor trimming, welding and forming device, which relates to the field of cable outer conductor forming and comprises a wrapping mechanism, a laser trimming mechanism, an outer conductor forming mechanism, a welding mechanism, an imaging detection mechanism, a repair welding mechanism and an edge grinding mechanism which are sequentially arranged along the conveying direction of an inner conductor, the wrapping mechanism is used for sequentially winding an insulating layer and a heat insulating layer on an inner conductor, the laser trimming mechanism is used for trimming two sides of an outer conductor belt, the outer conductor forming mechanism is used for folding the outer conductor belt into a ring shape, the welding mechanism is used for welding the two sides of the outer conductor belt together, and then the imaging detection mechanism is used for detecting the welding condition. In the case of insufficient welding, repair welding is carried out through the repair welding mechanism, burrs generated during repair welding are polished to be smooth through the edge grinding mechanism, the two side edges of the outer conductor belt are subjected to edge cutting treatment through the laser cutting machine, and the edge cutting device has the advantages of being high in edge cutting efficiency and high in edge cutting precision.

The invention discloses high-precision wafer laser trimming equipment and a trimming method. Comprising a feeding mechanism, a pre-reading mechanism, a visual positioning mechanism, a light path mechanism, a material taking manipulator mechanism, a wafer adsorption carrying table and a movement mechanism, the pre-reading mechanism comprises a code reader, and the code reader is used for reading wafer codes; the visual positioning mechanism is used for sequentially carrying out coarse positioning and accurate positioning on the wafer and compensating the position of the wafer in real time when the optical path mechanism trims the wafer; the light path mechanism is used for outputting laser to trim a trimming line, adjusting laser spot parameters according to parameters of the trimming line, and precisely machining the trimming line through switch light according to the position of the trimming line; and the movement mechanism comprises a servo motor and is used for driving the wafer to move below the visual positioning mechanism and the light path mechanism according to the Map, and the movement mechanism is matched with the light path mechanism to complete trimming of the trimming line. The trimming requirements of different chip trimming lines are met, and the machining precision of the chip trimming lines is guaranteed.

The invention discloses a laser ablation and parameter optimization system and method for a hemispherical harmonic oscillator. The system comprises a laser, a control system, a frequency difference test module, a vacuum cavity, and an electric rotating base, a working platform, a vibration test clamp, an electric control excitation hammer and a vibration stopping damper which are arranged in the vacuum cavity, the working platform is mounted on the electric rotating base; the vibration stopping damper, the vibration testing clamp and the electrically-controlled excitation hammer are all installed on the working platform. By means of the parameter optimization method of the ablation system, the fitting matching degree is judged according to experimental samples added in real time, and the fitting function is dynamically updated. Laser trimming parameters are determined according to the fitting function, the accuracy of the ablation amount is guaranteed, and the trimming efficiency and convergence are improved. The method is widely suitable for the size of the harmonic oscillator, and provides technical support for engineering development of the high-precision hemispherical harmonic oscillator.

The invention relates to the technical field of radio frequency integrated circuits and advanced semiconductor packaging, in particular to a radio frequency resistor calibration structure based on an RDL process and a manufacturing method, and the radio frequency resistor calibration structure comprises a main resistor module, a redundant resistor module, a laser fine tuning module, a shielding layer module and a temperature compensation module. The main resistor module is sputtered into a film through a low-temperature coefficient metal alloy, and the high-frequency skin effect is reduced by adopting a snakelike or interdigital geometric layout; and the redundant resistor module drives metal ions to migrate through a narrow-neck structure and an electromigration effect, and compensates photoetching line width deviation and uneven sputtering thickness. The laser fine tuning module adjusts a conductive path through selective ablation or annealing of pulse laser, and forms closed-loop calibration in combination with real-time feedback of the metal induction electrode. And the consistency regulation and control of radio frequency circuit parameters of a packaging level are realized.

The invention discloses a dynamic calibration method for precise stamping preparation of a gold-based soldering lug based on multi-mode laser positioning, and belongs to the technical field of high-precision brittle gold-based soldering lug manufacturing. Comprising the following steps that a strip roll material is fed into a machining table top, and a welding strip is positioned through positioning laser; visual data of the edge of the strip coil stock and the multi-stage combined stamping head are obtained, and the pre-stamping offset of the edge of the strip coil stock and a rough stamping head in the multi-stage combined stamping head is calculated; the pre-punching offset is transmitted to a displacement compensation table and a multi-stage combined punching head for displacement compensation; rough punching is conducted on the strip roll material through a rough punching head, and the gold-based soldering lug is fixed; collecting an edge image of the gold-based soldering lug after rough punching, and calculating an edge trimming amount; and the edge finishing amount is transmitted to a red laser finishing device in the multi-stage combined punching head for fine punching. Through multi-stage stamping and post-stamping laser trimming, visual identification and a trimming amount algorithm are combined, and the machining precision of + / -5 [mu] m level of the X-Y axial surface can be achieved.

The invention relates to the technical field of quartz crystal processing, and discloses a vacuum device for laser fine tuning of a quartz crystal wafer. A laser fine tuning system; a vacuumizing system; the control system is connected with the laser fine adjustment system and the vacuumizing system and comprises an acquisition module, a judgment module, an adjustment module and a storage module; the acquisition module is configured to determine the initial pumping rate of the vacuum pumping system based on the target vacuum degree and the volume information; the judgment module is configured to judge whether to adjust the initial air exhaust rate or not according to the air pressure change rate; the adjusting module is configured to determine the adjusting coefficient of the initial air exhaust rate according to the air exhaust influence factor and obtain the final air exhaust rate; the storage module is configured to store an air exhaust impact factor. According to the invention, accurate control and dynamic adjustment of the vacuumizing process are realized through the intelligent control system, and a stable and efficient environment is provided for fine adjustment of the quartz crystal wafer.

The invention discloses an electric meter sampling filter chip and system integrated with a programmable anti-aliasing filter, and relates to the field of electric energy metering chips, the electric meter sampling filter chip comprises a programmable anti-aliasing filter module, a digital control and interface module and a cooperative control unit, through binary weighted control of a switched capacitor array, the cut-off frequency can be dynamically adjusted within the range of 1 kHz to 100 kHz, and the cut-off frequency can be adjusted within the range of 1 kHz to 100 kHz. Switching of a Bessel mode, a Butterworth mode and a Chebyshev mode is physically achieved by reconstructing a feedback network, a programmable AAF, an ADC, control logic and a digital interface are integrated into a single chip, and the number of external elements such as an RC network and an operational amplifier is reduced; aDC sampling data is analyzed through FFT, the signal-to-noise ratio is calculated in real time, the filter mode is automatically switched, a hardware interrupt pin triggers notification after configuration is completed, MCU polling is replaced, and frequency response is ensured to be accurate and controllable through laser trimming of a switched capacitor array.

The invention relates to the technical field of laser cutting and welding, and discloses heat exchanger assembly positioning and welding equipment which comprises a cutting support, a cylinder frame and a flange frame are arranged on the cutting support and provided with a fixing part a and a fixing part b respectively, and the fixing part a and the fixing part b are used for fixing a to-be-machined cylinder and a to-be-machined flange assembly respectively. By setting the preset distance between the fixing ring and the positioning piece and combining with the slidable iris piece structure, each barrel can be axially positioned in a standardized mode before being cut, and therefore it is guaranteed that the lengths of cut parts are kept consistent. According to the structure, the problems that in the prior art, the laser trimming cutting length depends on manual judgment, errors are large, and repeatability is poor are effectively solved, and interface uniformity and follow-up welding consistency are improved.

The invention belongs to the technical field of metal label processing, and particularly relates to a metal label corner laser edge trimmer which comprises a numerical control coordinate assembly and a cutting table which are sequentially arranged in the vertical direction, and further comprises a guide piece, a material carrying cup and an ox horn cup, the numerical control coordinate assembly is provided with a laser head, and the guide piece is arranged on the back face of a metal label; two metal wires, an LED lamp and a lithium battery are arranged in the guide part, the LED lamp and the lithium battery are connected between the two metal wires, a guide hole matched with the guide part and a negative pressure part used for sucking a metal label are formed in an opening of the material carrying cup, and the metal label is positioned relative to the guide hole through the guide part to face the laser head during trimming. And the edge of the metal label is kept away from the material carrying cup and the negative pressure piece. The edge of the metal label can be avoided while rapid positioning is achieved, a falling space is reserved for cut waste edges, and the device is matched with a conductive coolant to assist heat dissipation in the trimming process and indicate the in-place state.

The invention discloses a laser trimming device for drawnwork embroidery crafts, belonging to the technical field of drawnwork embroidery craft processing, comprising a base plate, a supporting circular plate fixedly mounted on the base plate, an auxiliary component, a leveling component, and a pressing component arranged on the base plate, the leveling component being capable of leveling the embroidery crafts on the supporting circular plate, thereby effectively preventing the embroidery crafts from being folded on the supporting circular plate, and being capable of pressing both sides of a trimming area of ​​the embroidery crafts when trimming rectangular embroidery crafts, thereby improving the accuracy of the trimming position, the pressing component being capable of pressing and fixing circular or special-shaped embroidery crafts, and under the action of a resetting unit being capable of causing a long arm rotating plate to give way to the feeding of the laser head when the laser head is trimming the embroidery crafts.

The invention discloses a diamond grinding tool femtosecond laser trimming device and a trimming method thereof.The diamond grinding tool femtosecond laser trimming device comprises a sealing box, an adjusting ring is rotationally clamped on the sealing box and controlled through an electric motor, a plurality of pairs of air holes are formed in the adjusting ring, each pair of air holes comprises an air inlet and an air outlet, and the air inlet is communicated with the air outlet; a hose is arranged in each air hole in a penetrating mode, all the hoses are controlled through a comprehensive discharging and sucking controller, the comprehensive discharging and sucking controller is connected to a computer display and control system, and a trimming assembly is arranged in the sealing box. According to the device, the air blowing pipe and the air suction pipe are arranged to pass through air holes in the side of the transparent sealing box and are aligned with the femtosecond laser spot position to blow out inert gas, and therefore the influence that gas microparticles formed in the finishing process return to cover the diamond curved surface is avoided; therefore, pits and convex points caused by non-uniform energy absorption in the finishing process are avoided, and the finishing efficiency and the surface quality of the diamond grinding tool are improved.

The application provides a kind of hemispherical harmonic oscillator precision trimming device and method based on femtosecond laser, comprising: vacuum system, femtosecond laser trimming system, fixture, workpiece motion system and mass imbalance test system;Femtosecond laser trimming system contains focusing module, laser light path, femtosecond laser, femtosecond laser energy continuous regulation module and femtosecond laser patterning and control system;Workpiece motion system includes workpiece rotation mechanism and workpiece translation mechanism, workpiece rotation mechanism is used to realize the rotation motion of fixture and hemispherical harmonic oscillator;Workpiece translation mechanism is connected with workpiece rotation mechanism, for realizing the three-direction translation motion of hemispherical harmonic oscillator and workpiece rotation mechanism;Mass imbalance test system contains resonator excitation module and test module;Resonator excitation module is used to excite hemispherical harmonic oscillator;Test module is used to detect the vibration of hemispherical harmonic oscillator that has been excited.The application effectively reduces the influence of major trimming pit on the stability of resonator standing wave and gyroscopic precision.

The invention belongs to the technical field of laser cutting, and discloses an offshore power distribution cabinet metal plate laser trimming device which comprises a main frame and a portal frame connected to the upper end of the main frame, a laser cutting head is installed on the side face of the portal frame, a cutting frame is fixed to the middle of the main frame, supporting plates are distributed at the upper end of the cutting frame, and the two sides of the cutting frame are connected with material guiding pipes. And a supporting table is arranged in the middle of the cutting frame. According to the laser trimming equipment for the metal plate of the offshore power distribution cabinet, the symmetrically-distributed sealing pipes, the pistons and the movable guide pipes form a stable negative-pressure adsorption structure, and the stable negative-pressure adsorption structure is matched with the array type triangular supporting plates flush with the supporting table, so that it is guaranteed that the metal plate is stressed uniformly and placed flatly, clamping deformation or vibration displacement is avoided, contact damage between the supporting face and a workpiece is reduced, and the service life of the metal plate is prolonged. And the trimming size precision and the assembly adaptability are greatly improved, and the high-precision requirement of offshore equipment for sheet metal parts is completely met.

The invention provides a laser fuse method, system and device of an analog integrated circuit and a medium, the method comprises the steps that a trimming circuit is provided, the trimming circuit comprises a plurality of trimming branches with different trimming code values, the trimming branches are connected in series through trimming points, each trimming branch comprises 2n trimming resistors which are connected in parallel, and the trimming resistors are connected in series through the trimming points; the trimming points are in a short circuit state; actual measurement data of each chip to be trimmed are obtained to generate an actual measurement data table, and the actual measurement data table comprises coordinates of the chips to be trimmed and corresponding actual measurement parameters; and determining a target trimming value corresponding to the to-be-trimmed chip according to the actually measured data table, determining a to-be-accessed trimming branch based on the target trimming value, and positioning a corresponding trimming point to perform laser fuse, so that the corresponding trimming branch is switched on. The trimming circuit is combined with laser trimming, the structure is simple, operation is convenient, and trimming efficiency and precision can be improved.

The invention provides a multi-group analysis detection method and system based on laser resistance trimming, and relates to the technical field of detection, and the method comprises the steps: determining resistance trimming information of a plurality of groups of metal resistors; based on the resistance trimming information of each group of gold resistors, determining the resistance trimming type of each group of gold resistors; sequentially inputting the resistance trimming information of each group of alloy resistors into a pre-constructed cutting parameter generation model to obtain initial cutting parameters respectively corresponding to the resistance trimming information of each group of alloy resistors; based on the initial cutting parameters of each group of metal resistors, a high-precision laser beam is used for conducting laser resistor trimming on each group of metal resistors, and completion information of each group of metal resistors is obtained; wherein the completion information of each group of gold resistors at least comprises a current resistance value; and analyzing the resistance trimming information and the completion information of each group of gold resistors, and determining an optimal etching mode corresponding to each resistance trimming type. According to the invention, the alloy resistor can be accurately trimmed.

A handheld laser trimming and welding device can include a handheld laser trimming and welding wand and a nozzle. The nozzle can extend from the handheld laser trimming and welding wand to a distal portion, and the nozzle can have an aperture on the distal portion. The distal portion of the nozzle can be configured to optically communicate a laser to the distal portion of the nozzle and fluidically communicate a pressurized gas to the distal portion of the nozzle.

The invention discloses a DC-DC circuit testability testing method and device based on laser trimming, and belongs to the field of chip testing. By configuring a circuit shift register and controlling the circuit to enter a test mode, the internal upper and lower power tubes work in a constant conduction or turn-off state, and the conduction impedance test can be realized by applying a current excitation signal; in the test mode, the circuit is controlled to enter the trimming mode by changing the voltage of a feedback port, and online trimming of key parameters such as the circuit benchmark reference voltage and the internal working frequency can be achieved; based on a laser trimming test system, aiming at the long-term trouble test of conduction impedance parameters of a DC-DC circuit, a shift register control circuit is configured to enter a test mode, and the test of the conduction impedance is realized. Meanwhile, due to the discrete type of the production process, the circuit yield is improved through two measures of laser trimming and online trimming.

The invention discloses a manufacturing method of a through hole of a circuit board structure. The manufacturing method of the through hole of the circuit board structure comprises a preparation step, a first drilling step, a second drilling step, a hole repairing step and an electroplating step. In the preparation step, a circuit substrate with a first surface and a second surface is provided. A first conductive layer and a second conductive layer are respectively formed on the first surface and the second surface. A first drilling step: performing laser drilling on the first surface of the circuit substrate and the first conductive layer to form a blind hole; and a second drilling step: performing laser drilling on the second surface of the circuit substrate corresponding to the blind hole position and the second conductive layer to form a through hole penetrating through the blind hole. And a hole repairing step: carrying out laser hole repairing on one side of the through hole on the second surface. And an electroplating step: electroplating the circuit substrate to form an electroplated layer on the through hole, thereby effectively improving the problem of abnormal bowl bottom separation in the manufacturing method of the through hole of the existing circuit board structure.

The processing method of the semiconductor wafer comprises the following steps: using UV glue to stick the front and back surfaces of the semiconductor wafer, forming a first mask on the back surface of the semiconductor wafer, and forming a second mask on the front surface of the semiconductor wafer; sticking the back surface of the semiconductor wafer on a machine table to perform mechanical cutting, cutting to the second mask from the first mask; and using laser to trim the cutting surface of the semiconductor wafer. Through the UV glue mask protection and laser trimming process, the edge collapse rate in the wafer cutting process is significantly reduced, and the processing quality and product yield are improved.

The utility model discloses a voltage stabilization control mechanism for laser trimming in the technical field of PCB (printed circuit board) processing, and aims to solve the problem that the resistance voltage of a PCB (printed circuit board) is easy to be unstable during laser trimming of a resistor in the prior art. The device comprises a workbench and a mounting frame mounted on the workbench, a laser is arranged on the mounting frame, a placement plate used for placing a PCB is arranged on the workbench, the placement plate is located in the working area range of the laser, and an air blowing assembly is further arranged on the workbench and comprises an air inlet pipe, a cooling box and an air blowing pipe. Cooling liquid is contained in the cooling box, the air inlet pipe and the air blowing pipe are both communicated with the cooling box, and a pipeline of the air inlet pipe is inserted into the cooling liquid. When the laser trimming device is used for trimming the carbon film resistor by laser, the trimming environment is controlled, the large difference between the preset trimming parameter and the actual trimming result is prevented, the stability of the voltage of a circuit board is favorably controlled, and the quality and the yield of products are ensured.

The invention discloses an integrated planarization method and structure suitable for CrSi resistor laser trimming, and the method comprises the steps: carrying out the global planarization etching of a second dielectric layer between metal layers, keeping the thickness h, and forming the second dielectric layer between metal layers with larger surface roughness. And reducing the surface roughness of the second dielectric layer between the metal layers with relatively large surface roughness, and forming the second dielectric layer between the metal layers after the surface roughness is reduced. And performing global growth on the surface of the second dielectric layer between the metal layers after the surface roughness is reduced to form a third dielectric layer between the metal layers. And forming a thin-film resistor in the second device region, and globally growing to form a fourth dielectric layer between metal layers. And forming a second metal layer on the fourth dielectric layer between the metal layers, and enabling the second metal layer to be in contact with the first metal layer and the thin-film resistor respectively. While effective planarization is realized, the surface roughness is avoided or remarkably improved, and the strict requirements of processes such as laser trimming and the like are finally met.

The invention provides a micro drill cutting edge trimming method and device, electronic equipment and a storage medium, and the method comprises the steps: determining a to-be-trimmed feature based on a micro drill surface three-dimensional model corresponding to a to-be-trimmed micro drill; wherein the feature to be trimmed is a cutting edge line and / or a groove surface; filtering the three-dimensional geometric data of the to-be-trimmed features to generate smooth target geometric elements; based on a deviation value between the target geometric element and an original geometric element of the to-be-trimmed feature, determining material removal margin distribution; and based on the material removal allowance distribution, the laser machining device is controlled to execute laser finishing machining on the to-be-finished features, the problems that a traditional micro-drill cutting edge finishing mode is tedious in process, poor in consistency and poor in precision are solved, and the precision, the consistency and the overall automation level of the micro-drill cutting edge finishing process are improved.

The invention relates to a device for carrying out ultra-short pulse laser trimming on a chip resistor, and belongs to the technical field of laser trimming resistance, and the device comprises a laser device which is used for generating initial laser which is an ultra-short pulse Gaussian spot; the beam expander is used for adjusting the diameter of the passed initial laser to a preset required diameter; the half-wave plate is used for adjusting the polarization direction of the passing initial laser to be horizontal polarization; the spatial light modulator is used for loading a set hologram and modulating initial laser into flat-topped light, and the flat-topped light acts on a machining area of the chip resistor in the light path direction; the monitoring module is used for acquiring the real-time resistance value of the chip resistor and sending the real-time resistance value to the control module; and the control module is used for controlling the laser emission work of the laser according to the relationship between the real-time resistance and the resistance threshold. According to the invention, the technical problems of large heat affected zone, poor groove morphology, micro-cracks and the like existing in laser resistance trimming of the chip resistor by using Gaussian light spots in the prior art are solved.

The utility model provides a high-precision linear arc-shaped carbon film structure, which comprises an insulating substrate, a first conductive metal circuit layer, a second conductive metal circuit layer, a third conductive metal circuit layer, a fourth conductive metal circuit layer, a fifth conductive metal circuit layer, a sixth conductive metal circuit layer, a first carbon film resistance layer and a second carbon film resistance layer, the second conductive metal circuit layer is connected with the sixth conductive metal circuit layer through the first carbon film resistance layer, and the third conductive metal circuit layer is connected with the fifth conductive metal circuit layer through the second carbon film resistance layer; the first carbon film resistance layer and the second carbon film resistance layer are arranged to be arc-shaped; the first carbon film resistor layer and the second carbon film resistor layer are provided with the trimming edge sections along one side or / and two sides of the arc length direction through laser trimming, so that the resistance consistency is improved, the current consistency is improved, and the product yield is also greatly improved.

The invention discloses a metal plate corner laser trimming machine which comprises a machine body, a feeding assembly is arranged on the machine body and used for feeding and conveying materials, a discharging assembly is further arranged on the machine body and used for downwards conveying cut materials and cut waste materials in a segmented mode, a collecting assembly is arranged on the machine body, and the collecting assembly is used for collecting the cut materials and the cut waste materials. The collecting assembly is used for collecting the cut materials and the cut waste materials in a centralized mode. According to the material conveying device, when the driving part drives the smooth part to slide forwards, the smooth part pushes the second rack forwards, when the second rack slides, the second gear is driven to drive the conveying part to rotate, so that materials are conveyed forwards, when the second rack reversely slides on the smooth part, the second rack is reset under the action of the springback part, and when the second rack is reset, the springback part resets. And the conveying part is not driven to rotate under the action of the one-way part, so that intermittent conveying of the materials is achieved.

The invention discloses a laser debugging device, and relates to the technical field of laser, the laser debugging device is used for debugging the relative position of a laser diode and a shell, the laser debugging device comprises a mounting plate, a fixing assembly, a position adjusting assembly, a distance increasing lens and a receiving camera, the fixing assembly is arranged on the mounting plate, and the fixing assembly is provided with a first fixing position; the first fixing position is used for fixing the shell; the position adjusting assembly is arranged on the mounting plate and located on one side of the fixing assembly, the position adjusting assembly is provided with a second fixing position, the second fixing position is used for placing the laser diode, and the position adjusting assembly is used for adjusting the relative position of the laser diode and the shell; the distance increasing lens is arranged on the fixing assembly and used for increasing the distance of laser emitted by the laser diode. The receiving camera is arranged on the side, away from the position adjusting assembly, of the fixing assembly, located at the focal point of the distance increasing lens and used for receiving light spots emitted by the laser diode. According to the technical scheme provided by the invention, the size of the debugging device is reduced while long-distance light spot testing is realized at a short distance.

The present application relates to the technical field of cooling tower packing processing, in particular to a micro-channel structure cooling tower packing for efficient evaporation cooling and a processing technology thereof, which comprises the following steps: plasma activation treatment is performed on a base material of a body, the power is 280-320 W, and the time is 50-70 s; mold pressing forming: the base material preheated to 105-115 DEG C is placed into a mold with a temperature of 160+ / -5 DEG C, and the pressure is kept at 7-9 MPa for 25-35 s; laser trimming: the edge of the micro-channel unit is scanned by ultraviolet laser after mold pressing forming; spraying coating: a nano-hydrophilic coating is formed on the surface of the body by spraying and infrared curing process. Through the sawtooth corrugation, gentle slope corrugation and transition zone curvature control, the present application completes the airflow turbulence strengthening and water film residence time extension, and achieves the effect of improving the evaporation efficiency compared with the traditional packing. Through the micro-channel network construction, the present application completes the water film global diffusion driven by capillary force, and achieves the effect of improving the water film coverage compared with the traditional honeycomb hole and prolonging the anti-clogging cycle.