256 results about "Laser trimming" patented technology

Disclosed is an optical disk barcode forming method wherein, as information to be barcoded, position information for piracy prevention, which is a form of ID, is coded as a barcode and is recoded by laser trimming on a reflective film in a PCA area of an optical disk. When playing back the thus manufactured optical disk on a reproduction apparatus, the barcode data can be played back using the same optical pickup.

A system for probing circuit elements, includes a panel fixture, probe holder and stage. The fixture has a platen surface to support a work piece having work piece surface. The work piece surface is substantially parallel to the platen surface and has a target element thereon. The probe holder is configured to support a probe for detecting a characteristic of the target element. A stage rotates the probe holder about an axis substantially orthogonal to the platen surface, to align the probe with probe locations associated with the circuit element, so that the characteristic of the circuit element can detected by the probe. Fixturing motion can be optimized for efficient work piece manufacturing. Calibration and vision subassemblies are also provided.

An improved IDC trim resistor connector assembly made up of a generally open top cup shape connector with side wall slots and an interior first array of terminal posts arranged for passage therethrough of a first lead wire of sensor circuitry. A first stamped metal IDC terminal is push-on mounted on the terminal posts for IDC cradling and electrically and mechanically receiving and connecting to the first lead wire. A conventional trim resistor substrate is loose mounted but accurately positioned on the connector bottom wall and has an "E" pattern of resistive material adapted for center leg laser trimming to calibrate the associated sensor circuitry. A first IDC terminal spring leg overlap contacts one side leg of the trim resistor E-pattern and thereby spring clamps the resistor substrate. A cover is snap-latch mounted on the connector and has an access opening to enable laser trimming of the trim resistor after cover installation. One end of a second lead wire is received in a second IDC metal terminal in turn mounted on a second array of connector-interior terminal posts and also having a spring leg overlap electrically contacting and clamping the other E-pattern side leg. Spring barbs on the terminals anchor the same once fully inserted downwardly onto the terminal posts. Connector locking tangs and cover locking ears provide snap-on retention of the cover on the connector, and press-in/keeper internal cover projections cause push-down assembly of the lead wires as the cover is latched onto the connector. Cover locking tangs and cap latching ears provide snap-together locking of a cap on the cover when the cap is pushed down on the cover to seal the access opening after completion of laser trimming and in-filling of the covered container with sealant. In a second embodiment a crimp-type terminal, also provided with a spring clamping leg, is fastened to the second lead wire and has a barbed mounting strap clasping a modified second terminal post array when fully installed thereon.

A precision resistor of NiCr or SiCr has a refractive and thermal barrier layer beneath the resistor. The refractive barrier is a layer of refractory metal. The refractory metal prevents the incident laser beam of a laser trimmer penetrating lower layers of the device. Unwanted reflections and refractions caused by lower layers are avoided. The reflective barrier layer is a material selected from the group consisting of tungsten, titanium, molybdenum, TiSi2l3,14, CoSi215, MoSi2, TaSi2 and WSi2.

A method for creating electrical interconnects between a semiconductor die and package. In the preferred embodiment, an insulating material is applied over the die and extends to the substrate contact pads, leaving a portion of each contact pad exposed. Holes are then trimmed through the insulating material, exposing at least a portion of each die bond pad. A conductive material is then applied over the die, flowing into the holes, contacting the die bond pads, and extending out to contact at least a portion of each substrate contact pad. In another preferred embodiment, an electrically conductive bump may be formed on each die bond pad, protruding through said non-conductive material and at least partially through said conductive material. The conductive layer is then laser trimmed, forming conductive patches that serve as electrical interconnects between the die and package substrate.

A compact lower cost programmable logic controller with modular I/O is described. SPI bus is used for accessing multi-byte data from I/O modules, while 8 bit data bus is used to access single byte data from I/O modules. Compact I/O modules with use with the PLC are described. The include short circuit proof DC output modules, Relay output with built-in electromagnetic shield, analog modules with laser trimmed resistors, and high speed counter modules.

The invention is directed to a method to embed a thick film resistor composition into a printed wiring board comprising the steps of applying a reinforcing composition onto a resistor composition disposed on a metallic substrate forming an assembly wherein the resistor composition is at least partially coated with the reinforcing composition; processing the assembly; and applying the assembly onto at least one side of an organic substrate forming a component wherein the organic substrate is at least partially coated with an adhesive layer and wherein the reinforcing composition side of the assembly is embedded into the adhesive layer. The reinforcing composition allows laser trimming of the fired resistor and also eliminates cracking during lamination steps of the invention.

A voltage reference is dynamically and digitally controlled by a digital function. The digital function may be implemented as a digital calculation or look up table. Inputs to the function include a modifiable trim value stored in a trim register, and a substrate temperature value. The preset value of the trim register is a trim preset value generated by cutting fuses and/or leaving fuses uncut. The cutting may be performed using laser trimming-devices. The output of the digital function is a corrected reference trim value that controls the gain of a voltage reference amplifier whose input is a band gap based voltage reference, and whose output is a derived voltage reference. The substrate temperature value is provided by a monolithic temperature monitor whose sensor may be on the same die as the derived voltage reference. The derived voltage reference provides a stable reference voltage that is dynamically and digitally controllable, to a host system that requires a voltage reference.

A method, system and scan lens system are provided for high-speed, laser-based, precise laser trimming at least one electrical element. The method includes generating a pulsed laser output having one or more laser pulses at a repetition rate. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The method further includes selectively irradiating the at least one electrical element with the one or more laser pulses focused into at least one spot having a non-uniform intensity profile along a direction and a spot diameter as small as about 6 microns to about 15 microns so as to cause the one or more laser pulses to selectively remove material from the at least one element and laser trim the at least one element while avoiding substantial microcracking within the at least one element. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance and high absorption, but not so short so as to cause microcracking.

An array substrate including a signal line, a test line to inspect the open of the signal line and fault of the pixels, and a fuse electrically connecting the signal line with the test line. The fuse is opened when a current higher than a reference current is applied thereto. Accordingly, a laser trimming process to insulate the signal line from the test line is not needed after the signal line and pixels have been tested, so that the processing time may be shortened.

Disclosed is a method of producing a printed circuit board (PCB) with an embedded resistor, in which a resistor with a desired shape and volume is precisely formed using a resistor paste so that resistance values according to a position of the PCB are uniform, thereby a laser trimming process is omitted or minimally utilized. The method has advantages in that a production time of the PCB is shortened and productivity is improved because an operation condition is rapidly set without being greatly affected by the position precision of a printing device. Other advantages of the method are that the resistor paste with a relatively uniform thickness is secured through a screen printing process, thereby easily forming the resistor and improving resistance tolerance.

This invention pertains to an incremental sensor of position and/or speed, of the type which includes a moving component made of a soft material that has at least one moving tooth in a direction OZ with respect to a permanent magnet magnetized along the direction OY, which is approximately perpendicular to the OZ axis, and a probe which is sensitive to the direction and strength of the magnetic field, such as a Hall-effect gaussmeter, arranged in the air gap between the magnet and the tooth of the moving component so that its axis of greatest sensitivity is approximately oriented along the OZ axis. The Hall-effect gaussmeter is located near a singular point of the OZ axis where the average value of the magnetic field is weak and preferably less than .+-.20 mT and approximately equal to the average value of the alternating field of the integrated circuit connected to the Hall-effect gaussmeter. The permanent magnet can also be laser trimmed to achieve the desired operation in the Hall-effect gaussmeter.

A method and system are provided for high-speed, laser-based, precise laser trimming at least one electrical element along a trim path. The method includes generating a pulsed laser output with a laser, the output having one or more laser pulses at a repetition rate. A fast rise/fall time, pulse-shaped q-switched laser or an ultra-fast laser may be used. Beam shaping optics may be used to generate a flat-top beam profile. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance, high absorption and reduced or eliminated heat-affected zone (HAZ) along the trim path, but not so short so as to cause microcracking. In this way, resistance drift after the trimming process is reduced.

In the laser trimming of passive circuit elements such as resistors, capacitors and inductors, various trimming parameters must be selected. To select a parameter, such as a cut type or speed, a value of a parameter, such as the resistance or impedance of a resistor, of each of a plurality of elements is measured. The measured parameter value of each element is compared with a target value for the parameter to determine an offset value between the measured parameter value and the target value. The relevant trim parameters are then selected based on the determined offset values.

The invention discloses an intelligent laser trimming system and method based on binocular vision. The system comprises an industrial personal computer, a scanner and a box-type cutting platform. A mechanical hand, servo motors, a vision moving platform, a lighting system and a CCD binocular vision camera are installed in the box-type cutting platform. The industrial personal computer controls the CCD binocular vision camera installed on the vision moving platform to move through the servo motors. The mechanical hand is connected with the industrial personal computer through an arranged mechanical hand control cabinet. The vision moving platform is connected with the industrial personal computer through an arranged vision moving platform control cabinet. The system is high in intelligence degree, the automatic calibration and automatic scanned drawing programming functions are achieved, and production efficiency is greatly improved.

The invention discloses a manufacturing method for a plate type thin film resistor, which belongs to a manufacturing method for a plate type resistor. The invention aims to provide a manufacturing method for producing the plate type thin film resistor with high productivity and low cost. The manufacturing method comprises the manufacture of a gauge, a back electrode and a resistor body, encapsulating, trimming, splintering, sintering, end coating and electroplating; and the concrete steps comprise substrate burnishing and cleaning, printing for the gauge and the back electrode, electrode sintering, baffle layer printing, vacuum sputtering, baffler layer removing, thermal treatment, laser trimming, protective layer printing, protective layer curing, primary splintering, end coating for the electrode, end electrode sintering, secondary splintering, nickel plating and tinlead plating. The manufacturing method has the advantages of high productivity, low cost and the like, and is an ideal method for producing the plate type thin film resistors on a large scale.

The passive component (1) has a first part (22) of a material with a first resistance value, which value can be lowered to a second value by laser trimming. The second value is at most one tenth of the first value and preferably less. The material crystallizes in a laser trimming process, which locally heats the material to at least a transition temperature. The material contains at least two different elements, which are preferably aluminum and germanium.The passive component (1) may be, for example, a resistor or a capacitor and may be part of a thin-film network of resistors, capacitors and/or inductors. In a resistor, it is preferred to have a second part (4) which contains a different resistance material with a resistance value lower than the first value and preferably higher than the second value.

A method includes a scheme for trimming and compensation for a laser emitter in a fiber optic link. Data models of laser performance are provided and used to determine a base power level. It is then confirmed that the base power level is satisfactory. If necessary, adjustments are made to a set of user specified performance parameters until a satisfactory base power level is obtained. Then a table or relation of temperatures and associated current and target average optical power values is generated such that they can be used to regulate laser emitter performance over a range of temperature. Additionally, fiber optic links capable of trimming and compensation are also disclosed.

An electronic device is provided with a display such as a liquid crystal display. The display has a layer of liquid crystal material sandwiched between an upper display layer such as a color filter layer and a lower display layer such as a thin-film-transistor layer. An upper polarizer is formed on the upper surface of the color filter layer. A lower polarizer is formed on the lower surface of the thin-film-transistor layer. To protect display layers such as the color filter layer and the thin-film-transistor layer, a coating is deposited on a peripheral edge of the display layer. A laser is used to cut through portions of the polarizer that overhang the display layer while also cutting through the coating on the peripheral edge of the display layer. Following laser trimming operations, the coating is flush with an edge surface of the polarizer.