59 results about "Laser trimming" patented technology

The invention discloses an ultrahigh-precision low-noise band-gap reference circuit, and relates to the technical field of integrated circuit design, the ultrahigh-precision low-noise band-gap reference circuit comprises a starting turn-off circuit, a reference core circuit, a high-order temperature compensation circuit and a digital trimming circuit, the starting turn-off circuit is connected with the reference core circuit, and the high-order temperature compensation circuit is connected with the digital trimming circuit through a Brokaw type band-gap reference topological structure. Accurate compensation of the voltage is achieved through deep negative feedback of the operational amplifier and a high-order temperature compensation circuit, and the temperature drift of the reference voltage is as low as 0.5-2 ppm / DEG C (-40 DEG C to 130 DEG C) and is increased by 5-10 times compared with a traditional band-gap reference (5-10 ppm / DEG C). The power consumption of the system can be saved by turning off the circuit when the circuit is not used, meanwhile, the digital trimming module is added to replace laser trimming in traditional engineering, the upper limit of the trimming range is improved, high-order temperature compensation and the digital trimming circuit are introduced, the precision of output voltage is improved, different devices are replaced, and the noise of the circuit is reduced. The problems that a traditional high-voltage band-gap reference temperature coefficient is high and noise is large are solved.

The invention discloses high-precision wafer laser trimming equipment and a trimming method. Comprising a feeding mechanism, a pre-reading mechanism, a visual positioning mechanism, a light path mechanism, a material taking manipulator mechanism, a wafer adsorption carrying table and a movement mechanism, the pre-reading mechanism comprises a code reader, and the code reader is used for reading wafer codes; the visual positioning mechanism is used for sequentially carrying out coarse positioning and accurate positioning on the wafer and compensating the position of the wafer in real time when the optical path mechanism trims the wafer; the light path mechanism is used for outputting laser to trim a trimming line, adjusting laser spot parameters according to parameters of the trimming line, and precisely machining the trimming line through switch light according to the position of the trimming line; and the movement mechanism comprises a servo motor and is used for driving the wafer to move below the visual positioning mechanism and the light path mechanism according to the Map, and the movement mechanism is matched with the light path mechanism to complete trimming of the trimming line. The trimming requirements of different chip trimming lines are met, and the machining precision of the chip trimming lines is guaranteed.

The invention discloses a laser ablation and parameter optimization system and method for a hemispherical harmonic oscillator. The system comprises a laser, a control system, a frequency difference test module, a vacuum cavity, and an electric rotating base, a working platform, a vibration test clamp, an electric control excitation hammer and a vibration stopping damper which are arranged in the vacuum cavity, the working platform is mounted on the electric rotating base; the vibration stopping damper, the vibration testing clamp and the electrically-controlled excitation hammer are all installed on the working platform. By means of the parameter optimization method of the ablation system, the fitting matching degree is judged according to experimental samples added in real time, and the fitting function is dynamically updated. Laser trimming parameters are determined according to the fitting function, the accuracy of the ablation amount is guaranteed, and the trimming efficiency and convergence are improved. The method is widely suitable for the size of the harmonic oscillator, and provides technical support for engineering development of the high-precision hemispherical harmonic oscillator.

The invention relates to the technical field of radio frequency integrated circuits and advanced semiconductor packaging, in particular to a radio frequency resistor calibration structure based on an RDL process and a manufacturing method, and the radio frequency resistor calibration structure comprises a main resistor module, a redundant resistor module, a laser fine tuning module, a shielding layer module and a temperature compensation module. The main resistor module is sputtered into a film through a low-temperature coefficient metal alloy, and the high-frequency skin effect is reduced by adopting a snakelike or interdigital geometric layout; and the redundant resistor module drives metal ions to migrate through a narrow-neck structure and an electromigration effect, and compensates photoetching line width deviation and uneven sputtering thickness. The laser fine tuning module adjusts a conductive path through selective ablation or annealing of pulse laser, and forms closed-loop calibration in combination with real-time feedback of the metal induction electrode. And the consistency regulation and control of radio frequency circuit parameters of a packaging level are realized.

The invention discloses a dynamic calibration method for precise stamping preparation of a gold-based soldering lug based on multi-mode laser positioning, and belongs to the technical field of high-precision brittle gold-based soldering lug manufacturing. Comprising the following steps that a strip roll material is fed into a machining table top, and a welding strip is positioned through positioning laser; visual data of the edge of the strip coil stock and the multi-stage combined stamping head are obtained, and the pre-stamping offset of the edge of the strip coil stock and a rough stamping head in the multi-stage combined stamping head is calculated; the pre-punching offset is transmitted to a displacement compensation table and a multi-stage combined punching head for displacement compensation; rough punching is conducted on the strip roll material through a rough punching head, and the gold-based soldering lug is fixed; collecting an edge image of the gold-based soldering lug after rough punching, and calculating an edge trimming amount; and the edge finishing amount is transmitted to a red laser finishing device in the multi-stage combined punching head for fine punching. Through multi-stage stamping and post-stamping laser trimming, visual identification and a trimming amount algorithm are combined, and the machining precision of + / -5 [mu] m level of the X-Y axial surface can be achieved.

The invention discloses an electric meter sampling filter chip and system integrated with a programmable anti-aliasing filter, and relates to the field of electric energy metering chips, the electric meter sampling filter chip comprises a programmable anti-aliasing filter module, a digital control and interface module and a cooperative control unit, through binary weighted control of a switched capacitor array, the cut-off frequency can be dynamically adjusted within the range of 1 kHz to 100 kHz, and the cut-off frequency can be adjusted within the range of 1 kHz to 100 kHz. Switching of a Bessel mode, a Butterworth mode and a Chebyshev mode is physically achieved by reconstructing a feedback network, a programmable AAF, an ADC, control logic and a digital interface are integrated into a single chip, and the number of external elements such as an RC network and an operational amplifier is reduced; aDC sampling data is analyzed through FFT, the signal-to-noise ratio is calculated in real time, the filter mode is automatically switched, a hardware interrupt pin triggers notification after configuration is completed, MCU polling is replaced, and frequency response is ensured to be accurate and controllable through laser trimming of a switched capacitor array.

The invention discloses a diamond grinding tool femtosecond laser trimming device and a trimming method thereof.The diamond grinding tool femtosecond laser trimming device comprises a sealing box, an adjusting ring is rotationally clamped on the sealing box and controlled through an electric motor, a plurality of pairs of air holes are formed in the adjusting ring, each pair of air holes comprises an air inlet and an air outlet, and the air inlet is communicated with the air outlet; a hose is arranged in each air hole in a penetrating mode, all the hoses are controlled through a comprehensive discharging and sucking controller, the comprehensive discharging and sucking controller is connected to a computer display and control system, and a trimming assembly is arranged in the sealing box. According to the device, the air blowing pipe and the air suction pipe are arranged to pass through air holes in the side of the transparent sealing box and are aligned with the femtosecond laser spot position to blow out inert gas, and therefore the influence that gas microparticles formed in the finishing process return to cover the diamond curved surface is avoided; therefore, pits and convex points caused by non-uniform energy absorption in the finishing process are avoided, and the finishing efficiency and the surface quality of the diamond grinding tool are improved.

The application provides a kind of hemispherical harmonic oscillator precision trimming device and method based on femtosecond laser, comprising: vacuum system, femtosecond laser trimming system, fixture, workpiece motion system and mass imbalance test system;Femtosecond laser trimming system contains focusing module, laser light path, femtosecond laser, femtosecond laser energy continuous regulation module and femtosecond laser patterning and control system;Workpiece motion system includes workpiece rotation mechanism and workpiece translation mechanism, workpiece rotation mechanism is used to realize the rotation motion of fixture and hemispherical harmonic oscillator;Workpiece translation mechanism is connected with workpiece rotation mechanism, for realizing the three-direction translation motion of hemispherical harmonic oscillator and workpiece rotation mechanism;Mass imbalance test system contains resonator excitation module and test module;Resonator excitation module is used to excite hemispherical harmonic oscillator;Test module is used to detect the vibration of hemispherical harmonic oscillator that has been excited.The application effectively reduces the influence of major trimming pit on the stability of resonator standing wave and gyroscopic precision.

The invention belongs to the technical field of laser cutting, and discloses an offshore power distribution cabinet metal plate laser trimming device which comprises a main frame and a portal frame connected to the upper end of the main frame, a laser cutting head is installed on the side face of the portal frame, a cutting frame is fixed to the middle of the main frame, supporting plates are distributed at the upper end of the cutting frame, and the two sides of the cutting frame are connected with material guiding pipes. And a supporting table is arranged in the middle of the cutting frame. According to the laser trimming equipment for the metal plate of the offshore power distribution cabinet, the symmetrically-distributed sealing pipes, the pistons and the movable guide pipes form a stable negative-pressure adsorption structure, and the stable negative-pressure adsorption structure is matched with the array type triangular supporting plates flush with the supporting table, so that it is guaranteed that the metal plate is stressed uniformly and placed flatly, clamping deformation or vibration displacement is avoided, contact damage between the supporting face and a workpiece is reduced, and the service life of the metal plate is prolonged. And the trimming size precision and the assembly adaptability are greatly improved, and the high-precision requirement of offshore equipment for sheet metal parts is completely met.

The invention provides a multi-group analysis detection method and system based on laser resistance trimming, and relates to the technical field of detection, and the method comprises the steps: determining resistance trimming information of a plurality of groups of metal resistors; based on the resistance trimming information of each group of gold resistors, determining the resistance trimming type of each group of gold resistors; sequentially inputting the resistance trimming information of each group of alloy resistors into a pre-constructed cutting parameter generation model to obtain initial cutting parameters respectively corresponding to the resistance trimming information of each group of alloy resistors; based on the initial cutting parameters of each group of metal resistors, a high-precision laser beam is used for conducting laser resistor trimming on each group of metal resistors, and completion information of each group of metal resistors is obtained; wherein the completion information of each group of gold resistors at least comprises a current resistance value; and analyzing the resistance trimming information and the completion information of each group of gold resistors, and determining an optimal etching mode corresponding to each resistance trimming type. According to the invention, the alloy resistor can be accurately trimmed.

A handheld laser trimming and welding device can include a handheld laser trimming and welding wand and a nozzle. The nozzle can extend from the handheld laser trimming and welding wand to a distal portion, and the nozzle can have an aperture on the distal portion. The distal portion of the nozzle can be configured to optically communicate a laser to the distal portion of the nozzle and fluidically communicate a pressurized gas to the distal portion of the nozzle.

The invention discloses a DC-DC circuit testability testing method and device based on laser trimming, and belongs to the field of chip testing. By configuring a circuit shift register and controlling the circuit to enter a test mode, the internal upper and lower power tubes work in a constant conduction or turn-off state, and the conduction impedance test can be realized by applying a current excitation signal; in the test mode, the circuit is controlled to enter the trimming mode by changing the voltage of a feedback port, and online trimming of key parameters such as the circuit benchmark reference voltage and the internal working frequency can be achieved; based on a laser trimming test system, aiming at the long-term trouble test of conduction impedance parameters of a DC-DC circuit, a shift register control circuit is configured to enter a test mode, and the test of the conduction impedance is realized. Meanwhile, due to the discrete type of the production process, the circuit yield is improved through two measures of laser trimming and online trimming.

The invention discloses a manufacturing method of a through hole of a circuit board structure. The manufacturing method of the through hole of the circuit board structure comprises a preparation step, a first drilling step, a second drilling step, a hole repairing step and an electroplating step. In the preparation step, a circuit substrate with a first surface and a second surface is provided. A first conductive layer and a second conductive layer are respectively formed on the first surface and the second surface. A first drilling step: performing laser drilling on the first surface of the circuit substrate and the first conductive layer to form a blind hole; and a second drilling step: performing laser drilling on the second surface of the circuit substrate corresponding to the blind hole position and the second conductive layer to form a through hole penetrating through the blind hole. And a hole repairing step: carrying out laser hole repairing on one side of the through hole on the second surface. And an electroplating step: electroplating the circuit substrate to form an electroplated layer on the through hole, thereby effectively improving the problem of abnormal bowl bottom separation in the manufacturing method of the through hole of the existing circuit board structure.

The processing method of the semiconductor wafer comprises the following steps: using UV glue to stick the front and back surfaces of the semiconductor wafer, forming a first mask on the back surface of the semiconductor wafer, and forming a second mask on the front surface of the semiconductor wafer; sticking the back surface of the semiconductor wafer on a machine table to perform mechanical cutting, cutting to the second mask from the first mask; and using laser to trim the cutting surface of the semiconductor wafer. Through the UV glue mask protection and laser trimming process, the edge collapse rate in the wafer cutting process is significantly reduced, and the processing quality and product yield are improved.

The utility model discloses a voltage stabilization control mechanism for laser trimming in the technical field of PCB (printed circuit board) processing, and aims to solve the problem that the resistance voltage of a PCB (printed circuit board) is easy to be unstable during laser trimming of a resistor in the prior art. The device comprises a workbench and a mounting frame mounted on the workbench, a laser is arranged on the mounting frame, a placement plate used for placing a PCB is arranged on the workbench, the placement plate is located in the working area range of the laser, and an air blowing assembly is further arranged on the workbench and comprises an air inlet pipe, a cooling box and an air blowing pipe. Cooling liquid is contained in the cooling box, the air inlet pipe and the air blowing pipe are both communicated with the cooling box, and a pipeline of the air inlet pipe is inserted into the cooling liquid. When the laser trimming device is used for trimming the carbon film resistor by laser, the trimming environment is controlled, the large difference between the preset trimming parameter and the actual trimming result is prevented, the stability of the voltage of a circuit board is favorably controlled, and the quality and the yield of products are ensured.

The invention discloses an integrated planarization method and structure suitable for CrSi resistor laser trimming, and the method comprises the steps: carrying out the global planarization etching of a second dielectric layer between metal layers, keeping the thickness h, and forming the second dielectric layer between metal layers with larger surface roughness. And reducing the surface roughness of the second dielectric layer between the metal layers with relatively large surface roughness, and forming the second dielectric layer between the metal layers after the surface roughness is reduced. And performing global growth on the surface of the second dielectric layer between the metal layers after the surface roughness is reduced to form a third dielectric layer between the metal layers. And forming a thin-film resistor in the second device region, and globally growing to form a fourth dielectric layer between metal layers. And forming a second metal layer on the fourth dielectric layer between the metal layers, and enabling the second metal layer to be in contact with the first metal layer and the thin-film resistor respectively. While effective planarization is realized, the surface roughness is avoided or remarkably improved, and the strict requirements of processes such as laser trimming and the like are finally met.

The invention provides a micro drill cutting edge trimming method and device, electronic equipment and a storage medium, and the method comprises the steps: determining a to-be-trimmed feature based on a micro drill surface three-dimensional model corresponding to a to-be-trimmed micro drill; wherein the feature to be trimmed is a cutting edge line and / or a groove surface; filtering the three-dimensional geometric data of the to-be-trimmed features to generate smooth target geometric elements; based on a deviation value between the target geometric element and an original geometric element of the to-be-trimmed feature, determining material removal margin distribution; and based on the material removal allowance distribution, the laser machining device is controlled to execute laser finishing machining on the to-be-finished features, the problems that a traditional micro-drill cutting edge finishing mode is tedious in process, poor in consistency and poor in precision are solved, and the precision, the consistency and the overall automation level of the micro-drill cutting edge finishing process are improved.

The invention discloses a metal plate corner laser trimming machine which comprises a machine body, a feeding assembly is arranged on the machine body and used for feeding and conveying materials, a discharging assembly is further arranged on the machine body and used for downwards conveying cut materials and cut waste materials in a segmented mode, a collecting assembly is arranged on the machine body, and the collecting assembly is used for collecting the cut materials and the cut waste materials. The collecting assembly is used for collecting the cut materials and the cut waste materials in a centralized mode. According to the material conveying device, when the driving part drives the smooth part to slide forwards, the smooth part pushes the second rack forwards, when the second rack slides, the second gear is driven to drive the conveying part to rotate, so that materials are conveyed forwards, when the second rack reversely slides on the smooth part, the second rack is reset under the action of the springback part, and when the second rack is reset, the springback part resets. And the conveying part is not driven to rotate under the action of the one-way part, so that intermittent conveying of the materials is achieved.

The invention discloses a laser debugging device, and relates to the technical field of laser, the laser debugging device is used for debugging the relative position of a laser diode and a shell, the laser debugging device comprises a mounting plate, a fixing assembly, a position adjusting assembly, a distance increasing lens and a receiving camera, the fixing assembly is arranged on the mounting plate, and the fixing assembly is provided with a first fixing position; the first fixing position is used for fixing the shell; the position adjusting assembly is arranged on the mounting plate and located on one side of the fixing assembly, the position adjusting assembly is provided with a second fixing position, the second fixing position is used for placing the laser diode, and the position adjusting assembly is used for adjusting the relative position of the laser diode and the shell; the distance increasing lens is arranged on the fixing assembly and used for increasing the distance of laser emitted by the laser diode. The receiving camera is arranged on the side, away from the position adjusting assembly, of the fixing assembly, located at the focal point of the distance increasing lens and used for receiving light spots emitted by the laser diode. According to the technical scheme provided by the invention, the size of the debugging device is reduced while long-distance light spot testing is realized at a short distance.

The present application relates to the technical field of cooling tower packing processing, in particular to a micro-channel structure cooling tower packing for efficient evaporation cooling and a processing technology thereof, which comprises the following steps: plasma activation treatment is performed on a base material of a body, the power is 280-320 W, and the time is 50-70 s; mold pressing forming: the base material preheated to 105-115 DEG C is placed into a mold with a temperature of 160+ / -5 DEG C, and the pressure is kept at 7-9 MPa for 25-35 s; laser trimming: the edge of the micro-channel unit is scanned by ultraviolet laser after mold pressing forming; spraying coating: a nano-hydrophilic coating is formed on the surface of the body by spraying and infrared curing process. Through the sawtooth corrugation, gentle slope corrugation and transition zone curvature control, the present application completes the airflow turbulence strengthening and water film residence time extension, and achieves the effect of improving the evaporation efficiency compared with the traditional packing. Through the micro-channel network construction, the present application completes the water film global diffusion driven by capillary force, and achieves the effect of improving the water film coverage compared with the traditional honeycomb hole and prolonging the anti-clogging cycle.

The invention discloses a preparation process of a cover plate direct writing grid line. The preparation process comprises the following steps: S1, arranging a composite embedded line composed of a core layer and a peelable outer layer on the surface of a cover plate base material; s2, carrying out calibration and pattern compensation on the position of the pre-embedded line by adopting a laser positioning system; s3, depositing a metal conductive layer; s4, removing the outer layer of the pre-embedded wire in a thermal decomposition mode to separate the core layer from the metal layer; s5, laser finishing and forming; s6, annealing treatment is conducted on the grid lines, and transparent passivation layers are deposited on the surfaces of the grid lines; through the steps of pre-embedded line structure compounding, laser positioning calibration, metal deposition and selective removal, laser finishing, post-treatment and the like, high-precision, high-efficiency, low-cost and environment-friendly grid line preparation is realized; the problems of complex flow, high material waste, serious environmental pollution and insufficient silk-screen printing precision of the traditional photoetching etching process are effectively solved.

The invention relates to the technical field of material processing, and discloses a laser shaping device and method based on detection. The first base is arranged on the platform, a Y-direction moving mechanism is arranged on the first base, and the Y-direction moving mechanism comprises a first motor, a first lead screw and a first moving part; the second base is arranged on the first moving part, an X-direction moving mechanism is arranged on the second base, and the X-direction moving mechanism comprises a second motor, a second lead screw and a second moving part; the fixing device is arranged on the second moving part, and the fixing device is used for assembling a workpiece; and a pair of third bases are arranged on the platform, Z-direction moving mechanisms are arranged on the third bases, each Z-direction moving mechanism comprises a third motor, a third lead screw and a third moving piece, and a laser processor and a scanning probe are arranged on the pair of third moving pieces correspondingly. And the improvement of the workpiece surface flatness detection and shaping efficiency is facilitated.

The invention relates to the technical field of precise grinding of aero-engine blades, and discloses a laser trimming path real-time compensation method and system.The laser trimming path real-time compensation method fusing online monitoring comprises the steps that monitoring data of a multi-source heterogeneous sensor for grinding wheel laser trimming are collected; planning a laser trimming path; carrying out data preprocessing and space-time alignment; carrying out multi-modal feature extraction and feature selection; multi-modal feature fusion is conducted, and the current machining state of grinding wheel laser finishing is evaluated; the machining state of grinding wheel laser finishing is predicted; performing multi-target compensation optimization on the basic path planning result; performing path correction and smoothing processing; executing the compensation path instruction, monitoring the execution process in real time, evaluating the execution effect, and performing self-adaptive feedback; by continuously monitoring the execution effect and conducting self-adaptive adjustment, intelligent control over the finishing process is achieved.

The application relates to a photovoltaic module laser trimming device and system. The photovoltaic module laser trimming device is used for trimming the adhesive film on the glass plate of a photovoltaic module, and comprises a frame body, a placing table, a material conveying mechanism and a plurality of trimming assemblies. The photovoltaic module laser trimming system comprises a control module and the photovoltaic module laser trimming device. In actual production process, the photovoltaic module laser trimming system is provided with a gasket assembly between the glass plate and the adhesive film to prevent the cutting assembly from damaging the glass plate, thereby improving the quality of the photovoltaic module, the trimming efficiency of the photovoltaic module and the yield of the photovoltaic module. The control module is arranged, so that remote programmed setting can be realized, the automatic performance of the whole photovoltaic module laser trimming system is improved, and the production efficiency is improved.

The invention belongs to the technical field of mobile phone periscopic prism machining, and discloses a laser trimming device and method for mobile phone periscopic prism machining, the laser trimming device comprises a main body, a mounting disc and a trimming assembly, and further comprises a positioning mechanism arranged at the top end of the mounting disc; the positioning mechanism comprises a workbench fixedly connected to the top end of the mounting disc, and positioning rods are rotationally connected to the two sides of the outer surface of the workbench. The two positioning rods can be driven to move towards the surface of the prism through the hinge rod, the prism can be pushed to move towards the middle of the workbench, the two positioning rods make contact with the two sides of the prism at the same time, then positioning is completed, finally, the two positioning rods position the prism by driving the adsorption assembly, and the prism moves to the middle of the top end of the workbench. The problems of uneven edge cutting and size errors caused by prism position deviation are effectively avoided, the edge cutting quality is greatly ensured, and the product machining yield and the overall quality are improved.

The application discloses a thick-film multi-plate integrated ceramic substrate and a manufacturing method thereof. The thick-film multi-plate integrated ceramic substrate comprises a ceramic substrate frame (1) with two perpendicular positioning edges (2), a group of through holes (3) arranged in the ceramic substrate frame (1), and a circuit substrate (4) arranged in each through hole (3). The edge of the circuit substrate (4) is fixedly connected with the corresponding through hole (3) through at least two connecting parts (5). Each circuit substrate (4) has a certain size relationship with each positioning edge (2). The circuit substrate (4) is a circuit forming substrate provided with electronic components. The application solves the consistency problem of printing registration patterns through a process edge and an alignment symbol. The multi-plate structure eliminates the positioning error of a single substrate. A plurality of single plates are positioned at a time during one-time pattern printing, single plate resistance automatic laser fine adjustment is realized, the spacing between circular substrates is set through a laser fine adjustment program, and first-end-to-last-end connection multi-plate uninterrupted automatic fine adjustment is realized.

Disclosed in the present invention are a laser cutting and oxidation prevention processing method for an inner-layer resistor to improve resistance precision. The method comprises: determining parameters of laser cutting on the basis of the material, dimensions and required resistance change of a resistor, and making preparations before laser cutting of the resistor; accurately positioning the prepared resistor on a laser cutting workstation, and selecting a suitable cutting method to cut the resistor on the laser cutting workstation; and a laser cutting machine cutting the resistor on the basis of the preset parameters, and testing the surface of the cut resistor. By trimming the edges of the resistor that has been etched twice, the width direction precision of the resistor can reach + / -5 μm, thereby improving the resistance tolerance from + / -10 % to + / -2 %. Resistor laser cutting is used to dimensionally trim a completed resistor, and the resistor with uneven edges is trimmed by a CO2 laser optical path, such that the resistor dimensions become uniform and the dimensions are closer to the theoretical width. After etching and laser trimming of the resistor are completed, resin is coated on the resistor to achieve protection of a resistor layer.

The present application relates to the technical fields of pipe bending processing, and discloses a laser cutting device for elbow pipe with open-close splash-proof protection structure, which comprises a longitudinal guide rail, a laser cutting head slidingly connected to the longitudinal guide rail and having an inverted conical design at the lower end, and a transverse guide rail for driving the longitudinal guide rail to move transversely; a clamping unit comprising two symmetrical elbow seats arranged above and below for clamping the elbow, and a positioning assembly connected to the end of the elbow seat and cooperating with the laser cutting head to realize accurate positioning of the cutting point. The laser cutting device for elbow pipe with open-close splash-proof protection structure can effectively solve the problems in the prior art, such as the sparks and welding slag generated during laser trimming of the elbow port, which are easy to splash and adhere to the inner and outer walls, and the need for secondary polishing, as well as the irregular shape of the elbow, which leads to certain errors in cutting accuracy and affects the sealing and adaptability of pipe assembly.

The application provides a method for reconstructing a wafer edge and a reconstructed wafer. The method for reconstructing a wafer edge comprises the following steps: providing a first wafer; bonding a first core particle on the upper surface of the first wafer; wherein the edge area of the upper surface of the first wafer is not bonded by the first core particle, forming a vacancy area; bonding a second core particle at the vacancy area; wherein at least part of the second core particle exceeds the boundary of the first wafer; and removing the part of the second core particle exceeding the boundary of the first wafer through a laser trimming process.

The present application relates to the field of radio frequency integrated circuit and advanced semiconductor packaging technology, and particularly relates to a radio frequency resistor calibration structure and manufacturing method based on RDL process, comprising a main resistor module, a redundant resistor module, a laser trimming module, a shielding layer module and a temperature compensation module. The main resistor module is formed by sputtering of low-temperature coefficient metal alloy, and adopts a serpentine or interdigital geometry layout to reduce high-frequency skin effect; the redundant resistor module is driven by metal ion migration through a narrow neck structure and electromigration effect to compensate for photolithography line width deviation and sputtering thickness unevenness. The laser trimming module adjusts the conductive path through selective ablation or annealing by pulsed laser, and forms a closed-loop calibration combined with real-time feedback of the metal sensing electrode. The radio frequency circuit parameter consistency regulation at the packaging level is realized.