123results about "Resistor trimming" patented technology

The invention relates to the technical field of resistor manufacturing, in particular to a manufacturing process of a high-frequency and high-precision resistor device. Comprising the following steps: S1, substrate molding: molding substrate material powder into a required substrate shape through pressing or a mold, and carrying out sintering molding; s2, depositing a conductive thin film: depositing a layer of extremely thin conductive thin film on the substrate, and manufacturing resistive layers with different thicknesses by using a nickel-chromium alloy material to adapt to various resistance values; s3, photoetching and etching: generating a pattern through photoetching or laser trimming, increasing a resistance path and calibrating a resistance value to ensure that the resistance value is within a design range; s4, adjusting a resistance value; s5, surface treatment; and S6, screening and packaging. According to the method, the precision and the performance are controlled through the steps of calibrating the resistance value in the technological process, accurately controlling the resistance pattern through laser energy and accurately controlling the size of the pattern, so that the final product can meet the requirements of high frequency and high precision.

A resistor includes a substrate, a pair of inner electrodes, a thin-film resistive layer, a pair of backside electrodes, and a thick-film resistive layer. The substrate includes a first surface and a second surface opposite to the first surface. The pair of inner electrodes is disposed on two opposite ends of the first surface, respectively. The thin-film resistive layer is disposed on the first surface and contacts the pair of inner electrodes, wherein the thin-film resistive layer has a first resistance value and includes a trimming groove. The pair of backside electrodes is disposed on two opposite ends of the second surface, respectively. The thick-film resistive layer is disposed on the second surface and contacts the pair of backside electrodes, wherein the thick-film resistive layer has a second resistance value, and the second resistance value is greater than 100 times of the first resistance value.

The resistor body of the chip resistor is provided with a resistance value adjusting part. A meandering forming portion is formed in the resistance value adjusting portion. In the meandering forming portion, the first trimming groove and the second trimming groove are arranged along a first direction (longitudinal direction). The first trimming groove has a first linear portion extending from a second edge of the resistance value adjusting portion along a second direction (short side direction). The second trimming groove has a second linear portion extending from the second edge of the resistance value adjusting portion in the second direction, and a bent portion extending from the tip of the second linear portion toward the first trimming groove.

The invention provides a buried resistor, a manufacturing method thereof and a printed circuit board. The manufacturing method comprises the following steps: providing an inner-layer substrate; cutting the inner-layer substrate, laminating a thin dry film on the surface of one side of the copper layer of the inner-layer substrate, performing first patterning treatment, etching to remove the copper layer and the resistive layer which are not protected by the thin dry film after the first patterning treatment, and stripping the thin dry film to obtain a first semi-finished product; pressing a thick dry film on the surface of one side of the copper layer of the first semi-finished product, then carrying out second patterning treatment, then etching to remove the copper layer which is not protected by the thick dry film after the second patterning treatment, and stripping the thick dry film to obtain a second semi-finished product; and depositing a layer of solder resist ink at the etched part of the copper layer of the second semi-finished product to enable the solder resist ink to cover the exposed resistive layer, then performing resistance inspection, and then laminating a high-frequency material layer on the surface of the solder resist ink to obtain the buried resistor. According to the invention, the protection of the buried resistor and the effective control of the resistance value of the buried resistor are realized.

To suppress peeling-off of a glass layer.SOLUTION: A circuit substrate 10 includes a substrate body 11, a pair of electrodes 41, 42, a resistive element 60, and a glass layer 70. The substrate body 11 is made of a ceramic. The pair of electrodes 41, 42 are spaced apart from each other on the substrate body 11. The resistive element 60 is positioned so as to cross the pair of electrode 41, 42. The glass layer 70 covers the pair of electrode 41, 42 and the resistive element 60. When in an area where the resistive element 60 and the glass layer 70 are arranged on the substrate body 11 between the pair of electrodes 41, 42, an area centered between the pair of electrodes 41, 42 is defined as a central part, a minimal distance T2 between the substrate body 11 and a surface of the glass layer 70 at the central part is shorter than a minimal distance T1 between the surface of the glass layer 70 and the substrate body 11 at a periphery P of the resistive element 60 located on the electrodes 41, 42.SELECTED DRAWING: Figure 4

The present invention provides resistors having various arrangements of conductive parts and resistive elements, current sensing resistors, battery shunt resistors, and shunt resistors. [Solution] The resistor 610 has one or more resistive elements 611 and a plurality of conductive parts 612, 614. Openings or slots 672, 676 are formed within the resistive elements in a configuration that allows adjustment of the resistor's TCR (temperature coefficient of resistance). The shape, number, and orientation of the openings or slots are variable. In one embodiment, a header member is provided to fix or hold pins to the resistor.

The present disclosure relates to semiconductor structures and, more particularly, to resistor trimming structures and methods of use. The structure includes: a set of resistors each of which include an increasing resistance value; and a set of switches each of which are connected to a respective resistor of the set of resistors and each of which comprise a decreasing width dimension for each resistor of increasing resistance value.

The invention provides a 3D printing curved surface conformal resistor forming and precision control method, and solves the problems of poor resistance value precision and the like caused by material flow due to gravity factors, resistor morphology precision, thickness uniformity and the like when a resistor device is manufactured on a curved surface base material by transplanting an existing printing technology. Through one or more technical combinations of roughness differentiation design, precise milling within the range of not less than 2mm on the periphery of the deposited resistor area, rasterizing design or final normal printing form, printing and preparation of the precision-controllable resistor device on the surface of the curved-surface base material can be realized.

To provide a thin film chip resistor capable of preventing the resistance value from becoming unstable due to the heat generated by trimming and absorbed by a second parallel resistor pattern.SOLUTION: The thin film chip resistor includes a second parallel resistor pattern 24e in which an adjacent folded portion of a zigzag resistor pattern 24b is connected by a substantially U-shaped resistor pattern 24d. Each of the approximately U-shaped resistor patterns 24d has a separate trimming groove 30b formed opposite the longitudinal side of an insulating circuit board 21.SELECTED DRAWING: Figure 2

To provide a chip resistor having excellent surge characteristics and suitable for miniaturization.SOLUTION: A chip resistor 1 according to the present invention has a crank-shaped resistor 7 having a first resistor portion 7a, a second resistor portion 7b, and a third resistor portion 7c, and a first trimming groove 12 and a second trimming groove 13 are formed with their starting ends at positions that are approximately point-symmetric on the upper and lower sides of the first resistor portion 7a, and the ending positions of the first trimming groove 12 and the second trimming groove 13 are set so as not to exceed a first straight line A that passes through the center (point O) of the first resistor portion 7a and extends in the X-axis direction, and so as not to overlap on the same Y-axis.SELECTED DRAWING: Figure 3

A chip resistor according to the present invention is provided with: an insulating substrate which has a first main surface that is an end face of the chip resistor in the thickness direction, and a first lateral surface and a second lateral surface that are end faces of the chip resistor in the longitudinal direction; a first surface electrode which is arranged on the first lateral surface-side end of the first main surface; a second surface electrode which is arranged on the second lateral surface-side end of the first main surface; a resistor which is arranged on the first main surface, while being electrically connected to the first surface electrode and the second surface electrode; a protective film which is arranged on the resistor so as to partially cover the first surface electrode and the second surface electrode; a first conductive resin layer which is arranged so as to extend over the first surface electrode and the protective film; and a second conductive resin layer which is arranged so as to extend over the second surface electrode and the protective film. The second lateral surface-side end of the first conductive resin layer and the first lateral surface-side end of the second conductive resin layer are at a distance from each other.

The invention relates to a resistor (1) with a conductive material layer (3) made of a conductive material, a resistive material layer (2) made of a resistive material and joined to the conductive material layer (3), and with a groove (4) having a specific groove width (b), a specific groove depth (t) and a specific groove flank angle relative to the plane of the conductive material layer (3), wherein the groove (4) is arranged in the conductive material layer (3) and separates the conductive material layer (3) into two connection parts (5, 6) and projects into the resistive material layer (2). According to the invention, the groove flank angle is set such that the temperature coefficient of the resistance value is as close as possible to zero. The invention also relates to an associated production method.

The application provides an automatic polishing device for alloy resistance strip and an alloy resistance production process. The automatic polishing device for alloy resistance strip comprises a rack, a polishing mechanism, a limiting roller, a sliding table and a winding disc. The alloy resistance strip is stored on the winding disc, and the end of the alloy resistance strip is fixed on the limiting roller. The sliding table is used to drive the winding disc to translate along the extension direction of the axis of the limiting roller. The polishing mechanism is arranged towards the limiting roller and is used to polish the alloy resistance strip on the limiting roller. The limiting roller is arranged in the automatic polishing device for alloy resistance strip to provide support for the alloy resistance strip, so that the polishing mechanism can stably contact the alloy resistance strip, the polishing quality is ensured, and the polishing efficiency is improved.

To provide a method of easily, accurately and efficiently adjusting a temperature coefficient of resistance of a current sense resistor and a shunt resistor, and the resistors.SOLUTION: A resistor 10 has one or more resistive elements 11, 13 and a plurality of conductive portions 12, 14, 16. Openings or slots 72 allowing adjustment of temperature coefficient of resistance (TCR) values of the resistor are formed adjacently to a second side, namely an inner side 20, of the first conductive portion 12. The shape, quantity and orientation of the openings or slots can vary. In one aspect, header members 80a, 80b are provided for securing or holding pins 84 relative to the resistor.SELECTED DRAWING: Figure 1

This chip resistor comprises a substrate, a first electrode and a second electrode, and a resistor. A first trimming groove and a second trimming groove are formed in the resistor. The first trimming groove has a first linear portion and a second linear portion. The first linear portion extends from a first end edge of the resistor toward a second end edge thereof along a second direction intersecting a first direction. The second linear portion extends from a distal-end portion of the first linear portion toward the second trimming groove. The second trimming groove has a third linear portion and a curved portion. The third linear portion extends from the first end edge of the resistor toward the second end edge thereof. The curved portion extends from a distal-end portion of the third linear portion toward the first trimming groove. The curved portion is convex in a direction from the first end edge toward the second end edge.

The invention provides a chip resistor which has excellent surge characteristics and is suitable for miniaturization. In this chip resistor (1), a resistor body (7) that connects a first surface electrode (3) and a second surface electrode (4) is printed into a crank shape having a first resistor body part (7a), a second resistor body part (7b), and a third resistor body part (7c). A first region (S1) of the resistor (7), which is surrounded by a parallelogram having a first lead-out portion (7b-1) of the second resistor portion (7b) and a second lead-out portion (7c-1) of the third resistor portion (7c) on opposite sides, is a region where a large amount of current flows, and two second regions (S2a, S2b) located outside the first region (S1) are regions where a small amount of current is distributed. An adjustment groove (12) for adjusting a resistance value is integrally formed in an L-shaped cut shape, and has: a rough adjustment section (12a) that passes through a second region (S2a) in contact with the lower edge of a first resistor body section (7a) and extends into a first region (S1); and a fine adjustment section (12b) that passes through the inside of the first region (S1) from the tip of the coarse adjustment section (12a) and extends to a position at which the fine adjustment section (12b) reaches the second region (S2a) again.

In a chip resistor, a first trimming groove has: a first linear portion extending linearly from a first edge along an X-axis direction; and a second linear portion extending linearly along the Y-axis direction. The second trimming groove includes: a third linear portion disposed on a second upper surface electrode side of the first linear portion and extending linearly along the first linear portion 1 from the first edge; and a fourth linear portion disposed on the second edge side of the second linear portion and extending linearly along the second linear portion from the tip of the third linear portion. When viewed in the X-axis direction, the tip of the second trimming groove is positioned closer to the second upper surface electrode side than the tip of the first trimming groove.

The invention relates to a sensor element (10) for measuring a temperature, comprising - at least one carrier (11) with an upper side (18) and a lower side (19), an insulating layer (12) being formed on the upper side (19) of the carrier (11), - at least two electrodes (13a, 13b), which are formed on the carrier (2) at a distance from one another, - at least one functional layer (15) comprising a material with a temperature-dependent electrical resistance, wherein the at least one functional layer (14) is arranged at least partially between the electrodes (13a, 13b), - at least two intermediate layers (14) comprising an insulating material, - at least two contact pads (16a, 16b) for electrically contacting the sensor element (10), wherein the sensor element (10) is designed to be integrated as a discrete component directly into an electrical system, and wherein the sensor element (10) has a small deviation range from a nominal resistance, wherein at least one of the at least two electrodes (13a, 13b) is structured for setting the resistance value. The invention also relates to a method for producing a sensor element (10).

A current detection device (30) includes a resistance element (5), and a pair of electrodes (6, 7). The current detection device (30) has a projecting portion (11). The projecting portion (11) has a portion of the resistance element (5) and portions of the pair of electrodes (6, 7). The electrodes (6, 7) have first wall portions (66b, 67b) forming a portion of the projecting portion (11), and second wall portions (66a, 67a) forming the portion of the projecting portion (11). The electrodes (6, 7) have detection areas (66, 67) demarcated by the first wall portion (66b, 67b), the second wall portion (66a, 67a), a leading end portion (66c, 67c), and a contact surface (6a, 7a). The electrodes (6, 7) have voltage detecting portions (20, 21). The voltage detecting portions (20, 21) are arranged in the detection areas (66, 67) with a gap between the leading end portions (66c, 67c).

The invention discloses a miniature low-resistance thick-diaphragm thermistor and a resistance value adjusting method thereof, and belongs to the technical field of production of thick-diaphragm thermistors. The miniature low-resistance thick diaphragm type thermistor comprises a ceramic substrate, a thermistor layer, a first end electrode, a second end electrode, a first interdigital electrode layer, a second interdigital electrode layer and a top electrode layer, wherein the first interdigital electrode layer, the second interdigital electrode layer and the top electrode layer are made of electric conductor materials; according to the resistance value adjusting method, the resistance value of the horizontal branch and the resistance value of the vertical branch are calculated firstly, and then the resistance value of the miniature low-resistance thick-diaphragm thermistor is calculated. According to the invention, the interdigital electrode layer and the top electrode layer are connected with the thermistor layer and are used as resistance adjusting assemblies, so that the low-resistance function and the resistance adjusting function of the thick film type thermistor are greatly realized through structure adjustment, and the use amount of noble metal can be reduced, so that the cost is reduced, and the product volume is reduced; and finally, the comprehensive functions of miniaturization, low resistance, low cost and convenience in resistance value adjustment are realized at the same time.

The invention relates to the technical field of electronic resistor manufacturing, in particular to an etching method of a bendable resistor, which comprises the following steps: S1, selecting a stainless steel material, performing high-temperature cleaning treatment on the surface, and detecting that the stainless steel surface reaches 52 # standard by using a dyne pen; s2, carrying out double-sided screen printing on the stainless steel material, carrying out optical analysis by adopting LDI exposure, and carrying out developing molding to obtain the stainless steel material with a circuit; s3, etching liquid is sprayed to the stainless steel material with the circuit through an upper spraying disc and a lower spraying disc, etching is conducted, the upper spraying disc and the lower spraying disc are adjusted to enable the height difference between the upper spraying disc and the lower spraying disc to range from 40 mm to 60 mm, and the spraying pressure is set to range from 3.5 kg / cm < 3 > to 5.0 kg / cm < 3 >; and S4, cleaning the etched stainless steel material to obtain the bendable resistor. Through the process, the etching uniformity and precision can be improved, and the common problems of non-uniform etching and rough edge in the traditional etching process are effectively avoided. The prepared bendable resistor is high in resistance precision and good in stability, and can meet high requirements of precision electronic equipment on resistance performance and reliability.

A sensor element (100) for measuring a temperature is described, comprising a carrier (2) and at least one functional layer (7) comprising a material with a temperature-dependent electrical resistance. The sensor element (100) further comprises at least two electrodes (4a, 4b) for electrically contacting the functional layer (7), wherein the respective electrode (4a, 4b) is spirally formed and wherein the electrodes (4a, 4b) are spirally guided into one another, wherein a contact pad (10a, 10b) is arranged directly on a partial region of one of the electrodes (4a, 4b). The sensor element (1) is designed to be integrated directly into an electrical system as a discrete component. Furthermore, a method for producing a sensor element (100) is described.

An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance. (Fig. 9)

The invention provides a liquid metal resistor with a wide resistance value range and a preparation method thereof, the liquid metal resistor is prepared by adopting an ultrasonic jet printing technology, the preparation method specifically comprises the following steps: S1, taking liquid metal as a raw material, and carrying out atomization treatment to obtain liquid metal droplets; and S2, the air pressure of an ultrasonic spray head and the distance between the ultrasonic spray head and a substrate are adjusted, a printing network is constructed, the liquid metal liquid drops prepared in the step S1 serve as raw materials, and the liquid metal resistor is obtained through printing on the substrate. Compared with the prior art, the limitation of a traditional resistor in the aspects of resistance value adjusting range, precision and flexible circuit adaptability is solved.

A plurality of resistors are disclosed herein. The resistor may include one or more resistive elements and a plurality of conductive portions. Openings or slots, which can be configured to adjust temperature coefficient or resistance (TCR) values of the resistor, are formed in the resistive elements. The shape, quantity, and orientation of the openings or slots can vary. In one aspect, header assemblies are provided for securing or holding pins relative to the resistors.

The invention relates to a sensor element (100) for measuring a temperature, comprising a carrier (2) and at least one functional layer (7), which comprises a material having a temperature-dependent electrical resistance. The sensor element (100) also has at least two electrodes (4a, 4b) for making electrical contact with the functional layer (7), each electrode (4a, 4b) being spiral-shaped and the electrodes (4a, 4b) being spirally guided one inside the other, wherein in each case a contact pad (10a, 10b) is arranged directly on a sub-region of one of the electrodes (4a, 4b). The sensor element (1) is designed to be directly integrated into an electrical system as a discrete component. The invention also relates to a method for producing a sensor element (100).

A chip resistor 1, which is excellent in the surge characteristics and also suitable for miniaturization, is formed by printing into a crank shape, and a first area S1 surrounded by a parallelogram is a portion where a large amount of current flows while two second areas S2a, S2b located outside the first area S1 are portions with small current distributions. A trimming groove 12 for adjustment of a resistance value is formed into an L-cut shape as a whole such that it has a coarse adjustment portion 12a formed to pass through the second area S2a and extend into the first area S1 and a fine adjustment portion 12b formed to pass through the first area S1 from the distal end of the coarse adjustment portion 12a and extend to a position reaching the second area S2a again.

The invention provides automatic polishing equipment for an alloy resistor strip and an alloy resistor production process. The automatic polishing equipment for the alloy resistor strip comprises a rack, a polishing mechanism, a limiting roller, a sliding table and a winding disc, wherein the polishing mechanism, the limiting roller, the sliding table and the winding disc are located on the rack. The alloy resistance strip is stored on the winding disc, and the tail end of the alloy resistance strip is fixed to the limiting roller. The sliding table is used for driving the winding disc to horizontally move in the extending direction of the axis of the limiting roller. The polishing mechanism is arranged towards the limiting roller and used for polishing the alloy resistance strip located on the limiting roller. According to the automatic polishing equipment for the alloy resistor strip, the limiting rollers are arranged to support the alloy resistor strip, the polishing mechanism can make stable contact with the alloy resistor strip, the polishing quality is guaranteed, and the polishing efficiency is improved.