73results about "Resistor trimming" patented technology

A resistor includes a substrate, a pair of inner electrodes, a thin-film resistive layer, a pair of backside electrodes, and a thick-film resistive layer. The substrate includes a first surface and a second surface opposite to the first surface. The pair of inner electrodes is disposed on two opposite ends of the first surface, respectively. The thin-film resistive layer is disposed on the first surface and contacts the pair of inner electrodes, wherein the thin-film resistive layer has a first resistance value and includes a trimming groove. The pair of backside electrodes is disposed on two opposite ends of the second surface, respectively. The thick-film resistive layer is disposed on the second surface and contacts the pair of backside electrodes, wherein the thick-film resistive layer has a second resistance value, and the second resistance value is greater than 100 times of the first resistance value.

The resistor body of the chip resistor is provided with a resistance value adjusting part. A meandering forming portion is formed in the resistance value adjusting portion. In the meandering forming portion, the first trimming groove and the second trimming groove are arranged along a first direction (longitudinal direction). The first trimming groove has a first linear portion extending from a second edge of the resistance value adjusting portion along a second direction (short side direction). The second trimming groove has a second linear portion extending from the second edge of the resistance value adjusting portion in the second direction, and a bent portion extending from the tip of the second linear portion toward the first trimming groove.

To suppress peeling-off of a glass layer.SOLUTION: A circuit substrate 10 includes a substrate body 11, a pair of electrodes 41, 42, a resistive element 60, and a glass layer 70. The substrate body 11 is made of a ceramic. The pair of electrodes 41, 42 are spaced apart from each other on the substrate body 11. The resistive element 60 is positioned so as to cross the pair of electrode 41, 42. The glass layer 70 covers the pair of electrode 41, 42 and the resistive element 60. When in an area where the resistive element 60 and the glass layer 70 are arranged on the substrate body 11 between the pair of electrodes 41, 42, an area centered between the pair of electrodes 41, 42 is defined as a central part, a minimal distance T2 between the substrate body 11 and a surface of the glass layer 70 at the central part is shorter than a minimal distance T1 between the surface of the glass layer 70 and the substrate body 11 at a periphery P of the resistive element 60 located on the electrodes 41, 42.SELECTED DRAWING: Figure 4

The present invention provides resistors having various arrangements of conductive parts and resistive elements, current sensing resistors, battery shunt resistors, and shunt resistors. [Solution] The resistor 610 has one or more resistive elements 611 and a plurality of conductive parts 612, 614. Openings or slots 672, 676 are formed within the resistive elements in a configuration that allows adjustment of the resistor's TCR (temperature coefficient of resistance). The shape, number, and orientation of the openings or slots are variable. In one embodiment, a header member is provided to fix or hold pins to the resistor.

The present disclosure relates to semiconductor structures and, more particularly, to resistor trimming structures and methods of use. The structure includes: a set of resistors each of which include an increasing resistance value; and a set of switches each of which are connected to a respective resistor of the set of resistors and each of which comprise a decreasing width dimension for each resistor of increasing resistance value.

The invention provides a 3D printing curved surface conformal resistor forming and precision control method, and solves the problems of poor resistance value precision and the like caused by material flow due to gravity factors, resistor morphology precision, thickness uniformity and the like when a resistor device is manufactured on a curved surface base material by transplanting an existing printing technology. Through one or more technical combinations of roughness differentiation design, precise milling within the range of not less than 2mm on the periphery of the deposited resistor area, rasterizing design or final normal printing form, printing and preparation of the precision-controllable resistor device on the surface of the curved-surface base material can be realized.

To provide a thin film chip resistor capable of preventing the resistance value from becoming unstable due to the heat generated by trimming and absorbed by a second parallel resistor pattern.SOLUTION: The thin film chip resistor includes a second parallel resistor pattern 24e in which an adjacent folded portion of a zigzag resistor pattern 24b is connected by a substantially U-shaped resistor pattern 24d. Each of the approximately U-shaped resistor patterns 24d has a separate trimming groove 30b formed opposite the longitudinal side of an insulating circuit board 21.SELECTED DRAWING: Figure 2

A chip resistor according to the present invention is provided with: an insulating substrate which has a first main surface that is an end face of the chip resistor in the thickness direction, and a first lateral surface and a second lateral surface that are end faces of the chip resistor in the longitudinal direction; a first surface electrode which is arranged on the first lateral surface-side end of the first main surface; a second surface electrode which is arranged on the second lateral surface-side end of the first main surface; a resistor which is arranged on the first main surface, while being electrically connected to the first surface electrode and the second surface electrode; a protective film which is arranged on the resistor so as to partially cover the first surface electrode and the second surface electrode; a first conductive resin layer which is arranged so as to extend over the first surface electrode and the protective film; and a second conductive resin layer which is arranged so as to extend over the second surface electrode and the protective film. The second lateral surface-side end of the first conductive resin layer and the first lateral surface-side end of the second conductive resin layer are at a distance from each other.

The invention relates to a resistor (1) with a conductive material layer (3) made of a conductive material, a resistive material layer (2) made of a resistive material and joined to the conductive material layer (3), and with a groove (4) having a specific groove width (b), a specific groove depth (t) and a specific groove flank angle relative to the plane of the conductive material layer (3), wherein the groove (4) is arranged in the conductive material layer (3) and separates the conductive material layer (3) into two connection parts (5, 6) and projects into the resistive material layer (2). According to the invention, the groove flank angle is set such that the temperature coefficient of the resistance value is as close as possible to zero. The invention also relates to an associated production method.

The application provides an automatic polishing device for alloy resistance strip and an alloy resistance production process. The automatic polishing device for alloy resistance strip comprises a rack, a polishing mechanism, a limiting roller, a sliding table and a winding disc. The alloy resistance strip is stored on the winding disc, and the end of the alloy resistance strip is fixed on the limiting roller. The sliding table is used to drive the winding disc to translate along the extension direction of the axis of the limiting roller. The polishing mechanism is arranged towards the limiting roller and is used to polish the alloy resistance strip on the limiting roller. The limiting roller is arranged in the automatic polishing device for alloy resistance strip to provide support for the alloy resistance strip, so that the polishing mechanism can stably contact the alloy resistance strip, the polishing quality is ensured, and the polishing efficiency is improved.

To provide a method of easily, accurately and efficiently adjusting a temperature coefficient of resistance of a current sense resistor and a shunt resistor, and the resistors.SOLUTION: A resistor 10 has one or more resistive elements 11, 13 and a plurality of conductive portions 12, 14, 16. Openings or slots 72 allowing adjustment of temperature coefficient of resistance (TCR) values of the resistor are formed adjacently to a second side, namely an inner side 20, of the first conductive portion 12. The shape, quantity and orientation of the openings or slots can vary. In one aspect, header members 80a, 80b are provided for securing or holding pins 84 relative to the resistor.SELECTED DRAWING: Figure 1

This chip resistor comprises a substrate, a first electrode and a second electrode, and a resistor. A first trimming groove and a second trimming groove are formed in the resistor. The first trimming groove has a first linear portion and a second linear portion. The first linear portion extends from a first end edge of the resistor toward a second end edge thereof along a second direction intersecting a first direction. The second linear portion extends from a distal-end portion of the first linear portion toward the second trimming groove. The second trimming groove has a third linear portion and a curved portion. The third linear portion extends from the first end edge of the resistor toward the second end edge thereof. The curved portion extends from a distal-end portion of the third linear portion toward the first trimming groove. The curved portion is convex in a direction from the first end edge toward the second end edge.

In a chip resistor, a first trimming groove has: a first linear portion extending linearly from a first edge along an X-axis direction; and a second linear portion extending linearly along the Y-axis direction. The second trimming groove includes: a third linear portion disposed on a second upper surface electrode side of the first linear portion and extending linearly along the first linear portion 1 from the first edge; and a fourth linear portion disposed on the second edge side of the second linear portion and extending linearly along the second linear portion from the tip of the third linear portion. When viewed in the X-axis direction, the tip of the second trimming groove is positioned closer to the second upper surface electrode side than the tip of the first trimming groove.

The invention relates to a sensor element (10) for measuring a temperature, comprising - at least one carrier (11) with an upper side (18) and a lower side (19), an insulating layer (12) being formed on the upper side (19) of the carrier (11), - at least two electrodes (13a, 13b), which are formed on the carrier (2) at a distance from one another, - at least one functional layer (15) comprising a material with a temperature-dependent electrical resistance, wherein the at least one functional layer (14) is arranged at least partially between the electrodes (13a, 13b), - at least two intermediate layers (14) comprising an insulating material, - at least two contact pads (16a, 16b) for electrically contacting the sensor element (10), wherein the sensor element (10) is designed to be integrated as a discrete component directly into an electrical system, and wherein the sensor element (10) has a small deviation range from a nominal resistance, wherein at least one of the at least two electrodes (13a, 13b) is structured for setting the resistance value. The invention also relates to a method for producing a sensor element (10).

The invention discloses a miniature low-resistance thick-diaphragm thermistor and a resistance value adjusting method thereof, and belongs to the technical field of production of thick-diaphragm thermistors. The miniature low-resistance thick diaphragm type thermistor comprises a ceramic substrate, a thermistor layer, a first end electrode, a second end electrode, a first interdigital electrode layer, a second interdigital electrode layer and a top electrode layer, wherein the first interdigital electrode layer, the second interdigital electrode layer and the top electrode layer are made of electric conductor materials; according to the resistance value adjusting method, the resistance value of the horizontal branch and the resistance value of the vertical branch are calculated firstly, and then the resistance value of the miniature low-resistance thick-diaphragm thermistor is calculated. According to the invention, the interdigital electrode layer and the top electrode layer are connected with the thermistor layer and are used as resistance adjusting assemblies, so that the low-resistance function and the resistance adjusting function of the thick film type thermistor are greatly realized through structure adjustment, and the use amount of noble metal can be reduced, so that the cost is reduced, and the product volume is reduced; and finally, the comprehensive functions of miniaturization, low resistance, low cost and convenience in resistance value adjustment are realized at the same time.

A sensor element (100) for measuring a temperature is described, comprising a carrier (2) and at least one functional layer (7) comprising a material with a temperature-dependent electrical resistance. The sensor element (100) further comprises at least two electrodes (4a, 4b) for electrically contacting the functional layer (7), wherein the respective electrode (4a, 4b) is spirally formed and wherein the electrodes (4a, 4b) are spirally guided into one another, wherein a contact pad (10a, 10b) is arranged directly on a partial region of one of the electrodes (4a, 4b). The sensor element (1) is designed to be integrated directly into an electrical system as a discrete component. Furthermore, a method for producing a sensor element (100) is described.

A plurality of resistors are disclosed herein. The resistor may include one or more resistive elements and a plurality of conductive portions. Openings or slots, which can be configured to adjust temperature coefficient or resistance (TCR) values of the resistor, are formed in the resistive elements. The shape, quantity, and orientation of the openings or slots can vary. In one aspect, header assemblies are provided for securing or holding pins relative to the resistors.

The invention relates to a sensor element (100) for measuring a temperature, comprising a carrier (2) and at least one functional layer (7), which comprises a material having a temperature-dependent electrical resistance. The sensor element (100) also has at least two electrodes (4a, 4b) for making electrical contact with the functional layer (7), each electrode (4a, 4b) being spiral-shaped and the electrodes (4a, 4b) being spirally guided one inside the other, wherein in each case a contact pad (10a, 10b) is arranged directly on a sub-region of one of the electrodes (4a, 4b). The sensor element (1) is designed to be directly integrated into an electrical system as a discrete component. The invention also relates to a method for producing a sensor element (100).

The invention relates to a resistor (1) with two plate-shaped terminal parts (4, 5) made of a conductor material and a plate-shaped resistive element (3) made of a resistive material arranged sandwich-like between them, such that the electric current (I) flows transversely to the plane of the plates through the plate-shaped resistive element (3). The invention provides that the upper and lower contact surfaces (6, 7) between the resistive element (3) and the upper and lower terminal parts (4, 5) are bounded by an upper and lower lacquer frame (10, 11) made of an electrically insulating solder mask, wherein the upper and lower lacquer frame (10, 11) is applied to the top and bottom surfaces of the resistive element (3) and frames the upper and lower terminal parts (4, 5), thereby defining the area of ​​the upper and lower contact surfaces (6, 7).Furthermore, the invention comprises a manufacturing unit with several non-isolated resistors (1) according to the invention, a printed circuit board arrangement with a resistor (1) according to the invention and a manufacturing method for producing a resistor (1) according to the invention.

The invention relates to a PTC heating element (1) with a three-dimensional base body (2) having at least two opposing main surfaces (3, 4), wherein the distance of the base body (2) between the main surfaces (3, 4) is the thickness D of the base body (2), and wherein the electrical resistance R of the PTC heating element (1) has a minimum at higher temperatures and a resistance characteristic that increases further at even higher temperatures, wherein the reference temperature Tref is the temperature at which the electrical resistance has twice the value at its minimum at Tmin, and wherein the following applies to Tref: Tref = ( 40 * D / mm + 107 ) * ° C with a tolerance of ±10 °C for 0.5 mm <= D <= 1.7 mm with a tolerance of D ± 0.25 mm 85 ° C < = Tref < = 175 ° C.

The invention relates to a PTC heating element having a three-dimensional main body (2) with at least two main surfaces (3, 4) facing away from each other, the distance of the main body (2) between the main surfaces (3, 4) being the thickness D of the main body (2), and wherein the resistance R of the PTC heating element (1) has a minimum value first as the temperature increases and has a resistance characteristic that continues to increase as the temperature continues to increase, the reference temperature Tref is the temperature at which the resistance has two times the minimum value at Tmin, and wherein for Tref, it is applicable: Tref = (40 * D / mm + 107) DEG C wherein the tolerance is + / -10 K, the applicable condition: 0.5 mm < = D < = 1.7 mm wherein the tolerance of D is + / -0.25 mm, 85 DEG C < = Tref < = 175 DEG C.

The invention discloses a preparation method of a four-terminal resistor and the four-terminal resistor. The preparation method comprises the following steps: applying a layer of photosensitive film on the lower surface of an alloy body, exposing part of the alloy body through exposure, development and etching, and applying a metal layer at the exposed position to serve as an end surface electrode and a voltage acquisition point; wherein the voltage acquisition point is directly connected with the resistance design area of the resistance alloy, the measurement result is closer to the design result, and the earlier-stage design of the product is facilitated; the photosensitive film is applied to the lower surface of the alloy body, part of the alloy body is exposed through exposure, development and etching, the exposed part serves as the application position of the four terminals, products of different specifications can use a unified etching pattern, and production process control is simplified.

The present invention provides a thin-film thermistor, an electronic device, and a method for adjusting the resistance value of a thin-film thermistor, which allow for more flexible and appropriate adjustment of electrical characteristics. [Solution] The thin-film thermistor comprises an insulating substrate, a temperature-sensing layer (31), a first electrode (321), and a second electrode (322). The temperature-sensing layer (31) is located on the first surface of the insulating substrate. The first electrode (321) is located in contact with the temperature-sensing layer (31). The second electrode (322) is located in contact with the temperature-sensing layer (31) but at a distance from the first electrode (321). The first electrode (321) and the second electrode (322) each have a plurality of separated electrode portions, which are a main electrode (88) and a sub-electrode (89).

The invention relates to a PTC heating element (1) with a three-dimensional base body (2) having at least two opposing main surfaces (3, 4), wherein the distance of the base body (2) between the main surfaces (3, 4) is the thickness D of the base body (2), and wherein the electrical resistance R of the PTC heating element (1) has a minimum at higher temperatures and a resistance characteristic that increases further at higher temperatures, wherein the reference temperature Tref is the temperature at which the electrical resistance has twice the value at its minimum at Tmin, and wherein the following applies to Tref: Tref = ( 40 * D / mm + 75 ) °C with a tolerance of + − 10 °C for 0.625 mm <= D <= 2.5 mm and with a tolerance of D + − 0.25 mm . 100 <= Tref <= 175 °C .

The invention relates to an electronic component, in particular to a high-reliability chip resistor with high-voltage resistance, which comprises a substrate layer, end electrodes are arranged at two ends of the substrate layer, a resistance layer is overlapped between the end electrodes, and a protective layer is arranged on the resistance layer. The resistance layer is composed of a resistance wire and a resistance adjusting area, wherein the resistance wire is located on the surface of the substrate layer and composed of resistance materials which are arranged in a sinuous sinusoidal mode. According to the invention, a sinusoidal line layout is adopted to increase the distance of the part with large voltage difference of the resistor wire, so that the breakdown voltage at two ends is improved, and the voltage resistance of the resistor is greatly improved.

A circuit substrate (10, 10A, 10B) according to the present disclosure includes a substrate body (11), a pair of electrodes (41, 42), a resistor (60, 60A), and a glass layer (70, 70A). The substrate body is made of a ceramic. The pair of electrodes (41, 42) are spaced apart from each other on the substrate body (11). Each of the resistors (60, 60A) is located so as to extend over the pair of electrodes (41, 42). The glass layer (70, 70A) covers the pair of electrodes (41, 42) and the resistor (60, 60A). The resistor (60, 60A) contains lanthanum hexaboride. A thickness of the glass layer (70, 70A) at an outer peripheral portion of the resistor (60, 60A) is greater than the glass layer (70, 70A) at a center portion of the resistor (60, 60A).

A columnar resistor and a method of laser trimming for manufacturing the same are provided. The columnar resistor includes a resistance layer disposed on the surface of a columnar substrate and the resistive layer includes a resistance determining area, a first resistance adjustment area, and a second resistance adjustment area. The resistance determining area is configured to form a first laser-trimming line and achieve a first resistance value by a first laser-trimming. The first resistance adjustment area is configured to form a second laser-trimming line and achieve a second resistance value by a second laser-trimming. The resistance value is precisely adjusted by two laser-trimming processes of the resistive layer, thereby improving the stability of product manufacturing.

The invention provides a chip resistor which has excellent surge characteristics and is suitable for miniaturization. In this chip resistor (1), for a crank-shaped resistor (7) having a first resistor part (7a), a second resistor part (7b), and a third resistor part (7c), a first adjustment groove (12) and a second adjustment groove (13) are formed using substantially point-symmetric positions of the upper and lower sides of the first resistor part (7a) as starting end positions. The terminal positions of the first adjustment groove (12) and the second adjustment groove (13) are set so as not to exceed a first straight line (A) that passes through the center (O point) of the first resistor body section (7a) and extends in the X-axis direction, and so as not to overlap on the same Y-axis.

The invention relates to a PTC heating element having a three-dimensional main body (2) with at least two main surfaces (3, 4) facing away from each other, the distance of the main body (2) between the main surfaces (3, 4) being the thickness D of the main body (2), and wherein the resistance R of the PTC heating element (1) has a minimum value first as the temperature increases and has a resistance characteristic that continues to increase as the temperature continues to increase, the reference temperature Tref is the temperature at which the resistance has twice the minimum value at Tmin, and wherein for Tref: Tref = (40 * D / mm + 75) DEG C wherein the tolerance of Tref is + / -10 K, the condition of application: 0.625 mm < = D < = 2.5 mm wherein the tolerance of D is + / -0.25 mm, 100 DEG C < = Tref < = 175 DEG C.