609results about "Resistor mounting/supporting" patented technology

A method of making resistors includes providing a sacrificial layer. Conductive material is then formed over a region of the sacrificial layer. Resistive material is then deposited over the first surface of the sacrificial layer such that the resistive material covers the sacrificial layer and the conductive material. A portion of the sacrificial layer is then removed to expose the conductive material. A method of making resistors includes the steps of providing a sacrificial layer, removing at least a portion of the sacrificial layer from regions of the sacrificial layer so as to create a plurality of cavities within the sacrificial layer, plating said cavities with a conductive material, disposing resistive material over the first surface of the sacrificial layer such that resistive material covers the sacrificial layer and said conductive material, and removing at least a portion of said sacrificial layer to expose the conductive material. In another embodiment, a method of making resistors includes the steps of providing a sacrificial layer having a roughened first surface and a second surface, depositing resistive material over the first surface of the sacrificial layer such that the resistive material covers the first surface of the sacrificial layer, and selectively etching the sacrificial layer to form electrodes.

An RF coaxial terminator includes an impedance match element mounted within a housing. The impedance match element includes a central conductive pin, a supportive element, and a resistor, wherein the resistor longitudinally extends in a direction that is not coaxial with the longitudinal axis of the central conductive pin.

The flexible PTC heating element according to the invention has one of the following constitutions. A portion of an electrodes and a PTC resistor is impregnated into a flexible substrate. A flexible substrate is made of resin foam or rubber material having a concave / convex shape formed on the surface. The flexible PTC heating element has an elongation deformation portion disposed to at least one of an electrode and a PTC resistor. A flexible substrate has adhesiveness and either a flexible substrate or a flexible cover material has an elongation control portion. Therefore, the flexible PTC heating element is highly flexible and excellent in vibration durability.

The flexible PTC heating element according to the invention has one of the following constitutions. A portion of an electrodes and a PTC resistor is impregnated into a flexible substrate. A flexible substrate is made of resin foam or rubber material having a concave / convex shape formed on the surface. The flexible PTC heating element has an elongation deformation portion disposed to at least one of an electrode and a PTC resistor. A flexible substrate has adhesiveness and either a flexible substrate or a flexible cover material has an elongation control portion. Therefore, the flexible PTC heating element is highly flexible and excellent in vibration durability.

A heating system in the form of a multi-layer, yet relatively thin and flexible panel. The panel contains a number of layers including first, second and third electrically insulating layers. A first electrically conductive resistive layer (heater layer) is sandwiched between the first and second insulating layers. A second electrically conductive resistive layer (resistive neutral plane layer) is sandwiched between the second and third insulating layers. The heater layer has a neutral electrical connection and a live electrical connection. The neutral and live electrical connections are electrically connected to each other at the panel only by electrically resistive material of the heater layer extending between the neutral and live electrical connections. The resistive neutral plane layer has a neutral electrical connection electrically connected with the neutral connection of the heater layer. The resistive neutral plane layer is electrically isolated from the live connection of the heater layer by the second insulating layer.

There is provided a method and circuit for trimming a functional resistor on a thermally isolated micro-platform such that a second functional resistor on the same micro-platform remains substantially untrimmed; a method and circuit for providing and trimming a circuit such that at least two circuit elements of the circuit are subjected to a same operating environment and the operating environment is compensated for by distributing heat generated during operation of the circuit among the two circuit elements; a method and circuit for trimming a functional resistor on a thermally-isolated micro-platform such that a constant temperature distribution is obtained across the functional resistor; and a method and circuit for calculating a temperature coefficient of resistance of a functional resistor.

A ball grid array resistor network has a planar substrate formed of an organic material. The substrate preferably is a printed circuit board. The substrate has a top and bottom surface. A ball pad is located on the bottom surface. A low temperature resistor is located on the bottom surface and is connected to the ball pad. A solder mask is located over the first surface except for the ball pads. A conductive ball is attached to the ball pad. A reflowed solder paste connects the conductive ball to the ball pad. Several embodiments of the invention are shown.

A resistor device includes a resistor plate having a first aperture, a second aperture, a third aperture and a fourth aperture respectively arranged on a first side, a second side, a third side and a fourth side thereof. A first electrode plate is coupled to the first side of the resistor plate and includes a first measurement zone and a second measurement zone disposed at opposite sides of the first aperture; and a second electrode plate is coupled to the third side of the resistor plate and including a third measurement zone and a fourth measurement zone disposed at opposite sides of the third aperture, wherein the first measurement zone and the third measurement zone are disposed at opposite sides of the second aperture, and the second measurement zone and the fourth measurement zone are disposed at opposite sides of the fourth aperture.

A resistor device includes a resistor plate having a first aperture, a second aperture, a third aperture and a fourth aperture respectively arranged on a first side, a second side, a third side and a fourth side thereof. A first electrode plate is coupled to the first side of the resistor plate and includes a first measurement zone and a second measurement zone disposed at opposite sides of the first aperture; and a second electrode plate is coupled to the third side of the resistor plate and including a third measurement zone and a fourth measurement zone disposed at opposite sides of the third aperture, wherein the first measurement zone and the third measurement zone are disposed at opposite sides of the second aperture, and the second measurement zone and the fourth measurement zone are disposed at opposite sides of the fourth aperture.

There is provided a method and circuit for trimming a functional resistor on a thermally isolated micro-platform such that a second functional resistor on the same micro-platform remains substantially untrimmed; a method and circuit for providing and trimming a circuit such that at least two circuit elements of the circuit are subjected to a same operating environment and the operating environment is compensated for by distributing heat generated during operation of the circuit among the two circuit elements; a method and circuit for trimming a functional resistor on a thermally-isolated micro-platform such that a constant temperature distribution is obtained across the functional resistor; and a method and circuit for calculating a temperature coefficient of resistance of a functional resistor.

A faucet includes a logical control, a spout, a hub, a handle, and a touch control operably coupled to at least one of the spout, the hub, and the handle.

A ball grid array resistor network that has a ground plane to reduce noise and improve signal integrity. The ball grid array resistor network includes a substrate having a first and a second surface and vias that extending through the substrate between the first and second surfaces. Resistors are located on the first surface between the vias. Conductors are located over the vias and are electrically connected to ends of the resistors. A cover coat covers the conductors and resistors. A ground plane is located on the second surface. An insulating layer is located over the ground plane. Ball pads are located over the vias. The ball pads are electrically connected to the vias. Solder spheres are attached to the ball pads.

A heating system in the form of a multi-layer, yet relatively thin and flexible panel. The panel contains a number of layers including first, second and third electrically insulating layers. A first electrically conductive resistive layer (heater layer) is sandwiched between the first and second insulating layers. A second electrically conductive resistive layer (resistive neutral plane layer) is sandwiched between the second and third insulating layers. The heater layer has a neutral electrical connection and a live electrical connection. The neutral and live electrical connections are electrically connected to each other at the panel only by electrically resistive material of the heater layer extending between the neutral and live electrical connections. The resistive neutral plane layer has a neutral electrical connection electrically connected with the neutral connection of the heater layer. The resistive neutral plane layer is electrically isolated from the live connection of the heater layer by the second insulating layer.

A manufacturing technique for constructing passive electronic components in vertical configurations is disclosed. Electrically passive components are constructed in a structure that is substantially perpendicular to target platform including a first plane to provide a larger electrode contact area and a smaller physical dimension. Passive components structured to be substantially perpendicular to a plane associated with a target platform can be directly connected to pad contacts of an integrated circuit or substrate or can be embedded in a package to reduce the area overhead of a passive component while improving the effectiveness of the passive components in their applications.

A ceramic electronic component that includes a ceramic element, and a coating film and external electrodes on a surface of the ceramic element. The coating film includes cationic elements from a constituent element of the ceramic element, which are ionized and deposited from the ceramic element, and a resin. The surface of the coating film is recessed relative to a surface of wrapping parts of the external electrodes on the surface of the ceramic element.

A metal strip resistor is provided. The metal strip resistor includes a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating on each of the first and second opposite terminations. There is also an insulating material overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided. The method includes coating an insulative material to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the conductive pattern, and adjusting resistance of the metal strip.

The over-current protection device of the present invention can be used for over-current protection to PCM. The over-current protection device comprises a PTC device, at least one insulation layer; at least one electrode layer and at least one conductive channel. The insulation layer is placed on a surface of the PTC device, and the electrode layer is formed on the insulation layer afterwards. As a result, the insulation layer is between the electrode layer and the PTC device. The electrode layer serves as a surface of the over-current protection device. The conductive channel electrically connects the PTC device and the electrode layer. In an embodiment, the conductive channel is a blind hole penetrating through the electrode layer and the insulation layer and ending at the surface of the PTC device, and the surface of the blind hole is coated with a conductive layer to electrically connect the PTC device and the electrode layer.

A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an embodiment of the present invention includes: a substrate having a circuit formed thereon; first to third pads laminated and separated from one another on the substrate; first to third terminals connected to the first to third pads, respectively; and first and second resistors formed between the first and second terminals and between the second and third terminals, respectively, and serially connected to each other and configured to adjust electric current flowed into the circuit.

A resistor for electric high-voltage apparatus, especially for connection to a diverter switch in an on-load tap changer for a high-voltage transformer. The diverter switch and the resistor are arranged in a housing with transformer oil. The resistor includes a number of resistor elements, wherein each resistor element includes a resistive element, arranged in a frame, which are electrically interconnected by a connection member. The frames are designed to enclose resistive elements that include spring elements formed from spirally wound resistance wire. Connection members include a connection plug. A method of mounting a resistor for electric high-voltage apparatus.

Known Hall sensors are fastened to a printed circuit board by way of component holders in order, by way of the component holders, to achieve an exact positioning and securing on the printed circuit board in relation to a magnet ring of a rotor of an adjusting motor. But a properly manufactured assembly that is executed by means of automatic placement machines is not possible with the known component holders. Therefore a component holder (1) for a Hall sensor (2) is proposed, which is partially injection molded only onto the connecting prongs (8, 9, 10) of the Hall sensor (2) or is injection molded onto connecting prongs (8, 9, 10) and at least partially onto a housing (12) of the Hall sensor (2). The component holder for a Hall sensor according to the invention is provided for adjusting motors, in particular for window regulator motors of motor vehicles.

Known Hall sensors are fastened to a printed circuit board by way of component holders in order to achieve an exact positioning and securing on a printed circuit board in relation to a magnet ring of a rotor of an adjusting motor. A component holder for a Hall sensor is partially injection molded only onto connecting prongs of the Hall sensor or is injection molded onto connecting prongs and at least partially onto a housing of the Hall sensor. The component holder for a Hall sensor according to the invention is provided for adjusting motors, such as window regulator motors of motor vehicles.

A surge protective device (SPD) module includes a module housing, first and second module electrical terminals mounted on the module housing, a gas discharge tube (GDT) mounted in the module housing, and a fail-safe mechanism mounted in the module housing. The GDT includes a first GDT terminal electrically connected to the first module electrical terminal and a second GDT terminal electrically connected to the second module electrical terminal. The fail-safe mechanism includes: an electrically conductive shorting bar positioned in a ready position and repositionable to a shorting position; a biasing member applying a biasing load to the shorting bar to direct the shorting bar from the ready position to the shorting position; and a meltable member. The meltable member maintains the shorting bar in the ready position and melts in response to a prescribed temperature to permit the shorting bar to transition from the ready position to the shorting position under the biasing load of the biasing member. In the shorting position, the shorting bar forms an electrical short circuit between the first and second GDT terminals to bypass the GDT.

A surface-mount positive coefficient thermistor includes a plate-like positive coefficient thermistor element, a pair of electrodes on the respective two main surfaces of the positive coefficient thermistor element, a pair of metal terminals each having a cutout at one end region connected to the corresponding electrode, the metal terminals including a metal having a low thermal conductivity, and solders each connecting the end region of the corresponding metal terminal to the outermost layer of the corresponding electrode. The metal terminal is readily and uniformly soldered to the electrode in a short period of time.

The invention relates to a resistor, comprising an insulating bar, a group of resistance pellets, and connection seats, wherein the resistance pellets are connected on the insulating bar in series; the connection seats are arranged at the two ends of the insulating bar respectively; a conductive damping piece is arranged between two adjacent resistant pellets and is sleeved on the insulating bar; and a pressure spring which is used for compressing the resistance pellets is arranged between one of the connection seat and the resistant pellet adjacent to the connection seat. According to the resistor, the conductive damping piece is arranged between two adjacent resistant pellets and is sleeved on the insulating bar, and the pressure spring which is used for compressing the resistance pellets is arranged between the connection seat at one end of the insulating bar and the resistant pellet adjacent to the connection seat, accordingly, each element of the resistor can be ensured to be electrically contacted well, and the conductive damping pieces between the resistance pellets have a damping function in a vibration environment, so that the resistance pellets are not easy to damage, and the problem that the resistance pellets are easy to damage in the vibration environment in the prior art is solved.

Circuit panels are provided with resistors in vias extending between the top and bottom surfaces of the panels. The resistors may be formed by depositing a composite in each via, as by depositing a dispersion of a conductive material and a dielectric or by depositing one or more thin layers of a conductor. The resistors may be disposed at interior locations buried within a multilayer circuit board formed by laminating one or more panels having such resistors with one or more additional elements.

A multiple chip resistor is manufactured in the following method. First electrode layers are formed on a first surface of a substrate. Resistor elements electrically connected to the first electrode layers, respectively, are formed on the first surface of the substrate. Slits are formed in the substrate for separating the first electrode layers. Edge electrodes connected to the first electrode layers at the edges of the slits, respectively, are formed on respective edges at the slits of the substrate. The substrate is divided at the slits into strip substrates. Portions of the edge electrodes are removed for electrically isolating the resistor elements from each other. The method provides the edge electrodes on each strip substrate with an improved dimensional accuracy, hence allowing the edge electrodes to be isolated electrically from each other. Consequently, the multiple chip resistor is prevented from being mounted defectively when the resistor is surface-mounted.