104results about How to "Shorten manufacturing time" patented technology

A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal particle, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line extends laterally beyond the metal particle towards the chip, and the chip and the metal particle are embedded in the encapsulant and extend vertically beyond the routing line in the same direction.

A luminous keyboard includes: a plurality of key caps; a light guiding plate disposed under the key caps; a reflector disposed under the light guiding plate; a masking layer disposed between the key caps and the light guiding plate; a membrane circuit unit disposed under the key caps and on the masking layer; and a luminous unit having a conductive lead, and an illuminant electrically connected to the conductive lead. The conductive lead is made of a material including a conductive polymer gel and a conductive powder and is formed directly on one of the reflector, the masking layer and the membrane circuit unit.

Several embodiments of integrated circuit probe card assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates. Interleaved spring probe tip designs are defined which allow multiple probe contacts on very small integrated circuit pads. The shapes of probe tips are preferably defined to control the depth of probe tip penetration between a probe spring and a pad or trace on an integrated circuit device. Improved protective coating techniques for spring probes are also disclosed, offering increased reliability and extended useful service lives for probe card assemblies.

The invention relates to a kind of low-sugar and low-fat biscuit and the preparation method. The method comprises following steps: preparing flour dough with yeast and medium-strength (or high-strength)flour, getting fermented flour dough, adding egg, sugar and oil and other findings into flour dough, mixing with fermented flour dough and enzyme agent, adding low-strength flour, shaping through roll marking, cutting or roll cutting, drying, cooling and getting finished product. The invention employs low-sugar and low-fat formulation, combines biological techniquie such as fermentation and enzyme agent and produces crisp biscuit.

A rigid filter for capsules suitable for extracting beverages, comprising a flat body having a plurality of through filtering holes, which are sized so as to block the passage of solid particles and allow passage of brewed water or beverage, wherein the holes have a substantially symmetrical shape with respect to the middle plane of the flat body, so that the filter can be inserted into a capsule without taking care of the orientation of such holes with respect to the powdered substance within the capsule.

Disclosed is a thin-film solid secondary cell (1) wherein a positive electrode collector layer (20), a positive electrode active material layer (30), a solid electrolyte layer (40), a negative electrode active material layer (50) and a negative electrode collector layer (20) are arranged on a substrate (10). The positive electrode active material layer (30) is a thin film composed of a metal oxide containing a transition metal and lithium, while the negative electrode active material layer (50) is a thin film composed of a semiconductor, a metal, an alloy or a metal oxide other than vanadium oxide. At least layers other than collector layers (20) are amorphous thin films. The substance constituting the solid electrolyte layer (40) is lithium phosphate (Li₃PO₄) or lithium phosphate added with nitrogen (LIPON).

A first resist pattern is formed by exposure using a first multi-tone photomask, and a first conductive layer, a first insulating layer, a first semiconductor layer, and a second semiconductor layer are etched, so that an island-shaped single layer and an island-shaped stack are formed. Here, sidewalls are formed on side surfaces of the island-shaped single layer and the island-shaped stack. Further, a second resist pattern is formed by exposure using a second multi-tone photomask, and a second conductive layer and the second semiconductor layer are etched, so that a thin film transistor, a pixel electrode, and a connection terminal are formed. After that, a third resist pattern is formed by exposure from a rear side using metal layers of the first conductive layer and the second conductive layer as masks, and the third insulating layer are etched, so that a protective insulating layer is formed.

The present invention generally relates to a woven preform for reinforced composite materials and a method of making thereof. Specifically, the present invention is a method of machine weaving fiber preforms for polymer matrix composites that consist of closed perimeters with multiple intersecting members in their interiors. More specifically, the invention is a woven preform and a method of forming thereof with closed cells at the outer edges with continuous hoop reinforcement in each cell of the preform. The woven preform is woven flat in both the warp and weft directions, and then unfolded to achieve the final shape of the structure, and can be processed into composite structural components using known methods such as resin transfer molding or chemical vapor infiltration. Thus, complicated shapes of all sizes can be woven on a conventional loom using the instant method.

The invention discloses a prepreg/resin film infiltration co-curing forming method for composite stiffened wallboards. The method comprises the following steps: 1, tailoring prepregs, dry fibers and resin films; 2, spreading the prepregs and sizing dry fiber preforms; 3, assembling and packaging a mould for the stiffened wallboards; 4, co-curing and forming the stiffened wallboards; and 5, demolding the stiffened wallboards. According to the method, a skin is prepared by adopting prepreg spreading, ribs are prepared by the dry fiber preforms and the resin films, and in combination with the characteristics of a prepreg autoclave process and a resin film melting process, the ribs, the skin and the adhesive interface of the ribs and the skin are cured in an autoclave at the same time, thus realizing the co-curing forming of the stiffened wallboards with different rib forms and different material systems. The method can significantly improve the forming efficiency of the stiffened wallboard structure, reduce the manufacture cost, improve the quality of products and improve the flexibility and designability of the manufacturing process and is of great significance to the efficient low-cost manufacture of the composite material stiffened wallboard structure.

The invention discloses a panchromatic micrometer LED display chip based on a gallium nitride nanopore array/quantum dot composite structure. On the GaN blue-light LED epitaxial layer of a silicon substrate, an array rectangular mesa structure penetrating through a p-type GaN layer and a quantum well active layer to a n-type GaN layer is disposed. Each rectangular mesa structure constitutes one RGB pixel unit. In each rectangular pixel unit, a red-light rectangular sub-pixel region, a green-light rectangular sub-pixel region and a blue-light rectangular sub-pixel region are included. The adjacent sub-pixel regions are isolated by an isolation trench. Each sub-pixel region is provided with a nanopore array structure and is filled with red and green quantum dots. Panchromatic display is realized by quantum dot color conversion. A preparation method of the panchromatic micrometer LED display chip is also disclosed. The panchromatic micrometer LED display chip utilizes a nanopore structureto improve the stability and lifetime of the quantum dots, and utilizes the energy resonance transfer between quantum dots to improve the internal quantum efficiency and color conversion efficiency,and achieve panchromatic display with high resolution, high color gamut, and high contrast.

The present invention discloses a metal separator for a fuel cell including a reaction gas channel formed to protrude from a first face of the metal separator to a second face thereof, a coolant channel formed between the reaction gas channels protruding from the second face of the metal separator, a reaction gas manifold opened to introduce a reaction gas into the metal separator, a coolant manifold opened to introduce a coolant into the metal separator, and a stepped portion positioned at any one of the space between the reaction gas channel and the reaction gas manifold, and the reaction gas channel. This configuration serves to widen the reaction gas flowing portion and the coolant flowing portion on the metal separator, and prevent deformation of the reaction gas flowing portion and the coolant flowing portion, thereby improving efficiency of the fuel cell.

A method for manufacturing passive devices and semiconductor packages using a thin metal piece is provided. According to the method, an adhesive layer is formed on a dummy substrate; a thin metal piece is bonded on the adhesive layer; a masking material is attached to the thin metal piece, a region where vias are to be formed is patterned, the thin metal piece is etched at a predetermined depth; the masking material is removed, the etched portion is filled with polymer to form a flat polymer layer, a masking material is attached on the polymer layer, a region that is to be attached to an IPD or an IC chip is patterned, a metal pad is formed, and the formed devices are attached to a lower substrate using the metal pad; the adhesive layer and the dummy substrate are removed, a masking material is attached on a surface exposed, a region where passive devices are to be formed is patterned, and the thin metal piece is etched at a predetermined depth; and solder bumps for surface mounting are formed.

A fuses the carbonate fuel cell electrolyte membrane integrated preparation method, belongs to the field of fuel cell technology, that is as follows: use sub-micro-grade alpha-LiAlO2 powder or gamma -LiAlO2 powder as raw material, take water as solvent, after the ball grinding dispersion, add electrolyte salt, continue ball grinding mix, again add Al2O3 fiber, ball grinding mix to form a pulp containing substrate diaphragm material and the electrolyte saltm, directly spread this pulp on the double pole plate fitted with electrode, dry to obtain a fused carbonate fuel cell electrolyte membrane. As the pulp contains no dispersant, binder and plasticizer, the height of cell pile assembled under room temperature and the height of cell pile at working temperature will not change. In the course of preparation and primary operation, it dose not discharge organic solvent and waste gases.

Disclosed herein is a backsheet for a photovoltaic module. The backsheet includes a dielectric layer, an adhesive layer disposed on the dielectric layer, a barrier layer disposed on the adhesive layer and bonded to the dielectric layer via the adhesive layer, and a weather resistant layer directly disposed on and bonded to the barrier layer by a powder coating method.

The over-current protection device of the present invention can be used for over-current protection to PCM. The over-current protection device comprises a PTC device, at least one insulation layer; at least one electrode layer and at least one conductive channel. The insulation layer is placed on a surface of the PTC device, and the electrode layer is formed on the insulation layer afterwards. As a result, the insulation layer is between the electrode layer and the PTC device. The electrode layer serves as a surface of the over-current protection device. The conductive channel electrically connects the PTC device and the electrode layer. In an embodiment, the conductive channel is a blind hole penetrating through the electrode layer and the insulation layer and ending at the surface of the PTC device, and the surface of the blind hole is coated with a conductive layer to electrically connect the PTC device and the electrode layer.

An optoelectronic semiconductor device includes an epitaxial substrate and a plurality of microsized optoelectronic semiconductor elements. The microsized optoelectronic semiconductor elements are disposed separately and disposed on a surface of the epitaxial substrate. A length of a side of each of the microsized optoelectronic semiconductor elements is between 1 μm and 100 μm, and a minimum interval between two adjacent microsized optoelectronic semiconductor elements is 1 μm.

This disclosure relates to an organic electroluminescent display device and a method of sealing the same capable of reducing a manufacturing time and a complexity of manufacturing process. The organic electroluminescent display device comprises a first substrate including an active area and a bezel area outside the active area, the first substrate including an organic light emitting layer and a passivation film covering the organic light emitting layer thereon; a second substrate facing to the first substrate; and a filling layer in a space between the first substrate and the second substrate, wherein the filling layer includes; a first region having a first hardness, and spaced apart at a predetermined distance from the a passivation film to surround the protective layer in the bezel area; and a second region having a second hardness lower than the first hardness, and positioned inside the first region to be contacted with the first region.

A cost effective, pressure-sealed, multi-page paper assembly is configured as a mailer-type of assembly for use as a business form, direct mail piece or other document to distribute information to end-users. The multi-page paper assembly is formed from a single ply or sheet of paper that permits use of such cost-saving technologies as laser printing and imaging of the single ply or sheet. The multi-page paper assembly includes a central transverse line of cross fold perforations and a plurality of lines of fold assist perforations that permit the single ply or sheet to be folded into a desired Z-fold, C-fold, eccentric C-fold, V-fold, double parallel-fold or other folded configuration having a number of inboard panels to serve as pages of the assembly. Deposits of pressure-activated cohesive along one or both surfaces of the single ply or sheet are placed to define those panels to serve as inboard boards and to adhere portions of the ply or sheet when folded. Cohesive deposits can form seals and thereby a secure seal multi-page paper assembly when pressure-sealed to protect contents. Use of low-tack deposits can form unsecured seals for use with direct mail pieces. Removal of stub portions of the paper assembly permits the sealed assembly to be opened in a book-like manner along the sealed cross fold perforations and access provided to the multiple of pages contained therein.

A windshield assembly includes a windshield frame constructed to support a windshield. A plurality of couplers are secured to the windshield frame, and a tower frame for a wakeboard tow rope or cable attachment, radar arch or the like is connected to the windshield frame via the couplers. In one arrangement, the couplers are connected to the wing sections of the windshield frame, and the tower frame extends between the wing sections and above an area defined between the wing sections. The integrated tower frame and windshield simplifies installation for the boat manufacturer while accommodating many varieties of tower and windshield configurations.

A remote monitoring system and method that packages, transmits, receives, decodes, stores, and distributes data sent from remote monitoring devices via a wireless network and that provides manufacturers with reduced wireless manufacturing expenses, data collection costs, dissemination costs, and wireless network access fees.

It is an object of the present invention to provide a method of manufacturing a display device, which can display images favorably by insulating a short-circuit portion between an anode and a cathode. Further, it is another object of the invention to provide a method of manufacturing a display device, which can prevent intrusion of moisture so as to inhibit deterioration of a light emitting element when the short-circuit portion between the anode and the cathode is insulated. Specifically, the invention provide a method of manufacturing a display device, wherein a reverse bias voltage is applied to the light emitting element including an electro-luminescent material between the anode and the cathode so as to insulate the short-circuit portion between the anode and the cathode at a temperature of from −40° C. to 8° C., more preferably, from −25° C. to 8° C.

A novel hot extrusion tee joint forming process comprises the following steps: Step one, rolling steel plates: a stamped steel plate is divided into three areas arranged in parallel according to the depth, namely an end part area, a middle part area and a tail part area; the wall thickness of the middle part area is greater than those of the end part area and the tail part area; smooth transition; Step two, molding and welding a steel tube, and manufacturing the steel tube: a thickening area is formed on the wall of the area where the middle part area is; Step three, trepanning, extruding and forming a tee joint workpiece: marking out a line and trepanning in the thickening area; Step four, shaping processing: heating to about 900 DEG C, heat preserving, and shaping. The novel hot extrusion tee joint forming process is optimized based on the conventional process, comparatively simpler, saves the steel tube flattening and bulging processes, greatly saves the product manufacturing time, and improves the working efficiency; when the flattening and bulging processes are saved, the manufacturing and molding time of a tee joint is greatly reduced, and the entire production cycle is substantially shortened.

A method of manufacturing a thin film transistor includes: forming a gate insulating layer on a substrate having a gate electrode; forming a semiconductor layer of nanomaterial on the gate insulating layer; forming a source electrode and a drain electrode on the gate insulating layer; and applying a voltage to the source electrode and the drain electrode to arrange a direction of the nanomaterial.

The invention provides an assembly-free manufacturing method and a device for a micro mechanical structure. The method comprises the following steps: establishing a three-dimensional model of each part of a target mechanical structure, digitally assembling the three-dimensional model into integral machinery, carrying out hierarchical slicing on the integral machinery to obtain each layer of processing graphs, and carrying out processing path planning on graphs on each layer to generate a numerical control program; taking a workpiece substrate to deposit a first material as a sacrificial material in a micro electro-deposition mode, carrying out area-selecting removal on the deposited sacrificial material according to the generated numerical control program in a micro electrical removal processing mode, etching out an area for depositing a structural material in the next step and depositing a second material as the structural material, repeating the steps until the sacrificial material at each layer and the structural material are completely shaped; and finally, removing the sacrificial material to release the mechanical structure, thereby obtaining the target mechanical structure. The invention further provides a device capable of realizing the assembly-free manufacturing method for the micro mechanical structure.

The invention provides a liner of a vacuum electric heating container and an electric kettle. The liner of the vacuum electric heating container comprises an inner liner body, a heating device and an outer liner body, wherein the heating device is installed on the bottom of the inner liner body, the outer liner body is connected with the inner liner body in a sealed mode, and a vacuum layer is arranged between the outer liner body and the inner liner body. According to the liner of the vacuum electric heating container, the outer liner body is only arranged on the outer side wall of the inner liner body, and the heating device is arranged on the bottom of the inner liner body, namely the vacuum layer is arranged between the inner liner body and the outer liner body. Compared with the prior art, the liner of the vacuum electric heating container has the advantages that parts related to a vacuum layer on the bottom of the inner liner body are omitted, and thus the production cost is reduced; meanwhile, due to the fact that the process for machining the vacuum layer on the bottom of the inner liner body is omitted, the product manufacturing time is shortened, namely the product manufacturing efficiency is improved; the product manufacturing cost is further reduced, and the market competitiveness of products is improved.

The invention provides a bottom case of a kitchen range and the kitchen range with the same. The bottom case of the kitchen range provided by the invention comprises a bottom wall and at least three side walls, wherein each side wall is provided with a horizontal flange; and an included angle is formed between ends of each two adjacent flanges. The bottom case of the kitchen range also comprises a jacket, which is used for packaging the ends of each two adjacent flanges and further connecting the two adjacent flanges. Due to the adoption of the technical scheme provided by the invention, the cost of a die can be greatly reduced, and the production efficiency is improved. In addition, due to the utilization of the jacket, the problem that when a gap is formed between each two adjacent flanges, water leakage is easy to occur at the gap is solved.

The present invention provides a testing method for LCD panels. First, a plurality of panels are formed on a substrate. Each panel has first conducting lines and second conducting lines, which are perpendicular to each other. The first conducting lines and the second conducting lines of adjacent panels are electrically connected, respectively. Finally, all panels on the substrate are simultaneously tested by a testing circuit.

A buckle structure includes a housing including a top plate and two side plates, a sliding wedge and a pivotal piece. Each side plate has a guiding slot. The sliding wedge is positioned below the housing and has projection portions projecting from its two sides. The projection portions are fit into corresponding guiding slots of the housing, and stoppers are positioned on top surface of the sliding wedge. The waist belt is fastened by the stoppers positioned on top surface of the sliding wedge so that the waist belt will not be loosed. Connection portions are extending from the top plate, and each connection portion has a through hole at its midpoint. Pivotal pins are extending from the pivotal piece and correspond to the through holes of the two connection portions. The pivotal piece is formed with the two pivotal pins so structure is simplified and cost is lowered.

The invention provides a wheel hub with a hollow structure. The wheel hub with the hollow structure comprises a rim, a plurality of spokes and an installation disc; one ends of the spokes are fixedly connected with the rim, and the other ends of the spokes are fixedly connected with the installation disc, and the plurality of spokes are uniformly distributed between the rim and the installation disc; the wheel hub is provided with a hollow structure; the hollow structure comprises a first part in a rim wall and a second part in spoke bodies; the first part and the second part are mutually communicated, and extend to the installation disc; one end of the hollow structure, which is positioned in the spokes, is sealed, and the other end of the hollow structure, which is positioned in a rim wall, is provided with an opening, and the opening is positioned on the inner wall surface of the rim; the inner wall surface of the rim is used for installing a vacuum tyre. The invention also provides an engine vehicle. A heat dissipation area of the wheel hub is increased for an empty cavity of the wheel hub provided with the empty cavity provided by the invention, and the integral weight of the wheel hub is lowered; the empty cavity and the inner part of the vacuum tyre are communicated, so that the intensity of pressure in the empty cavity and the intensity of pressure in the vacuum tyre are equal, and further the wheel hub has greater intensity; the safety of the wheel hub cannot be lowered under the condition of reducing the weight of the wheel hub.

A dough composition is disclosed comprising native starch, pre-gelatinized starch, egg, milk, bulking agent, and fat, wherein the dough contains less flour than starch as provided by the native and pregelatinized starches combined, and water serves as the primary leavening agent. A method of preparing a dough for a leavened product is also disclosed. The method involves combining native starch, pre-gelatinized starch, water, fat, egg and less than 3% by weight gluten at a temperature lower than the gelatinization temperature of the native starch.