The utility model relates to high -power
semiconductor module packaging technical field discloses a novel high -power
semiconductor module packaging, including concave
aluminium bottom plate, the concave
aluminium bottom plate top is provided with the shell, the concave
aluminium bottom plate inside
assembly is integrated without pressure piece utility
electrode, the concave aluminium bottom plate and utility
electrode between
assembly have conductive positive
electrode, conductive negative electrode,
semiconductor chip, integrated gate device body and
DBC substrate, and the concave aluminium bottom plate and utility electrode are fixed through the bolt on the elastic pressing plate, the utility model through the concave aluminium bottom plate and top each component
assembly are finished, use the first step encapsulation of insulating glue
perfusion mode, after 3 minutes of negative pressure 0.097mpa, secondary insulating glue
perfusion negative pressure 0.08mpa keeps 3 minutes, and product insulation effect can reach 10200V / min, ensure the normal use of maximum high -
power module 2000A and 6500V, solve the current device process complex, high -power
chip can not be positioned, and the problem that the assembly operation is complicated and difficult to
mass production.