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1551results about How to "Eliminate internal stress" patented technology

High-energy beam-ultrasonic composite additive manufacturing method for metal materials

The invention discloses a high-energy beam-ultrasonic composite additive manufacturing method for metal materials and belongs to the field of additive manufacturing (3D printing) of metal materials. The method comprises the steps that based on the technical principle of layer-by-layer accumulation of additive manufacturing, metal forming materials are melted through high-energy beams; after the metal forming materials are melted / solidified layer by layer to accumulate to a certain number of layers, the solidified layers are subjected to ultrasonic peening to have compressive plastic deformation, so the internal stress and the internal defects of formed parts are eliminated, and crystalline grains are refined; afterwards, the process of layer-by-layer melting / solidifying accumulation and the process of ultrasonic peening are continued until the whole forming process of metal members is completed. According to the method, real-time layer-by-layer treatment is performed on the solidified layers through ultrasonic peening, so the internal stress and the internal defects can be effectively reduced or eliminated, the crystalline grains can be refined, and the mechanical property of the metal members through additive manufacturing can be improved.
Owner:BEIJING INSTITUTE OF TECHNOLOGYGY

Manufacturing technology of molybdenum-based rare-earth alloy slab and equipment thereof

The invention relates to a process for manufacturing the molybdenum based rare earth alloy plate and equipment for manufacturing the same, wherein pure molybdenum powder is simultaneously added with four rare earth oxides of ZrO2, Y2O3, La2O3 and Nd2O3 according to certain ratio, by utilizing the chrematistics of long and large crystal grain and strong sag resistance and anti-creep property of rare earth alloy elements and the dispersion strengthening function, the re-crystallization temperature of the metal molybdenum is increased, the mechanical performances of the molybdenum based material such as tensile property, yielding behavior and extensibility are improved, and the application range of the molybdenum based material is widened; and the manufacturing process comprises production procedures of material preparation treatment, mixing treatment, forming treatment, sintering treatment, material making treatment and the like and the setting of various technical parameters of special technical equipment and process. With the preparation process, the molybdenum based rare earth alloy plate which has the advantages of good electric conductivity and heat conductivity, excellent high-temperature resistance and corrosion resistance and better mechanical performances such as tensile property, yielding behavior and extensibility, and fills in domestic blank and can replace the imported material can be manufactured.
Owner:四平市北威钼业有限公司

Manufacturing method of hot bent 3D (Three Dimensional) glass white sheet

The invention relates to a manufacturing method of a hot bent 3D (Three Dimensional) glass white sheet. The manufacturing method comprises the following steps: (1) cutting a material: cutting a glass white sheet material into a plurality of small glass white sheets with proper sizes; (2) finely engraving: putting the small glass white sheets into a CNC (Computer Numerical Control) fine engraving machine, and punching and grinding edges; (3) cleaning: carrying out cleaning treatment on the glass white sheet by utilizing a glass cleaning machine; (4) carrying out ultrasonic treatment: washing surface residual waste dreg on the surface of the glass white sheet by utilizing an ultrasonic washing machine; (5) hot bending: putting the glass white sheet into a hot bending mold and hotly bending, machining and molding the glass white sheet into a 3D curve surface; (6) tempering: putting the hotly bent glass white sheet into a tempering frame; conveying the tempering frame into a tempering furnace and raising the temperature to 380 DEG C-420 DEG C, wherein the heating time is 4h-8h and the hardness reaches 7H; (7) carrying out plasma spraying: putting the glass white sheet into a fingerprint oil spraying machine and spraying fingerprint oil on a surface through plasmas; baking at a temperature of 140 DEG C-160 DEG C for 25-30 minutes until the fingerprint oil is dried; (8) fitting: fitting release films on upper and lower surfaces of the glass white sheet; and (9) packaging.
Owner:DONGGUAN YUANMEI PRECISION ELECTRONICS CO LTD

Wafer level chip size package and manufacturing method thereof

The invention discloses a wafer level chip size package and a manufacturing method of the wafer level chip size package, belonging to the field of sensors. The wafer level chip size package comprises a wafer, wherein the positive surface of the wafer is a first surface which forms an image sensing region, the negative surface of the wafer is a second surface, and the first surface comprises a microlens, a metal interconnection layer and an optical interaction region from top to bottom; a silicon through hole which does not penetrate through a silicon substrate and a redistribution region are manufactured on the first surface, and I/Os at the periphery of the optical interaction region are connected with the silicon through hole; the wall of the silicon through hole is manufactured into a passivation layer and is filled; a polymer material is manufactured into a second protective layer on the redistribution region; the first surface is in bonding with a glass sheet, and a cavity is formed between the glass sheet and the wafer; the second surface is thinned and forms a groove structure through an etching process, and the silicon through hole is exposed; a line layer is manufactured on the second surface, and the silicon through hole is connected to a solder pad cushion; a welding prevention layer is manufactured on the line layer, and the solder pad cushion is exposed; and a solder ball is arranged on the solder pad cushion. With the adoption of the wafer level chip size package and the manufacturing method of the wafer level chip size package, the technological process is reduced, the reliability and the production efficiency of a product are improved, and the production cost is lowered.
Owner:BEIJING UNIV OF TECH

Electroplated diamond bur and manufacturing method thereof

The invention provides an electroplated diamond bur and a manufacturing method thereof. The electroplated diamond bur comprises a pure nickel base plated layer plated on a bur substrate, a sand plated layer plated on an alloy on the pure nickel base plated layer and a nano-diamond composite thickening plated layer plated on the sand plated layer on the alloy. The manufacturing method of the electroplated diamond bur comprises: the processing of the bur substrate, the treatment of the bur substrate and micron diamond and nanometer diamond powder before electroplating, preparation of a multi-component multi-layer composite plated layer at the head part of the bur and the heat treatment after electroplating. The electroplated diamond bur has higher hardness and wear resistance, the plated layers are difficult to wear during the using process, and the better holding force to diamond can be kept; on the one hand, the adoption of the heat treatment process after electroplating can eliminate internal pressure in the plated layers, on the other hand, the adoption of the heat treatment process can be simultaneously conductive to leading an interface between the bur substrate and the plated layer to form a diffusion layer, enhance the bonding force between the strengthening plated layer and the bur substrate, and greatly prolong the service life of the diamond bur.
Owner:HARBIN ENG UNIV

Hot-rolled steel wire rod for large bridge cable rope zinc-plated steel wire over 2000 MPa level and production method

The invention relates to a hot-rolled steel wire rod for a large bridge cable rope zinc-plated steel wire over the 2000 MPa level. Chemical components of the steel wire rod comprise, by weight percentage, 0.90-1.10% of C, 0.20-0.60% of Si, 0.30-0.90% of Mn, smaller than or equal to 0.010% of P, smaller than or equal to 0.005% of S, 0.10-0.40% of Cr, 0.010-0.070% of Al, 0.02-0.15% of V, smaller than or equal to 0.05% of Cu, 20-40 ppm of Ca, 20-90 ppm of N and the balance Fe and inevitable residual elements. The content of sorbite texture of the steel wire rod is larger than or equal to 95%. Thethrough ring range of the tensile strength is smaller than or equal to 70 MPa (uniformity). After the steel wire rod is subjected to drawing and zinc plating, the tensile strength of the zinc-platedsteel wire is larger than or equal to 2000 MPa, and the number of torsions is larger than or equal to 12. According to the technical flow of the steel wire rod, pretreatment of molten iron is carriedout, steel is smelted through a converter or an electric furnace, LF refining is carried out, RH degassing treatment is carried out, continuous casting of 390*510 cogged ingot is carried out, a blankis reheated, the blank is rolled, the surface of an intermediate billet is subjected to finishing, the intermediate billet is reheated, the intermediate billet is rolled, the steel wire rod is subjected to EDC water bath toughening treatment, and the steel wire rod is collected and packed.
Owner:JIANGYIN XINGCHENG GOLD MATERIALS CO LTD

Anneal technique for producing SPCC steel grade with zincing wire annealing oven

An annealing process of producing SPCC steel in annealing furnace on galvanizing line belongs to the field of the heat treatment technology of metal. Using the process can also meet the strength and plasticity requirement of strip steel on continuous annealing line. The method comprises the following procedures: the steel is heated to 630 minus or plus 20 DEG C by open fire; the steel is heated to 760 minus or plus 20 DEG C by a radiant tube; dew point is controlled below minus 40 DEG C; the steel is maintained at 710 minus or plus 20 DEG C by radiant tube; dew point is controlled below minus 40 DEG C; the strip steel is sprayed to 210 minus or plus 20 DEG C, the dew point of the first area of the spray section is controlled below minus 60 DEG C; and is cooled to 160 minus or plus 20 DEG C. The method can be used on the annealing furnace of the galvanizing line and be suitable for annealing of SPCC steel. The method can eliminate the internal stress of the rolling processing of strip steel, promote the plasticity and the toughness of the strip steel, and meet the strength and the plasticity requirement of the strip steel on the continuous annealing line. The tensile strength of product is approximately at 380Megapascal, the yield strength is below 330Megapascal, and the elongation is more than 36 percent. The grain size of product stabilizes between 11 and 13 Mum, the elongation and the stamping property are all at the higher level. The method can avoid the idle of the production equipment of galvanizing line and reduce the depreciation loss of equipment.
Owner:HEBEI IRON AND STEEL

Non-radiative multi-component composite tungsten negative material for microwave oven magnetron and preparation process of negative material

InactiveCN103849804AImproved winding performanceWinding Performance GuaranteeTransit-tube cathodesRheniumLutetium
The invention discloses a non-radiative multi-component composite tungsten negative material for a microwave oven magnetron and a preparation process of the negative material. The tungsten cathode material comprises lanthanum oxide, zirconium oxide, yttrium oxide, lutetium oxide, rhenium and tungsten, wherein the mass percent of each rare-earth oxide in the tungsten electrode material is 0.5%-1.5%, the mass percent of the total rare-earth oxides in the tungsten electrode is 2%-3%, the mass percent of the alloy element rhenium in the tungsten electrode material is 1%-4%, and the tungsten accounts for the rest mass percent. The tungsten cathode material is non-radiative, excellent in thermal emission performance, excellent in high-temperature creep resistance, thermal shock resistance and sag resistance, and long in service life. The preparation method of the non-radiative multi-component composite tungsten cathode material for the microwave oven magnetron comprises the steps of solution preparation, drying, reducing, isostatic cool pressing, sintering, incipient fusion, medium-frequency induction annealing, press working, winding and mechanical straightening. The non-radiative multi-component composite tungsten negative material for the microwave oven magnetron is better in usability. When heated periodically for a long time at a high temperature, the multi-component composite tungsten wire produced by virtue of the process is capable of going through large deformational resistance, and has the sag resistance.
Owner:深圳市威勒科技股份有限公司
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