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118 results about "Optical interaction" patented technology

Packaging structure and manufacture method for complementary metal-oxide-semiconductor transistor (CMOS) image sensors

The invention discloses a packaging structure and a manufacture method for CMOS image sensors, and belongs to the sensor field. An optical interaction area is placed at a center on a first surface on the front surface of a silicon substrate, a metal interconnection layer is formed on the optical interaction area, a micro lens array is placed on the metal interconnection layer, and a first protection layer is arranged on the outer side of the metal interconnection layer; silicon through holes not penetrating through the silicon substrate and a redistribution layer are manufactured on the first surface, and an input/output (I/N) around the optical interaction area is connected with the silicon through holes through the redistribution layer; passivation layers are manufactured on the silicon through hole walls, and the silicon through holes are filled; a second protection layer is arranged on the redistribution layer; the silicon substrate is bonded with a glass sheet, and a cavity is arranged between the glass sheet and the silicon substrate; the second surface of the silicon substrate is thinned to expose the silicon through holes; a line layer is manufactured on the second surface of the silicon substrate to connect the silicon through holes to pads, and a solder mask layer is manufactured on the line layer and exposes the pads; and solder balls are arranged on the pads. According to the packaging structure and the manufacture method for CMOS image sensors, the layering problem between the glass and the silicon substrate in the packaging structure is solved, the reliability is improved, and the packaging structure is suitable for chips with large sizes.
Owner:BEIJING UNIV OF TECH

Method for producing hologram by pico-second laser

Disclosed is a method of producing a hologram through a two-beam laser interfering exposure process, which comprises emitting a coherent laser light with a pulse width (τ) ranging from greater than 900 femtoseconds to 100 picoseconds and a laser power of 10 μJ/pulse or more using a solid-state laser as a light source, dividing the pulses light from the laser into two beams, controlling the two beams temporally and spatially in such a manner that the two beam are converged on a surface of or inside a workpiece for recording a hologram while matching the respective converged spots of the two beams with one another temporally and spatially to create the interference therebetween so as to record a surface-relief hologram on the surface of the workpiece or an embedded hologram inside the workpiece in an irreversible manner. The present invention can solve a problem with a conventional process of recording a hologram in a non-photosensitive material in an irreversible manner using interfering femtosecond laser pulses, specifically, distortion in the waveforms of pulsed laser beams and resulting instability in recording of an embedded hologram due to a non-linear optical interaction between the femtosecond laser pulses and air/the material.
Owner:JAPAN SCI & TECH CORP
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