Hot melt adhesive

A technology of hot melt adhesive and tackifier, which is applied in the directions of adhesives, adhesive additives, polymer adhesive additives, etc., can solve the problems of inability to adapt to bonding cables, weak adhesion of hot melt adhesives, and large melt viscosity, etc. To achieve the effect of strong adhesion, fast production speed and low melt viscosity

CN102653665AInactive Publication Date: 2012-09-05成都鑫三洋科技发展有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2012-09-05
Estimated Expiration
Not applicable · inactive patent
Patent Text Reader

Abstract

The invention discloses a hot melt adhesive which comprises the following components in parts by mass: 5-10 parts of EVA (ethylene-co-vinyl acetate), 2-6 parts of tackifier, 5-10 parts of diluent, 0.5-1.5 parts of antioxidant and 0.5-1.5 parts of plasticizer. The tackifier is one of rosin resin, petroleum resin, terpene resin, phenolic resin and epoxy resin; the diluent includes one or both of wax and low-molecular polyolefin; the antioxidant is phenolic antioxidant; and the plasticizer is DCHP (Dicyclohexyl phthalate). The EVA contains 20-30% of vinyl acetate monomer; and the wax is microcrystalline wax with molecular weight of 3,000-4,000 and melting point of 65-85 DEG C.
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Description

technical field

[0001] The embodiment of the invention relates to a hot melt adhesive and a preparation method thereof. Background technique

[0002] Hot-melt adhesive is a kind of plastic adhesive. Its physical state changes with temperature within a certain temperature range, but its chemical properties remain unchanged. It is non-toxic and tasteless. It is an environmentally friendly chemical product. Hot-melt adhesives have been used in many domestic industries. Wide application, the cable manufacturing industry also uses hot-melt tape or hot-melt adhesive film to wrap around the parts of the cables that need to be bonded, and melts after heating to play the role of bonding. The existing hot-melt adhesives for cables have weak bonding force, high melt viscosity, large equipment investment, and slow production speed, which cannot meet the needs of bonding cables. Contents of the invention

[0003] The present invention aims to solve the above-mentioned defects of the p...

Examples

Embodiment Construction

[0021] According to one embodiment of the present invention, the hot-melt adhesive is formed by mixing the following materials in parts by mass, 5 parts of EVA; 2 parts of rosin resin; 2 parts of wax; 3 parts of low-molecular polyolefin; 0.5 part of phenolic antioxidant; 0.5 parts of DCHP; the EVA contains 30% vinyl acetate monomer; the softening point of the rosin resin is 100° C.; the wax is a microcrystalline wax with a molecular weight of 3000 and a melting point of 65° C.

[0022] According to one embodiment of the present invention, it is formed by mixing the following materials in parts by mass, 8 parts of EVA; 4 parts of rosin resin; 4 parts of wax; 4 parts of low molecular polyolefin; 1.5 parts of phenolic antioxidant; 1.5 parts of DCHP; The EVA contains 35% vinyl acetate monomer; the rosin resin has a temperature of 110°C; the wax is a microcrystalline wax with a molecular weight of 4000 and a melting point of 85°C.

[0023] According to one embodiment of the present...