231results about How to "Improve manufacturing efficiency" patented technology

A pair of rimless spectacles includes two lenses, a frame including two temple units and a bridge, and a connection mechanism. The connection mechanism includes a plurality of first connectors spacedly provided at the lenses at a predetermined location and a plurality of second connectors provided at a predetermined location of each of the temple units and the bridge respectively, wherein the second connectors are coupled with the first connectors respectively to couple the temple units at two outer sides of the lenses respectively and to couple the bridge between two inner sides of the lenses respectively in a tool-less manner.

A trocar system including a cannula and an obturator assembly being at least partially insertable through the cannula. The obturator assembly including a housing, a penetrating tip disposed at a distal end, an elongated shield including a guard extending from a shaft are movable relative to the penetrating tip, and a latch mechanism disposed generally within the housing. The latch mechanism facilitates changing the configuration of the obturator assembly between a fixed-shield orientation, wherein at least a portion of the guard is maintained to extend at least partially distal of the penetrating tip to prevent puncturing of tissue by the penetrating tip, to a non-fixed shield orientation whereby upon application of force to the distal end of the obturator assembly, the guard and penetrating tip are permitted to move relative one another to facilitate puncturing of tissue by the penetrating tip.

A through electrode extends through a silicon substrate from the upper surface to the lower surface of the substrate to accomplish electrical conduction between the upper and lower surfaces of the substrate. The through electrode includes a plurality of slender through holes formed in a through electrode forming area of the silicon substrate. The slender through holes extend through the silicon substrate from the upper surface to the lower surface of the silicon substrate. The through electrode also includes a plurality of conductive bodies fitted in the slender through holes. The conductive bodies are electrically connected with each other.

An electrodeionization, (EDI) apparatus has flow cells with a sparse distribution of ion exchange (IX) material or beads. The beads extend between membranes defining opposed walls of the cell to separate and support the membranes, and form a layer substantially free of bead-to-bead dead-end reverse junctions. The beads enhance capture of ions from surrounding fluid in dilute cells, and do not throw salt when operating current is increased. In concentrating cells, the sparse bead filling provides a stable low impedance bridge to enhanced power utilization in the stack. A monotype sparse filling may be used in concentrate cells, while mixed, layered, striped, graded or other beads may be employed in dilute cells. Ion conduction paths are no more than a few grains long and the lower packing density permits effective fluid flow. A flow cell thickness may be below one millimeter, and the beads may be discretely spaced, form a mixed or patterned monolayer, or form an ordered bilayer, and a mesh having a lattice spacing comparable to or of the same order of magnitude as resin grain size, may provide a distributed open support that assures a stable distribution of the sparse filling, and over time maintains the initial balance of uniform conductivity and good through-flow. The cells or low thickness and this resin layers relax stack size and power supply constraints, while providing treatment efficiencies and process stability. Reduced ion migration distances enhance the ion removal rate without reducing the product flow rate. The sparse resin bed may be layered, graded along the length of the path, striped or otherwise patterned. Inter-grain ion hopping is reduced or eliminated, thus avoiding the occurrence of salt-throwing which occurs at reverse bead junctions of prior art constructions. Conductivity of concentrate cells is increased, permitting more compact device construction, allowing increases in stack cell number, and providing more efficient electrical operation without ion additions. Finally, ion storage within beads is greatly reduces, eliminating the potential for contamination during reversal operation. Various methods of forming sparse beds and assembling the stacks are disclosed.

The invention discloses a 3D printing method for a building beam component. The method comprises the steps of manufacturing a forming mold frame, wherein the forming mold frame is provided with a square groove with an opening in one side and a cavity, and the square groove is wrapped by the cavity; manufacturing a supporting frame body, wherein a printing mechanism and a heat steam jetting mechanism are mounted on a walking mechanism; adding heat exchange media to the cavity in advance, wherein the inner surface temperature of the forming mold frame reaches 35-40 DEG C; generating a 3D CAD model of the beam component on a computer, wherein the thickness of a concrete layer corresponding to each cross section layer is 5-10cm; sending a control command to the walking mechanism by the computer, and enabling the walking mechanism to do reciprocating movement on a beam, wherein the hot steam jetting mechanism jets hot steam to the surface of the formed concrete layer, and the temperature of the hot steam is 40-45 DEG C. According to the method, the manufacturing efficiency of the building beam component can be improved, labor cost and production cost are lowered, and due to the more precise control over the production process, the product with the higher quality can be obtained.

A sealed cooking pouch specifically designed for microwave cooking raw frozen protein entrees containing a raw meat protein portion, preferably beef, poultry, fish, pork or veal, along with starch, sauce and vegetable portions. The packaging material is manipulated into a pouch shape, meant to receive the protein entree ingredients before sealing, during the manufacturing process. The packaging material is composed of a heat-sealable polyester layer with a thin layer of aluminum deposited on one side and a layer of water-repellant 20 lb-25 lb. structural paper stock, laminated together through the use of a water-based adhesive. The aluminum can be uniformly deposited centrally where maximum temperature concentration is desired, and deposited in patterns that allow for temperature attenuation in parts of the package where this is desirable. The structural paper outer layer is treated with a wax emulsion to repel water that forms from condensation on the outside of the cooking pouch.

The invention provides a preparation method of a thin film transistor of a flexible electronic device. The method comprises the following steps of: (1) preparing a bendable and stretchable substrate; (2) stretching the substrate, and coating an adhesive on a surface of a stretched rubber substrate; (3) depositing a gate on the substrate; (4) depositing an organic dielectric layer unit on the device which is processed in the step (3); (5) respectively depositing a source unit layer and a drain unit layer on the organic dielectric layer unit; (6) loosening the substrate, releasing loads which are acted on the substrate, and carrying out heat treatment to eliminate an interface stress and a pressure stress of the device; and (7) depositing the organic dielectric layer unit. The invention provides the method for mechanically stretching the substrate, so the channel width of the device is reduced, manufacturing accuracy is improved effectively, and the resolution ratio of the flexible electronic device is improved.

The present invention provides a thermosetting type die bond film that can be preferably broken by tensile force. It is a thermosetting type die bond film used for a method of obtaining a semiconductor element from a semiconductor wafer by forming a reforming region by irradiating the semiconductor wafer with a laser beam and then breaking the semiconductor wafer in the reforming region or a method of obtaining a semiconductor element from a semiconductor wafer by forming grooves that do not reach the backside of the semiconductor wafer on a surface thereof and then exposing the grooves from the backside by grinding the backside of the semiconductor wafer, wherein the elongation rate at break at 25° C. before thermal curing is larger than 40% and 500% or less.

The invention discloses a concentrating flux plate and device transfer equipment. The concentrating flux plate comprises a first preset area and a second preset area. The concentrating flux plate is used for enabling the magnetic field generated by the magnetic components in the corresponding device transfer equipment to be concentrated in the first preset area and shielding the magnetic field inthe second preset area adjacent to the first preset area so that the corresponding magnetic field acting force of the magnetic field is enabled to be concentrated in the first preset area, and the device to be transferred by the device transfer equipment is enabled to be transferred to the preset position of the array substrate arranged on the bearing table of the device transfer equipment withinthe preset path range corresponding to the first preset area. A lot of devices can be rapidly arranged on the array substrate so that the manufacturing efficiency of the device array substrate including the devices and the array substrate can be enhanced.

The invention discloses a panchromatic micrometer LED display chip based on a gallium nitride nanopore array/quantum dot composite structure. On the GaN blue-light LED epitaxial layer of a silicon substrate, an array rectangular mesa structure penetrating through a p-type GaN layer and a quantum well active layer to a n-type GaN layer is disposed. Each rectangular mesa structure constitutes one RGB pixel unit. In each rectangular pixel unit, a red-light rectangular sub-pixel region, a green-light rectangular sub-pixel region and a blue-light rectangular sub-pixel region are included. The adjacent sub-pixel regions are isolated by an isolation trench. Each sub-pixel region is provided with a nanopore array structure and is filled with red and green quantum dots. Panchromatic display is realized by quantum dot color conversion. A preparation method of the panchromatic micrometer LED display chip is also disclosed. The panchromatic micrometer LED display chip utilizes a nanopore structureto improve the stability and lifetime of the quantum dots, and utilizes the energy resonance transfer between quantum dots to improve the internal quantum efficiency and color conversion efficiency,and achieve panchromatic display with high resolution, high color gamut, and high contrast.

A heat exchanger 10 includes a brazing heat exchanging tube S and a fin 4. The heat exchanging tube S and the fin 4 are brazed with each other via the brazing layer 11 of the heat exchanging tube S. The brazing layer 11 is formed by spraying of a brazing material consisting of Si: 6 to 15 mass%, Zn :1 to 20 mass%, at least one of Cu: 0.3 to 0.6 mass% and Mn: 0.3 to 1. 5 mass, and the balance being aluminum and inevitable impurities.

The invention relates to a secondary integrally-forming shoe, a shoe-making die and a producing method. The shoe-making die comprises a left-side baffle plate, a right-side baffle plate, a shoe last, a toe front baffle plate, an intermediate cover baffle plate, a sole cover plate and a die base plate; the left-side baffle plate, the right-side baffle plate, the shoe blast, the toe front baffle plate and the intermediate-cover baffle plate form a vamp die cavity; the left-side baffle plate, the right-side baffle plate, the shoe last, the toe front baffle plate and the sole cover plate form a shoe vamp and a sole die cavity; and the intermediate cover baffle plate and the sole cover plate are provided with feeding holes. The intermediate cover baffle plate and the sole cover plate can be used by stages, so that the vamp and the sole can be separated and injected into forming, or can be connected with the vamp while injecting the sole into forming in the same die, the vamp and the sole are formed from different flexible same injection material by injection and can be completely combined; in addition, the falling and the water seepage of the vamp and the sole can be completely avoided.

A multi-tone optical mask includes a substrate, a light-blocking pattern, a first semi-transmitting pattern and a second semi-transmitting pattern. The light-blocking pattern is formed on the substrate. The first semi-transmitting pattern is formed on the substrate. The second semi-transmitting pattern partially overlaps the first semi-transmitting pattern. The multi-tone optical mask has at least five different light-transmittances corresponding to a plurality of areas divided on the substrate.

The invention discloses micro device transfer equipment, a method for transferring micro devices by adopting the same and a micro device transfer board. The equipment comprises a bearing platform, themicro device transfer board and magnetic components, wherein the bearing platform comprises a bearing surface which is used for bearing an array substrate of to-be-received micro devices; the micro device transfer board comprises an attachment surface which is used for allowing to-be-transferred micro devices to be attached to, and the micro device transfer board is used for moving the to-be-transferred micro devices to the position above the bearing platform and enabling the to-be-transferred micro devices to face the array substrate; the magnetic components are arranged in the bearing platform or arranged on the surface, back to the bearing surface, of the bearing platform, and are used for generating magnetic fields and applying magnetic field acting force to the to-be-transferred micro devices when the to-be-transferred micro devices are located above the array substrate; the micro device transfer board is further used for releasing the micro devices when the to-be-transferred micro devices are located above the array substrate, so that the micro devices are transferred to the preset positions of the array substrate under the joint action of the gravity and the magnetic fieldacting force. A large number of micro devices can be rapidly arranged on the array substrate.

The invention belongs to the field of anticorrosion of wet chimneys and discloses an anticorrosion method of a chimney used for discharging wet-method desulfurized fume. The method comprises the following steps of: continuously producing fiber glass reinforced plastic protection plates 2 which have a ribbed strap structure by using a fiber glass reinforced plastic material which has high corrosion resistance in a pultrusion and compression molding mode; fixing the fiber glass reinforced plastic protection plates 2 on the inner surface of a fume discharging cylinder 1 of the chimney by means of hanging, fixing by bolts, bonding or welding; and smartly connecting the fiber glass reinforced plastic protection plates one another to form an airtight complete fiber glass reinforced plastic protection cylinder which can efficiently prevent leakage of the fume to protect the chimney against the corrosion by the wet-method desulfurized fume.

This invention discloses a multi-wavelength selective laser rapid prototyping system comprising laser light sources, laser transmission and control components, laser focusing and scanning components, manufacturing chamber, powder feeding components, powder laying components, gas circulation control components, real-time monitoring components, lifting components, powder recovery components, and computer. Said laser light source comprises a first laser source for providing a first wavelength laser beam and a second laser source for providing a second wavelength laser beam, or a laser source for providing both the first and second wavelength laser beams. Adoption of a short wave laser beam in the system is beneficial to improve the manufacturing resolution and precision. At the same time a superposed long wavelength laser beam is adopted to ensure the preheating and subsequent heat treatment. Thermal stress of the manufactured structure is reduced. Manufacturing efficiency is further improved. A multi-wavelength selective laser rapid prototyping method is also provided.

This steel has a chemical composition which contains, in mass%, 0.16-0.30% of C, 0.01-2.0% of Si, 0.35-1.45% of Mn, 0.05-3.0% of Cr, 0.001-0.2% of Al, 0.04-5.0% of Ni, 0.015%-1.0% of Sn, 0.004-0.05% of S, 0.003-0.03% of N, 0.005% or less of O, 0.025% or less of P, 0-1.0% of Mo, 0-1.0% of Cu, 0-0.005% of B, 0-0.3% of Nb, 0-0.3% of Ti, 0-1.0% of V, 0-0.01% of Ca, 0-0.01% of Mg, 0-0.05% of Zr, 0-0.1% of Te and 0-0.005% of a rare earth element, with the balance made up of Fe and impurities. If [Si%], [Ni%], [Al%] and [Sn%] are the contents of Si, Ni, Al and Sn in terms of mass%, the relation 42 ≥ 21 × [Si%] + 5 × [Ni%] + 40 × [Sn%] + 32 × [Al%] ≥ 8.5 is satisfied.

A method of forming a composite powder coating comprises depositing multiple layers of a powder coating composition onto a substrate, wherein adjacent layers are formed of a different powder coating composition; and curing the multiple layers of the powder coating composition in a single thermal curing step. The layers can be used to protect power generation equipment from aqueous corrosion, particle erosion, slurry erosion, fretting, and foulig.

The present invention provides a light diffuser plate, a surface emission light source apparatus and a liquid crystal display apparatus which are capable of preventing the generation of annoying noise in an area of contact between the light diffuser plate and a lamp box.

The present invention relates to a surface emission light source apparatus comprising a plurality of light sources disposed at a distance from each other in a lamp box, that is made of a resin and has an open front side, and a light diffuser plate that is made of a resin and is disposed on the front side of the frame of the lamp box so as to close the opening of the lamp box, wherein at least a part of the back surface of the light diffuser plate that makes contact with the front surface of the frame is formed as a matted surface, the matted surface has an arithmetic mean surface roughness Ra in a range from 0.8 to 15 μm and a mean surface irregularity interval Rsm in a range from 100 to 300 μm.

The present invention provides a refrigerator in which the manufacturing efficiency of a refrigerator is improved, repair or replacement of parts is facilitated even when a cooling failure occurs, or the cooling failure is suppressed to ensure cooling performance or improve reliability. Equipped with a refrigerator compartment (52) at the top of the freezer compartment (53), equipped with a vegetable compartment (54) at the bottom of the freezer compartment (53), and equipped with an electric cooler (58) and blower (64) at the back of the freezer compartment (53). In the refrigerator, a valve device (65) is provided above the blower (64) to control blowing cold air to the refrigerator compartment (53), and a part of the cold air through the valve device (65) is transported to the vegetable compartment (54).

Disclosed is a secondary battery pack including a battery cell having an anode and a cathode terminal formed at one face having a sealed surplus portion and a protection circuit module (PCM) electrically connected to the battery cell via the anode and the cathode terminal, wherein the PCM includes a board having a protection circuit formed thereon, the board being provided with an anode terminal connection part and a cathode terminal connection part connected to the anode terminal and the cathode terminal, respectively, the board is coupled to the anode terminal and the cathode terminal of the battery cell via the anode terminal connection part and the cathode terminal connection part and is mounted to the sealed surplus portion of the battery cell, and the secondary battery pack further includes a frame mounted to the PCM and the battery cell so as to surround the PCM and the battery cell.

The invention discloses a drilling machine, which comprises a machine platform, a frame, a movable platform, a cutting detection mechanism, a powder absorption device and an oil cooling device. The machine platform serves as a bearing device of the whole drilling machine, the frame is arranged on the machine platform, the movable platform comprises an X axis platform installed on the machine platform and a Y axis platform installed on the frame, the cutting detection mechanism is fixedly installed on the frame through a casing of the cutting detection mechanism, and the powder absorption device is arranged on the side of the frame and is communicated with the casing of the cutting detection mechanism through a connection pipe. At least six mechanical arm devices are arranged on the frame, and each mechanical arm device comprises a main holder device and an auxiliary holder device installed on the side of the main holder device. The drilling machine is compact in structure and high in manufacture accuracy and production efficiency, can save material resources and greatly lower production and manufacture cost.

In one embodiment, a feeder for agglomerating particles comprises an enclosure that has an inlet and an outlet and that is adapted to receive a predetermined amount of the agglomerating particles. An inlet valve controls entry into the enclosure, while an outlet valve controls discharge from the enclosure. A transportation system such as an auger system carries the agglomerating particles from the outlet valve to the inner portion of a drum, and, in order to prevent a clogging of the transportation system, the speed of the transportation system is coordinated with the opening rate of the outlet valve. The drum is adapted to spread out the agglomerating particles through perforations in the drum wall, so to cause the agglomerating particles to be delivered from the inner portion of the drum to a conveyor system outside the drum at a substantially uniform rate.

A method of manufacturing a semiconductor device, includes: a first resist film formation process of forming a first resist film on a processing target surface using a positive-type photoresist material; a first resist pattern formation process of forming a first resist pattern by performing development after exposure in which light is irradiated onto the first resist film; a second resist film formation process of forming a second resist film on the processing target surface, where the first resist pattern is formed, using a photoresist material; and a second resist pattern formation process of forming a second resist pattern by performing exposure in which light is irradiated onto the second resist film and then performing development. The method further includes an insolubilization process for insolubilizing the first resist pattern against a developer and a solvent of a photoresist material used in the second resist pattern formation process.

The invention relates to a liquid crystal panel repairing machine with fast lighting function, comprising a bearing table, a photograph laser mechanism, a clamping mechanism and at least one fast contact mechanism. The bearing table is used for bearing a liquid crystal panel; the photograph laser mechanism is arranged on the bearing table and provided with a slide way and a photograph laser head is arranged on the slide way, driven to move relative to the bearing table and used for emitting laser for the liquid crystal panel on the bearing table; the clamping mechanism is arranged on the bearing table and used for clamping and locating the liquid crystal panel on the bearing table; and the fast contact mechanism is arranged on the clamping mechanism and provided with a lifting head, and the lifting head is provided with a plurality of probes facing towards the liquid crystal panel on the bearing table. The invention has the functions of fast lighting to carry out scanning and laser repairing, and the like.

The invention provides a semiconductor device and method of manufacturing the same. A semiconductor device includes a substrate, a semiconductor element disposed on the substrate, and a heat conductive member composed of a solder material. The heat conductive member covers the semiconductor element, and is connected to a connection pad formed on the substrate. A heat radiator is disposed on the heat conductive member. The heat conductive member thermally connecting the semiconductor element to the heat radiator reduces the risk that electromagnetic noise may be emitted from or may be incident on the semiconductor element.

A method for producing a fiber prefabricated rod comprises the following steps of: (1) preparing a fiber core rod by the vapor axial deposition VAD technology; (2) preparing a fluorine-doped bogging cladding by the plasma chemical vapor deposition PCVD technology, followed by melting the fluorine-doped bogging cladding with the fiber core rod prepared in Step (1) to produce a fiber core rod prefabricated component; (3) preparing an outer cladding of the fiber core rod prefabricated component by the outer vapor deposition OVD technology, followed by sintering to finally obtain the transparent fiber prefabricated rod. The fiber core rod includes a cladding with the ratio of the cladding diameter to the core diameter being within the range from 3.2 to 4.6; the diameter ratio of the initial position of the fluorine-doped bogging cladding to the core ranges from 3.2 to 4.6; and the ratio of the fluorine-doped bogging cladding width to the core diameter ranges from 0.24 to 0.49. By the adoption of the method provided by the invention, the key technology for the high-efficient large scale production of single-mode fibers is solved, the manufacture efficiency of the curly insensitive single-mode fiber prefabricated rod is greatly raised, and the production cost is reduced.

The invention discloses a battery hot press. The battery hot press comprises a working platform, a cold pre-pressing mechanism, hot pressing mechanisms, a hot final-pressing mechanism, a material feeding mechanism support a, a material feeding mechanism support b, a material feeding mechanism moving part a, a position changing device of the material feeding mechanism moving part b, a material grabbing mechanism a, material grabbing mechanisms b, material input mechanisms, and an output mechanism. The working platform of the battery hot press is successively provided with the cold pre-pressing mechanism, the six hot pressing mechanisms and the hot final-pressing mechanism from the left to the right. The cold pre-pressing mechanism, the six hot pressing mechanisms and the front side of the hot final-pressing mechanism are all provided with the material feeding mechanisms. The material grabbing mechanism a stretches across the upper portion of the material feeding mechanism support a and the upper portion of the material feeding mechanism support b. The left end of the material grabbing mechanism a and the right end of the material grabbing mechanism a are provided with the material input mechanism and the material grabbing mechanism b respectively. The front sides of the material grabbing mechanisms b are provided with output mechanisms. Through the method, the battery hot press can quickly and efficiently conducts cold pressing and hot pressing on battery blank, improves production and manufacturing efficiency and lessens labor intensity of workers.

A method of manufacturing a blazed diffractive grating includes a first step of forming a first groove having a first surface and a second surface by moving, in the first direction at a first position in the second direction, a cutting tool having a first cutting blade and a second cutting blade to cut the object; a second step of forming a second groove by moving, in the first direction at a second position separated from the first position in the second direction by a grating pitch, the cutting tool to cut the object; and a third step of forming a blazed surface of the first groove using the first cutting blade by moving, in the first direction at a third position between the first position and the second position, the cutting tool to cut the first surface of the first groove.

The invention relates to a traffic information reading method based on a coding traffic sign. The traffic information reading method comprises the following specific steps: arranging a calibration area and a traffic information area on a traffic sign board, dividing the traffic information area into a plurality of information regions, dividing the information regions into a plurality of information subareas, and assigning each information subarea; drawing a calibrating pattern in the calibration area; forming a standard traffic sign board picture; enabling the corresponding values of the information subareas in the same information region or the sum of the corresponding values of any one information subareas to correspond to one type of traffic information to form a standard list; manufacturing the traffic sign board; shooting the traffic sign board to obtain a real picture; and comparing the real picture with the standard traffic sign board picture to obtain traffic information by combining with the standard list. Traffic sign identification speed and accuracy can be improved, a traffic information integration level is high so as to reduce traffic sign board arrangement amounts, the traffic sign boards are unified, the production and manufacture efficiency of the traffic sign boards are improved so as to lower production cost, and the invention is suitable to widely popularize.