[0023] The word "embodiment" used in this specification means an example, example, or illustration. In addition, the article "a" used in this specification and appended claims can generally be construed as "one or more" unless otherwise specified or the singular form can be clearly determined from the context.
[0024] reference figure 1 , figure 2 with image 3 , figure 1 It is a schematic diagram of the positional relationship between the device transfer device provided with the magnetic conductive plate 106 and the array substrate 102 on which the device 104 is to be provided according to the present invention, figure 2 Is a schematic diagram of the first embodiment of the magnetic conductive plate 106 of the present invention, image 3 It is a schematic diagram of the second embodiment of the magnetic conductive plate 106 of the present invention.
[0025] The magnetic conductive plate 106 of the present invention can be installed in a device transfer device.
[0026] The device transfer device includes a carrying table 101, a device transfer board 103 and a magnetic member 105.
[0027] The carrying platform 101 has a carrying surface for carrying the array substrate 102 of the device 104 to be received.
[0028] The magnetic conductive plate 106 is arranged above the bearing surface of the carrying platform 101 or arranged in the carrying platform 101, and the magnetic conductive plate 106 is used to make the magnetic field generated by the magnetic member 105 concentrate in a first predetermined area 1061, and shield the magnetic field at a second predetermined area 1062 adjacent to the first predetermined area 1061, so that the magnetic field force corresponding to the magnetic field is concentrated in the first predetermined area 1061, thereby Therefore, the device 104 is transferred to the predetermined position on the array substrate 102 within a predetermined path range corresponding to the first predetermined area 1061.
[0029] The magnetic conductive plate 106 is used to transmit the magnetic field in the first predetermined area 1061 and to shield the magnetic field in the second predetermined area 1062.
[0030] The first predetermined area 1061 corresponds to the area in the array substrate 102 where the device 104 is to be disposed. At least two of the first predetermined regions 1061 are arranged in a one-dimensional array or a two-dimensional array.
[0031] The magnetic conductive plate 106 is also used to form magnetic lines of induction at the first predetermined area 1061 to increase the strength of the magnetic field force acting on the device 104.
[0032] The material of the magnetic conductive plate 106 is a material with a magnetic permeability greater than a predetermined value.
[0033] The material of the magnetic conductive plate 106 is iron.
[0034] In the case that the magnetic conductive plate 106 is disposed above the bearing surface, the magnetic conductive plate 106 has a predetermined distance from the bearing surface.
[0035] At least two of the magnetic members 105 constitute a magnetic field source array, the magnetic members 105 are used as magnetic field sources, and at least two of the magnetic field sources are arranged in a one-dimensional array or a two-dimensional array. The magnetic field source is a permanent magnet or an electromagnetic generator.
[0036] In the case where the magnetic field source is the electromagnetic generator, the magnetic member 105 further includes a switch control line, a switch, and a power supply line. The switch is a triode switch.
[0037] The switch is connected with the switch control line, the power supply line, and the electromagnetic generator. The switch is used to open or close the current channel between the power supply line and the electromagnetic generator under the control of the switch control signal provided by the switch control line.
[0038] The device transfer board 103 has an attachment surface, the attachment surface is used to attach the device 104 to be transferred, and the device transfer board 103 is used to move the device 104 to be transferred above the carrier 101 , And used to make the device 104 to be transferred face the array substrate 102.
[0039] The magnetic member 105 is placed in the carrying table 101 or on the surface of the carrying table 101 facing away from the carrying surface. The magnetic member 105 is used to generate a magnetic field and is used to When the device 104 is located above the array substrate 102, a magnetic field force is applied to the device 104 to be transferred.
[0040] Wherein, the device transfer board 103 is also used to release the device 104 when the device 104 to be transferred is located above the array substrate 102, so that the device 104 is under the common force of gravity and the magnetic field. Transfer to a predetermined position on the array substrate 102 under the action.
[0041] The device transfer board 103 is also used to reduce the adsorption force of the device 104 when the device 104 to be transferred is located above the array substrate 102, so as to release the device 104, so that the device 104 is Under the combined action of the gravity and the magnetic field, it is transferred to the predetermined position on the array substrate 102.
[0042] Wherein, the adsorption force is at least one of intermolecular force, electrostatic force, and magnetic force.
[0043] The magnetic member 105 is used to first increase the strength of the magnetic field force acting on the device 104 when the device 104 to be transferred is located above the array substrate 102, so that the device 104 and the The device transfer plate 103 is separated from each other, and the strength of the magnetic field force is reduced during the falling process of the device 104.
[0044] The device also includes a connector for heating the soldering material between the array substrate 102 and the device 104 transferred to the array substrate 102, so that the soldering material is melted and connected The device 104 and the array substrate 102.
[0045] The predetermined position corresponds to the pixel area in the array substrate 102.
[0046] In the case where the adsorption force is an electrostatic force, the device transfer plate 103 is used to reduce the amount of charge that applies the electrostatic force to the device 104.
[0047] The size of the device 104 is smaller than a predetermined value. The device 104 is a light emitting diode lamp.
[0048] The device 104 has magnetic poles. The device 104 has an electrode terminal.
[0049] The device array substrate includes an array substrate 102, a device array, and a fixing member.
[0050] The array substrate 102 is provided with a first wire array, a second wire array, a control switch array, and a contact electrode array. The first wire array includes at least two first wires. One direction is arranged in a one-dimensional array, the second wire array includes at least two second wires, and at least two of the second wires are arranged in a one-dimensional array along a second direction perpendicular to the first direction, The control switch array includes at least four control switches, the at least four control switches are arranged in a two-dimensional array along the first direction and the second direction, the contact electrode array includes at least four contact electrodes, and the control switch Connected with the first wire, the second wire and the contact electrode.
[0051] The device array includes at least two devices 104, at least two of the devices 104 are arranged in a one-dimensional array or a two-dimensional array, the devices 104 are arranged on the array substrate 102, and the devices 104 are passed through a device transfer device It is arranged on the array substrate 102.
[0052] The fixing member is made by coating a photoresist material on the array substrate 102 provided with the device 104, so that the photoresist material is in contact with both the device 104 and the array substrate 102, and reacts to the light The resist material is made by curing, and the fixing member is used to fix the device 104 on the array substrate 102.
[0053] The array substrate 102 is used to connect with the device array including at least two of the devices 104 to form the device array substrate.
[0054] The contact electrode is used to receive the device 104 and connect with the device 104, the contact electrode has a first area, the device 104 has a second area, and the second area is the device 104 and the device 104. The contact area of the contact electrode, the first area is greater than twice the second area.
[0055] The magnetic conductive plate 106 may also be disposed in the array substrate 102.
[0056] There is a gap between two adjacent devices 104 disposed on the array substrate 102, and the fixing member fills the gap.
[0057] The fixing member is in contact with at least a part of the side wall of the device 104.
[0058] The fixing member covers the device 104, and the fixing member is also used to package the whole composed of the device 104 and the array substrate 102.
[0059] The fixing member is cured by heating the photoresist material by a heat source, and/or the fixing member is cured by irradiating the photoresist material with an ultraviolet light source.
[0060] The method for transferring the device 104 by the device transfer apparatus of the present invention includes the following steps:
[0061] A. The device transfer board 103 moves the device 104 to be transferred to the upper side of the stage 101, and makes the device 104 to be transferred face the array substrate 102.
[0062] B. The magnetic member 105 applies a magnetic field force to the device 104 to be transferred when the device 104 to be transferred is located above the array substrate 102.
[0063] C. The device transfer board 103 releases the device 104 when the device 104 to be transferred is located above the array substrate 102, so that the device 104 is transferred under the combined action of gravity and the magnetic field To a predetermined position on the array substrate 102.
[0064] The step C is:
[0065] When the device 104 to be transferred is located above the array substrate 102, the device transfer board 103 reduces the adsorption force of the device 104 to release the device 104, so that the device 104 is under the gravity. It is transferred to the predetermined position on the array substrate 102 under the combined action of the force of the magnetic field.
[0066] Wherein, the adsorption force is at least one of intermolecular force, electrostatic force, and magnetic force.
[0067] The step B includes:
[0068] b1. The magnetic member 105 first increases the intensity of the magnetic field force acting on the device 104 when the device 104 to be transferred is located above the array substrate 102, so that the device 104 and the The device transfer board 103 is separated.
[0069] b2. The magnetic member 105 reduces the strength of the magnetic field force when the device 104 is falling.
[0070] The method also includes the following steps:
[0071] D. The connector heats the soldering material disposed between the array substrate 102 and the device 104 transferred to the array substrate 102 to melt the soldering material and connect the device 104 and the array substrate 102.
[0072] The predetermined position corresponds to the pixel area in the array substrate 102.
[0073] The manufacturing method of the device array substrate of the present invention includes the following steps:
[0074] E. A device array is arranged on the array substrate 102, wherein the device array includes at least two devices 104, and at least two of the devices 104 are arranged in a one-dimensional array or a two-dimensional array.
[0075] F. Apply a photoresist material to the array substrate 102 provided with the device 104, so that the photoresist material contacts both the device 104 and the array substrate 102.
[0076] G. Curing the photoresist material to form the fixing member, which is used to fix the device 104 on the array substrate 102.
[0077] There is a gap between two adjacent devices 104 disposed on the array substrate 102.
[0078] The step F includes:
[0079] f1. Coating the photoresist material on the gap.
[0080] The fixing member is in contact with at least a part of the side wall of the device 104.
[0081] The step F also includes:
[0082] b2. Coating the photoresist material on the device 104 to package the whole composed of the device 104 and the array substrate 102.
[0083] The step G includes:
[0084] c1. Use a heat source to heat and cure the photoresist material to form the fixing member; and/or
[0085] c2. Use an ultraviolet light source to irradiate the photoresist material for curing to form the fixing member.
[0086] The core of the device 104 (Micro Device) transfer device and method of the present invention is to "throw" or "jet print" from the device transfer board 103 (Donor substrate) to the array substrate 102 (Receiver substrate) through magnetic interaction. The device 104 eliminates the complicated and lengthy precise alignment process.
[0087] In the carrier 101 or below the array substrate 102, there is a magnetic field formed by a permanent magnet or an electromagnetic generator. The force of the magnetic field corresponding to the magnetic field is used to make the magnetic device 104 can be adsorbed by the array substrate 102.
[0088] The device transfer device and method of the present invention can be applied to any one or a combination of the following three situations:
[0089] (1) The device 104 having a vertical electrode structure;
[0090] (2) There is only one electrode contact on the array substrate 102;
[0091] (3) A specific position of the device 104 needs to be in contact with the array substrate 102.
[0092] At this time, the precise alignment and the complex force interaction process of the device transfer board 103 and the array substrate 102 are no longer required, and only the attraction of the device transfer board 103 to the device 104 is reduced, so that all The device 104 is separated from the device transfer board 103 and moves toward the array substrate 102 under the combined action of gravity and magnetic field. The device transfer plate 103 adsorbs the device 104 through intermolecular force, hydrogen bond, electrostatic force or magnetic force or other chemical and physical means. During the transfer of the device 104, the adsorption force of the device transfer plate 103 is weakened For example, it can be accomplished by reducing the electrostatic force by reducing the current at the head of the array substrate 102; on the other hand, the attractive force of the array substrate 102 can be increased accordingly, for example, when the device is transferred During the advancement of the board 103, the magnetic field strength jumps and then drops, so that the device 104 is forced to leave the device transfer board 103.
[0093] Take the device 104 as a Micro LED as an example. The Micro LED needs to be in contact with and bonded to a single side of the array substrate 102. The device transfer board 103 is located above the array substrate 102, and the two move towards each other. The device transfer board 103 is located in the array When the pixel area in the substrate 102 is above, the reduction of the adsorption force of the device transfer plate 103 or the increase of the attractive force of the array substrate 102 or the combination of the two causes the Micro LED to separate from the device transfer plate 103 and fall On the array substrate 102, the connection is realized by heating with solder or the like at the connection point.
[0094] The above process does not use precise alignment operations, nor is there a connection between the device transfer board 103 and the array substrate 102 through the device 104, and the device transfer board 103 and the array substrate 102 are non-contact. In the process of moving toward each other, a large number of the devices 104 can easily fall on the array substrate 102. What is important is that in order to ensure the correct drop position, the drop position of the electrode of the device 104 is the pixel area of the array substrate 102.
[0095] In order to ensure that the device 104 is "thrown" or "jet-printed" in the correct position, the present invention uses a patterned plate (magnetic conductive plate 106) that shields the magnetic field between the magnetic field and the array substrate 102. The magnetic conductive plate 106 is made of a material with high magnetic permeability, and is placed between the stage 101 (Stage) and the magnetic member 105, so that the magnetic lines of force at the predetermined position can pass, and the magnetic lines of force at positions other than the predetermined position are made as far as possible. It is closed between the plates, thereby greatly reducing the force of the magnetic field in the invalid position (position other than the predetermined position).
[0096] The magnetic field source is patterned and corresponds to the position of the pixel or the device 104 one-to-one.
[0097] Further, for example, when a Micro LED or other Micro Device is in contact with the array substrate 102, in order to meet the above requirements, the contact area can be designed to be larger.
[0098] A small part of the magnetic field passes through the hollow area (the first predetermined area 1061) of the magnetic conductive plate 106, and other areas of the magnetic conductive plate 106 are mainly shielded by materials with higher magnetic permeability.
[0099] The hollow area of the circular hole of the magnetic conductive plate 106 has a small amount of magnetic lines passing through, so that the magnetic force on the corresponding position is greatly enhanced. This high permeability material, such as iron, can be made into corresponding pixels by photolithography. Area opening, non-pixel area shielding structure.
[0100] The size of the electrode on the array substrate 102 that is in contact with the device 104 to be transferred is twice or more than the size of the device 104, so that the device 104 can still be placed in the predetermined position. Work effectively.
[0101] After the device 104 is "sprayed", under the action of the magnetic field, the magnetic pole side of the device 104 is close to the array substrate 102. The magnetic poles and the electrodes on the array substrate 102 may be connected to each other, or they may not have a conductive effect.
[0102] In order to fix the device 104 arranged on the array substrate 102, the present invention uses a photoresist (Photo Resist) to coat the array substrate 102 provided with the device 104, and the coating thickness can completely cover the The device 104 may not be covered. When completely covered, it can not only fix the device 104, but also function as an isolation package. If the photoresist material Slit Coating is used, after the wet film coating is completed, thermal curing or UV light irradiation or the combination of the two methods are used to cure the photoresist, thereby renting the encapsulation layer through the cured light
[0103] The device 104 is fixed to the array substrate 102 by the interaction force between the cured photoresist material (the fixing member) and the array substrate 102 and the interaction force with the sidewall of the device 104 on.
[0104] This technical solution is different from the method in which the solder is arranged at the contact position of the device 104 and the array substrate 102, and the bottom end is contacted, heated, melted and then solidified.
[0105] When the device 104 is adsorbed by the magnetic member 105, a layer of packaging material (photoresist material) is applied by means of Slit Coating or downward Sputter, and the device 104 is directly packaged on the array substrate 102.
[0106] The present invention applies a magnetic field force to a large number of devices provided on the device transfer board through the magnetic member, so that a large number of the devices can be transferred (set) to the array substrate at one time, that is, the present invention can A large number of devices are quickly arranged on the array substrate, which improves the manufacturing efficiency of the device array substrate including the device and the array substrate.
[0107] In summary, although the present invention has been disclosed in preferred embodiments as above, the above-mentioned preferred embodiments are not intended to limit the present invention. Those of ordinary skill in the art can make various modifications without departing from the spirit and scope of the present invention. Such changes and modifications, therefore, the protection scope of the present invention is subject to the scope defined by the claims.
