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2159results about How to "Efficient manufacturing" patented technology

Plasma processing apparatus, electrode plate for plasma processing apparatus, and electrode plate manufacturing method

A plasma processing apparatus for performing a plasma process on a target substrate includes a process container configured to accommodate the target substrate and to reduce pressure therein. A first electrode is disposed within the process container. A supply system is configured to supply a process gas into the process container. An electric field formation system is configured to form an RF electric field within the process container so as to generate plasma of the process gas. A number of protrusions are discretely disposed on a main surface of the first electrode and protrude toward a space where the plasma is generated.
Owner:OCTEC INC +1

Laminated semiconductor substrate process for producing the same

The present invention provides a bonded substrate fabricated to have its final active layer thickness of 200 nm or lower by performing the etching by only 1 nm to 1 μm with a solution having an etching effect on a surface of an active layer of a bonded substrate which has been prepared by bonding two substrates after one of them having been ion-implanted and then cleaving off a portion thereof by heat treatment. SC-1 solution is used for performing the etching. A polishing, a hydrogen annealing and a sacrificial oxidation may be respectively applied to the active layer before and / or after the etching. The film thickness of this active layer can be made uniform over the entire surface area and the surface roughness of the active layer can be reduced as well.
Owner:SUMCO CORP +1

Equipment and method for identifying, monitoring and evaluating equipment, environmental and physiological conditions

A system and method are disclosed for identifying monitoring and evaluating hazardous or potentially hazardous conditions. The system-may-be worn-by safety personnel to detect equipment conditions such as low power supply, environmental conditions such as ambient temperature and / or physiological conditions such as heart rate of a wearer. The system may further include a control unit having electronics operable to communicate signals associated with equipment, environmental and physiological conditions.
Owner:FIREEYE DEVMENT

Method and apparatus for manufacturing device

A method for manufacturing a device, includes: (A) forming a first electrode layer on a substrate; (B) forming a ferroelectric layer on the first electrode layer; (C) forming a second electrode layer on the ferroelectric layer; (D) forming a mask having a predetermined pattern on the second electrode layer; (E) forming a memory element by selectively removing the first electrode layer, the ferroelectric layer, and the second electrode layer using the mask; and (F) removing the mask, where at least, the processes (D) and (E), or the processes (E) and (F) are continuously performed under a reduced pressure.
Owner:ULVAC INC +1

Lamp, lamp holder, power supply module, backlight assembly having the power supply module and display device having the power supply module

A lamp, lamp holder, and a power supply substrate that allow easy fabrication of a backlight assembly or a power supply module for a display device are presented. The lamp includes a lamp tube and an electrode that extends outside the lamp tube to form a lamp lead. The lamp holder includes a body for holding the lamp tube and a power supply member for providing voltage to the lamp lead. A power supply module includes a power supply substrate combined with a lamp holder holding the lamp. The lamp holders are fixed to fixing portions of the power supply substrate or to fixing holes of a connection plate. As the design allows easy separation of the lamp holders from the power supply substrate, building a backlight assembly or a display device is facilitated.
Owner:SAMSUNG DISPLAY CO LTD

Electrospun blends of natural and synthetic polymer fibers as tissue engineering scaffolds

InactiveUS20060263417A1Facilitate cell penetrationFacilitate proliferationBiocidePeptide/protein ingredientsFiberPolymer science
Non-woven fibrous scaffolds made by electrospinning from the synthetic biodegradable polymer such as, for example, poly(lactic-co-glycolic acid) (PLGA) and natural proteins, such as, for example, gelatin (denatured collagen) and elastin and a method of making thereof.
Owner:DREXEL UNIV

Arrangement for authentication of a person

A capacitive fingerprint sensor is fabricated on a plastic substrate (363) with an embedded integrated circuit chip (380). The invention describes a way to create two or three dimensional forms for electrode structures (321, 322, 325, 365, 366) that can be used to optimize the performance of the sensor. When the three dimensional structure is designed to follow the shape of a finger, a very small pressure is required when sliding the finger along the sensor surface. This way the use of the sensor is ergonomic and the measurement is made very reliable. The inventive fabrication method describes the way, how to connect and embed an integrated circuit containing measurement electronics with a batch processed larger scale electrode configuration that is used for capturing the capacitive image of the fingerprint.
Owner:NOKIA TECHNOLOGLES OY

Battery pack

ActiveUS20050031945A1Low resistance configurationResistivity does not decayPrimary cell to battery groupingBatteries circuit arrangementsEngineeringBattery pack
The battery pack is provided with a battery block, a case, and a circuit board. The battery block has a plurality of batteries lined up in a horizontal row with the same orientation, and lead plates connect to terminals of those batteries to form a parallel unit. A plurality of parallel units are stacked in the vertical direction with different orientation, and battery terminals are connected by lead plates in the vertical direction to connect parallel units in series. Lead plates have projections which protrude horizontally beyond the confines of the battery block and connect with the circuit board, and the battery block and circuit board are connected as a unit.
Owner:SANYO ELECTRIC CO LTD

Light emitting device

A light emitting device includes a substrate having a first surface and a second surface not parallel to the first surface, and a light emission layer disposed over the second surface to emit light. The light emission layer has a light emission surface which is not parallel to the first surface.
Owner:SIPHOTON

Expansion method, method for manufacturing semiconductor device, and semiconductor device

An embodiment of the present invention relates to an expansion method comprising: a step (I) of preparing a laminate having a semiconductor wafer in which modified sections have been formed along intended cutting lines, a die bonding film and a dicing tape, a step (IIA) of expanding the dicing tape with the laminate in a cooled state, a step (IIB) of loosening the expanded dicing tape, and a step (IIC) of expanding the dicing tape with the laminate in a cooled state, dividing the semiconductor wafer and the die bonding film into chips along the intended cutting lines, and widening the spaces between the chips.
Owner:RESONAC CORP

Organic electro-optic device and method for making the same

The present invention directed to an organic light emitting device and method for making the same. The method comprises the steps of: forming a first component comprising at least one first material on a first substrate; forming a second component comprising at least one second material on a second substrate, wherein at least one opening is formed through the second component; forming a third component; and laminating the first component, the second component and the third component together such that the second component is located between the first component and the third component, the at least one first material and the at least one second material form at least part of an organic electro-optic device located between the first substrate and the second substrate, the third component is bonded to the second component, and the third component is bonded to the first component through the at least one opening.
Owner:BOE TECH GRP CO LTD

Transfer substrate, method for fabricating display device, and display device

A transfer substrate includes a support base which transmits laser light with a predetermined wavelength, a photothermal conversion layer provided on the support base, and a transfer layer provided on the photothermal conversion layer, the transfer layer including at least a luminescent layer. The photothermal conversion layer is composed of a first material and a second material having different absorptances with respect to the laser light.
Owner:JOLED INC

Drink sleeve

The present invention relates to a drink sleeve that includes a first layer, a second layer and a tab. The first layer includes a top end, a bottom end and lateral edges. The second layer also includes a top end, a bottom end and lateral edges. The lateral edges of the first layer are bonded to the lateral edges of the second layer such that a pocket is formed between the first and second layers. The pocket is adapted to receive a beverage container that is inserted between the top ends of the first and second layers. The tab extends between the bottom end of the first layer and the bottom end of the second layer. The tab includes a fold which unfolds as the beverage container is inserted into the pocket. Once the beverage container is fully inserted into the pocket, the tab forms a coaster.
Owner:KIMBERLY-CLARK WORLDWIDE INC

2-in-1 SD type memory card adapter

A 2-in-1 card-insertion type memory card adapter meeting the size of an SD card and being provided thereon with a plurality of electric conducting sheets meeting the transmission specification of the SD car, the adapter has a fitting groove; wherein the fitting groove can afford direct insertion of a Mini SD card therein for positioning, alternatively, it can afford positioning therein of a positioning rack meeting the size of the Mini SD card, the positioning rack can afford positioning therein of a Micro SD card, so that the Micro SD card can indirectly positioned in the fitting groove; the fitting groove has therein a first pin set and a second pin set in connection with windows for a plurality of electric conducting sheets, the first pin set is for connecting a Mini SD card, and the second pin set is for connecting a Micro SD card.
Owner:HWANG CHIN HWA

Fastening strap system

A fastening strap system, particularly of the hook-and-loop variety (with hooks on one side of the strap and loops on the other side), for selectively and independently binding and / or releasing a plurality of sets of essentially longitudinal objects, such as wires, from one another. Each system includes at least two attached straps which each independently of the other may be used to loopably bind objects. A preferred aperture between the straps permits cinching of each strap. A continuous strip of such two-sided material may be stored on a reel and is designed so that a user may select a preferred length and configuration for a particular use by making a single cut of the material strip from the reel-strip end.
Owner:SCHULTZ JOSEPH P

Perylene-imide semiconductor polymers

ActiveUS20100283047A1Excellent charge transport propertiesLarge solubilityConductive materialSolid-state devicesImideSemiconductor materials
Disclosed are new semiconductor materials prepared from perylene-imide copolymers. Such polymers can exhibit high n-type carrier mobility and / or good current modulation characteristics. In addition, the compounds of the present teachings can possess certain processing advantages such as solution-processability and / or good stability at ambient conditions.
Owner:RAYNERGY TEK INC +1

Electrochemical device and method for manaufacturing same

An electrochemical device having an electrode plate assembly. The electrode plate assembly includes (a) at least one first electrode, (b) at least one second electrode, and (c) a separator interposed between the first electrode and the second electrode. The first electrode includes a first current collector sheet and at least one first electrode mixture layer carried thereon. The second electrode includes a second current collector sheet and at least one second electrode mixture layer carried thereon. At least one of the first current collector sheet and the second current collector sheet has a conductive area and an insulating area.
Owner:PANASONIC CORP

Blends of dibenzoate plasticizers

Plasticizer blends comprise a triblend of diethylene glycol dibenzoate, dipropylene glycol dibenzoate, and 1,2-propylene glycol dibenzoate, in specified ratios, useful in combination with a multitude of thermoplastic polymers, thermosetting polymers, and elastomeric polymers and numerous applications, including but not limited to plastisols, adhesives, sealants, caulks, architectural coatings, industrial coatings, OEM coatings, inks, overprint varnishes, polishes, and the like. The advantages rendered by the use of the triblend depend on the type of polymer and application in which it is utilized and include among other advantages higher solvating power and lower processing time, low VOC's, reduced plasticizer freeze point, improved gelation and fusion characteristics, higher tensile strength, superior stain and extraction resistance, and improved rheology over traditional diblends of diethylene glycol dibenzoate and dipropylene glycol dibenzoate.
Owner:EMERALD KALAMA CHEM

Wafer level package integrated circuit incorporating solder balls containing an organic plastic-core

An integrated circuit including solder balls containing an elastic or resilient material core, a hard or rigid shell substantially enclosing the core, and an electrical contact layer substantially enclosing the shell. The elastic or resilient core serves as a stress buffer layer in a wafer level package (WLP) integrated circuit. The elastic or resilient material core may include an organic plastic material, such as a Divinilbenzene cross-linked co-polymer of relatively high resistance. This material has a relatively good elongation property so that it can effectively absorb forces exerted upon the integrated circuit by, for example, the flexing of a printed circuit board (PCB) or other structure to which the integrated circuit is attached. The hard or rigid shell serves to contain the elastic or resilient core and may include copper. The electrical contact layer serve to provide a good adhesive electrical contact to an under bump metallization (UBM) layer, may include a lead free, Tin-Gold (SnAg) material.
Owner:MAXIM INTEGRATED PROD INC

Planar polymer memory device

The present invention provides a planar polymer memory device that can operate as a non-volatile memory device. A planar polymer memory device can be formed with two or more electrodes and an electrode extension associated with one electrode, wherein a selectively conductive medium and dielectric separate the electrodes. The method for forming a planar polymer memory device comprises at least one of forming a first electrode with an associated plug, forming a second electrode, forming a passive layer over the extension, depositing an organic polymer and patterning the organic polymer. The method affords integration of a planar polymer memory device into a semiconductor fabrication process. A thin film diode (TFD) can further be employed with a planar polymer memory device to facilitate programming. The TFD can be formed between the first electrode and the selectively conductive medium or the second electrode and the selectively conductive medium.
Owner:MONTEREY RES LLC

Display apparatus

Disclosed herein is a display apparatus, including: a pixel array section including a plurality of pixel circuits disposed in a matrix and each including a driving transistor for producing driving current, a storage capacitor for storing information of a image signal amplitude, an electro-optical element connected to an output terminal side of the driving transistor, and a sampling transistor for writing information of the signal amplitude into the storage capacitor, the driving transistor being operable to produce driving current based on the information stored in the storage capacitor and supply the driving current to the electro-optical element to cause the electro-optical element to emit light; a driving signal fixing circuit for keeping the driving current fixed; and a light blocking layer provided on the light input side of a transistor which participates in the driving signal fixing function and for preventing appearance of leak current of the transistors arising from light irradiation.
Owner:SONY CORP

Variable slit apparatus, illumination apparatus, exposure apparatus, exposure method, and device fabrication method

The present invention provides a variable slit apparatus, which can rapidly change the shape of the slit width of the illumination light while finely controlling the shape of the slit-shaped illumination light, an illumination apparatus that uses such, an exposure apparatus, and the like. The variable slit apparatus for forming a slit-shaped illumination light comprises: a first light-shielding mechanism that comprises a plurality of blades for defining one long side of the illumination light; a second light-mechanism configured to define another long side of the illumination light; and a drive mechanism that changes the width of the illumination light in the latitudinal direction orthogonal to the longitudinal direction by driving the first light-shielding mechanism and the second light-shielding mechanism.
Owner:NIKON CORP

Light emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb

In accordance with the invention, a light emitting diode package assembly is provided to emulate the pattern of light produced by an incandescent filament bulb. The package assembly is composed of a substrate for LEDs comprising a heat-sinking base having a pair of opposing major surfaces. Each major surface has an overlying of thermally conducting ceramic and an outer surface layer of light reflective material. Disposed on each surface layer is a plurality of LEDs. Advantageously, the LEDs are arranged on the surface in a configuration of low mutual obstruction. Advantageously, reflecting elements transverse to each surface layer are positioned and shaped to reflect a substantial portion of the light emitted from the LEDs that would otherwise enter neighboring LEDs. In a preferred embodiment, the LEDs are arranged in the general form of a closed curve, and a transverse reflector is disposed in the interior of the curve. Alternatively, the LEDs can be arranged in a linear array. The assembly can be efficiently fabricated by back-to-back assembly of two similar subassemblies.
Owner:LIGHTING SCI GROUP

Rare earth-doped semiconductor infrared radiation thick-film electronic paste and preparation method therefor

The present invention discloses rare earth-doped semiconductor infrared radiation thick-film electronic paste and a preparation method therefor. The electronic paste comprises, in percentage by weight, 10%-90% of an organic vehicle and 10%-90% of a functional phase. The organic vehicle comprises, in percentage by weight, 50%-95% of an organic solvent,1%-40% of a thickening agent, and 0%-5% of an organic additive. The functional phase comprises, in percentage by weight, 40%-95% of a rare earth-doped infrared radiation semiconductor material, 5%-60% of a conductive material, and 0%-20% of a functional additive. According to the electronic paste, the selecting range of a base material is wide, the heating temperature range is wide, the heating efficiency is high, the temperature of a heating body itself is low, and the bidirectional thermoelectric conversion can be achieved. The preparation method comprises: a, mixing the thickening agent, the organic additive and the organic solvent to prepare the organic vehicle; b, mixing and grinding the organic vehicle and the functional phase to prepare the electronic paste; c, printing the electronic paste on a substrate by means of screen printing, and performing curing or sintering to form a film.
Owner:DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD

Light emitting device

A light emitting device includes a substrate having a first surface and a second surface not parallel to the first surface, and a light emission layer disposed over the second surface to emit light. The light emission layer has a light emission surface which is not parallel to the first surface.
Owner:PAN SHAOHER X

Separator for non-aqueous batteries, non-aqueous battery using same, and production method for separator for non-aqueous batteries

Provided is a separator for non-aqueous batteries not only having shutdown property but also achieving both higher output and short-circuit resistance. The separator comprising a laminate comprising: a low melting-point polymer fiber layer (A) having a melting point of 100 to 200° C., the low melting-point polymer fiber layer (A) comprising nanofibers having a fiber diameter of 1000 nm or smaller and formed from the low melting-point polymer; and a heat-resistant polymer fiber layer (B) positioned on the low melting-point polymer fiber layer (A) and comprising a high melting-point polymer having a melting point over 200° C. or a heat infusible polymer, the heat-resistant polymer fiber layer (B) comprising a mixture of nanofibers having a fiber diameter of 1000 nm or smaller and non-nanofibers having a fiber diameter over 1000 nm and both formed from heat-resistant polymer.
Owner:KURARAY CO LTD
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