This application provides an electro-optic modulator
chip, a packaging structure, and an electronic device, relating to the field of
optical communication technology. The electro-optic modulator
chip includes: a first end connected to an input
light source, and a second end connected to an output
light source and a monitoring end; the input
light source is used to transmit an input optical
signal to the electro-optic modulator; the electro-optic modulator modulates the input optical
signal to obtain a modulated optical
signal and a monitoring optical signal, and transmits the modulated optical signal to the output light source and the monitoring optical signal to the monitoring end; the output light source is used to output the modulated optical signal; the monitoring end is used to output the monitoring optical signal; the transmission direction of the optical signal is parallel to the plane of the substrate. The packaging structure includes: a substrate, a monitor, and the electro-optic modulator
chip; the electro-optic modulator chip is fixedly mounted on the substrate; the monitor is fixedly mounted on the substrate; the monitor receives the monitoring optical signal output by the electro-optic modulator chip and performs
optical power monitoring based on the monitoring optical signal to obtain the monitoring result.