Surface-mounting high-precision large-power NTC (Negative Temperature Coefficient) thermistor and making method thereof

Abstract

The invention belongs to the technical field of electronic components and in particular discloses a surface-mounting high-precision large-power NTC (Negative Temperature Coefficient) thermistor and a making method thereof. The surface-mounting high-precision large-power NTC thermistor comprises an NTC thermal sensitive ceramic medium with a sheet type structure, wherein the upper surface and the lower surface of the NTC thermal sensitive ceramic medium are provided with sheet surface electrodes and thin glass encapsulating layers from inside to outside, the front side and the rear side of the NTC thermal sensitive ceramic medium are also provided with glass encapsulating layers, and two end surfaces of the NTC thermal sensitive ceramic medium with the sheet type structure are provided with termination electrodes. The NTC thermistor has the advantages of large borne power, high precision, high resistance qualified rate, good heat radiation, strong current circulating capability and good reliability.

Description

technical field [0001] The invention belongs to the technical field of electronic components. Specifically disclose a surface-mounted high-precision high-power NTC thermistor and a manufacturing method thereof. Background technique [0002] The power type NTC thermistor has the characteristic that the resistance of the cold state is large and the resistance gradually decreases as the temperature rises. This characteristic is used in the circuit to suppress the surge current and effectively protect the secondary circuit from being damaged by large current. [0003] The existing power type NTC thermistor uses a lead design, such as figure 1 As shown, in this structural design, the wafer NTC chip 10 is welded with leads 20 and then an insulating encapsulation layer 30 is used to encapsulate the wafer NTC chip 10 therein. This kind of wafer type power NTC thermistor has three major disadvantages: [0004] (1) Due to the lead structure, the production and installation efficie...

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Problems solved by technology

[0004] (1) Due to the lead structure, the production and installation efficiency is low and the reliability is not high;

[0005] (2) Since the wafer-type NTC chip 10 is placed inside the thicker insulating encapsulation layer 30, the insulating encapsulation layer 30 is generally epoxy resin or phenolic resin, which has poor thermal conductivity and poor heat dissipation effect

While the power type NTC thermistor is in operation, the power it dissipates instantaneously under the impact of the surge current is very large, which produces a large amount of heat and needs to be dissipated in the shortest possible time. However, because the insulating encapsulation la

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