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1524results about "Resistor details" patented technology

High-frequency patch resistor and manufacturing method thereof

The embodiment of the invention discloses a high-frequency patch resistor which comprises a substrate, a back electrode, a surface electrode, a resistor body and a first lateral conducting electrode, wherein in order to enable characteristic impedance to be matched with anticipatory target impedance, the resistor body is provided with an external cutting notch, i.e. cutting is started from the edge of the resistor body, the partial area of the resistor body is directly cut off from the resistor body, and the cross-sectional area of the resistor body can be decreased to a greater degree, so that the high-frequency patch resistor has a larger resistance-adjusting range and is beneficial to the matching of the characteristic impedance of the characteristic impedance resistor and the anticipatory target impedance. The invention also provides a manufacturing method of the high-frequency patch resistor to manufacture the high-frequency patch resistor with the larger resistance-adjusting range. The high-frequency patch resistor provided by the invention is suitable for microwave radio-frequency structures and chipping, and meanwhile, the high-frequency patch resistor can be manufactured in large scales and with high efficiency by utilizing the manufacturing method of the high-frequency patch resistor provided by the invention.
Owner:四平市吉华高新技术有限公司

Thin film surface mount components

Surface mount components and related methods of manufacture involve one or more thin film circuits provided between first and second insulating substrates. The thin film circuits may include one or more passive components, including resistors, capacitors, inductors, arrays of one or more passive components, networks or filters of multiple passive components. Such thin film circuit(s) can be sandwiched between first and second insulating substrates with internal conductive pads being exposed between the substrates on end and / or side surfaces of the surface mount component. The exposed conductive pads are then electrically connected to external terminations. The external terminations may include a variety of different materials, including at least one layer of conductive polymer and may be formed as termination stripes, end caps or the like. Optional shield layers may also be provided on top and / or bottom device surfaces to protect the surface mount components from signal interference. For embodiments where one or more thin film circuits are provided between insulating base and cover substrates, such thin film circuit(s) can be formed with conductive pads that extend to and are initially exposed along one or more surfaces of the resultant component. The cover substrate is formed with a plurality of conductive elements (e.g., internal active electrodes, internal anchor electrodes and / or external anchor electrodes) that are designed to generally align with the conductive pads formed on the base substrate such that conductive element portions are exposed in groups along one or more peripheral surfaces of a device. External plated terminations are then formed directly to the exposed portions of the conductive elements.
Owner:KYOCERA AVX COMPONENTS CORP

Coating liquid for forming transparent conductive film, substrate with transparent conductive film, and display device

Disclosed is a coating liquid for forming a transparent conductive film, comprising conductive fine particles having an average particle diameter of 1 to 200 nm, silica particles having an average particle diameter of 4 to 200 nm and a polar solvent. The silica particles are in the form of chain silica particles having 2 to 10 silica particles on an average being connected. The content of an alkali in the silica particles is not more than 1000 ppm in terms of an alkali metal M. Also disclosed is a substrate with a transparent conductive film, comprising a substrate, a transparent conductive fine particle layer formed on the substrate and containing conductive fine particles having an average particle diameter of 1 to 200 nm and silica particles having an average particle diameter of 4 to 200 nm and/or chain silica particles having 2 to 10 silica particles on an average being connected, and a transparent film provided on the transparent conductive fine particle layer and having a refractive index lower than that of the transparent conductive fine particle layer. A display device using the substrate with a transparent conductive film is further disclosed. The coating liquid for forming a transparent conductive film is capable of forming a transparent conductive film having low surface resistance, excellent antistatic properties, excellent electromagnetic blocking properties, high film strength and excellent adhesion to a substrate.
Owner:CATALYSTS & CHEM
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