330results about "Resistor details" patented technology

The invention provides a carbon ceramic resistor and a preparation method thereof, and relates to the technical field of special material production of power systems and electrical equipment. The preparation method comprises the steps that carbon-containing electric conductor raw materials are mixed to obtain a first mixed raw material, and the carbon-containing electric conductor raw materials comprise, by mass, 15 parts of gluconic acid, 10 parts of aluminum oxide and 55 parts of deionized water; performing hydrothermal reaction on the first mixed raw material to obtain a carbon-containing conductor precursor; the carbon-containing conductor precursor is carbonized in a protective atmosphere, a carbon-containing conductor of a core-shell structure is obtained, and the carbon-containing conductor takes aluminum oxide as an inner core and takes a conductive carbon material formed by gluconic acid as a conductive outer shell; mixing the carbon-containing electric conductor with the core-shell structure with a carbon ceramic matrix raw material to obtain a resistor blank; and sintering the resistor blank to obtain the carbon ceramic resistor. The uniformity, the stability and the reliability of the carbon ceramic resistor are improved, so that the carbon ceramic resistor can better meet the application requirements of ultrahigh-voltage and extra-high-voltage alternating-current power transmission systems.

A frame terminal 8 is bent so that its cross-sectional shape is an S-shape, and such that separation distances L1, L2 and L3 in a horizontal direction between an uppermost portion and a lowermost portion, in the vertical direction, of an end portion side face 21a of a resistance element 8 built into a mold divider 1, and a part substantially midway between an uppermost point and a lowermost point thereof, and the parts of the surface of the frame terminal 6 that correspond to these parts in the horizontal direction satisfy the relation L1>L2≥L3. As a result, in the mold divider 1, a space which is to be filled with a joining material and which has a non-uniform separation distance is formed between the frame terminal 6 and the end portion side face 21a, thereby making it possible to ensure the bonding strength between the resistance element 8 and the frame terminal 6.

An energy dissipation system for a vehicle, the energy dissipation system comprising an air compressor comprising a compressor inlet configured to receive ambient air, an electric motor comprising a rotor having a rotor shaft operatively connected to a compressor shaft of the air compressor, power electronics arranged in a power electronics housing, the power electronics being electrically connected to the electric motor and configured to feed electric power to the electric motor, and an air flow channel through which the ambient air is configured to be fed to the compressor inlet, the air flow channel being formed by an inner elongated tube member and an outer elongated tube member, wherein the electric motor is housed within the inner elongated tube member and attached to a first inner surface, and wherein the power electronics housing is attached to a second outer surface.

The invention discloses an overvoltage protection combined lightning arrester of a power system. The overvoltage protection combined lightning arrester comprises an insulating cylinder, a lower fixing part, a lower electrode, a resistor body, an end cover, an upper fixing part and an upper electrode, the lower fixing part is fixed to the lower end of the insulating cylinder in a sealed mode, the lower electrode is connected to the upper end of the lower fixing part, the resistor body is connected to the upper end of the lower electrode, the end cover is sealed and installed at the upper end of the insulating cylinder through threads, the upper fixing part is fixed to the upper end of the end cover in a sealed mode, and the upper electrode is connected to the lower end of the upper fixing part; the device further comprises an inner sealing cylinder, an outer sealing cylinder, a heat conduction mechanism and a pneumatic mechanism. The inner sealing cylinder is arranged on the periphery of the resistor body, the upper end and the lower end of the inner sealing cylinder are in movable contact with the end cover and the inner wall of the insulating cylinder respectively, the outer sealing cylinder is in movable contact with the inner wall of the insulating cylinder, the heat conduction mechanism is arranged in the inner sealing cylinder, and the pneumatic mechanisms are circumferentially arranged and are arranged between the inner sealing cylinder and the outer sealing cylinder respectively.

The present invention relates to a resistor unit (1, 1', 1''), comprising: at least one electrical resistor (10), at least one fluid-carrying cooling unit (30) on and / or in which at least part of the at least one electrical resistor (10) is arranged, at least one detection unit (3, 4, 5, 6, 7, 71, 72) and at least one evaluation device (40) that can be operatively connected to the at least one detection unit (3, 4, 5, 6, 7, 71, 72), the at least one detection unit (3, 4, 5, 6, 7, 71, 72) being configured to measure a variable that represents the temperature (TR) of the at least one electrical resistor (10) per se or in combination with a further detection unit (3, 4, 5, 6, 7, 71, 72) and that relates to an electrical property of the at least one electrical resistor (10) and / or to a property of a fluid flowing through the fluid-carrying cooling unit (30). The present invention additionally relates to a brake system and to a vehicle having such a resistor unit and to a method for estimating a temperature of the fluid-cooled electrical resistor.

The utility model discloses an overvoltage protection assembly and system formed by voltage-sensitive nonlinear elements. The assembly comprises an insulating core tube, a plurality of nonlinear elements, a first electrode, a second electrode, an insulating cylinder, a cooling fan and a temperature sensor. The assembly can perform forced air cooling on the nonlinear element, and is timely in response, good in cooling effect, simple and compact in structure and easy to integrate.

The utility model relates to a standardized gap lightning arrester with an insulation support and a fault indication function, which comprises a standardized gap lightning arrester body, the insulation support is mounted at the lower end of the standardized gap lightning arrester body, a disconnector is mounted at the lower end of the insulation support, and a second screw is mounted at the tail end of the disconnector. A mounting hole is formed in one side, far away from the lower end of the standard gap lightning arrester body, of the insulating bracket, the mounting hole in the insulating bracket is connected with the mounting hole in the metal bracket through a first screw, and a second screw at the tail end of the disconnector is connected with the first screw at the joint of the insulating bracket and the metal bracket through a copper wire woven belt. According to the utility model, the disconnector, the insulating bracket and the metal bracket are arranged on the standard gap lightning arrester body, so that when the lightning arrester is broken down by lightning stroke, the disconnector falls off and forms a fault mark, operation and maintenance personnel can easily find a fault point and can carry out targeted maintenance, and meanwhile, due to the insulating bracket, secondary accidents can be avoided.

This chip resistor is provided with a ceramic substrate, two electrodes that are disposed on the ceramic substrate, and a resistor that electrically connects the two electrodes. The ceramic substrate comprises a base material that contains a sintered body of ceramic particles (A) and a covering that contains a sintered body of α-alumina particles (B). The covering covers at least a part of the surface of the base material. The average particle diameter of the α-alumina particles (B) is smaller than the average particle diameter of the ceramic particles (A). The ceramic substrate has a support surface, the support surface-side surface of the base material is covered with the covering, and the resistor overlaps the support surface.

To provide a multilayer ceramic electronic component capable of achieving an improvement in deflection resistance.SOLUTION: A multilayer ceramic electronic component includes a laminate 10 including an internal electrode layer 30, and a pair of external electrodes 40 disposed on both ends of the laminate 10. The external electrodes 40 each include a main surface side external electrode 411A, and the main surface side external electrode 411A has a surface 411sA facing a main surface TS. The surface 411sA includes a step portion 900 that lowers the height of the surface 411sA, of the laminate 10, on a center side in a length direction L than that of the surface 411sA of the laminate 10 on the outside in the length direction L, in the height from the main surface TS to the surface 411sA. The step portion 900 has a shape curved convexly toward the center in the length direction L and extends across a width direction W at the surface 411sA.SELECTED DRAWING: Figure 2

An overvoltage protection apparatus (14) has at least one isolator apparatus (38) which is provided in a housing (50), a thermally conductive element (40), an operating element (42) for operating an indicator apparatus (44), and a locking element (58), wherein the thermally conductive element (40) is in contact with the housing (50). The operating element (42) is attached to the thermally conductive element (40) by means of the locking element (58) and the attachment is formed in such a way that the locking element (58) becomes detached from the thermally conductive element (40) and / or from the operating element (48) and releases the operating element (42) when a predetermined temperature at the locking element (58) is exceeded. The invention further discloses a modular overvoltage protection system (10).

To provide a temperature sensor in which a thermistor is accurately determined with respect to a case.SOLUTION: A thermistor assembly body 110 includes a thermistor 111, rigid two lead members 112, and a first resin part 113. A first end part 1121 of the two lead members 112 is connected to the thermistor 111 and the thermistor 111 is sealed by the first resin part 113.SELECTED DRAWING: Figure 6

The utility model discloses a waterproof sealing structure of an air blower resistor, relates to the technical field of waterproof sealing structures, and provides the following scheme aiming at the problems that in the prior art, the anti-condensation effect is poor, condensed water drops are easily gathered and flow into the connecting part of the resistor and a device to cause short circuit, and the waterproof sealing structure of the air blower resistor comprises a resistor body, a waterproof shell is fixed outside the resistor body, a waterproof base is inserted into the bottom of the resistor body, and the waterproof base comprises a bottom plate. According to the utility model, condensed water drops are drained through the arranged waterproof housing, most of water flows out through the isolation frame, the waterproof platform and the bottom, and a small part of water enters between the isolation frame and the bayonet socket through a gap between the waterproof housing and the isolation frame; water between the isolation frame and the bayonet socket flows into the drainage shell through the arranged inclined block, and the baffle is pushed outwards through gravitational potential energy generated by the inclined block, so that the water is discharged outwards through the drainage shell.

The utility model provides a resistor element. The resistor element comprises a substrate; the resistor body is arranged on the front surface of the substrate; and the first protection layer is arranged on the back surface of the substrate. According to the invention, the first protection layer is arranged on the back surface of the substrate, so that the substrate is protected by the first protection layer, the possibility of appearance damage of the resistor in the manufacturing process is effectively reduced, and the product yield is greatly improved.

This negative-characteristic thermistor is provided with: a ceramic substrate formed from a ceramic composition containing Mn, Ni, and Fe; and an external electrode provided at an end portion of the ceramic substrate, in which the external electrode includes a base layer covering the end portion of the ceramic substrate and including Cu and glass, and a plating layer covering the base layer, and the Ni content, the Mn content, and the F content in the ceramic substrate satisfy the following formulae (1) and (2): 26.4 mol% < = [Ni] < = 29.5 mol%, 1.65 < = [Mn] / [Fe] < = 1.90 (2). Wherein [Ni], [Mn], and [Fe] are the contents (mol%) of Ni, Mn, and Fe, respectively, when the total content of Mn, Ni, and Fe contained in the ceramic matrix is 100 mol%.

A sensor device (1) for measuring the temperature of a surface (9A) is described, comprising: at least one sensor element (2); a ceramic housing (3) in which the sensor element (2) is at least partially disposed within the ceramic housing (3); a base (5) at least partially surrounding the ceramic housing (3); an external housing (8) connected to the base (5) in which the external housing (8) at least partially encloses the base (5) and the ceramic housing (3); and at least one mounting element (7) adapted and positioned to mount the sensor device (1) to a target application (9), wherein the ceramic housing (3) is adapted and positioned to be in direct mechanical contact with the surface (9A) whose temperature is to be measured. Furthermore, the use of the sensor device (1) is described.

The present invention relates to a jumper element, a shunt resistance device, and a method for adjusting characteristics of a shunt resistance device for current detection. A jumper element (10) for constituting a shunt resistance device for current detection is made of an electrically conductive metal material. The jumper element (10) has a main body portion (11) capable of being joined to a resistor body (5) constituting a part of the shunt resistance device, and a protruding portion (12) formed at a side portion of the main body portion (11), the protruding portion (12) being positioned so as not to overlap the resistor body (5).

To suppress peeling-off of a glass layer.SOLUTION: A circuit substrate 10 includes a substrate body 11, a pair of electrodes 41, 42, a resistive element 60, and a glass layer 70. The substrate body 11 is made of a ceramic. The pair of electrodes 41, 42 are spaced apart from each other on the substrate body 11. The resistive element 60 is positioned so as to cross the pair of electrode 41, 42. The glass layer 70 covers the pair of electrode 41, 42 and the resistive element 60. When in an area where the resistive element 60 and the glass layer 70 are arranged on the substrate body 11 between the pair of electrodes 41, 42, an area centered between the pair of electrodes 41, 42 is defined as a central part, a minimal distance T2 between the substrate body 11 and a surface of the glass layer 70 at the central part is shorter than a minimal distance T1 between the surface of the glass layer 70 and the substrate body 11 at a periphery P of the resistive element 60 located on the electrodes 41, 42.SELECTED DRAWING: Figure 4

The invention relates to a protective device (11) for an electronic component (10), wherein the protective device (11) can be arranged to at least partially encompass the at least one electronic component (10) and an electronic component (10) with such a protective device (11).

The invention discloses a pi-shaped chip high-voltage pulse attenuation network resistor and a manufacturing method thereof, and belongs to the technical field of electronic components. The network resistor structure comprises a ceramic substrate, a resistive layer, a resistive layer R1, a resistive layer R2, a resistive layer R3, a surface electrode, a back electrode, a side electrode, an electrode nickel-plated layer, an electrode lead-tin-plated layer, a glass protection layer and an epoxy resin layer. The manufacturing method comprises the following steps: printing a surface electrode on the upper surface of a ceramic substrate, printing a back electrode on the lower surface of the ceramic substrate, printing a resistive layer bridged on the surface electrode, printing protective glass on the resistive layer, carrying out laser resistance trimming on the resistive layer, printing an epoxy resin protective layer and a mark on the protective glass, and sputtering a metal layer on the end surface. And preparing an electrode nickel-plated layer and a lead-tin-plated layer on the end surface. The problems that in the prior art, overheat burnout is likely to occur, electrodes are likely to be eroded in a humid or sulfur-containing environment, and the manufacturing precision and stability are difficult to improve and control are solved. The resistor is widely applied to the technical field of attenuation network resistors.

The invention relates to a resistor assembly (2) comprising at least one connecting element (3, 3 ') and at least one resistor element (4). A coating (5) is applied as a substrate to at least a portion (411) of the surface (41) of the resistor element (4) or as a substrate to at least a portion (311) of the surface (31) of the connecting element (3, 3 '), said coating having at least one layer (50, 51, 52, 53). According to the invention, the coating (5) is designed such that the metal and the semiconductor are in direct contact at a boundary surface (61) between the substrate and the coating (5), such that a p-n transition is formed at the boundary surface (61), and / or the metal and the semiconductor or the first semiconductor and the second semiconductor are in direct contact at least at a boundary surface (62) between the first layer (50, 51) and the second layer (52) of the coating (5), such that a p-n transition is formed at the boundary surface (61). This is such that a p-n transition is formed at the boundary surface (62). The layer (50, 51, 52, 53) of the coating (5) may be in contact with an uncoated portion (412, 412 ') of the surface (41) of the resistor element (4) or an uncoated portion (312) of the surface (31) of the connection element (3, 3'), or both the first layer (50, 51) and the other layer (52, 53) of the coating (5), in order to detect a measurement signal for determining the temperature of the resistor assembly (2).

To provide an electronic component capable of achieving both adhesion and visibility of a mark to an element body. An electronic component includes an element body and a mark formed on the element body. A main material of the mark is different from a material of the element body. The mark includes a first portion that constitutes a part of the mark and a second portion located at a position different from the first portion and connected to the first portion. A ratio of a main material of the mark included in the first portion is lower than a ratio of a main material of the mark included in the second portion.

The utility model discloses a load box with an adjusting function. The load box comprises a device body and a plurality of resistors arranged in the device body. An electrical installation assembly and a plurality of wiring copper bars are arranged on one side of the device body, the wiring copper bars are located below the electrical installation assembly, and an operation panel is arranged on one side of the electrical installation assembly; a cavity is formed in the device body, grid plates are symmetrically arranged on the two sides of the cavity, a heat dissipation assembly is arranged on one side of the resistor, and the resistor and the heat dissipation assembly are both arranged in the cavity; according to the resistor box, the grating plates are arranged on the two sides of the resistor and the heat dissipation fan, heat can be rapidly dissipated from the air openings while heat dissipation of the resistor is achieved, heat in the resistor box cannot be increased, the heat dissipation effect is improved, in addition, the size of the resistor is controlled through the multiple operation knobs, flexible adjustment of the resistor box is achieved, and the test effect is improved.

The present invention relates to a resistor structure with a dual-combination cooling method, comprising a base, a fan component, a resistor component, a water-cooled heat sink component, a hot air duct, and a cold air duct. The fan component and the resistor component are arranged side by side, with the fan component's air outlet facing the resistor component. The water-cooled heat sink component is arranged on one side of the resistor component. The resistor component is connected to the water-cooled heat sink component's air inlet via the hot air duct, and the water-cooled heat sink component's air outlet is connected to the fan component via the cold air duct. When the resistor component is operating, the fan component blows heat generated by the resistor component into the water-cooled heat sink component. The water-cooled heat sink component dissipates the hot air and converts it into cold air, which is then drawn into the fan component for circulation. Compared with existing technologies, the present invention utilizes both air-cooled and water-cooled circulation for heat dissipation, resulting in better heat dissipation and a wide range of applications.

The present invention relates to a semiconductor device. The semiconductor device of the present invention comprises a semiconductor substrate, a semiconductor layer arranged on the semiconductor substrate, several resistors arranged on the semiconductor layer, at least one electrode layer arranged on the semiconductor layer, and a first temperature sensing pad, a second temperature sensing pad, and a third temperature sensing pad arranged on the semiconductor layer, wherein the several resistors are electrically connected to at least one of the first temperature sensing pad, the second temperature sensing pad, and the third temperature sensing pad, and since heat is transferred through the semiconductor layer to the several resistors, the temperature of a maximum heat source of the semiconductor layer and the semiconductor device can be measured by the resistance values ​​of the several resistors.

To provide a laminated resistor that is low in height and suppresses a short circuit caused by solder wetting.SOLUTION: A multilayer resistor includes a thin plate-shaped resistor having a first plane and a second plane in the thickness direction, a first electrode formed on the first plane, and a second electrode formed on the second plane, the resistor contains a nickel-chromium or iron-chromium metal material, the second electrode faces a circuit pattern when mounted on a circuit board, and the thickness of the resistor is configured to be between three and eight times the thickness of the second electrode.SELECTED DRAWING: Figure 1

Provided is an electronic component comprising: an element body (20); an inorganic oxide layer (30) that covers an outer surface (21) of the element body (20); and a glass layer (50) that covers an outer surface (31) of the inorganic oxide layer (30). The glass layer (50) contains one or more elements selected from alkali metals and alkaline earth metals. Voids (P) are present between the element body (20) and the inorganic oxide layer (30).

An electric-powered road vehicle comprises two front wheels and two rear wheels; at least one battery; at least one electric machine configured to convert electrical energy to kinetic energy and vice versa. The electric machine is connected, on one side, to at least one battery and, on another side, to at least one of said wheels in such a way that during the running or acceleration of the vehicle, the electric machine converts incoming electrical energy arriving from the battery into kinetic energy to be transmitted to at least one of said wheels. At least one dissipative braking device converts the kinetic braking energy of at least one of said wheels into heat. A resistor device is connected to the electric machine and is configured to convert incoming electrical energy arriving from the electric machine into heat.

The present invention provides a braking resistor system (10) for a vehicle, comprising at least one electronic unit (13) including an inverter (12), power electronics and / or a control unit, and a high-load resistor unit (11) electrically coupled to the electronic unit (13) and having a housing (16), wherein the electronic unit (13) and the high-load resistor unit (11) are arranged adjacent to each other and are electrically coupled via a phase-carrying busbar (23), and wherein a cooling device (14) is provided for the joint cooling of the high-load resistor unit (11) and the electronic unit (13), as well as a vehicle with such a braking resistor system (10).

An aspect of the disclosure relates to a composite thermistor element (10). The element comprises a sensor material (1) disposed between a pair of electrodes (2a, 2b). The sensor material comprises particles (3) in a dielectric matrix (4). The particles (3) have a core (6) with a temperature dependent resistance and a coating layer (7) of an inorganic material. The particles form an electronic conduction path (5) between the electrodes (2a, 2b) with a temperature dependent resistance and a baseline resistance. Further aspects relate to methods of making thermistors, coated particles, compositions for use in making composite thermistors comprising the particles, and temperature sensors comprising the thermistors disclosed herein.

Chip with varistor function, - comprising a zinc oxide varistor layer (VS) - with a multi-layer electrode structure that realizes a varistor function in the varistor layer - with at least two solderable or bondable external contacts (AK) on a first main surface of the varistor layer (VS) - with a glass layer (GS) applied to the first main surface, leaving only the external contacts uncovered - wherein the glass layer comprises as main component oxides of Si and / or Ge, B and K, which in total comprise at least 70 wt.% of the components of the glass layer, - where the content of Al, Ga, Cr and Ti is less than one percent by weight based on the total glass composition.