210results about "Resistor details" patented technology

The invention provides a carbon ceramic resistor and a preparation method thereof, and relates to the technical field of special material production of power systems and electrical equipment. The preparation method comprises the steps that carbon-containing electric conductor raw materials are mixed to obtain a first mixed raw material, and the carbon-containing electric conductor raw materials comprise, by mass, 15 parts of gluconic acid, 10 parts of aluminum oxide and 55 parts of deionized water; performing hydrothermal reaction on the first mixed raw material to obtain a carbon-containing conductor precursor; the carbon-containing conductor precursor is carbonized in a protective atmosphere, a carbon-containing conductor of a core-shell structure is obtained, and the carbon-containing conductor takes aluminum oxide as an inner core and takes a conductive carbon material formed by gluconic acid as a conductive outer shell; mixing the carbon-containing electric conductor with the core-shell structure with a carbon ceramic matrix raw material to obtain a resistor blank; and sintering the resistor blank to obtain the carbon ceramic resistor. The uniformity, the stability and the reliability of the carbon ceramic resistor are improved, so that the carbon ceramic resistor can better meet the application requirements of ultrahigh-voltage and extra-high-voltage alternating-current power transmission systems.

A frame terminal 8 is bent so that its cross-sectional shape is an S-shape, and such that separation distances L1, L2 and L3 in a horizontal direction between an uppermost portion and a lowermost portion, in the vertical direction, of an end portion side face 21a of a resistance element 8 built into a mold divider 1, and a part substantially midway between an uppermost point and a lowermost point thereof, and the parts of the surface of the frame terminal 6 that correspond to these parts in the horizontal direction satisfy the relation L1>L2≥L3. As a result, in the mold divider 1, a space which is to be filled with a joining material and which has a non-uniform separation distance is formed between the frame terminal 6 and the end portion side face 21a, thereby making it possible to ensure the bonding strength between the resistance element 8 and the frame terminal 6.

An energy dissipation system for a vehicle, the energy dissipation system comprising an air compressor comprising a compressor inlet configured to receive ambient air, an electric motor comprising a rotor having a rotor shaft operatively connected to a compressor shaft of the air compressor, power electronics arranged in a power electronics housing, the power electronics being electrically connected to the electric motor and configured to feed electric power to the electric motor, and an air flow channel through which the ambient air is configured to be fed to the compressor inlet, the air flow channel being formed by an inner elongated tube member and an outer elongated tube member, wherein the electric motor is housed within the inner elongated tube member and attached to a first inner surface, and wherein the power electronics housing is attached to a second outer surface.

The present invention relates to a resistor unit (1, 1', 1''), comprising: at least one electrical resistor (10), at least one fluid-carrying cooling unit (30) on and / or in which at least part of the at least one electrical resistor (10) is arranged, at least one detection unit (3, 4, 5, 6, 7, 71, 72) and at least one evaluation device (40) that can be operatively connected to the at least one detection unit (3, 4, 5, 6, 7, 71, 72), the at least one detection unit (3, 4, 5, 6, 7, 71, 72) being configured to measure a variable that represents the temperature (TR) of the at least one electrical resistor (10) per se or in combination with a further detection unit (3, 4, 5, 6, 7, 71, 72) and that relates to an electrical property of the at least one electrical resistor (10) and / or to a property of a fluid flowing through the fluid-carrying cooling unit (30). The present invention additionally relates to a brake system and to a vehicle having such a resistor unit and to a method for estimating a temperature of the fluid-cooled electrical resistor.

The utility model discloses a waterproof sealing structure of an air blower resistor, relates to the technical field of waterproof sealing structures, and provides the following scheme aiming at the problems that in the prior art, the anti-condensation effect is poor, condensed water drops are easily gathered and flow into the connecting part of the resistor and a device to cause short circuit, and the waterproof sealing structure of the air blower resistor comprises a resistor body, a waterproof shell is fixed outside the resistor body, a waterproof base is inserted into the bottom of the resistor body, and the waterproof base comprises a bottom plate. According to the utility model, condensed water drops are drained through the arranged waterproof housing, most of water flows out through the isolation frame, the waterproof platform and the bottom, and a small part of water enters between the isolation frame and the bayonet socket through a gap between the waterproof housing and the isolation frame; water between the isolation frame and the bayonet socket flows into the drainage shell through the arranged inclined block, and the baffle is pushed outwards through gravitational potential energy generated by the inclined block, so that the water is discharged outwards through the drainage shell.

This negative-characteristic thermistor is provided with: a ceramic substrate formed from a ceramic composition containing Mn, Ni, and Fe; and an external electrode provided at an end portion of the ceramic substrate, in which the external electrode includes a base layer covering the end portion of the ceramic substrate and including Cu and glass, and a plating layer covering the base layer, and the Ni content, the Mn content, and the F content in the ceramic substrate satisfy the following formulae (1) and (2): 26.4 mol% < = [Ni] < = 29.5 mol%, 1.65 < = [Mn] / [Fe] < = 1.90 (2). Wherein [Ni], [Mn], and [Fe] are the contents (mol%) of Ni, Mn, and Fe, respectively, when the total content of Mn, Ni, and Fe contained in the ceramic matrix is 100 mol%.

A sensor device (1) for measuring the temperature of a surface (9A) is described, comprising: at least one sensor element (2); a ceramic housing (3) in which the sensor element (2) is at least partially disposed within the ceramic housing (3); a base (5) at least partially surrounding the ceramic housing (3); an external housing (8) connected to the base (5) in which the external housing (8) at least partially encloses the base (5) and the ceramic housing (3); and at least one mounting element (7) adapted and positioned to mount the sensor device (1) to a target application (9), wherein the ceramic housing (3) is adapted and positioned to be in direct mechanical contact with the surface (9A) whose temperature is to be measured. Furthermore, the use of the sensor device (1) is described.

The present invention relates to a jumper element, a shunt resistance device, and a method for adjusting characteristics of a shunt resistance device for current detection. A jumper element (10) for constituting a shunt resistance device for current detection is made of an electrically conductive metal material. The jumper element (10) has a main body portion (11) capable of being joined to a resistor body (5) constituting a part of the shunt resistance device, and a protruding portion (12) formed at a side portion of the main body portion (11), the protruding portion (12) being positioned so as not to overlap the resistor body (5).

To suppress peeling-off of a glass layer.SOLUTION: A circuit substrate 10 includes a substrate body 11, a pair of electrodes 41, 42, a resistive element 60, and a glass layer 70. The substrate body 11 is made of a ceramic. The pair of electrodes 41, 42 are spaced apart from each other on the substrate body 11. The resistive element 60 is positioned so as to cross the pair of electrode 41, 42. The glass layer 70 covers the pair of electrode 41, 42 and the resistive element 60. When in an area where the resistive element 60 and the glass layer 70 are arranged on the substrate body 11 between the pair of electrodes 41, 42, an area centered between the pair of electrodes 41, 42 is defined as a central part, a minimal distance T2 between the substrate body 11 and a surface of the glass layer 70 at the central part is shorter than a minimal distance T1 between the surface of the glass layer 70 and the substrate body 11 at a periphery P of the resistive element 60 located on the electrodes 41, 42.SELECTED DRAWING: Figure 4

The invention relates to a protective device (11) for an electronic component (10), wherein the protective device (11) can be arranged to at least partially encompass the at least one electronic component (10) and an electronic component (10) with such a protective device (11).

The invention discloses a pi-shaped chip high-voltage pulse attenuation network resistor and a manufacturing method thereof, and belongs to the technical field of electronic components. The network resistor structure comprises a ceramic substrate, a resistive layer, a resistive layer R1, a resistive layer R2, a resistive layer R3, a surface electrode, a back electrode, a side electrode, an electrode nickel-plated layer, an electrode lead-tin-plated layer, a glass protection layer and an epoxy resin layer. The manufacturing method comprises the following steps: printing a surface electrode on the upper surface of a ceramic substrate, printing a back electrode on the lower surface of the ceramic substrate, printing a resistive layer bridged on the surface electrode, printing protective glass on the resistive layer, carrying out laser resistance trimming on the resistive layer, printing an epoxy resin protective layer and a mark on the protective glass, and sputtering a metal layer on the end surface. And preparing an electrode nickel-plated layer and a lead-tin-plated layer on the end surface. The problems that in the prior art, overheat burnout is likely to occur, electrodes are likely to be eroded in a humid or sulfur-containing environment, and the manufacturing precision and stability are difficult to improve and control are solved. The resistor is widely applied to the technical field of attenuation network resistors.

To provide an electronic component capable of achieving both adhesion and visibility of a mark to an element body. An electronic component includes an element body and a mark formed on the element body. A main material of the mark is different from a material of the element body. The mark includes a first portion that constitutes a part of the mark and a second portion located at a position different from the first portion and connected to the first portion. A ratio of a main material of the mark included in the first portion is lower than a ratio of a main material of the mark included in the second portion.

The present invention relates to a semiconductor device. The semiconductor device of the present invention comprises a semiconductor substrate, a semiconductor layer arranged on the semiconductor substrate, several resistors arranged on the semiconductor layer, at least one electrode layer arranged on the semiconductor layer, and a first temperature sensing pad, a second temperature sensing pad, and a third temperature sensing pad arranged on the semiconductor layer, wherein the several resistors are electrically connected to at least one of the first temperature sensing pad, the second temperature sensing pad, and the third temperature sensing pad, and since heat is transferred through the semiconductor layer to the several resistors, the temperature of a maximum heat source of the semiconductor layer and the semiconductor device can be measured by the resistance values ​​of the several resistors.

An electric-powered road vehicle comprises two front wheels and two rear wheels; at least one battery; at least one electric machine configured to convert electrical energy to kinetic energy and vice versa. The electric machine is connected, on one side, to at least one battery and, on another side, to at least one of said wheels in such a way that during the running or acceleration of the vehicle, the electric machine converts incoming electrical energy arriving from the battery into kinetic energy to be transmitted to at least one of said wheels. At least one dissipative braking device converts the kinetic braking energy of at least one of said wheels into heat. A resistor device is connected to the electric machine and is configured to convert incoming electrical energy arriving from the electric machine into heat.

The present invention provides a braking resistor system (10) for a vehicle, comprising at least one electronic unit (13) including an inverter (12), power electronics and / or a control unit, and a high-load resistor unit (11) electrically coupled to the electronic unit (13) and having a housing (16), wherein the electronic unit (13) and the high-load resistor unit (11) are arranged adjacent to each other and are electrically coupled via a phase-carrying busbar (23), and wherein a cooling device (14) is provided for the joint cooling of the high-load resistor unit (11) and the electronic unit (13), as well as a vehicle with such a braking resistor system (10).

An aspect of the disclosure relates to a composite thermistor element (10). The element comprises a sensor material (1) disposed between a pair of electrodes (2a, 2b). The sensor material comprises particles (3) in a dielectric matrix (4). The particles (3) have a core (6) with a temperature dependent resistance and a coating layer (7) of an inorganic material. The particles form an electronic conduction path (5) between the electrodes (2a, 2b) with a temperature dependent resistance and a baseline resistance. Further aspects relate to methods of making thermistors, coated particles, compositions for use in making composite thermistors comprising the particles, and temperature sensors comprising the thermistors disclosed herein.

A method for applying a coating to at least one electronic component is described comprising the following steps:A) Providing a coating arrangement (1) comprising a coating roller (2), wherein the coating roller (2) is rotatable around a rotation axis (R);B) Providing a coating material (3) on the coating roller (2);C) Providing at least one electronic component (10);D) Moving the at least one electronic component (10) along the rotating coating roller (3) to obtain a coating (12) of at least a part of the electronic component (10).Moreover, a coating arrangement (1) for applying a coating (12) to at least one electronic component (10) is described.

The present invention relates to a surface-mountable temperature sensor (1) in a flip-chip design for mounting on a circuit board (10), comprising a sensor element (2) that changes its electrical properties depending on the temperature, an outer metallization (3) for contacting the circuit board (10), wherein the outer metallization (3) extends on a surface (2A, 3A) that faces the circuit board (10) when installed, and in the form of a solder-wettable side flank (3B) on a side surface (2B) perpendicular to the surface (3A). The invention further relates to a sensor device comprising the sensor (1) and a circuit board (10) on which the sensor (1) is mounted using the flip-chip method.

The utility model discloses a high-voltage thick-film ceramic resistor, which comprises a resistor, two ends of the resistor are symmetrically and fixedly connected with fixing frames, one side of each fixing frame is provided with a positioning hole, two sides of the resistor are symmetrically provided with fixing assemblies used for fixing the positions of the fixing frames, each fixing assembly comprises a mounting seat arranged at the bottom of the corresponding fixing frame, and the mounting seats are fixedly connected with the resistor. A limiting block is connected into the positioning hole in a penetrating mode, a positioning block is fixedly connected to the top end of the limiting block, and a fixing piece used for limiting the moving direction of the limiting block is arranged on one side of the limiting block. Through the design of the mounting seat, the limiting block, the positioning block, the fixed part and the movable part, the arranged limiting block is matched with the positioning hole formed in the fixed frame, the width of the arranged positioning block is larger than that of the positioning hole, and the position of the fixed frame is fixed through the positioning block which cannot be used upwards; and the situation that the fixing frame is directly fixed through a bolt when the position of the fixing frame is fixed is avoided.

It continues to perform the desired function in environments with temperature fluctuations. [Solution] The mounted component 1 is attached to the substrate electrode 23 provided on the substrate 2 by a solder joint 4. The mounted component 1 comprises a component body 11 and a component electrode 12 exposed from the component body 11. The component electrode 12 includes a back electrode bonding surface 122a that faces the substrate electrode 23 and is in contact with the back solder layer 431, an end electrode bonding surface 121a that extends in a direction upright from the substrate electrode 23 and is in contact with the end solder fillet 41, and an end chamfered electrode bonding surface 125a that connects the back electrode bonding surface 122a to the end electrode bonding surface 121a. The distance of the end chamfered electrode bonding surface 125a from the virtual surface 122K including the back electrode bonding surface 122a gradually increases.

The invention relates to the technical field of preparation of electronic components, and particularly discloses lead-free composite glass powder for side insulation of a resistor disc and a preparation method of the lead-free composite glass powder. The lead-free composite glass powder for side insulation of the resistor disc comprises the following raw materials in parts by weight: 90-110 parts of matrix glass powder and 10-30 parts of functional filler, and the matrix glass powder is vanadate-molybdate series lead-free glass. The lead-free composite glass powder is provided for the side face of the resistor disc, a compact insulating layer is formed after sintering, and the resistor disc has the advantages of being good in dielectric strength and good in durability.

The invention discloses a line lightning arrester, and relates to the technical field of power system lightning protection, the line lightning arrester comprises a lightning arrester body, a hinge fixing base and an electric control separation device, the lightning arrester body comprises a first lightning protection unit and a second lightning protection unit which are connected in series, and the bottom end of the first lightning protection unit is hinged to the hinge fixing base; the electric control disconnecting device comprises a thermal explosion disconnector and a leakage current monitoring module, the thermal explosion disconnector is connected with the first lightning protection unit and the second lightning protection unit, and the leakage current monitoring module is used for collecting the leakage current value of the first lightning protection unit in real time; under the condition that the leakage current value of the first lightning protection unit exceeds a preset action current threshold value, the leakage current monitoring module controls the thermal explosion disconnector to trigger a disengagement action, so that the top end of the first lightning protection unit is separated from the second lightning protection unit, and then the first lightning protection unit can rotate towards the ground around the hinged fixed base under the action of self weight; therefore, the first lightning protection unit and the second lightning protection unit are reliably separated, and timely separation of the fault lightning arrester is realized.

This electronic component has a first external electrode, a base body part, and a second external electrode that are disposed in order in a first direction. A direction opposite to the first direction is defined as a second direction. A direction orthogonal to the first direction is defined as an orthogonal direction. The first external electrode includes: a first external electrode body which is spaced apart from the base body part and disposed in a second direction relative to the second external electrode; and a first external electrode extension part extending in the first direction from an edge section of the first external electrode body. The second external electrode includes: a second external electrode body which is spaced apart from the base body part and disposed in the first direction relative to the first external electrode; and a second external electrode extension part extending in the second direction from an edge section of the second external electrode body. A portion of the first external electrode extension part and a portion of the second external electrode extension part constitute a pair of facing parts facing each other in the orthogonal direction. An insulating layer is provided between the pair of facing parts.

The laminated resistor has a plate-shaped resistor body having a first plane and a second plane in the thickness direction, a first electrode formed on the first plane, and a second electrode formed on the second plane, and the resistor body includes a metal body made of a conductive metal material and insulating particles made of an insulating material. The insulating particles include first insulating particles having a particle diameter of 5 [mu] m or more, and when the laminated resistor is mounted on a printed circuit board, the end surface of the resistor body is exposed, and the second electrode is connected via solder.

The invention discloses an electrode for a low-cost high-surge-resistance thermistor chip and a preparation method thereof, the electrode comprises a substrate, a composite barrier layer, a silver seed layer, a thick film electrode layer and an anti-oxidation layer, and the thick film electrode layer is made of copper. The NTC thermistor is manufactured through substrate pretreatment, composite barrier layer sputtering, silver seed layer sputtering, thick film electrode preparation, surface activation treatment and anti-oxidation treatment, and has the advantages that a high-resistance transition layer is eliminated, the contact resistance is stable, and the circulation requirement of the power type NTC thermistor is completely met; the copper paste is low in cost, low in electrode porosity, high in through-flow density, capable of bearing surge current, free of ablation, capable of working for more than 1000 hours under steady-state through-flow and low in contact resistance amplification, reducing atmosphere sintering can adapt to transformation of an existing thick film production line, the magnetron sputtering process is free of extra equipment investment, and direct large-scale mass production can be achieved.

A temperature-sensor assembly comprising at least one temperature sensor and at least one supply line, wherein the temperature sensor has at least one electrically insulating substrate with an upper side and an underside, wherein a temperature-sensor structure with at least one sensor-contact surface is formed at least on parts of the upper side, wherein the supply line has at least one supply-line contact surface, wherein the supply-line contact surface is connected to the sensor-contact surface at least in part by means of a first sinter layer.

The invention relates to the technical field of piezoresistors, in particular to a piezoresistor disc and a preparation method thereof.The piezoresistor disc comprises two electrodes and a ceramic substrate arranged between the two electrodes, and a plurality of transition layers are arranged at the contact positions of the ceramic substrate and the electrodes; the materials of the transition layers are obtained by doping silver powder with different mass fractions on the basis of ceramic base powder used for sintering the ceramic matrix, and the mass fractions of the silver powder in the multiple transition layers are gradually increased from the side close to the ceramic matrix to the side close to the electrode, so that gradient transition from the ceramic matrix material to the electrode material in component is formed. When the temperature changes, the thermal expansion difference between the adjacent transition layers can be obviously reduced, stress concentration generated at the interface due to the fact that the thermal expansion coefficient difference of two materials is too large in a traditional structure is avoided, and therefore the possibility that interface resistance changes after long-time use is reduced.

To provide dielectric material and a multilayer ceramic electronic component having a high dielectric constant and excellent withstanding voltage characteristics.SOLUTION: An dielectric according to one embodiment of the invention includes: a main component represented by (Ba1-XCaX)(Ti1-y(Zr,Sn,Hf)y)O3 (wherein 0≤X≤1, 0≤y≤0.5); a first subcomponent including one or more of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Nb, Tb, Eu, Tm, La, Lu and Yb; a second sub-component including Si and / or Al; and a third sub-component including Ba and / or Ca.SELECTED DRAWING: Figure 4