224results about "High voltage circuit adaptations" patented technology

This application relates to a heat dissipation shielding structure and a processing method, a circuit board assembly, and an electronic device. The printed circuit board includes a mounting surface. Electronic components are mounted on the mounting surface. The electronic components include an active component and a passive component. The heat dissipation shielding structure includes an insulating layer. The insulating layer is covered on the mounting surface, and wraps at least a side surface of the active component, so that a side that is of the insulating layer and that faces away from the mounting surface forms a first surface together with a top surface of the active component. A shielding layer is covered on the first surface, a shape of the shielding layer matches a shape of the first surface, and the shielding layer is electrically connected to a ground network of the printed circuit board.

A voltage converting circuit comprises a multi-layer printed-circuit-board stack having an input terminal and a reference terminal, first and second switching elements connected to each other at an output terminal and a parallel-plate capacitor connected with the first and the second switching elements; the stack comprises a top conductive layer provided with said input, reference and output terminals and with a plurality of power-conducting traces, a first and a second metal plane forming said electrodes of the parallel-plate capacitor, a first and a second signal layer having first and second signal-routing traces, wherein the first and the second metal plane are arranged between the top conductive layer and two signal layers, and wherein the top conductive layer and the first metal plane are separated from each other by an insulating layer of the stack only.

A power semiconductor module includes a semiconductor board and a number of semiconductor chips attached to the semiconductor board. Each semiconductor chip has two power electrodes. An adapter board is attached to the semiconductor board above the semiconductor chips. The adapter board includes a terminal area for each semiconductor chip on a side facing away from the semiconductor board. The adapter board, in each terminal area, provides a power terminal for each power electrode of the semiconductor chip associated with the terminal area. Each power terminal is electrically connected via a respective vertical post below the terminal area with a respective semiconductor chip and each of the power terminals has at least two plug connectors. Jumper connectors interconnect the plug connectors for electrically connecting power electrodes of different semiconductor chips.

A flexible printed circuit board according to an embodiment includes: a substrate; and a circuit pattern disposed on the substrate, wherein the circuit pattern includes a plurality of first circuit patterns, a plurality of second circuit patterns, and a plurality of third circuit patterns, wherein the third circuit pattern includes a third-first pad portion, a third-second pad portion, and a third wiring portion connecting the third-first pad portion and the third-second pad portion, a plurality of fourth wiring portions are disposed between a plurality of third wiring portions, a line width of the third wiring portion is greater than a line width of the fourth wiring portion, and a distance between the third wiring portion and the fourth wiring portion adjacent to the third wiring portion is greater than a distance between the fourth wiring portions.

Disclosed in the present invention is a filter circuit. A first PCB layer consists of a power line, a power interface, a second filter capacitor, and a first filter capacitor; the power line comprises a power supply network and a GND network; the second PCB layer is provided with a conductor plane; the power interface is connected to the GND network and is further connected to the conductor plane; the GND network, the second filter capacitor, and the conductor plane are sequentially connected; the power supply network, the first filter capacitor, and the conductor plane are sequentially connected. The circuit design of the circuit structure and the overall layout design idea in the present invention have a good suppression effect on common-mode noise, differential mode noise, radiation noise and conduction noise.

A voltage converter is provided, comprising:a first circuit board with a first circuit section of the voltage converter, wherein the first circuit section comprises semiconductor chips embedded between metal layers of the first circuit board, anda second circuit section a second circuit board with a second circuit section of the voltage converter, wherein the first circuit section is electrically coupled to the second circuit section.

A technique that is capable of suppressing a decrease in the effective area of wiring due to through holes and enables stable power supply is provided. A semiconductor device (1) has a surface layer power supply path (40) in a surface layer wiring layer (31), on which a chip module (5M) is mounted, of a main substrate (3) that has a plurality of wiring layers (31, 32, 33, 39) and through holes (TH), the surface layer power supply path (40) supplying power to a semiconductor chip (51p) via an inner peripheral-side power supply terminal group (141g) and an outer peripheral-side power supply terminal group (16g). The surface layer power supply path (40) overlaps the inner peripheral-side power supply terminal group (141g) and the outer peripheral-side power supply terminal group (16g) as seen in the orthogonal direction (Z), and is formed continuously so as to extend in a direction (Y) from a position at which the surface layer power supply path (40) is connected to the inner peripheral-side power supply terminal group (141g) toward the outer peripheral side of the main substrate (3).

The application discloses a manufacturing method of a ground performance metal-based circuit board for an intelligent networked automobile. According to design data, a substrate is manufactured, first drilling is performed, and carbon oil is filled, then first baking and curing are performed, a filling hole is formed, and a filling plate is formed on the whole plate; then polishing is performed, a ground circuit pattern is manufactured on the surface copper layer, and a metal-based circuit board is formed on the whole plate through subsequent processing; through the manufacturing method, the problem of hole wall cracking and separation caused by the thermal expansion and cold shrinkage difference of multi-layer materials of the substrate is effectively avoided in the method for forming a ground circuit by adopting an electroplating hole in the prior art; meanwhile, the complex processes such as copper deposition and copper plating required in electroplating are omitted, the processing flow is simplified, the carbon oil material cost is lower than that of silver paste and copper paste in the prior art, the material matching of the carbon oil with the circuit board body is better, the electrical connection between the ground circuit and the metal-based layer can be stably realized, and good ground performance is ensured.

A wiring board includes a wiring layer, a shield layer, and an insulating layer. The wiring layer includes at least one signal line and at least one ground line. The shield layer overlaps the wiring layer in plan view. The insulating layer is provided between the wiring layer and the shield layer. The insulating layer includes at least one end portion surrounded by the insulating layer. The at least one end portion is located on at least the at least one ground line. A connection conductor line electrically connecting the shield layer to the at least one ground line is provided on part of the at least one end portion.

A printed circuit board (PCB) assembly for electrostatic discharge (ESD) protection is disclosed. The assembly includes a top layer comprising at least one signal track and configured to support at least a portion of a plurality of electronic components mounted thereon. A middle layer disposed beneath the top layer. The middle layer comprises at least one ground tack configured to receive electrostatic discharge currents from adjacent layers. A bottom layer disposed beneath the middle layer. The bottom layer comprising at least one power track and configured to support another portion of the plurality of electronic components. A plurality of metal discharge elements disposed on at least one of the top layer or the bottom layer. Each of the metal discharge element is electrically connected to the at least ground track of the middle layer.

A power supply module is provided for powering an integrated circuit chip located at a first side of a first carrier board, including: a first-stage power supply unit; and a second-stage power supply unit, where one or more power input terminals of the second-stage power supply unit is electrically connected with one or more corresponding power output terminals of the first-stage power supply unit through a second carrier board; the second carrier board is configured to transmit power from the first-stage power supply unit to the second-stage power supply unit, and the second-stage power supply unit further supplies the power to the integrated circuit chip; one or more power output terminals of the second-stage power supply unit is electrically connected with one or more corresponding power terminals of the integrated circuit chip.

The present invention relates to a power electronic system (2) comprising: at least one electronic device; a printed circuit board (4) on which a plurality of electrical components are mounted; and positive and negative polarity connection components (6) configured to electrically connect the electronic device to an energy storage device, each polarity connection component (6) being formed by a first polarity branch (8, 12) and a second polarity branch (10, 14) that are different from each other and electrically connected to each other, the first positive polarity branch (8) and the first negative polarity branch (12) being electrically connected to the second positive polarity branch (10) and the second negative polarity branch (14) respectively via the printed circuit board (4).

The invention relates to a vehicle headlamp module comprising a circuit arrangement for controlling at least one function of a vehicle headlamp and a housing for accommodating the circuit arrangement, wherein the housing has a metallic, electrically conductive shielding surface towards the circuit arrangement for electromagnetic shielding of the circuit arrangement, wherein the circuit arrangement has a touch-sensitive surface section, wherein the touch-sensitive surface section has no electrical components arranged thereon and a flat section towards the shielding surface of the housing, wherein an electrical strip conductor and / or a contact extends along the touch-sensitive surface section, wherein a plurality of solidified, electrically non-conductive adhesive points are arranged on the touch-sensitive surface section, which adhesive points project in the direction of the flat section of the shielding surface of the housing from the touch-sensitive surface section for ensuring a minimum distance between the touch-sensitive surface section and the flat section of the shielding surface of the housing.

An interposer for a processor includes: an electrically insulating material having a first main side and a second main side opposite the first main side; a plurality of electrically conductive structures embedded in the electrically insulating material and configured to provide an electrical interface for a processor substrate at the first main side of the electrically insulating material and to provide electrical connections from the electrical interface to the second main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material to a lower voltage at the first main side of the electrically insulating material.

The invention relates to a flexible printed circuit board comprising a conductor track unit (14). A first side (30) of the conductor track unit (14) is connected to a first carrier film (16) by means of a first adhesive layer (18). A first outer side (20) of the flexible printed circuit board (12) is formed by a surface of the first carrier foil (16) facing away from the conductor track unit (14). The flexible printed circuit board (12) comprises a second carrier film (26) which is connected to a second side (32) of the conductor track unit (14) by means of a second adhesive layer (28). A second outer side (34) of the flexible printed circuit board (12) is formed by a surface of the second carrier film (26) facing away from the conductor track unit (14). The first adhesive layer (18) has a lower thickness (40) than the second adhesive layer (28). The invention also relates to a control device comprising such a printed circuit board (12) and to a method for manufacturing a flexible printed circuit board (12).

A protection circuit arrangement includes a substrate having a first surface and a second surface; a connector on the first surface and electrically connected to a battery cell; an overvoltage protection element on the second surface and electrically connected to the connector; and a fuse on the first surface and electrically connected to the overvoltage protection element.

To prevent lead breakage of mounted components due to vibration of heavy components on a substrate.SOLUTION: A printed circuit board 100 has a first component 10, which is a heavy component that stores electrical or inductive energy, a second component 20, which is a power device with a plurality of leads 200, and a substrate 30 on which the first component 10 and second component 20 are mounted. In the substrate 30, a slit 30a is provided between the first component 10 and the second component 20, and the lead of the second component 20 is soldered to the substrate. In the printed circuit board 100, the slit 30a suppresses the propagation of vibration from the heavy first component 10 to the second component 20, thus preventing vibration-induced breakage of the lead 200.SELECTED DRAWING: Figure 6

A printed circuit board (PCB) assembly for electrostatic discharge (ESD) protection is disclosed. The assembly includes a top layer comprising at least one signal track and configured to support at least a portion of a plurality of electronic components mounted thereon. A middle layer disposed beneath the top layer. The middle layer comprises at least one ground track configured to receive electrostatic discharge currents from adjacent layers. A bottom layer disposed beneath the middle layer. The bottom layer comprises at least one power track 108a and configured to support another portion of the plurality of electronic components. A plurality of metal discharge elements disposed on at least one of the top layer or the bottom layer. Each of the metal discharge element is electrically connected to the at least ground track of the middle layer.

The application discloses a circuit board assembly and a terminal, relates to the technical field of electronic devices, and aims to solve the problem that various electronic components cannot be integrated on a circuit board simultaneously in the case that the circuit board occupies limited planar area in an entire electronic product. The circuit board assembly comprises at least two layers of circuit boards and at least one first adapter plate. The circuit board has oppositely arranged upper and lower surfaces. The upper and lower surfaces of the circuit board are used for integrating electronic components. In addition, the first adapter plate is arranged on at least one side of the at least two layers of circuit boards and is electrically connected with the at least two layers of circuit boards.

Provided is a control device that comprises a printed wiring board and takes into account the dissipation of heat from a power supply IC. A control device (60) has a transformer (41) that is mounted on a first surface (51a) of a printed wiring board (51) such that a heat dissipation space (450) is formed between the transformer (41) and the first surface (51a). A power supply IC (43) is mounted on a second surface (51b) of the printed wiring board (51) so as to be opposite at least a portion of the transformer (41). The printed wiring board (51) has a plurality of ventilation holes (511) that lead to the heat dissipation space 450 at locations that are opposite the transformer (41) and locations that are opposite the power supply IC (43).

The invention relates to an insulating seal for an electrical plug connector, having a passage opening for receiving contact elements of the electrical plug connector, having a contact sealing portion which extends in a sleeve-like manner along the passage opening, and having a creepage distance increasing portion which is arranged opposite the contact sealing portion, wherein the creepage distance increasing portion continues the passage opening in a tube-like manner and / or extends away from the passage opening in a plate-like manner. The contact sealing portion serves to seal a gap between the contact elements and a housing of the plug connector, while the creepage distance increasing portion is adapted to isolate the contact elements from other components in the interior of the housing which have different electrical potentials. The seal according to the invention thus replaces additional insulating components and allows savings in terms of costs, material and / or installation space. The invention also relates to the use of such a seal. The invention also relates to an electrical plug connector and an electrical plug connector assembly having such a seal.

A sensing device is disclosed. The sensing device comprising a printed circuit board (PCB), a conductive port coupled to the PCB via a conductive adhesive and defining an orifice filled with a protective gel. Further, the sensing device comprises a sensing element disposed on the PCB within the conductive port and encased by the protective gel, and a conductive member disposed at least over the protective gel. The conductive member is configured to discharge static charges accumulated over the protective gel to the PCB via at least the conductive adhesive.

A circuit board according to an embodiment includes a first insulating layer, a coating layer disposed on the first insulating layer, and a circuit pattern layer disposed on the coating layer, wherein the circuit pattern layer includes a first metal layer disposed on the coating layer, and a second metal layer disposed on the first metal layer, wherein the coating layer includes a first functional group bonded to the first insulating layer, and a second functional group bonded to the first metal layer.

A segmented bottom-emitting OLED device compromising an array of multiple OLED segments arranged on a common transparent substrate, where the array forms an emitting area where each segment is separated by a non-emitting gap; wherein each OLED segment is defined by a transparent bottom electrode segment, organic layers for light emission, and a top electrode; wherein between the bottom electrode and the substrate in at least one OLED segment, there is a transparent insulating layer that is closer to the bottom electrode segment and a transparent conductive layer that is closer to the substrate.

A bonding structure is provided. The bonding structure includes a first substrate, a dielectric layer, a second substrate, a reflowable element, and a dielectric adhesive element. The dielectric layer is over the first substrate. The second substrate is over the first substrate. The reflowable element connects the first substrate to the second substrate. The dielectric adhesive element encapsulates the reflowable element and partially horizontally overlaps the dielectric layer.

A high voltage inductive adder is disclosed. An inductive adder may include a plurality of switch boards that each include a plurality of switch boards that include a plurality of solid state switches. These switch boards may be stacked one upon another. The inductive adder may include a transformer comprising a plurality of toroid-shaped transformer cores disposed on a corresponding one of the plurality of switch boards; and a transformer rod that extends through the plurality of switch boards and the plurality of transformer cores. The inductive adder may include an output electrically coupled with the transformer rod. And each of the plurality of circuit boards, for example, may include a tailbiter circuit electrically coupled in parallel with the output.

Power module (10) for a converter for use in a vehicle that is at least partially electrified, wherein the power module (10) has the following: - at least one power switch (12) that can be switched to convert an input current into an output current, - several power terminals (14, 15, 16) which are electrically connected to current electrodes (18, 20) of the circuit breaker (12) and are designed to supply the input current or to draw the output current, - at least one signal pin (22, 22a,b) designed to imprint a control signal generated by a control device (30, 30a,b) onto a control electrode (24) of the circuit breaker (12), and - an electrically conductive shield (26) that is galvanically isolated from the signal pin (22, 22a,b) and at least partially surrounds the signal pin (22, 22a,b).

A half-bridge switch arrangement includes a high-side switch having a plurality of parallel-connected first semiconductor switching elements, a low-side switch having a plurality of parallel-connected second semiconductor switching elements, a positive busbar to which a terminal of each of the first semiconductor switching elements of the high-side switch is electrically connected, a negative busbar to which a terminal of each of the second semiconductor switching elements of the low-side switch is electrically connected, and a heat sink, the heat sink having a first section and a second section disposed on the first section, the first semiconductor switching elements and the second semiconductor switching elements being disposed on the second section, wherein the positive busbar and the negative busbar are disposed one above the other on an upper surface of the first section.

A display device includes a driver comprising a flexible circuit board connected to a display panel. The driver further includes: a first source circuit board; a second source circuit board; a main circuit board including a controller for generating a power supply voltage, the main circuit board applying the power supply voltage to each of the first and second source circuit boards; and a connector connecting the first and second source circuit boards. The connector is electrically connected to a first voltage line of a plurality of voltage lines of the first source circuit board that is most adjacent to the second source circuit board, and a second voltage line of a plurality of voltage lines of the second source circuit board that is most adjacent to the first source circuit board.