494results about "High voltage circuit adaptations" patented technology

A printed circuit board includes a substrate with first through-portion; a magnetic layer disposed in at least a portion of the first through-portion and having a second through-portion; an electronic component having at least a portion disposed in the second through-portion; a first wiring pattern disposed on an upper surface of the magnetic layer; a second wiring pattern disposed on a lower surface of the magnetic layer; and a first through-via having at least a portion surrounded by the magnetic layer, and including a first via pattern connecting the first and second wiring patterns to each other.

A lamp (10) comprising a printed circuit board (100) which comprises a substrate (110) extending in a first direction x. A high voltage track (120) and a plurality of conductive regions (130) are provided on the substrate. The high voltage track extends in the first direction, and the plurality of conductive regions are provided in a row extending in the first direction. Each conductive region comprises three subregions (131, 132, (133) arranged along the first direction, with a center subregion (133) having a greater distance D3 from the high voltage track than a distance D1, D2 between the high voltage track and each of the first and second subregions.

This application relates to a heat dissipation shielding structure and a processing method, a circuit board assembly, and an electronic device. The printed circuit board includes a mounting surface. Electronic components are mounted on the mounting surface. The electronic components include an active component and a passive component. The heat dissipation shielding structure includes an insulating layer. The insulating layer is covered on the mounting surface, and wraps at least a side surface of the active component, so that a side that is of the insulating layer and that faces away from the mounting surface forms a first surface together with a top surface of the active component. A shielding layer is covered on the first surface, a shape of the shielding layer matches a shape of the first surface, and the shielding layer is electrically connected to a ground network of the printed circuit board.

To provide a circuit board unit that suitably prevents unnecessary radiation noise resulting from a current flowing in a connector unit.SOLUTION: A circuit board unit 60 comprises: a first circuit board 61; a second circuit board 62; a connector unit 70 that has a first connector 71 attached to the first circuit board 61 and a second connector 72 attached to the second circuit board 62; and a metal member 80 that connects the first circuit board 61 and the second circuit board 62 to each other. The metal member 80 has a first connection part 85a that is electrically connected to a first ground layer 61g, a second connection part 85b that is electrically connected to a second ground layer 62g, and a cover part 80a that covers at least part of the connector unit 70. The cover part 80a has an opposite wall part 61. The opposite wall part 81 overlaps the first circuit board 61 when seen in a direction orthogonal to a plate surface of the first circuit board 61, and overlaps the second circuit board 62 when seen in a direction orthogonal to a plate surface of the second circuit board 62.SELECTED DRAWING: Figure 2

A measuring device for has a housing, a measuring circuit board, and a communication circuit board. The measuring circuit board has a voltage connection, a voltage divider, a CT connection for connecting an external current transformer, a measuring chip connected to the voltage divider and the CT connection for determining electrical quantities and outputting as measurement data to a first part of a plug connector. The communication circuit board is connected to a second part of the plug connector, which together with the first part connects the communication circuit board and the measuring circuit board, a data communication chip connected to the second part and electrically isolated to receive the measurement data from the measuring chip, where a galvanic isolation between the measuring chip and the data communication chip is provided on the communication circuit board, a data connection connected to the data communication chip and a user interface.

A voltage converting circuit comprises a multi-layer printed-circuit-board stack having an input terminal and a reference terminal, first and second switching elements connected to each other at an output terminal and a parallel-plate capacitor connected with the first and the second switching elements; the stack comprises a top conductive layer provided with said input, reference and output terminals and with a plurality of power-conducting traces, a first and a second metal plane forming said electrodes of the parallel-plate capacitor, a first and a second signal layer having first and second signal-routing traces, wherein the first and the second metal plane are arranged between the top conductive layer and two signal layers, and wherein the top conductive layer and the first metal plane are separated from each other by an insulating layer of the stack only.

To provide a device for fixing a camera module circuit board.SOLUTION: A device for fixing a camera module circuit board is provided, comprising: a base portion; and a fixing unit including a first fixing part for supporting one side of each of a plurality of boards, and a second fixing part for supporting the other side opposite the one side of each of the plurality of boards. A plurality of first fixing parts extend in a first direction from the base portion, and include a plurality of protrusions protruding in a direction perpendicular to the first direction in order to support one side of each of the plurality of boards. A plurality of second fixing parts extend in the first direction from the base portion, and include a plurality of protrusions for supporting the other side of each of the plurality of boards.SELECTED DRAWING: Figure 6

A power semiconductor module includes a semiconductor board and a number of semiconductor chips attached to the semiconductor board. Each semiconductor chip has two power electrodes. An adapter board is attached to the semiconductor board above the semiconductor chips. The adapter board includes a terminal area for each semiconductor chip on a side facing away from the semiconductor board. The adapter board, in each terminal area, provides a power terminal for each power electrode of the semiconductor chip associated with the terminal area. Each power terminal is electrically connected via a respective vertical post below the terminal area with a respective semiconductor chip and each of the power terminals has at least two plug connectors. Jumper connectors interconnect the plug connectors for electrically connecting power electrodes of different semiconductor chips.

A power module for the controllable electrical power supply of a consumer includes a plurality of housed power semiconductors each with an electrically non-insulated heat discharge surface, a printed circuit board, a heat sink, one or more insulation plates, wherein the printed circuit board is arranged on a side of the power semiconductor in an orthogonal direction opposite the heat sink, wherein the insulation plate is arranged between the housed power semiconductors and a cooling surface of the heat sink, wherein one insulation plate in each case is interlockingly connected by one side to one electrically non-insulated heat discharge surface of a housed power semiconductor and is interlockingly connected by the other side to the heat sink.

An electrode module for use in an air ionizer system is disclosed herein. The electrode module includes a first printed circuit board extending in a first direction from a first edge to a second edge, a first positive high voltage track formed on the first printed circuit board, the first positive high voltage track extending in the first direction, a first negative high voltage track formed on the first printed circuit board, the first negative high voltage track being spaced apart from the first positive high voltage track by a first distance in a second direction perpendicular to the first direction, a first ion sense trace formed on the first printed circuit board, a first ion probe attached to the first printed circuit board and the first ion sense trace, and a first connector coupled to the first positive high voltage track and configured to receive a first ion emitter.

The invention relates to the technical field of solid state disks, in particular to a bonding pad assembly, a circuit board, a memory card, a card seat and a starting judgment device. The bonding pad assembly is distributed on a substrate of the memory card; the bonding pad assembly comprises a plurality of rows of bonding pads; the plurality of rows of bonding pads comprise a first row of bonding pads; the first row of bonding pads comprise a first grounding bonding pad; the width of the first grounding bonding pad is greater than that of any bonding pad in the first row of bonding pads; the length of the first grounding bonding pad is greater than or equal to the length of any bonding pad of the first row of bonding pads; the distance from the central point of the first grounding bonding pad to a preset reference line on the substrate is smaller than the distance from the central point of any bonding pad in the first row of bonding pads to the reference line; wherein the linear direction parallel to the reference line is the width direction of each component of the bonding pad component. The bonding pad assembly is small in size and can support hot plug.

The present application relates to a cooling structure, and specifically relates to a cooling and shielding structure, a processing method, a circuit board assembly and an electronic apparatus. The cooling and shielding structure is applied to a circuit board. The circuit board comprises a mounting surface, electronic components being mounted on the mounting surface, and the electronic components comprising an active device and a passive device. The cooling and shielding structure comprises an insulating layer, the insulating layer covering the mounting surface, coating the side surface and the top surface of the passive device, and at least coating the side surface of the active device, so that the side of the insulating layer facing away from the mounting surface forms a first surface, or the side of the insulating layer facing away from the mounting surface and the top surface of the active device collectively form a first surface. A shielding layer covers the first surface, the shape of the shielding layer being matched with the shape of the first surface, and the shielding layer being electrically connected to a ground end of the circuit board. While achieving a shielding effect on electronic components on circuit boards, the cooling and shielding structure provided in the present application can also improve a cooling effect on the electronic components, thereby improving the working stability and safety of the circuit boards.

The invention relates to an amplifier circuit (1) for broadband and low-noise amplification of a capacitive current source, preferably a thermoelectric sensor, comprising: a signal input (3) which can be connected to the capacitive current source in a node K1; the invention relates to an amplifier (1) for amplifying an input voltage, comprising an input stage (A1), which is connected to a node K1 at an input (7) of the input stage (A1) and has a node K2 at an output (9) of the input stage (A1), the input stage (A1) being designed to amplify the input voltage by at least three times, the input stage (A1) being designed to provide a high-ohm input resistance at the input of the input stage (A1), the input stage (A1) is designed to provide a stable and load-independent voltage at the output of the input stage (A1); the invention relates to a power amplifier comprising a first amplifier (A1) and a second amplifier (A3), an amplifier cascade (11) having at least a first amplifier and a second amplifier (A2, A3), each having an input (13, 17) and an output (15, 19), the output (15) of the first amplifier (A2) being connected in a node K3 to the input (17) of the second amplifier (A3), the input (13) of the first amplifier (A2) being connected to a node K2, the output (15, 19) being connected in a node K3 to the input (17) of the second amplifier (A3). An output (19) of the second amplifier (A3) is connected to a node K4, the amplifier cascade (11) being arranged to produce a high signal gain with a low phase shift over a wide frequency range; a feedback network (F1), which is connected to the input (7) of the input stage (A1) in a node K1 and to the output (19) of the second amplifier (A3) in a node K4, said feedback network (F1) being designed to provide a high-ohm feedback resistance with a parasitic capacitance of less than 0.5 pF, the feedback network (F1) is arranged to provide a negative feedback to a structure comprising the input stage (A1) and the amplifier cascade (11), and a signal output (21) connected to a node K5, which is connected to or corresponds to a node K4. The invention also relates to a sensor system.

The invention discloses an anti-static circuit board and a production process thereof, and belongs to the technical field of circuit boards, and the production process comprises the following steps: 1, obtaining polyaniline-based graphene composite powder through amidation and polymerization reaction; step 2, taking AgNO3 as a silver source, loading silver particles on the surface of the Fe3O4 nanowire, and then carrying out surface modification by using a KH-560 silane coupling agent to obtain a modified conductive Fe3O4 nanowire; 3, the polyaniline-based graphene composite powder, the modified conductive Fe3O4 nanowires and other auxiliary materials are subjected to ultrasonic mixing, and anti-static liquid is obtained; 4, etching an inner layer circuit, spraying an anti-static liquid on an outer layer base material, laminating, drilling, performing copper deposition, etching the circuit and performing resistance welding treatment to obtain an anti-static circuit board; according to the anti-static circuit board and the production process thereof, the anti-static performance, the efficient heat conduction performance and the electromagnetic shielding performance are achieved.

A flexible printed circuit board according to an embodiment includes: a substrate; and a circuit pattern disposed on the substrate, wherein the circuit pattern includes a plurality of first circuit patterns, a plurality of second circuit patterns, and a plurality of third circuit patterns, wherein the third circuit pattern includes a third-first pad portion, a third-second pad portion, and a third wiring portion connecting the third-first pad portion and the third-second pad portion, a plurality of fourth wiring portions are disposed between a plurality of third wiring portions, a line width of the third wiring portion is greater than a line width of the fourth wiring portion, and a distance between the third wiring portion and the fourth wiring portion adjacent to the third wiring portion is greater than a distance between the fourth wiring portions.

Systems, apparatuses and methods may provide for technology that includes a voltage regulator, a board assembly including a die and a circuit board electrically coupled to a first side of the die, and a thermal dissipation assembly thermally and electrically coupled to a second side of the die, wherein the thermal dissipation assembly is further electrically coupled to the voltage regulator. In one example, the thermal dissipation assembly includes a vapor chamber and the technology further includes a plurality of copper plates electrically coupled to the voltage regulator and a package substrate containing the die, wherein the plurality of copper plates are further thermally coupled to the vapor chamber.

A printed circuit board and a method of manufacturing the same. The printed circuit board includes: a first insulating layer; and a plurality of first metal patterns disposed on the first insulating layer, wherein the first insulating layer has at least one recessed portion, the recessed portion is disposed between the plurality of first metal patterns, and each of the plurality of first metal patterns includes a first seed metal layer disposed on the first insulating layer, a second seed metal layer disposed on the first seed metal layer, and a metal pattern layer disposed on the second seed metal layer.

Disclosed in the present invention is a filter circuit. A first PCB layer consists of a power line, a power interface, a second filter capacitor, and a first filter capacitor; the power line comprises a power supply network and a GND network; the second PCB layer is provided with a conductor plane; the power interface is connected to the GND network and is further connected to the conductor plane; the GND network, the second filter capacitor, and the conductor plane are sequentially connected; the power supply network, the first filter capacitor, and the conductor plane are sequentially connected. The circuit design of the circuit structure and the overall layout design idea in the present invention have a good suppression effect on common-mode noise, differential mode noise, radiation noise and conduction noise.

A voltage converter is provided, comprising:a first circuit board with a first circuit section of the voltage converter, wherein the first circuit section comprises semiconductor chips embedded between metal layers of the first circuit board, anda second circuit section a second circuit board with a second circuit section of the voltage converter, wherein the first circuit section is electrically coupled to the second circuit section.

A power electronics converter is disclosed. The power electronics converter comprises a converter commutation cell comprising a power circuit and a gate driver circuit, the power circuit comprising at least one power semiconductor switching element and at least one capacitor. Each power semiconductor switching element has at least three terminals including a gate terminal. The gate driver circuit is electrically connected to and configured to provide switching signals to the gate terminal of each of the at least one power semiconductor switching elements. The power electronics converter may be an AC-DC power electronics converter (i.e., an inverter or a rectifier) or a DC-DC power electronics converter

A technique that is capable of suppressing a decrease in the effective area of wiring due to through holes and enables stable power supply is provided. A semiconductor device (1) has a surface layer power supply path (40) in a surface layer wiring layer (31), on which a chip module (5M) is mounted, of a main substrate (3) that has a plurality of wiring layers (31, 32, 33, 39) and through holes (TH), the surface layer power supply path (40) supplying power to a semiconductor chip (51p) via an inner peripheral-side power supply terminal group (141g) and an outer peripheral-side power supply terminal group (16g). The surface layer power supply path (40) overlaps the inner peripheral-side power supply terminal group (141g) and the outer peripheral-side power supply terminal group (16g) as seen in the orthogonal direction (Z), and is formed continuously so as to extend in a direction (Y) from a position at which the surface layer power supply path (40) is connected to the inner peripheral-side power supply terminal group (141g) toward the outer peripheral side of the main substrate (3).

The application discloses a manufacturing method of a ground performance metal-based circuit board for an intelligent networked automobile. According to design data, a substrate is manufactured, first drilling is performed, and carbon oil is filled, then first baking and curing are performed, a filling hole is formed, and a filling plate is formed on the whole plate; then polishing is performed, a ground circuit pattern is manufactured on the surface copper layer, and a metal-based circuit board is formed on the whole plate through subsequent processing; through the manufacturing method, the problem of hole wall cracking and separation caused by the thermal expansion and cold shrinkage difference of multi-layer materials of the substrate is effectively avoided in the method for forming a ground circuit by adopting an electroplating hole in the prior art; meanwhile, the complex processes such as copper deposition and copper plating required in electroplating are omitted, the processing flow is simplified, the carbon oil material cost is lower than that of silver paste and copper paste in the prior art, the material matching of the carbon oil with the circuit board body is better, the electrical connection between the ground circuit and the metal-based layer can be stably realized, and good ground performance is ensured.

A circuit board having a top side and a bottom side, wherein the circuit board has at least two circuits, wherein each of the at least two circuits has at least one printed conductor and at least one current-carrying electronic component, and wherein the circuit board has at least one through-hole, which is provided with at least one insulating unit, wherein the at least one insulating unit is arranged in the at least one through-hole and is therefore mechanically connected to the circuit board and is positioned between a first circuit and at least one second circuit of the printed circuit.

A wiring board includes a wiring layer, a shield layer, and an insulating layer. The wiring layer includes at least one signal line and at least one ground line. The shield layer overlaps the wiring layer in plan view. The insulating layer is provided between the wiring layer and the shield layer. The insulating layer includes at least one end portion surrounded by the insulating layer. The at least one end portion is located on at least the at least one ground line. A connection conductor line electrically connecting the shield layer to the at least one ground line is provided on part of the at least one end portion.

A printed circuit board (PCB) assembly for electrostatic discharge (ESD) protection is disclosed. The assembly includes a top layer comprising at least one signal track and configured to support at least a portion of a plurality of electronic components mounted thereon. A middle layer disposed beneath the top layer. The middle layer comprises at least one ground tack configured to receive electrostatic discharge currents from adjacent layers. A bottom layer disposed beneath the middle layer. The bottom layer comprising at least one power track and configured to support another portion of the plurality of electronic components. A plurality of metal discharge elements disposed on at least one of the top layer or the bottom layer. Each of the metal discharge element is electrically connected to the at least ground track of the middle layer.

To provide a printed circuit board and a power conversion device that implement reduction in electric field strength and prevention of dielectric breakdown.SOLUTION: A printed wiring board 100 includes an insulating substrate 1, an inner layer conductor pattern 2, an interlayer insulating layer 3 formed so as to cover the inner layer conductor pattern, and an outer layer conductor pattern 4 that is formed on a surface opposite to a surface on the insulating substrate side and facing the inner layer conductor pattern in a plate thickness direction. The inner layer conductor pattern has a surface region 7 which is a surface on the outer layer conductor pattern side, and the outer layer conductor pattern has an inner layer surface 4b which is a surface on the interlayer insulating layer side and a side edge portion 4a which is a side surface on which an edge is formed. An end portion of the inner layer surface of the outer layer conductor pattern is formed at a position where it does not overlap with the surface region of the inner layer conductor pattern in a planar direction. The distance X in the planar direction between the end portion of the inner layer surface of the outer layer conductor pattern and the end portion of the surface region of the inner layer conductor pattern is longer than half the distance Z in the plate thickness direction between the outer layer conductor pattern and the inner layer conductor pattern.SELECTED DRAWING: Figure 1

The invention relates to a DC-DC converter, in particular of a motor vehicle, and a method for its production, the DC-DC converter comprising at least one filter (12) for filtering at least one supplied high-voltage input variable (10), at least one DC-AC converter (18), to which at least one output signal of the filter (12) can be supplied, at least one transformer (20), to which at least one output signal of the DC-AC converter (18) can be supplied, at least one AC-DC converter (22), to which at least one output signal of the transformer (20) can be supplied, at least one further filter (26), to which at least one output signal of the AC-DC converter (22) can be supplied, wherein the output signal of the further filter (26) is available as a low-voltage output variable (28), wherein at least one printed circuit board (32) is provided, on which at least the filters (12, 26),the transformer (20) as well as the DC-AC converter (18) and the AC-DC converter (22) and the transformer (20) are arranged and / or wherein at least one shield (48) is provided which serves both for electromagnetic shielding and for fastening at least one of the filters (12, 26) and / or the transformer (20).

A segmented bottom-emitting OLED device compromising an array of multiple OLED segments arranged on a common transparent substrate, where the array forms an emitting area where each segment is separated by a non-emitting gap; wherein each OLED segment is defined by a transparent bottom electrode segment, organic layers for light emission, and a top electrode; wherein between the bottom electrode and the substrate in at least one OLED segment, there is a transparent insulating layer that is closer to the bottom electrode segment and a transparent conductive layer that is closer to the substrate.

A power supply module is provided for powering an integrated circuit chip located at a first side of a first carrier board, including: a first-stage power supply unit; and a second-stage power supply unit, where one or more power input terminals of the second-stage power supply unit is electrically connected with one or more corresponding power output terminals of the first-stage power supply unit through a second carrier board; the second carrier board is configured to transmit power from the first-stage power supply unit to the second-stage power supply unit, and the second-stage power supply unit further supplies the power to the integrated circuit chip; one or more power output terminals of the second-stage power supply unit is electrically connected with one or more corresponding power terminals of the integrated circuit chip.