27results about "High voltage circuit adaptations" patented technology

A flexible printed circuit board according to an embodiment includes: a substrate; and a circuit pattern disposed on the substrate, wherein the circuit pattern includes a plurality of first circuit patterns, a plurality of second circuit patterns, and a plurality of third circuit patterns, wherein the third circuit pattern includes a third-first pad portion, a third-second pad portion, and a third wiring portion connecting the third-first pad portion and the third-second pad portion, a plurality of fourth wiring portions are disposed between a plurality of third wiring portions, a line width of the third wiring portion is greater than a line width of the fourth wiring portion, and a distance between the third wiring portion and the fourth wiring portion adjacent to the third wiring portion is greater than a distance between the fourth wiring portions.

A technique that is capable of suppressing a decrease in the effective area of wiring due to through holes and enables stable power supply is provided. A semiconductor device (1) has a surface layer power supply path (40) in a surface layer wiring layer (31), on which a chip module (5M) is mounted, of a main substrate (3) that has a plurality of wiring layers (31, 32, 33, 39) and through holes (TH), the surface layer power supply path (40) supplying power to a semiconductor chip (51p) via an inner peripheral-side power supply terminal group (141g) and an outer peripheral-side power supply terminal group (16g). The surface layer power supply path (40) overlaps the inner peripheral-side power supply terminal group (141g) and the outer peripheral-side power supply terminal group (16g) as seen in the orthogonal direction (Z), and is formed continuously so as to extend in a direction (Y) from a position at which the surface layer power supply path (40) is connected to the inner peripheral-side power supply terminal group (141g) toward the outer peripheral side of the main substrate (3).

The present invention relates to a power electronic system (2) comprising: at least one electronic device; a printed circuit board (4) on which a plurality of electrical components are mounted; and positive and negative polarity connection components (6) configured to electrically connect the electronic device to an energy storage device, each polarity connection component (6) being formed by a first polarity branch (8, 12) and a second polarity branch (10, 14) that are different from each other and electrically connected to each other, the first positive polarity branch (8) and the first negative polarity branch (12) being electrically connected to the second positive polarity branch (10) and the second negative polarity branch (14) respectively via the printed circuit board (4).

A circuit board according to an embodiment includes a first insulating layer, a coating layer disposed on the first insulating layer, and a circuit pattern layer disposed on the coating layer, wherein the circuit pattern layer includes a first metal layer disposed on the coating layer, and a second metal layer disposed on the first metal layer, wherein the coating layer includes a first functional group bonded to the first insulating layer, and a second functional group bonded to the first metal layer.

A technique that is capable of suppressing a decrease in the effective area of wiring due to through holes and enables stable power supply is provided. A semiconductor device (1) has a surface layer power supply path (40) in a surface layer wiring layer (31), on which a chip module (5M) is mounted, of a main substrate (3) that has a plurality of wiring layers (31, 32, 33, 39) and through holes (TH), the surface layer power supply path (40) supplying power to a semiconductor chip (51p) via an inner peripheral-side power supply terminal group (141g) and an outer peripheral-side power supply terminal group (16g). The surface layer power supply path (40) overlaps the inner peripheral-side power supply terminal group (141g) and the outer peripheral-side power supply terminal group (16g) as seen in the orthogonal direction (Z), and is formed continuously so as to extend in a direction (Y) from a position at which the surface layer power supply path (40) is connected to the inner peripheral-side power supply terminal group (141g) toward the outer peripheral side of the main substrate (3).

The present disclosure provides a curable composition comprising (a) an epoxy resin; (b) a hardener; (c) a curing catalyst; (d) boron nitride as fillers; and (e) an optional additive. The present disclosure also provides an insulating film comprising the aforementioned curable composition, which are particularly suited for manufacturing printed circuit boards (PCBs). The insulating film exhibit excellent electrical properties, including low dissipation factor (Df) and a low coefficient of thermal expansion (CTE). Furthermore, the insulating film provides significant advantages in reducing the production time in PCB manufacturing processes that involve a plasma etching step.

An electronic device configured for a buck-boost circuit to be disposed thereon, and includes a chassis, a circuit board and noise suppression capacitors. The circuit board is disposed in the chassis, and is configured for the buck-boost circuit to be disposed thereon. The circuit board has a power circuit structure having power conductive vias. The noise suppression capacitors are disposed on at least one side of the power circuit structure. The power circuit structure provides at least a part of the noise suppression capacitors located adjacent to the power conductive vias, and provides at least a part of the noise suppression capacitors located away from the power conductive vias. A distance between any two adjacent noise suppression capacitors located away from the power conductive vias is configured to be less than or equal to one-eighth of a wavelength of a signal noise generated by the buck-boost circuit.

For single photon emission computed tomography (SPECT) detectors, embedded capacitive material (ECM) is used in printed circuit boards (PCB) with semiconductor detectors. High voltage (HV) filtering and / or blocking capacitors are formed from ECM. ECM is less disruptive to radiation or emissions to be detected by the semiconductor detectors compared to surface mounted capacitors.

This invention provides an electronic device for housing a buck-boost circuit, comprising a housing, a circuit board, and a plurality of noise-canceling capacitors. The circuit board is disposed within the housing and is used to house the buck-boost circuit. The circuit board has a power layer. The power layer has a plurality of power through-layer portions. The noise-canceling capacitors are disposed on at least one side of the power layer. At least some of the noise-canceling capacitors are located near these power through-layer portions. At least another portion of the noise-canceling capacitors are located away from these power through-layer portions. Among the noise-canceling capacitors located away from these power through-layer portions, the spacing between any two adjacent noise-canceling capacitors is less than or equal to one-eighth of the wavelength of the noise generated by the buck-boost chip. The solution provided by this invention can effectively reduce the noise intensity in electronic devices.

Printed circuit board (10) for a light module (100) of a vehicle, comprising an electrical circuit (20) with a consumer (30) and at least one short-circuit section (40) connected in parallel to the consumer (30), wherein the circuit (20) has a fuse device (50) connected in series with the consumer (30) and the short-circuit section (40) for disconnecting the electrical circuit (20), and wherein the short-circuit section (40) has a first conductor surface (42) and a second conductor surface (44) separated from the first conductor surface (42) by a short-circuit gap (46), wherein the short-circuit section (40) is formed by the two adjacent conductor surfaces (42, 44).

A power supply device includes: a primary-side printed circuit board (PCB); a secondary-side PCB insulated from the primary-side PCB; a filter device including a plurality of metal plates disposed between the primary-side PCB and the secondary-side PCB; and a transformer disposed on the filter device, and including a primary-side winding connected to the primary-side PCB and a secondary-side winding connected to the secondary-side PCB.

A printed wiring board includes a fiber-containing insulating plate including a fibrous base material, and a CAF-resistant wiring structure. The CAF-resistant wiring structure includes a ground conductor, a first conductor included in a power supply line, and a second conductor included in a signal line. The first conductor and the second conductor are present in a range where the first conductor and the second conductor can be short-circuited each other by a conductive anode filament. Furthermore, the ground conductor, the first conductor, and the second conductor are arranged in order of the first conductor, the ground conductor, and then the second conductor, in a direction in which the fibrous base material extends.

The present invention relates to a resin composition. The present invention aims to provide a resin composition and the like in which even if a via hole and a groove are formed by plasma treatment, the unevenness of the side surface and the bottom surface of the via hole or the groove can be suppressed, the processing speed can be improved, and a cured product excellent in toughness and insulation reliability can be obtained. The solution is a resin composition containing (A) an epoxy resin, (B) an inorganic filler material having an average particle diameter of 0.1 μm or less, (C) a resin having an imide skeleton represented by the following formula (C), and (D) a resin having a phenylene ether skeleton represented by the following formula (D), wherein the content of the (B) component is 69 mass% or less when the nonvolatile content in the resin composition is taken as 100 mass%, and the content of the (C) component is 1 mass% or more and 15 mass% or less when the nonvolatile content in the resin composition is taken as 100 mass%.

A multi-phase busbar (1) for conducting electric energy, comprising an optional base layer (2) of an insulating material, a first conducting layer (4a) of a sheet metal, a first 10 insulating layer (6a) of an insulating material arranged on said first conducting layer (4a), a second conducting layer (4b) of a sheet metal arranged on said insulating layer (6a) and a second layer (6b) of an electrically insulating material which is arranged on said second conducting layer (4b), wherein said first and second conducting layers (4a, 4b) may comprise a coating (14) of an electrically insulating material and said first and / or second insulating layers (6a, 6b) comprise spacers each spacer comprising a layer (6) of a rigid insulating material wherein at least one of said spacers (6a, 6b) is glued to an electrically insulating coating (14) of said first and / or second conducting layer (4a, 4b) and / or 20 at least one of said spacers (6a, 6b) is glued to a conductive surface of an uncoated first and / or second conducting layer (4a, 4b). by means of an adhesive (7).

An electronic module that can prevent the occurrence of creeping discharge and whose mass producibility is improved. An electronic module has: a circuit board in which a metal layer, which structures wiring patterns, and a metal base are layered via an insulating layer; electronic components joined to the wiring patterns and a coating film formed at obverses and side surfaces of the electronic components and the circuit board by ceramic coating or glass coating.

To prevent static electricity from entering a ground region on which a connector is mounted.SOLUTION: A front layer of a printed circuit board 100 includes: frame ground regions 102a, 102b on which connectors 202, 203 to be connected with external apparatuses or communication cables are mounted and which are connected with a ground; a signal ground region 101 which is separated from the frame ground regions 102a, 102b at the front layer, on which electronic devices 200, 201 configured to receive signals from the connectors 202, 203 are mounted, and which is connected with the ground; and a static electricity removal ground region 103 separated from the frame ground regions 102a, 102b and the signal ground region 101 at the front layer, situated outside the frame ground regions 102a, 102b, and connected with the ground.SELECTED DRAWING: Figure 3

Disclosed herein is a device that provides for high power transfer. The device may include a printed circuit board and a package substrate disposed on the printed circuit board. The device may also include a plurality of high-power voltage regulators disposed on and electrically connected to the package substrate. The device may also include a plurality of low-power voltage regulators disposed on and electrically connected to the printed circuit board.

An object of the present disclosure is to provide a printed circuit board that prevents breakage of a lead of a mounted component due to vibration of a heavy component on a substrate. A printed circuit board (100) includes a first component (10) that is a heavy component that accumulates electric energy or inductive energy, a second component (20) that is a power device having a plurality of leads (200), and a substrate (30) on which a first component (10) and a second component (20) are mounted. In the substrate (30), a slit (30a) is provided between the first component (10) and the second component (20), and a lead of the second component (20) is soldered. In the printed circuit board (100), the slit (30a) suppresses propagation of vibration from the heavy first component (10) to the second component (20), thereby preventing the leads (200) from breaking due to the vibration.

To provide a display device preventing moisture penetration from a position on top of an insulating layer through the insulating layer near the open area.SOLUTION: A display device according to an embodiment of the present disclosure comprises: a substrate including a display area, an open area positioned in the display area, and an intermediate area positioned between the display area and the open area; and a capping layer disposed in the intermediate area and extending in a closed loop surrounding the open area. The capping layer contains a metal material and is connected to the ground or to a power source having a given voltage.SELECTED DRAWING: Figure 10

An external connection terminal capable of suppressing spark failure. The external connection terminal includes: a conduction portion that is electrically connected to an electronic circuit; and a non-conduction portion that is electrically insulated from the electronic circuit, in which the conduction portion and the non-conduction portion consist of a material including metal, and a ratio x of an occupied area of the non-conduction portion to an occupied area of the conduction portion in a plan view and a ratio y of a height of the non-conduction portion to a height of the conduction portion simultaneously satisfy x≥0.30, y≥1.00, and y≥−0.50×x+1.25.

The present invention relates to a power electronics system (2) comprising at least one electronic device, a printed circuit board (4) on which a plurality of electrical components are installed, and positive and negative polarity branches (6) configured to electrically link the electronic device to an electrical energy storage means, each polarity branch (6) being formed respectively by a first polarity branch (8, 12) and a second polarity branch (10, 14) distinct from each other and electrically connected to each other, the first positive polarity branch (8) and the first negative polarity branch (12) being respectively electrically connected to the second positive polarity branch (10) and to the second negative polarity branch (14) via the printed circuit board (4).

To provide a sensor interposer employing castellated through-vias formed in a PCB.SOLUTION: A sensor interposer includes: a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via; the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace having a first portion and a second portion, the first portion being formed on the first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the second portion being formed on the second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace providing electrical isolation between the first and second electrical contacts.SELECTED DRAWING: Figure 1

A power supply circuit board is provided with a step-down converter and a power input port, and the step-down converter is electrically connected to the power input port. The power input port is configured to receive an input voltage, and the step-down converter is configured to convert the input voltage into a voltage required by a chip component. The power supply circuit board is further provided with a first connector, and the first connector is electrically connected to the step-down converter. The first connector mates with a second connector of a voltage regulator in the chip component, the first connector is disposed opposite to the second connector, and the chip component obtains, through the first connector, the voltage required by the chip component.

An electrode module for use in an air ionizer system is disclosed herein. The electrode module includes a first printed circuit board extending in a first direction from a first edge to a second edge, a first positive high voltage track formed on the first printed circuit board, the first positive high voltage track extending in the first direction, a first negative high voltage track formed on the first printed circuit board, the first negative high voltage track being spaced apart from the first positive high voltage track by a first distance in a second direction perpendicular to the first direction, a first ion sense trace formed on the first printed circuit board, a first ion probe attached to the first printed circuit board and the first ion sense trace, and a first connector coupled to the first positive high voltage track and configured to receive a first ion emitter.

Power module with encapsulated component and method of manufacturing this module. One aspect of the invention relates to a power module (100, 100') comprising at least one power electronic component (110) embedded in a printed circuit (120) comprising: a first and a second conductive substrate (121, 122), and an encapsulation resin (130) housed between the first and the second conductive substrates, the encapsulation resin (130) having at least two distinct permittivities (ɛ1,ɛ2), the encapsulation resin extending away from the component having a first permittivity ɛ1 and the encapsulation resin extending near the electronic component (110) having a second permittivity ɛ2, greater than the first permittivity.Another aspect of the invention relates to a method (200) for manufacturing the power module (100, 100') in which a first inner pre-impregnated sheet is cut to form cavities adapted to receive, on the one hand, the electronic component and, on the other hand, other pre-impregnated sheets of different permittivities. Figure to be published with the abbreviation: Figure 4.

A semiconductor module includes a board including a chip area and a tab area sequentially arranged in a first direction, a semiconductor chip provided on the chip area, a plurality of signal tabs provided on the tab area, and at least one anti-static portion having conductivity, provided in the tab area, and spaced apart from the plurality of signal tabs, where the plurality of signal tabs and the at least one anti-static portion are sequentially arranged in the first direction and the at least one anti-static portion is disposed on a line extending from at least one of the plurality of signal tabs in the first direction.