786results about "High voltage circuit adaptations" patented technology

A printed circuit board includes a substrate with first through-portion; a magnetic layer disposed in at least a portion of the first through-portion and having a second through-portion; an electronic component having at least a portion disposed in the second through-portion; a first wiring pattern disposed on an upper surface of the magnetic layer; a second wiring pattern disposed on a lower surface of the magnetic layer; and a first through-via having at least a portion surrounded by the magnetic layer, and including a first via pattern connecting the first and second wiring patterns to each other.

The present disclosure relates to a printed circuit board including: a first insulating layer; a first wiring layer disposed on the first insulating layer; a second wiring layer disposed on the first insulating layer; a second insulating layer disposed on the first insulating layer; a third wiring layer disposed on the second insulating layer; a first cavity penetrating through at least a portion of the first insulating layer; and a second cavity penetrating through at least a portion of the second insulating layer and connected to the first cavity. The first and second cavities have different wall surface inclinations, and a depth of the first cavity is smaller than a thickness of the first insulating layer and is greater than a thickness of each of the first and second wiring layers.

A display module includes a display panel and a peripheral region. The peripheral region includes a bendable fan-out region including a panel bonding portion and a driving chip; a flexible circuit board, including a first and a second conductive layers, and a substrate. The first conductive layer includes a first and a second bonding portions, and a connection portion; the second conductive layer is located on a side of the first conductive layer and at least partially overlaps with the first bonding portion; the first and the second conductive layers are connected through a via hole penetrating through the substrate; an end of the flexible circuit board is bonded to the panel bonding portion through the first bonding portion, and the second bonding portion is bonded to a control circuit board; and a conductive protection layer, covering the driving chip and connected to the second conductive layer.

The present disclosure provides a wiring harness production method, a nozzle and a wiring harness. The wiring harness production method includes: Step S10: preparing a substrate; Step S20: spraying a conductive material onto the substrate to form a conductive loop; and Step S30: forming an insulating protective layer at the periphery of the conductive loop and on a surface thereof. The present disclosure solves the technical problems of complex production process and high processing cost of a wiring harness for electrically connecting electrical components.

A power supply circuit board and computer equipment relate to the technical field of power supply. Wherein a step-down transformer and a power input interface are arranged in the power supply circuit board, and the step-down transformer is electrically connected with the power input interface; the power supply input interface is used for receiving an input voltage, and the step-down transformer is used for converting the input voltage into a voltage required by the chip assembly; a first connector is also arranged in the power supply circuit board, and the first connector is electrically connected with the step-down transformer; the first connector is in butt joint with a second connector of a voltage stabilizer of the chip assembly, the position of the first connector is opposite to the position of the second connector, and the chip assembly obtains voltage needed by the chip assembly through the first connector.

Disclosed herein is a device that provides for high power transfer. The device may include a printed circuit board and a package substrate disposed on the printed circuit board. The device may also include a plurality of high-power voltage regulators disposed on and electrically connected to the package substrate. The device may also include a plurality of low-power voltage regulators disposed on and electrically connected to the printed circuit board.

The technology of this application relates to an optical-electrical co-package structure including a carrier circuit board, an optical-electrical conversion module, a package circuit board, and an electrical chip. The package circuit board and the optical-electrical conversion module are respectively located on a first side surface and a second side surface that are opposite to each other of the carrier circuit board. The electrical chip is disposed on the package circuit board, and the optical-electrical conversion module is separated from the package circuit board, to significantly reduce a size of the package circuit board, reduce processing difficulty and costs of the package circuit board, and reduce a loss of a high-speed signal transmission link. In addition, the carrier circuit board is provided with a first conductive via, and the package circuit board is electrically connected to the optical-electrical conversion module to reduce inter-board traces on a connection link between the optical-electrical conversion module and the package circuit board.

A power module comprises: an upper arm structure that includes a first semiconductor switch, a second semiconductor switch and a fifth semiconductor switch; a lower arm structure that includes a third semiconductor switch, a fourth semiconductor switch and a sixth semiconductor switch; a first gate driving board, attached with the upper arm, wherein the first gate driving board includes gate drivers connected to gates of the first semiconductor switch, the second semiconductor switch, and the fifth semiconductor switch; a second gate driving board, attached with the lower arm, wherein the second gate driving board includes third gate drivers connected to gates of the third semiconductor switch, the fourth semiconductor switch, and the sixth semiconductor switch; etc.

The invention relates to a copper-clad laminate and a preparation method thereof, the copper-clad laminate comprises a single-sided composite copper foil, the single-sided composite copper foil comprises a single-layer copper foil and a carrier film covering the single-layer copper foil; the at least one layer of prepreg is laminated on the single-sided composite copper foil, the prepreg is formed by impregnating thin glass fiber cloth with a resin glue solution, and the number of warp yarns and the number of weft yarns of the thin glass fiber cloth are consistent; the resin glue solution is prepared from bisphenol A cyanate ester resin, bicyclic epoxy resin, bisphenol A epoxy resin, polyhedral oligomeric silsesquioxane and mesoporous silicon dioxide filler. By improving the copper foil structure and the resin component, the low dielectric constant and low loss of the copper-clad laminate are realized, and the copper-clad laminate is especially suitable for 5G products.

A liquid-cooled power electronics unit includes a planar circuit board body having conductor tracks, a wet side with a wet space for carrying a dielectric cooling liquid, and a fluidically, separated dry side, wherein at least two high-voltage power semiconductors are arranged on the circuit board body on the wet side within the wet space, the high-voltage power semiconductors being cooled by the cooling liquid, and an electronic low-voltage circuit is arranged on the dry side of the circuit board body.

A lamp (10) comprising a printed circuit board (100) which comprises a substrate (110) extending in a first direction x. A high voltage track (120) and a plurality of conductive regions (130) are provided on the substrate. The high voltage track extends in the first direction, and the plurality of conductive regions are provided in a row extending in the first direction. Each conductive region comprises three subregions (131, 132, (133) arranged along the first direction, with a center subregion (133) having a greater distance D3 from the high voltage track than a distance D1, D2 between the high voltage track and each of the first and second subregions.

An apparatus may include a printed circuit board including an integrated circuit including buck converter circuitry and an inductor coupled to the integrated circuit.

This application relates to a heat dissipation shielding structure and a processing method, a circuit board assembly, and an electronic device. The printed circuit board includes a mounting surface. Electronic components are mounted on the mounting surface. The electronic components include an active component and a passive component. The heat dissipation shielding structure includes an insulating layer. The insulating layer is covered on the mounting surface, and wraps at least a side surface of the active component, so that a side that is of the insulating layer and that faces away from the mounting surface forms a first surface together with a top surface of the active component. A shielding layer is covered on the first surface, a shape of the shielding layer matches a shape of the first surface, and the shielding layer is electrically connected to a ground network of the printed circuit board.

To provide a circuit board unit that suitably prevents unnecessary radiation noise resulting from a current flowing in a connector unit.SOLUTION: A circuit board unit 60 comprises: a first circuit board 61; a second circuit board 62; a connector unit 70 that has a first connector 71 attached to the first circuit board 61 and a second connector 72 attached to the second circuit board 62; and a metal member 80 that connects the first circuit board 61 and the second circuit board 62 to each other. The metal member 80 has a first connection part 85a that is electrically connected to a first ground layer 61g, a second connection part 85b that is electrically connected to a second ground layer 62g, and a cover part 80a that covers at least part of the connector unit 70. The cover part 80a has an opposite wall part 61. The opposite wall part 81 overlaps the first circuit board 61 when seen in a direction orthogonal to a plate surface of the first circuit board 61, and overlaps the second circuit board 62 when seen in a direction orthogonal to a plate surface of the second circuit board 62.SELECTED DRAWING: Figure 2

A measuring device for has a housing, a measuring circuit board, and a communication circuit board. The measuring circuit board has a voltage connection, a voltage divider, a CT connection for connecting an external current transformer, a measuring chip connected to the voltage divider and the CT connection for determining electrical quantities and outputting as measurement data to a first part of a plug connector. The communication circuit board is connected to a second part of the plug connector, which together with the first part connects the communication circuit board and the measuring circuit board, a data communication chip connected to the second part and electrically isolated to receive the measurement data from the measuring chip, where a galvanic isolation between the measuring chip and the data communication chip is provided on the communication circuit board, a data connection connected to the data communication chip and a user interface.

A voltage converting circuit comprises a multi-layer printed-circuit-board stack having an input terminal and a reference terminal, first and second switching elements connected to each other at an output terminal and a parallel-plate capacitor connected with the first and the second switching elements; the stack comprises a top conductive layer provided with said input, reference and output terminals and with a plurality of power-conducting traces, a first and a second metal plane forming said electrodes of the parallel-plate capacitor, a first and a second signal layer having first and second signal-routing traces, wherein the first and the second metal plane are arranged between the top conductive layer and two signal layers, and wherein the top conductive layer and the first metal plane are separated from each other by an insulating layer of the stack only.

To provide a device for fixing a camera module circuit board.SOLUTION: A device for fixing a camera module circuit board is provided, comprising: a base portion; and a fixing unit including a first fixing part for supporting one side of each of a plurality of boards, and a second fixing part for supporting the other side opposite the one side of each of the plurality of boards. A plurality of first fixing parts extend in a first direction from the base portion, and include a plurality of protrusions protruding in a direction perpendicular to the first direction in order to support one side of each of the plurality of boards. A plurality of second fixing parts extend in the first direction from the base portion, and include a plurality of protrusions for supporting the other side of each of the plurality of boards.SELECTED DRAWING: Figure 6

A power semiconductor module includes a semiconductor board and a number of semiconductor chips attached to the semiconductor board. Each semiconductor chip has two power electrodes. An adapter board is attached to the semiconductor board above the semiconductor chips. The adapter board includes a terminal area for each semiconductor chip on a side facing away from the semiconductor board. The adapter board, in each terminal area, provides a power terminal for each power electrode of the semiconductor chip associated with the terminal area. Each power terminal is electrically connected via a respective vertical post below the terminal area with a respective semiconductor chip and each of the power terminals has at least two plug connectors. Jumper connectors interconnect the plug connectors for electrically connecting power electrodes of different semiconductor chips.

A printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls disposed on the insulating layer, and at least partially covering side surfaces of the plurality of pads, respectively, while being free from surfaces of the plurality of pads, respectively. The plurality of insulating walls are disposed to be spaced apart from each other on the insulating layer.

A power module for the controllable electrical power supply of a consumer includes a plurality of housed power semiconductors each with an electrically non-insulated heat discharge surface, a printed circuit board, a heat sink, one or more insulation plates, wherein the printed circuit board is arranged on a side of the power semiconductor in an orthogonal direction opposite the heat sink, wherein the insulation plate is arranged between the housed power semiconductors and a cooling surface of the heat sink, wherein one insulation plate in each case is interlockingly connected by one side to one electrically non-insulated heat discharge surface of a housed power semiconductor and is interlockingly connected by the other side to the heat sink.

An electrode module for use in an air ionizer system is disclosed herein. The electrode module includes a first printed circuit board extending in a first direction from a first edge to a second edge, a first positive high voltage track formed on the first printed circuit board, the first positive high voltage track extending in the first direction, a first negative high voltage track formed on the first printed circuit board, the first negative high voltage track being spaced apart from the first positive high voltage track by a first distance in a second direction perpendicular to the first direction, a first ion sense trace formed on the first printed circuit board, a first ion probe attached to the first printed circuit board and the first ion sense trace, and a first connector coupled to the first positive high voltage track and configured to receive a first ion emitter.

In order to provide an active ester resin that is capable of achieving an excellent dielectric dissipation factor in a high temperature environment, an active ester resin comprising one or more of α-methylbenzyl groups per one molecule is provided.

The invention relates to the technical field of solid state disks, in particular to a bonding pad assembly, a circuit board, a memory card, a card seat and a starting judgment device. The bonding pad assembly is distributed on a substrate of the memory card; the bonding pad assembly comprises a plurality of rows of bonding pads; the plurality of rows of bonding pads comprise a first row of bonding pads; the first row of bonding pads comprise a first grounding bonding pad; the width of the first grounding bonding pad is greater than that of any bonding pad in the first row of bonding pads; the length of the first grounding bonding pad is greater than or equal to the length of any bonding pad of the first row of bonding pads; the distance from the central point of the first grounding bonding pad to a preset reference line on the substrate is smaller than the distance from the central point of any bonding pad in the first row of bonding pads to the reference line; wherein the linear direction parallel to the reference line is the width direction of each component of the bonding pad component. The bonding pad assembly is small in size and can support hot plug.

The present application relates to a cooling structure, and specifically relates to a cooling and shielding structure, a processing method, a circuit board assembly and an electronic apparatus. The cooling and shielding structure is applied to a circuit board. The circuit board comprises a mounting surface, electronic components being mounted on the mounting surface, and the electronic components comprising an active device and a passive device. The cooling and shielding structure comprises an insulating layer, the insulating layer covering the mounting surface, coating the side surface and the top surface of the passive device, and at least coating the side surface of the active device, so that the side of the insulating layer facing away from the mounting surface forms a first surface, or the side of the insulating layer facing away from the mounting surface and the top surface of the active device collectively form a first surface. A shielding layer covers the first surface, the shape of the shielding layer being matched with the shape of the first surface, and the shielding layer being electrically connected to a ground end of the circuit board. While achieving a shielding effect on electronic components on circuit boards, the cooling and shielding structure provided in the present application can also improve a cooling effect on the electronic components, thereby improving the working stability and safety of the circuit boards.

The invention relates to an amplifier circuit (1) for broadband and low-noise amplification of a capacitive current source, preferably a thermoelectric sensor, comprising: a signal input (3) which can be connected to the capacitive current source in a node K1; the invention relates to an amplifier (1) for amplifying an input voltage, comprising an input stage (A1), which is connected to a node K1 at an input (7) of the input stage (A1) and has a node K2 at an output (9) of the input stage (A1), the input stage (A1) being designed to amplify the input voltage by at least three times, the input stage (A1) being designed to provide a high-ohm input resistance at the input of the input stage (A1), the input stage (A1) is designed to provide a stable and load-independent voltage at the output of the input stage (A1); the invention relates to a power amplifier comprising a first amplifier (A1) and a second amplifier (A3), an amplifier cascade (11) having at least a first amplifier and a second amplifier (A2, A3), each having an input (13, 17) and an output (15, 19), the output (15) of the first amplifier (A2) being connected in a node K3 to the input (17) of the second amplifier (A3), the input (13) of the first amplifier (A2) being connected to a node K2, the output (15, 19) being connected in a node K3 to the input (17) of the second amplifier (A3). An output (19) of the second amplifier (A3) is connected to a node K4, the amplifier cascade (11) being arranged to produce a high signal gain with a low phase shift over a wide frequency range; a feedback network (F1), which is connected to the input (7) of the input stage (A1) in a node K1 and to the output (19) of the second amplifier (A3) in a node K4, said feedback network (F1) being designed to provide a high-ohm feedback resistance with a parasitic capacitance of less than 0.5 pF, the feedback network (F1) is arranged to provide a negative feedback to a structure comprising the input stage (A1) and the amplifier cascade (11), and a signal output (21) connected to a node K5, which is connected to or corresponds to a node K4. The invention also relates to a sensor system.

A computer-implemented method for evaluating a minimum clearance distance between a first conductive element and a second conductive element included in a printed circuit board (PCB) is provided. The PCB comprises a plurality of conductive layers and a plurality of conductive elements, where each conductive layer comprises one or more conductive elements. The plurality of conductive layers comprises one or more outer conductive layers. The method comprises selecting a first conductive element (A) disposed on a first outer conductive layer and a second conductive element (B) disposed on a second outer conductive layer of the PCB, a clearance between which has a minimum spacing requirement. The method also comprises creating polygons of the first and second conductive elements, wherein a polygon of the first conductive element is A′ and a polygon of the second conductive element is B′. The method also comprises determining if there is at least one conductive layer disposed between A′ and B′. If no conductive layer is disposed between A′ and B′, then A″ and B″ are created on an evaluation layer. The method further comprises calculating a shortest unshielded distance (dxy) between A″ and B″. The method also comprises using a distance between the conductive layers (dz), and calculating a distance (d), wherein d=√{square root over (dxy2+dz2)}. If the calculated distance d is less than the minimum spacing requirement, a violation is indicated.

The invention discloses an anti-static circuit board and a production process thereof, and belongs to the technical field of circuit boards, and the production process comprises the following steps: 1, obtaining polyaniline-based graphene composite powder through amidation and polymerization reaction; step 2, taking AgNO3 as a silver source, loading silver particles on the surface of the Fe3O4 nanowire, and then carrying out surface modification by using a KH-560 silane coupling agent to obtain a modified conductive Fe3O4 nanowire; 3, the polyaniline-based graphene composite powder, the modified conductive Fe3O4 nanowires and other auxiliary materials are subjected to ultrasonic mixing, and anti-static liquid is obtained; 4, etching an inner layer circuit, spraying an anti-static liquid on an outer layer base material, laminating, drilling, performing copper deposition, etching the circuit and performing resistance welding treatment to obtain an anti-static circuit board; according to the anti-static circuit board and the production process thereof, the anti-static performance, the efficient heat conduction performance and the electromagnetic shielding performance are achieved.

A flexible printed circuit board according to an embodiment includes: a substrate; and a circuit pattern disposed on the substrate, wherein the circuit pattern includes a plurality of first circuit patterns, a plurality of second circuit patterns, and a plurality of third circuit patterns, wherein the third circuit pattern includes a third-first pad portion, a third-second pad portion, and a third wiring portion connecting the third-first pad portion and the third-second pad portion, a plurality of fourth wiring portions are disposed between a plurality of third wiring portions, a line width of the third wiring portion is greater than a line width of the fourth wiring portion, and a distance between the third wiring portion and the fourth wiring portion adjacent to the third wiring portion is greater than a distance between the fourth wiring portions.

Systems, apparatuses and methods may provide for technology that includes a voltage regulator, a board assembly including a die and a circuit board electrically coupled to a first side of the die, and a thermal dissipation assembly thermally and electrically coupled to a second side of the die, wherein the thermal dissipation assembly is further electrically coupled to the voltage regulator. In one example, the thermal dissipation assembly includes a vapor chamber and the technology further includes a plurality of copper plates electrically coupled to the voltage regulator and a package substrate containing the die, wherein the plurality of copper plates are further thermally coupled to the vapor chamber.