Semiconductor device and memory card using the same

Abstract

A circuit board has a curved portion provided in at least one side of an external shape thereof. An external connecting terminal is provided on a first main surface of the circuit board. A semiconductor element is mounted on a second main surface of the circuit board. A first wiring network is provided in a region except the terminal region on the first main surface. A second wiring network is provided on the second main surface. Distance from the side including the curved portion to the first wiring network is larger than distance from at least one of the other sides to the first wiring networks, and distance from the side including the curved portion to the second wiring network is larger than distance from at least one of the other sides to the second wiring networks.

Description

CROSS-REFERENCE TO THE RELATED APPLICATION[0001]This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2006-098271 filed on Mar. 31, 2006 and the prior Japanese Patent Application No. 2006-277884 field on Oct. 11, 2006; the entire contents of which are incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a semiconductor device and a memory card using the same.[0004]2. Description of the Related Art[0005]Semiconductor memory cards having a NAND type flash memory or the like built therein are downsized while having larger capacity. For instance, SD™ memory card is presented in three sizes, a size of a normal SD™ card, a size of a mini SD™ card and a size of a micro SD™ card, in which even the micro SD™ card is expected to have a larger capacity. In an attempt to increase the capacity of the downsized memory card, it is examined and put into practical u...

AI Technical Summary

Benefits of technology

The present invention relates to a semiconductor device and a memory card with a curved shape. The semiconductor device includes a substrate with a curved portion on at least one side, a semiconductor element mounted on the substrate, and a wiring network provided on the substrate. The distance between the curved portion of the substrate and the wiring network is larger than the distance between the other sides of the substrate and the wiring network. The memory card includes a substrate with a curved portion on at least one side, an external connecting terminal, a first wiring network, an insulating layer, a second wiring network, a semiconductor memory element, and a sealing resin layer. The distance between the curved portion of the substrate and the first wiring network is larger than the distance between the other sides of the substrate and the first wiring network, and the distance between the curved portion of the substrate and the second wiring network is larger than the distance between the other sides of the substrate and the second wiring network. These technical effects improve the performance and reliability of the semiconductor device and memory card.

Problems solved by technology

However, these machining methods have a problem of a low cutting speed compared with the blade dicing.

When the laser beam machining or the water jet machining is adopted to cut the entire outline, a machining efficiency down in the cutting step of the circuit board frame is unavoidable.

Affected by the heat generated at the time of the cutting, there arise problems such as an insulation performance down between the wirings, a short circuit caused by carbonized resist or core material composing the circuit board, and further an easily-caused characteristic degradation of the semiconductor element.

Images