98 results about "Glass epoxy" patented technology

In a multilayer wiring board comprising a core board, and a wiring layer and an electrically insulating layer that are stacked on one surface of said core board, a thermal expansion coefficient of said core board in XY directions falls within a range of 2 to 20 ppm, a core member for said core board is a core member selected from silicon, ceramics, glass, a glass-epoxy composite, and metal, said core board is provided with a plurality of through holes that are made conductive between the front and the back by a conductive material, and a capacitor is provided on one surface of said core board, wherein said capacitor comprises an upper electrode being the conductive material in said through hole, and a lower electrode disposed so as to confront said upper electrode via a dielectric layer.

Transistor package leads form quarter-wave antenna elements that directly radiate RF energy into free space without the need for a separate antenna. The transistor operates at a fundamental frequency and radiates a harmonic, thereby allowing radiation at frequencies normally considered “beyond cutoff” for a packaged transistor. This technique enables an additional 20 GHz of spectrum for use by surface mount technology. The transistor may be mounted on 1.6 mm thick glass-epoxy circuit board that also forms a quarter-wave reflector at 26 GHz. An optional dielectric lens produces a narrow beam and an optional planar filter rejects spurious fundamental emissions. A 26 GHz ultra-wideband (UWB) pulse-echo radar rangefinder implementation provides a low-cost upgrade to ultrasound.

This invention provides a method for manufacturing a double-sided wiring board in which a fine wiring pattern can be formed, even when copper is deposited on a copper foil surface which may be exposed in the case of performing electroplating processing for making the wall surface of a through-hole or a blind via hole conductive and film thickness is thickened, and to provide also the double-sided wiring board and its base substrate. A double-sided wiring base substrate is produced by sticking extremely thin copper foil 2 with carrier which is made of extremely thin copper foil 4 having about 1-5 Mum thickness, and provided with a carrier layer 3 to both the surfaces of an electrically insulating substrate such as a glass epoxy base material 1, before and after forming through-holes 5 or the like, the carrier layers 3 are peeled off. Then an electroless copper plating film 6 and an electroplating copper film 7 are formed by plating processing, the upper and lower surfaces are made conductive, and, after forming a fine wiring pattern 8 by etching, surface processed films 9 are formed to obtain the double-sided wiring board.

A circuit board includes an electrical insulator layer formed of a reinforcer sheet with density distribution in its in-plane direction, an electrical conductor filled in a plurality of inner via holes provided in the electrical insulator layer in its thickness direction, and a wiring layer connected to the electrical conductor. The inner via holes provided in a high-density portion of the reinforcer sheet are formed to have a smaller cross-section than the inner via holes provided in a low-density portion of the reinforcer sheet. In this manner, it is possible to provide a circuit board that can achieve a high-density wiring and an inner via connection resistance with less variation, when a base material including a reinforcer sheet with density distribution in its in-plane direction such as a glass-epoxy base material is used for an insulator layer.

Any damage inflicted on test pads, inter-layer insulating films, semiconductor elements or wiring at the time of electrical inspection of semiconductor integrated circuit devices is to be reduced. Reinforcements having a substantially equal linear expansion ratio (coefficient of thermal expansion) relative to a wafer to be inspected are formed over an upper face of a thin film probe, grooves are cut in the reinforcements above the probes, a first elastomer which is softer than a second elastomer is so arranged as to fill the grooves and overflow the grooves by a prescribed quantity, a glass epoxy substrate, which is a multi-layered wiring board, is fitted over the second elastomer, and pads provided over an upper face of the glass epoxy substrate and bonding pads which are part of wirings belonging to the thin film probe are electrically connected by wires.

A spacer-connector stud comprises a stacked array of glass epoxy laminates, each laminate having a copper layer laminated thereto. The top and bottom laminates of the stud include a spatial array of thermal contacts suitable as a footprint for C4 bump technology. A location is selected on a circuitized base card to accommodate the laminated stud. The stud has a thickness greater than twice the thickness of the components attached to the card. The thermal contacts on the stud, typically solderable, join to a wiring array on the card. A second multi-chip module card having attached and interconnected components on both sides of the second card is mechanically aligned with the based card and pressed against the contacts on the top layer of the stud to form an assembly. The assembly is heated causing the second card to become soldered to the contact footprint on the stud.