Double-sided wiring board fabrication method, double-sided wiring board, and base material therefor

一种印制电路板、制造方法的技术，应用在印刷电路制造、多层电路制造、印刷电路等方向，能够解决难以形成微细布线等问题
CN1842254AInactive Publication Date: 2006-10-04HITACHI CABLE LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HITACHI CABLE LTD
Publication Date
2006-10-04
Estimated Expiration
Not applicable · inactive patent

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Abstract

This invention provides a method for manufacturing a double-sided wiring board in which a fine wiring pattern can be formed, even when copper is deposited on a copper foil surface which may be exposed in the case of performing electroplating processing for making the wall surface of a through-hole or a blind via hole conductive and film thickness is thickened, and to provide also the double-sided wiring board and its base substrate. A double-sided wiring base substrate is produced by sticking extremely thin copper foil 2 with carrier which is made of extremely thin copper foil 4 having about 1-5 Mum thickness, and provided with a carrier layer 3 to both the surfaces of an electrically insulating substrate such as a glass epoxy base material 1, before and after forming through-holes 5 or the like, the carrier layers 3 are peeled off. Then an electroless copper plating film 6 and an electroplating copper film 7 are formed by plating processing, the upper and lower surfaces are made conductive, and, after forming a fine wiring pattern 8 by etching, surface processed films 9 are formed to obtain the double-sided wiring board.
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Description

technical field

[0001] The present invention relates to a method for manufacturing a double-sided wiring printed circuit board, a double-sided wiring printed circuit board and its basic original board, and especially relates to the electroplating treatment for conducting the wall surface of a through hole or a blind hole, Even when copper is deposited on the exposed copper foil surface to thicken the copper film, a method of manufacturing a double-sided wiring printed circuit board, a double-sided wiring printed circuit board, and its base original board can be formed. Background technique

[0002] With the rapid development of miniaturization, high integration, and high performance of electronic appliances, double-sided wiring printed circuit boards are attracting attention as circuit boards for mounting IC chips. The structure of the double-sided wiring printed circuit board is that there are copper foil pattern layers on the upper and lower (front and back) sides of the s...

Claims

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