Double-sided wiring board fabrication method, double-sided wiring board, and base material therefor

一种印制电路板、制造方法的技术，应用在印刷电路制造、多层电路制造、印刷电路等方向，能够解决难以形成微细布线等问题

Inactive Publication Date: 2006-10-04
HITACHI CABLE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] However, if the existing double-sided wiring printed circuit board is used, the thickness of the copper plating layer used for the conduction treatment of the through hole or the blind hole, from the point of view of ensuring the heat resistance and humidity resistance reliability of the substrate, has It is necessary to make a thickness of 15 μm or more; at this time, when the conductive hole is a through hole, copper plating is performed on both sides of the copper foil surface; Copper plating is also performed on the copper foil surface on the opening side of the hole that has not been masked. Since the total thickness of the copper foil becomes about 30 μm or more than the original thickness, there is a problem that it is difficult to form fine wiring.

Method used

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  • Double-sided wiring board fabrication method, double-sided wiring board, and base material therefor
  • Double-sided wiring board fabrication method, double-sided wiring board, and base material therefor
  • Double-sided wiring board fabrication method, double-sided wiring board, and base material therefor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] figure 1 (a)~ figure 1 (g) is a cross-sectional view of the manufacturing method (each process) of the double-sided wiring printed wiring board of Example 1 using a glass epoxy substrate (through-hole processing).

[0062] A glass epoxy substrate 1 having a thickness of 100 μm and a size of 500×500 mm was prepared. The epoxy resin is in a semi-hardened state (B-grade state).

[0063] An ultra-thin copper foil 2 with a carrier (trade name: "CopperBond Extra Thin Foil", manufactured by O-Rinbras Co., Ltd., Japan) was bonded to the upper and lower surfaces of the substrate 1 by hot pressing, so that it sandwiched the epoxy resin. Glass substrate1. The copper foil 2 is composed of an ultra-thin copper foil 4 (3 μm) / peelable layer / carrier copper foil 3 (18 μm). The bonding of the glass epoxy substrate 1 and the ultra-thin copper foil 2 with the carrier is by pasting the surface of the ultra-thin copper foil 4 on the glass epoxy substrate 1 ( figure 1 (a)) proceed.

...

Embodiment 2

[0071] figure 2 (a)~ figure 2 (i) is a sectional view of the manufacturing method (each process) of the double-sided wiring printed wiring board (double-sided wiring flexible printed wiring board) of Example 2 using a polyimide substrate (blind via processing).

[0072] A thermoplastic polyimide-based adhesive was applied to both sides, and a polyimide tape (polyimide substrate 10 ) having a total thickness of 25 μm and a width of 70 mm was prepared for tens of meters.

[0073] An ultra-thin copper foil 2 with a carrier (trade name: "CopperBond Extra Thin Foil", manufactured by O-Linburas Co., Ltd., Japan) was bonded to one side of the substrate 10 by hot pressing, and an electrolytic copper foil with a thickness of 12 μm was bonded. 11 is pasted on the other side of the substrate 10, so that the two clamp the polyimide substrate 10 ( figure 2 (a)). The ultra-thin copper foil 2 with a carrier is composed of an ultra-thin copper foil 4 (3 μm) / peelable layer / carrier copper...

Embodiment 3

[0083] image 3 (a)~ image 3 (i) is a cross-sectional view of the manufacturing method (each process) of the double-sided wiring printed wiring board (double-sided wiring flexible printed wiring board) of Example 3 using a polyimide substrate (blind via processing) .

[0084] A thermoplastic polyimide adhesive was applied to both sides, and a polyimide tape (polyimide substrate 10 ) having a total thickness of 25 μm and a width of 70 mm was prepared for tens of meters.

[0085] An ultra-thin copper foil 2 with a carrier (trade name: "CopperBond Extra Thin Foil", manufactured by O-Linburas Co., Ltd., Japan) was bonded to both sides of the substrate 10 by hot pressing, so that the polyimide film was sandwiched between them. Substrate 10 ( image 3 (a)). The ultra-thin copper foil 2 with a carrier is composed of an ultra-thin copper foil 4 (3 μm) / peelable layer / carrier copper foil 3 (18 μm). The polyimide substrate 10 and the ultra-thin copper foil with carrier 2 are bonded...

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PUM

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Abstract

This invention provides a method for manufacturing a double-sided wiring board in which a fine wiring pattern can be formed, even when copper is deposited on a copper foil surface which may be exposed in the case of performing electroplating processing for making the wall surface of a through-hole or a blind via hole conductive and film thickness is thickened, and to provide also the double-sided wiring board and its base substrate. A double-sided wiring base substrate is produced by sticking extremely thin copper foil 2 with carrier which is made of extremely thin copper foil 4 having about 1-5 Mum thickness, and provided with a carrier layer 3 to both the surfaces of an electrically insulating substrate such as a glass epoxy base material 1, before and after forming through-holes 5 or the like, the carrier layers 3 are peeled off. Then an electroless copper plating film 6 and an electroplating copper film 7 are formed by plating processing, the upper and lower surfaces are made conductive, and, after forming a fine wiring pattern 8 by etching, surface processed films 9 are formed to obtain the double-sided wiring board.

Description

technical field [0001] The present invention relates to a method for manufacturing a double-sided wiring printed circuit board, a double-sided wiring printed circuit board and its basic original board, and especially relates to the electroplating treatment for conducting the wall surface of a through hole or a blind hole, Even when copper is deposited on the exposed copper foil surface to thicken the copper film, a method of manufacturing a double-sided wiring printed circuit board, a double-sided wiring printed circuit board, and its base original board can be formed. Background technique [0002] With the rapid development of miniaturization, high integration, and high performance of electronic appliances, double-sided wiring printed circuit boards are attracting attention as circuit boards for mounting IC chips. The structure of the double-sided wiring printed circuit board is that there are copper foil pattern layers on the upper and lower (front and back) sides of the s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/42H05K1/11H01L21/60
CPCH05K2201/0352H05K3/025H05K3/0038H05K3/421H05K2201/0394H05K3/0035H05K3/427Y10T29/49126Y10T29/49155Y10T29/49165H05K3/42
Inventor 珍田聪宫本宣明
Owner HITACHI CABLE LTD
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