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Resin composition for adhesive, adhesive containing same, adhesive sheet, and printed wiring board containing adhesive sheet as adhesive layer

A resin composition and adhesive technology, applied in the direction of film/sheet adhesive, non-polymer adhesive additive, adhesive type, etc. problems such as reduced adhesiveness, to achieve the effect of excellent adhesion, maintenance of peel strength, and excellent adhesion

Active Publication Date: 2011-11-30
TOYO TOYOBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, this composition significantly reduces the humidity solder resistance after storage at room temperature or 40°C, and the adhesiveness at high temperature and high humidity, and does not ensure a stable chip life.

Method used

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  • Resin composition for adhesive, adhesive containing same, adhesive sheet, and printed wiring board containing adhesive sheet as adhesive layer
  • Resin composition for adhesive, adhesive containing same, adhesive sheet, and printed wiring board containing adhesive sheet as adhesive layer
  • Resin composition for adhesive, adhesive containing same, adhesive sheet, and printed wiring board containing adhesive sheet as adhesive layer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0186] 100 parts of polyester resin A as thermoplastic resin (A) (only the mass of solid content, the same below), and R972 [Nippon Aerosil Co., Ltd., hydrophobic fumed silica] 20 as inorganic filler (B) were mixed. parts, 248 parts of methyl ethyl ketone as a solvent (C), and 112 parts of toluene to adjust the solid content concentration to 25% of the resin composition (β). Next, epoxy resin A [Dainippon Ink Chemical Industry Co., Ltd. product, HP7200-H (dicyclopentane diene type epoxy resin), epoxy value=3540 equivalent / 10 6 g] 11.9 parts, 5.1 parts of methyl ethyl ketone as a solvent (C), and a resin composition (γ) in which the solid content concentration was adjusted to 70%. A target resin composition for an adhesive agent is obtained by mixing the obtained resin composition (β) and resin composition (γ). The compounding quantity of an epoxy resin was determined by calculating from the epoxy group which contained 1.05 times of the total amount of the acid value of a poly...

Embodiment 2

[0188] Similar to Example 1, a resin composition was produced with the components and compounding quantities shown in Table 3, and the characteristics were evaluated. In addition, in all the examples, the resin composition (β) was prepared at a solid content concentration of 25%, and the resin composition (γ) was prepared at a solid content concentration of 70%.

Embodiment 3

[0190] Mix 333.3 parts of polyurethane resin solution a as thermoplastic resin (A), 220 parts of R9720 parts as inorganic filler (B), 94.7 parts of methyl ethyl ketone as solvent (C), and 32 parts of toluene, and adjust the solid content concentration to 25% of the resin composition (β). Next, 19.3 parts of epoxy resin A as an epoxy resin (D) and 8.3 parts of methyl ethyl ketone as a solvent (C) were mixed to adjust a resin composition (γ) having a solid content concentration of 70%. A target resin composition for an adhesive agent is obtained by mixing the obtained resin composition (β) and resin composition (γ). The compounding quantity of an epoxy resin was determined by calculating from the epoxy group which contained 1.05 times of the total amount of the acid value of a polyester resin. Adhesion evaluation samples were produced by the method described above, and Table 4 shows the evaluation results. Both the initial evaluation and the evaluation over time showed good re...

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Abstract

The present invention provides an adhesive which has a high degree of moist-heat resistance that enables the adhesive layer to withstand soldering with a lead-free solder under high-humidity conditions and which has excellent adhesiveness under high-temperature high-humidity conditions, while retaining adhesion to various plastic films, metals, and glass-epoxies. A B-stage adhesive sheet obtained from the adhesive is provided which has a satisfactory sheet life and can retain satisfactory adhesive properties even when used after having been transported under high-temperature high-humidity conditions. The resin composition for adhesives comprises a thermoplastic resin (A), an inorganic filler (B), a solvent (C), and an epoxy resin (D), wherein the thermoplastic resin (A) has an acid value and a number-average molecular weight which are in specific ranges, the epoxy resin (D) is an epoxy resin having a dicyclopentadiene skeleton, and a dispersion (a) having a specific makeup including the thermoplastic resin (A) and the inorganic filler (B) in a total amount of 25 parts by mass and in the same proportion as in the resin composition for adhesives has a thixotropic index (TI value) of 3-6 at 25 C.

Description

technical field [0001] The present invention relates to a resin composition excellent in adhesion to various plastic films, adhesion to metals such as copper, aluminum, and stainless steel, adhesion to glass, heat resistance, moisture resistance, sheet life, etc., An adhesive, an adhesive sheet containing the resin composition, and a printed wiring board containing the adhesive sheet as an adhesive layer. Background technique [0002] In recent years, adhesives have been used in various fields. Due to the diversification of the purpose of use, it is required to have adhesion to various plastic films, adhesion to metals such as copper, aluminum, and stainless steel, and adhesion to metals such as copper, aluminum, and stainless steel. The adhesion, heat resistance, moisture resistance, sheet life, etc. of the epoxy glass steel plate are further improved compared to the adhesives used so far. For example, epoxy / acrylic butadiene-based adhesives or epoxy / polyvinyl butyral adhe...

Claims

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Application Information

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IPC IPC(8): C09J163/08C09J7/00C09J11/04C09J163/00C09J201/00
CPCC08G59/24C08L63/00C09J163/00C09J163/08
Inventor 南原慎太郎伊藤武田中秀树粟田达也家根武久麻田裕子
Owner TOYO TOYOBO CO LTD
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