52results about "Epoxidised polymerised polyene adhesives" patented technology

An adhesive composition is characterized by including an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group and a thermosetting agent. The adhesive composition achieves high reliability in a package in which a semiconductor chip of reduced thickness is mounted even when exposed to severe reflow conditions. An adhesive sheet having an adhesive layer comprising the above adhesive composition and a production process for a semiconductor device using the above adhesive sheet are also provided.

A curable resin composition includes (A) a cationically polymerizable-compound, (B) a cationic photopolymerization initiator, and (C) an epoxidized polyisoprene containing an epoxy group at 0.15 to 2.5 meq/g in the molecule and having a number-average molecular weight of 15000 to 200000. The curable resin composition shows excellent elongation properties and high break elongation even in a cured state and can give a cured product having superior compatibility, transparency, flexibility and waterproofness. Accordingly, the composition is suitable for use as adhesives, coating agents, encapsulating materials, inks, sealing materials and the like.

There is provided an adhesive sheet that has initial adhesiveness, can realize bonding between metals, between a metal and an organic material, and between organic materials, and can retain an excellent adhesion strength without undergoing a temperature change. The adhesive sheet comprises a first release paper, an adhesive layer, and a second release paper stacked in that order, the adhesive layer containing an adhesive, the adhesive containing at least an acrylic resin, an epoxy resin, and a curing agent, the content of the epoxy resin being 175 to 300 parts by weight per 100 parts by weight of the acrylic resin.

A method for preparing flexible heat conducting insulating adhesive film used in an LED heat radiation substrate comprises the preparation of a flexible heat conducting insulating adhesive and that of the flexible heat conducting insulating adhesive film, wherein the flexible heat conducting insulating adhesive comprises liquid epoxy resin, solid epoxy resin, flexibilizer, curing agent, high-heat conductivity inorganic packing, organic solvent, coupling agent, dispersing agent and flatting agent. The method for preparing the flexible heat conducting insulating adhesive film comprises the following steps: coating the flexible heat conducting insulating adhesive on a release film through a coating machine; baking through a temperature control baking channel to obtain an flexible heat conducting insulating adhesive layer used in the LED heat radiation substrate; coating the release film on the adhesive surface in a compounding manner; and rolling and forming to obtain the flexible heat conducting insulating adhesive film used in the LED heat radiation substrate. The adhesive film used in the LED heat radiation substrate has the characteristics of high heat dissipation, insulation, heat resistance and peel strength, flexibility and the like.

The invention relates to the technical field of corrosion of repaired mouths of engineering and petroleum pipelines, in particular to a hot-melt adhesive for preventing the corrosion of a repaired mouth of a pipeline. The hot-melt adhesive comprises the following components in percentage by weight: 30 to 70 percent of epoxidized SBS (styrene-butadiene-styrene) resin, 5 to 40 percent of vinyl copolymer, 5 to 40 percent of rubber elastomer, 5 to 40 percent of tackifying resin, 5 to 20 percent of inorganic filler and 1 to 8 percent of aid; and the hot-melt adhesive is prepared by performing melt blending on the components by using an intensive shear banbury, and performing extrusion granulation by using a twin-screw extruder. The hot-melt adhesive for preventing the corrosion of the repaired mouth of the pipeline, which is prepared from the epoxidized SBS resin serving as a base material, solves the problem that the conventional hot-melt adhesive has insufficient toughness and brittle failure at low temperature and low peel strength at high temperature. The hot-melt adhesive has high toughness at low temperature and high peel strength at high temperature, hardly falls off or allows water to enter the pipeline in the long-term running process, is convenient to construct in field, has excellent bonding property and ensures reliable bonding.

A curable casemaking adhesive, books and related articles bound thereby. In one embodiment, a UV curable hot melt adhesive is used to form the case, which is preferably also embossed. In another embodiment, a moisture curable hot melt adhesive is used to form the case, which is preferably also embossed.

The present invention provides an adhesive which has a high degree of moist-heat resistance that enables the adhesive layer to withstand soldering with a lead-free solder under high-humidity conditions and which has excellent adhesiveness under high-temperature high-humidity conditions, while retaining adhesion to various plastic films, metals, and glass-epoxies. A B-stage adhesive sheet obtained from the adhesive is provided which has a satisfactory sheet life and can retain satisfactory adhesive properties even when used after having been transported under high-temperature high-humidity conditions. The resin composition for adhesives comprises a thermoplastic resin (A), an inorganic filler (B), a solvent (C), and an epoxy resin (D), wherein the thermoplastic resin (A) has an acid value and a number-average molecular weight which are in specific ranges, the epoxy resin (D) is an epoxy resin having a dicyclopentadiene skeleton, and a dispersion (a) having a specific makeup including the thermoplastic resin (A) and the inorganic filler (B) in a total amount of 25 parts by mass and in the same proportion as in the resin composition for adhesives has a thixotropic index (TI value) of 3-6 at 25 C.

The invention relates to filling glue and a preparation method thereof, in particular to high-reliability fast-curing filling glue. The high-reliability fast-curing filling glue is prepared from the following raw materials in percentage by weight: 10-50% of epoxy resin, 5-20% of an epoxy diluent, 5-15% of epoxy resin with capability of free radical reaction, 0-10% of an olefin monomer with capability of free radical reaction, 5-20% of a toughener, 0.5-3% of a coupling agent, 0.1-5% of a cationic initiator, 0.1-5% of a radical initiator, 0-5% of filler and 0-5% of pigment. The bottom filling glue provided by the invention can fast cure, has a high glass-transition temperature (Tg), a low expansion coefficient and good repair property, and can be mainly used for flip chip bottom filling to improve the connection reliability.

The invention provides an adhesive composition. The adhesive composition contains a component (A), a component (B) and a component (C), wherein the component (A) contains an epoxy group, a structural unit from acrylonitrile, and (methyl) acrylic resin with weight-average molecular weight of 50,000 to 1,500,000; the component (B) contains epoxy resin with a dicyclopentadiene skeleton structure; and the component (C) contains aromatic polyamide with a diphenyl sulfone skeleton structure. In addition, the invention also provides an adhesive sheet using the adhesive composition, a dicing die attach film using the adhesive composition and having excellent property stability and pickup stability, and a semiconductor device obtained by using the adhesive sheet or the dicing die attach film. The adhesive composition has excellent adhesive property, shows excellent embedded performance, and can provide a high-reliability semiconductor device when being used for manufacturing the semiconductor device.

The invention discloses an adhesive for an optical communication device. A formula for preparing the adhesive for the optical communication device comprises the following raw materials in percentagesby weight: 30-50% of epoxy resin, 10-50% of bifunctional resin, 1-10% of functional resin, 1-10% of a toughening agent, 1-10% of a thermal curing agent and 0.5-5% of a photo curing agent. According tothe adhesive for the optical communication device, the performance index of the adhesive meets the requirements on the process and reliability of an active or passive optical device, an existing method of improving reliability by using two adhesives (UV adhesive positioning and thermal curing adhesive) respectively can be replaced well, the adhesive has double curing functions of photo curing andheating curing, and the product has the characteristics of rapid UV positioning performance and high reliability of a heating curing adhesive.

The present invention provides: an adhesive resin composition containing the following components (A), (B) and (C), wherein, (A): an olefin resin containing an epoxy group, (B): a curing agent, (C): thermally decomposable foaming agent; an adhesive film formed by forming the adhesive resin composition into a film; an adhesive laminated film formed by laminating the adhesive film on a support substrate; A laminate formed by bonding an adherend to an adhesive layer obtained by heating the adhesive film; and a method of heating the laminate and peeling and recovering the adherend from the laminate .

The invention belongs to the technical field of high polymer materials and discloses a fluorine-containing anti-corrosion silicone adhesive and a preparation method thereof. The fluorine-containing anti-corrosion silicone adhesive comprises the following components in parts by weight: 30-50 parts of a fluorine-containing compound, 10-15 parts of an amine compound, 20-40 parts of an epoxy resin compound, 25-40 parts of hydrogen-containing phenyl silicone resin, 2-4 parts of a flexibilizer, 0.001-0.005 part of a catalyst and 1-2 parts of a curing agent. As the fluorine-containing compound is added and used in the fluorine-containing anti-corrosion silicone adhesive and can perform additive reaction with the epoxy resin compound, the silicone adhesive obtained after curing not only has high bonding strength of epoxy resin but also has corrosion resistance of the fluorine-containing compound, and therefore, has a wide application value.

The invention relates to adhesive preparation processes, especially to a preparation process of an adhesive suitable for adhesive coated copper foil. The preparation process consists of: a. blending 30-70 parts of polybutadiene epoxy resin (by mass) with polybutadiene with 2-10 parts of an epoxy active diluent at a temperature of 30-70DEG C for 1-3h for compounding; b. blending the obtained compound with 5-20 parts of bisphenol A epoxy resin at a temperature of 30-70DEG C for 1-3h for compounding so as to obtain an epoxy dispersion liquid dispersible in methanol; and c. blending the epoxy dispersion liquid with 400-600 parts of phenolic resin and 500-700 parts of polyvinyl acetal resin at a temperature of 30-70DEG C for 5-12h for compounding, and carrying out dispersion with 1125-1750 parts of methanol as a solvent, thus obtaining the qualified copper foil adhesive. The process of the invention uses suitable epoxy resin and conducts compounding and modification on it so as to solve the problem of solubility in methanol, thus achieving the purpose of reducing the production cost of the copper foil adhesive.

A curable thermal interface material is provided comprising a functionalized elastomer and a filler. Preferred materials comprise an epoxidized polybutadiene cured with an iodonium catalyst and a filler comprising silver and/or aluminum oxide.

Disclosed is polymer materials essentially free of silicone capable of room-temperature thermal cure and when cured having low modulus, low out-gassing rate. The material before cure typically comprises three components: (i) a cationically curable component comprising the backbone of a hydrocarbon-based rubber material essentially free of carbon-carbon double bonds and triple bonds; (ii) a hydroxyl-containing component having at least two hydroxyl groups per molecule; (iii) an initiator component having essentially no volatility at room temperature and also yield products after polymerization that have minimal or no volatility at room temperature; (iv) an optional viscosity adjustment component either homopolymerizable or capable of copolymerizing with the photo or electron beam curable material component of (i); and (v) an optional non-alkaline inert filler. Also disclosed are process for making such cured material and devices comprising such cured polymer materials.

The invention relates to the field of semiconductor packaging, and discloses an epoxy resin composition and a preparation method and application thereof, the epoxy resin composition comprises epoxy resin, phenolic resin, a curing accelerator, a filler, a release agent, a coupling agent and an adhesion accelerator; wherein the adhesion promoter comprises a first adhesion promoter and an optional second adhesion promoter; the first adhesion promoter is selected from at least one of a thiazole compound, a thiadiazole compound and a pyrazole compound. According to the epoxy resin composition, groups such as amino groups, sulfydryl groups and the like in molecules of the adhesion promoter and hydroxyl groups on metal form hydrogen-bond interaction or N and S atom lone electron pairs and metal atom empty orbits form covalent bonds, so that adhesion between a system and a nickel-plated copper framework is enhanced; meanwhile, the epoxy resin composition has necessary flowability, formability and flame retardance.

A process for the preparation of pressure sensitive adhesive tapes where cationic cure is conducted against liners and substrates with low moisture content and in an environment where moisture ingress during cure is prevented.

Provided are: an underfill material which enables a wide mounting margin; and a process for producing a semiconductor device using the same. This underfill material (20) comprises an epoxy resin, an acid anhydride, an acrylic resin and an organic peroxide, and exhibits a lowest-melt-viscosity reaching temperature of 100 to 150 DEG C and a lowest melt viscosity of 100 to 5000Pa s as determined under temperature rise conditions of 5 to 50 DEG C/min. Since the lowest-melt-viscosity reaching temperature of the underfill material varies only slightly as measured under various temperature rise conditions, the underfill material can ensure void-less mounting and good solder jointing even when the temperature profile in thermocompression bonding is not strictly controlled, thus enabling a wide mounting margin.

There is provided a photocurable and thermosetting resin composition which suppresses decrease of adhesive strength in a moisture resistance test of the cured resin composition, and has a sufficiently long pot life. The resin composition includes (A) an acrylic resin, (B) a multifunctional nitrogen-containing heterocyclic compound represented by a specific chemical formula, (C) a latent curing agent, (D) a radical polymerization inhibitor, and (E) an anionic polymerization retarder. The resin composition preferably further includes (F) a compound having a glycidyl group, other than the acrylic resin.

The present invention provides an adhesive composition that may improve both adhesiveness to a film layer and adhesiveness to a rubber layer, and an adhesion method using the same, as well as a laminate and a tire. The adhesive composition according to the present invention includes a rubber component, at least 80 mass % of which rubber component is an epoxidized natural rubber.