Preparation process of adhesive suitable for adhesive coated copper foil

A preparation process and adhesive technology, applied in the direction of adhesives, adhesive types, novolac epoxy resin adhesives, etc., can solve the problems of poor solubility of epoxy resin and achieve the effect of reducing production costs

Inactive Publication Date: 2012-10-17
佛冈建滔实业有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Phenolic resins and polyvinyl acetal resins have sufficient solubility in me

Method used

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  • Preparation process of adhesive suitable for adhesive coated copper foil

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Embodiment Construction

[0007] Such as figure 1 Shown:

[0008] 1. Blend 30-70 parts of polybutadiene epoxy resin (parts by mass) and 2-10 parts of epoxy reactive diluent at 30-70°C for 1-3 hours for compounding;

[0009] 2. Blend the above compound with 5 to 20 parts of bisphenol A epoxy resin at 30 to 70 ° C for 1 to 3 hours to prepare an epoxy dispersion that can be dispersed in methanol;

[0010] 3. Blend the above epoxy dispersion with 400-600 parts of phenolic resin and 500-700 parts of polyvinyl acetal resin at 30-70°C for 5-12 hours for compounding, and use 1125-1750 parts of methanol as a solvent for dispersion , to obtain a qualified copper foil adhesive.

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Abstract

The invention relates to adhesive preparation processes, especially to a preparation process of an adhesive suitable for adhesive coated copper foil. The preparation process consists of: a. blending 30-70 parts of polybutadiene epoxy resin (by mass) with polybutadiene with 2-10 parts of an epoxy active diluent at a temperature of 30-70DEG C for 1-3h for compounding; b. blending the obtained compound with 5-20 parts of bisphenol A epoxy resin at a temperature of 30-70DEG C for 1-3h for compounding so as to obtain an epoxy dispersion liquid dispersible in methanol; and c. blending the epoxy dispersion liquid with 400-600 parts of phenolic resin and 500-700 parts of polyvinyl acetal resin at a temperature of 30-70DEG C for 5-12h for compounding, and carrying out dispersion with 1125-1750 parts of methanol as a solvent, thus obtaining the qualified copper foil adhesive. The process of the invention uses suitable epoxy resin and conducts compounding and modification on it so as to solve the problem of solubility in methanol, thus achieving the purpose of reducing the production cost of the copper foil adhesive.

Description

Technical field: [0001] The invention relates to an adhesive preparation process, in particular to an adhesive preparation process suitable for glued copper foil. Background technique: [0002] There are certain differences in the molecular weight distribution, polarity and solubility parameters of phenolic resin, polyvinyl acetal, and epoxy resin. Therefore, to prepare a uniform system of glue, it is necessary to disperse and dissolve it with various solvents. These include higher-priced benzenes, ketones, and cheap solvents such as methanol. Phenolic resins and polyvinyl acetal resins have sufficient solubility in methanol, but conventionally used epoxy resins have extremely poor solubility in methanol. Invention content: [0003] The present invention is an adhesive suitable for glued copper foil invented in order to solve the above technical problems. [0004] A preparation process of an adhesive suitable for gluing copper foil, the preparation process is: a. 30-70 p...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/04C09J163/08C09J163/02C08G59/62
Inventor 陈定淼吴伟安李瑞枝张君
Owner 佛冈建滔实业有限公司
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