Adhesive resin composition and use thereof

A resin composition and adhesive technology, applied in the direction of synthetic resin layered products, epoxy resin glue, adhesive types, etc., can solve problems such as peeling and difficult recycling

Inactive Publication Date: 2005-06-15
SUMITOMO CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, as a result of the inventor's research, since the adhesive layer in the laminate described in the above-mentioned Japanese Patent Laid-Open

Method used

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  • Adhesive resin composition and use thereof
  • Adhesive resin composition and use thereof
  • Adhesive resin composition and use thereof

Examples

Experimental program
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Effect test

manufacture example

[0104] The above-mentioned (A), (B) and (C) were added to the small batch kneader "Laborplast Mill" (manufactured by Toyo Seiki Seisakusho Co., Ltd.: 50C150, mixer: R100H) pre-kneaded at 10 rpm for 7 minutes at a cylinder set temperature of 100° C., and then main-kneaded at 50 rpm for 5 minutes to obtain an adhesive resin composition.

[0105] (2): Production example of adhesive laminated film

[0106] After hot pressing the adhesive resin composition obtained in (1) under the preforming conditions described below, the SUS plate and the fluororesin sheet were sequentially stacked on the hot plate of the hot press machine preheated to 100°C, A polyethylene terephthalate template and the obtained preform were placed on the fluororesin sheet, then the fluororesin sheet was placed, and then a SUS (stainless steel) plate was placed, and hot pressing was carried out in accordance with the film forming conditions described below to obtain Adhesive film.

[0107] Next, the film-like...

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PUM

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Abstract

The present invention provides: an adhesive resin composition containing the following components (A), (B) and (C), wherein, (A): an olefin resin containing an epoxy group, (B): a curing agent, (C): thermally decomposable foaming agent; an adhesive film formed by forming the adhesive resin composition into a film; an adhesive laminated film formed by laminating the adhesive film on a support substrate; A laminate formed by bonding an adherend to an adhesive layer obtained by heating the adhesive film; and a method of heating the laminate and peeling and recovering the adherend from the laminate .

Description

technical field [0001] The present invention relates to an adhesive resin composition comprising an epoxy group-containing olefin resin, a curing agent, and a thermally decomposable foaming agent, an adhesive film formed by forming the adhesive resin composition into a film, and an adhesive film formed on a support base. An adhesive laminate film formed by laminating the adhesive film on a material, a laminate formed by bonding an adherend to an adhesive layer obtained by heating the adhesive film, and heating the laminate A method of peeling the laminate from the laminate and recovering the adherend. Background technique [0002] Laminates obtained by bonding adherends via an adhesive layer of an adhesive film are widely used in automotive parts, home appliances, electronic products, office supplies, daily necessities, and the like. Also disclosed in Japanese Patent Laid-Open No. 64-14235 is that a laminate that is strongly bonded to an adherend is obtained through an adhe...

Claims

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Application Information

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IPC IPC(8): B32B7/12C09J7/10C09J163/08
CPCB32B7/12C09J163/08C09J2423/00C09J2463/00C09J7/35C09J7/10C09J163/00
Inventor 藤田真人长谷川俊之
Owner SUMITOMO CHEM CO LTD
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