1741results about "Heat-activated film/foil adhesives" patented technology

The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

It is an object of the invention to provide a curable resin composition excellent in mechanical strength, heat resistance, moisture resistance, flexibility, resistance to thermal cycles, resistance to solder reflow, dimensional stability, and the like after curing and providing high adhesion reliability and conduction reliability and an adhesive epoxy resin paste, an adhesive epoxy resin sheet, a conductive connection paste, and a conductive connection sheet using the curable resin composition, and an electronic component joined body. The invention relates to a curable resin composition, which contains an epoxy resin, a solid polymer having a functional group to react with the epoxy group and a curing agent for an epoxy resin, no phase separation structure being observed in a matrix of a resin when a cured product is dyed with a heavy metal and observed with a transmission electron microscope.

A self-adhering air and moisture barrier sheet membrane for structural surfaces of buildings, which is permeable to the passage of water vapor, is comprised of a water vapor permeable sheet onto one surface of which is applied an adhesive in a non-continuous film.

Incorporating organophilic clay into hot melt adhesive compositions, particularly those comprising semi-crystalline, thermoplastic polymers, greatly improves the adhesive properties in many respects. Some of these improvements are particularly beneficial to the specific use of hot melt adhesives filled with electrically conductive particles for use as electrically conductive adhesives.

Hot-melt processable adhesive, such as pressure-sensitive-adhesive (PSA) or heat-activatable adhesive, compositions of the present invention possess a broad formulation latitude and adequate cohesive strength after application for use in high performance applications. Hot-melt processable adhesives of the invention comprise at least one block copolymer comprising at least two A blocks and at least one B block. The A and B blocks are derived from monoethylenically unsaturated monomers, which monomers result in saturated polymer backbones without the need for subsequent hydrogenation upon their polymerization. Preferably, the block copolymer is a (meth)acrylate block copolymer.

Provided are a heat curable adhesive composition and an adhesive article suited for dicing of a semiconductor and die-bonding of the diced semiconductor chip, and a semiconductor apparatus and a process for preparing a semiconductor apparatus using the adhesive composition and article. In one embodiment, the present invention provides a heat curable adhesive composition comprising a caprolactone-modified epoxy resin and a tack reducing component. Another embodiment of the present invention provides an adhesive article comprising a heat curable adhesive layer of a heat curable adhesive composition comprising a caprolactone-modified epoxy resin, a tack reducing component, and a backing layer carrying said adhesive layer on at least a portion of the backing layer.

The present invention provides a dicing / die bonding sheet which can be used as a dicing tape during dicing, enables ready separation of the semiconductor element and the adhesive layer from the pressure-sensitive adhesive layer during pickup, and in which the adhesive layer has satisfactory adhesiveness as a die bonding material. A dicing / die bonding sheet in which the pressure-sensitive adhesive layer comprises a compound (A), containing intramolecular, radiation curable carbon-carbon double bonds with an iodine value of 0.5 to 20, and at least one compound (B) selected from a group consisting of polyisocyanates, melamine-formaldehyde resins, and epoxy resins, and the adhesive layer comprises an epoxy resin (a), a phenolic resin (b) with a hydroxyl equivalent of at least 150 g / eq., an epoxy group-containing acrylic copolymer (c), comprising from 0.5 to 6% by weight of glycidyl acrylate or glycidyl methacrylate, and with a weight average molecular weight of at least 100,000, a filler (d), and a curing accelerator (e).

A film adhesive for sealing a plurality of chip-type devices on a substrate at one time, including an adhesive layer of an adhesive composition which exhibits a minimum value of a storage modulus of elasticity before curing from 1x10<3 >to 5x10<5 >Pa measured by using a dynamic visco-elasticity measuring apparatus while elevating the temperature from 80° C. to 150° C. at an elevating temperature rate of 2.4° C. / min and at a shearing rate of 6.28 rad / sec and a storage modulus of elasticity after curing from 5x10<5 >to 5x10<7 >Pa measured by using a dynamic visco-elasticity measuring apparatus at a sample temperature of 150° C. in a tensile mode at a measuring frequency of 6.28 rad / sec.

A retroreflective sheet comprises a film having a substantially flat surface and a large number of pyramidal projections having retroreflectivity on the opposite surface, and a colored layer and an adhesive layer disposed on the surface of the film having the projections. The adhesive layer comprises a heat-sensitive adhesive containing an acrylic polymer and a phenolic resin, and exhibits an elastic modulus (by dynamic viscoelasticity measurement, compression mode) at 30 DEG C. ranging from about 1x106 to 1x108 dyn / cm2.

A pressure sensitive adhesive composition comprised of: a) 75 to 99.9 weight percent of a tackified thermoplastic polymer component comprising 1) 1–99 weight percent of a thermoplastic polymer substantially without epoxy-binding or ester functions, and 2) 1–99 weight percent of a tackifier; and b) 0.1 to 25 weight percent of an epoxy component comprising a cured epoxy and non-woven webs made of this adhesive composition.

Provided is a pressure sensitive adhesive sheet that does not adhere to other apparatuses, even when it is used in a manufacturing scheme using heat treatment or treatment involving heat generation. More particularly, the pressure sensitive adhesive sheet is suited for semiconductor wafer processing, possessing unprecedented high-temperature heat resistance. The pressure sensitive adhesive sheet can be used as a surface protective sheet, a dicing sheet or a pickup sheet, by imparting properties such as a protective function of an uneven circuit surface or expanding properties. The pressure sensitive adhesive sheet comprises a base material obtained by film-forming and curing a first curable resin, a top coat layer formed on the base material by coating and curing a second curable resin, and a pressure sensitive adhesive layer formed on the opposite side of the base material.

Provided are a heat curable adhesive composition and an adhesive article suited for dicing of a semiconductor and die bonding of the diced semiconductor chip, and a semiconductor apparatus and a process for preparing a semiconductor apparatus using the adhesive composition and article. In one embodiment, the present invention provides a heat curable adhesive composition comprising a caprolactone-modified epoxy resin and a tack reducing component. Another embodiment of the present invention provides an adhesive article comprising a heat curable adhesive layer of a heat curable adhesive composition comprising a caprolactone-modified epoxy resin, a tack reducing component, and a backing layer carrying said adhesive layer on at least a portion of the backing layer.

The invention is a patch system for repairing collapsible fuel tanks, water tanks, inflatable boats, and other articles fabricated from a flexible structural fabric coated with a polymer. The coated structural fabric is made of nylon or polyester synthetic fibers or a blend thereof, which are coated with a thermoplastic elastomer. The structural coated fabric is coated with a thermoplastic elastomer that is a urethane (TPU), or a TPU alloy polymer. Likewise, the patch is a urethane adhesive having a latent cure coated on a TPU film. The patch can also have an integral reinforcing fabric for applications requiring a higher tensile patch. In the invention, the urethane adhesive of the patch is solvent activated by the application of a thin coating of a volatile, substantially low odor, fugitive solvent like acetone or MEK. While in the activated state, the adhesive has much less cyrstallinity and a lot more tack. The solvent activated adhesive has good wetting, and aggressively wets out and adheres to the surface of the TPU coating on the tank. The activated adhesive side of the patch is pressed against the surface of the tank. The solvent will also partially etch the thermoplastic urethane polymer coating on the tank fabric, and rapidly diffuses therein, ultimately evaporating to the surroundings. The cross-linkable urethane adhesive contains a blocked isocyanate and, preferably, an uretdione. The reduced cyrstallinity in the adhesive imparts greater freedom to the blocked isocyanate that can, depending on the equilibrium of the system, begin to cross-link the adhesive. The curing process can be accelerated through the application of heat, albeit will slowly progress to a cured state at ambient conditions.

There are disclosed an adhesive composition comprising: (a) an epoxy resin, (b) a curing agent and (c) a polymer compound with a weight average molecular weight of 100,000 or more, wherein a ratio of A / B exceeds 1 and is 10 or less, where A represents the total weight of (a) the epoxy resin and (b) the curing agent and B represents a weight of (c) the polymer compound; an adhesive composition, whose compositions are separated into a sea phase and an island phase, when viewed at a section in a cured state, and a ratio X / Y is in a range of 0.1 to 1.0, where X is an area of the sea phase and Y is an area of the island phase; a process for producing said adhesive composition; an adhesive film wherein said adhesive composition is formed into a film form; an adhesive film for bonding a semiconductor chip and a wiring board for mounting a semiconductor or for bonding semiconductor chips themselves, wherein the adhesive film can perform bonding by heat-pressing with a pressure of 0.01 to 0.5 MPa; a wiring board for mounting a semiconductor equipped with said adhesive film on a surface for mounting a semiconductor chip; and a semiconductor device using said adhesive film or said wiring board for mounting a semiconductor.

Provided is an image transfer material, comprising a support, optionally at least one barrier layer, a melt transfer layer, and an image receiving layer. Also provided is a process for preparing the image transfer material. Further provided is a heat transfer process using the disclosed material. In the heat transfer process, after imaging, the image receiving layer and melt transfer layer are peeled away from the optionally barrier-coated support material and placed, preferably image side up, on top of a receptor element. A non-stick sheet is then optionally placed over the imaged peeled material and heat is applied to the top of the optional non stick sheet. The melt transfer layer then melts and adheres the image to the receptor element. A composition comprising: at least one self-crosslinking polymer; and at least one dye retention aid.

The present invention provides a dicing die bond film in which peeling electrification hardly occurs and which has good tackiness and workability. The dicing die bond film of the present invention is a dicing die bond film including a dicing film and a thermosetting type die bond film provided thereon, wherein the thermosetting type die bond film contains conductive particles, the volume resistivity of the thermosetting type die bond film is 1×10−6 Ω·cm or more and 1×10−3 Ω·cm or less, and the tensile storage modulus of the thermosetting type die bond film at −20° C. before thermal curing is 0.1 to 10 GPa.

This invention relates to an adhesive article which provides air egress. Air egress is provided by supplying a mute, such as areas of no initial adhesion for the air to flow out from under the construction. The invention relates to an adhesive article comprising a facestock having a front surface and a back surface, a continuous layer of adhesive having an upper surface and a lower surface wherein the upper surface of the adhesive layer is adhered to the back surface of the facestock, and a plurality of spaced-apart non-adhesive material which is in contact with the lower surface of the adhesive layer wherein the lower surface of the adhesive layer has a Sheffield roughness of at least about 10 and the adhesive article provides air egress. The invention also relates to methods of preparing the adhesive articles, These articles have usefulness as industrial graphics images, as well as decorative coverings, etc. The articles provide air egress and optionally repositionability and slideability.

A linerless pressure-sensitive label uses a heat-activated, non-tacky dead coat to cover a pressure sensitive substratum. Upon heat activation, the dead coat melts and admixes with an underlying pressure-sensitive adhesive substratum thereby resulting in an exposed pressure-sensitive adhesive. The label can then be applied to packaging or an end product by pressing the adhesive side of the label to the packaging or end product similar to a conventional pressure-sensitive label, however, no silicone-coated release liner is required. The elimination of the silicone-coated release liner results in lower material costs, lower shipping costs and less waste.

An object of the present invention is to provide a die-adhering adhesive film which can be laminated on a back of a wafer at a temperature lower than a softening temperature of a protecting tape for an ultra-thin wafer, or a dicing tape to be laminated, can reduce a thermal stress such as warpage of a wafer, can simplify a step of manufacturing a semiconductor device, and is excellent in heat resistance and humidity resistance reliance, an adhesive sheet in which the adhesive film and a dicing tape are laminated, as well as a semiconductor device.

The present invention addresses the problem of providing a resin composition including a polyimide that is soluble in a solvent and from which a resulting film will be highly viscoelastic and flexible at high temperatures. In order to resolve this problem, a polyimide resin composition includes a polyimide including polycondensate units of tetracarboxylic dianhydride and diamine, wherein either the tetracarboxylic dianhydride includes a dianhydride (alpha 1) represented by general formula (1) or the diamine includes an aromatic diamine (beta 1) represented by general formula (2) and the diamine includes an aliphatic diamine (beta 2) represented by general formula (3) or (4), the sum amount of the dianhydride (alpha 1) and aromatic diamine (beta 1) contained therein being 5-49 mol% with respect to the sum of the tetracarboxylic dianhydride and the diamine, and the amine equivalent thereof being 4,000-20,000. In the formula (3), R1 is an aliphatic chain; H2N-R2-NH2... (4), in the formula (4), R2 is an aliphatic chain.

In a wafer dicing / die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent, the ratio of the total weight of the epoxy resin and the epoxy resin curing agent to the weight of the polyimide resin being from 0.1:1 to 3:1. Due to heat resistance, improved adhesive properties and a low modulus of elasticity, the wafer dicing / die bonding sheet is effective for reducing the warpage of a chip after die bonding.

An adhesive tape comprising a base and, superimposed thereon, an adhesive layer, this adhesive layer comprising an adherent component (A), an epoxy resin (B), a thermally active latent epoxy resin curing agent (C), an energy radiation polymerizable compound (D) and a photopolymerization initiator (E), wherein either or both of the epoxy resin (B) and energy radiation polymerizable compound (D) have a dicyclopentadiene skeleton in its molecule or molecules thereof. The resultant adhesive tape has an adhesive layer which provides reduced water absorption of an adhesive curing product and which enables a lowering of the elastic modulus thereof during thermocompression bonding.

A decorative laminate includes a laminate substrate coated with an adhesive layer. The adhesive layer is a layer of a physically setting, solvent-free adhesive material including an acrylic polymer. The adhesive layer is self-adhesive at room temperature. The adhesive-coated laminate substrate has a peeling-off force of at least 0.2 N / mm2, after application on a carrier. A method for the production of the adhesive-coated laminate substrate, its use as a coating material, and a composite of the adhesive-coated laminate substrate and a carrier material are also provided.

The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density such as copper-clad laminates.The flame retardant adhesive composition according to the present invention comprises: (A) a halogen-free epoxy resin, (B) a carboxyl group-containing acrylic resin and / or a carboxyl group-containing acrylonitrile-butadiene rubber, (C) a curing agent, (E) specific phosphinate and / or diphosphonate compounds, and (F) an ion scavenger and / or a heavy metal deactivator.

To provide a resin composition that contains a solvent-soluble polyimide and can provide a film exhibiting high viscoelasticity and flexibility at high temperatures. To attain this, a polyimide resin composition is provided that includes a polyimide having a polycondensation unit of a tetracarboxylic acid dianhydride and a diamine, wherein the tetracarboxylic acid dianhydride includes an (α1) tetracarboxylic acid dianhydride represented by general formula (1), or the diamine includes an (β1) aromatic diamine represented by general formula (2), the diamine includes an (β2) aliphatic diamine represented by general formula (3) or (4), a total amour of the (α1) tetracarboxylic acid dianhydride and the (β1) aromatic diamine is 5 to 49 mol % with respect to a total amount of the tetracarboxylic acid dianhydride and the diamine, and an amine equivalent of the polyimide is 4,000 to 20,000.

The present invention relates to an adhesive tape and to a method for its manufacture, the tape comprising: (A) a heat-activatable adhesive resin layer, wherein the resin is a polymer of one or more monomers selected from the group consisting of olefins, and (B) a pressure-sensitive adhesive layer, comprising an acrylic-type pressure sensitive adhesive, wherein said pressure sensitive adhesive layer is permanently and directly bonded to a first major surface of said heat-activatable adhesive layer. The present invention also relates to an intermediate article comprising the heat-activatable adhesive resin layer (A) releasably bonded to a support layer, to a composite article comprising the adhesive tape and a rubber article bonded to the second major surface of the heat-activatable layer (A), and to a vehicle comprising the composite article.

Resin compositions, which contain: (a) a heat-resistant resin which is soluble in organic solvents wherein the heat-resistant resin is one or more heat-resistant resin(s) selected from the group consisting of a polyimide resin, a polyamide-imide resin, a polyamide resin, a polyether imide resin, a polybenzoxazol resin, a polybenzimidazole resin, copolymers thereof, and mixtures thereof; (b) a thermosetting resin; (c) a filler; and (d) resin having a polybutadiene structure and / or a polysiloxane structure, wherein: the heat-resistant resin (a) and the thermosetting resin (b) are present in a weight ratio of heat-resistant resin (a) to thermosetting resin (b) of from 100:1 to 1:1; the heat-resistant resin (a), thermosetting resin (b), and filler (c) are present in relative amounts such that weight ratio of the total amount of heat-resistant resin (a) and thermosetting resin (b) to filler (c) by weight is from 100:1 to 3:2; the resin having a polybutadiene structure and / or a polysiloxane structure (d) is present in an amount of 0.1 to 15 parts by weight based on 100 parts by weight of the heat-resistant resin (a); and the heat-resistant resin (a), thermosetting resin (b), filler (c), and resin having a polybutadiene structure and / or a polysiloxane structure (d) are present in a total amount of not less than 70% by weight, based on the total weight of the resin composition, are useful for preparing adhesive films, which are, in turn, useful for forming interlayer insulation layers for multi-layered printed wiring boards having an excellent mechanical strength and capable of being roughened by an oxidizing agent.